EP3SL50F484I4LN - 47,500-Cell, 717MHz Stratix III FPGA
MPN: EP3SL50F484I4LN β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $783.1695 | $783.17 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SL50F484I4LN Overview
A field-programmable gate array is an integrated circuit containing programmable logic elements, routing resources, memory blocks, and configurable I/O. Engineers configure the device after PCB assembly to implement digital processing, control, interface, or protocol functions. Within the semiconductor hierarchy, the device belongs to FPGA & CPLD, followed by programmable logic IC, integrated circuit, and ultimately semiconductor. Its logic density and embedded memory distinguish it from smaller CPLDs and fixed-function application-specific integrated circuits.
The headline resources are 47,500 cells, 2,184,192 memory bits, and 296 I/O pins. Mouser additionally identifies 1,900 LABs, while distributor data describes 2,184,192 memory bits and 47,500 logic elements. These resources support parallel datapaths, buffering, state-machine implementation, and interfaces that exceed the practical capacity of modest programmable-logic devices. The 717 MHz figure provides a high-frequency reference for evaluating timing performance, although application-specific clock rates require the manufacturer timing specifications.
Architecturally, Stratix III devices combine programmable logic arrays with embedded memory and programmable I/O structures. This allows logic functions and memory-intensive subsystems to coexist on one configurable platform. The FPGA can implement parallel processing without consuming the same number of general-purpose processor cycles, while its programmable I/O supports system-level integration. Configuration memory must be loaded with a user-generated bitstream before normal operation, and board design must preserve the required configuration interface.
Typical applications include telecommunications equipment, industrial automation, test and measurement, image and signal processing, and high-speed communications infrastructure. A 296-I/O interface is valuable for systems that aggregate many parallel channels, memory controls, or external converters. The 2,184,192-bit embedded-memory capacity also benefits buffering, packet processing, and state-rich control logic. Buyers should confirm speed-grade, configuration, thermal, signal-integrity, and software-tool requirements before release to production.
A key design trade-off is package density versus assembly complexity. The 484-ball BGA requires controlled PCB fabrication, via and escape routing, and appropriate assembly capability; the large 23 mm by 23 mm package footprint is not interchangeable with a smaller FPGA package. Power integrity, simultaneous switching noise, decoupling, and thermal management also become more significant as logic utilization and clock rates increase. Validate the final design using Intel or Altera design tools and the applicable device documentation.
This product page consolidates the verified distributor specifications, commercial availability signals, package identity, and same-brand drop-in comparison candidates. Unlike a bare distributor listing, it also distinguishes exact-family pin-compatible ordering options from broader functional comparisons and identifies where timing, power, configuration, or qualification data still requires manufacturer-document verification.
Drop-in alternatives for EP3SL50F484I4LN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484I4LN (same form factor and footprint) β differing in Package, Process Technology, Embedded Memory, Series, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL50F484I4LG
β Drop-Inβ In Stock
$945 / Unit
View Datasheet βEP3SL50F484I4L
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$658.26 / Unit
View Datasheet βEP3SL50F484I4G
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$165 / Unit
View Datasheet βEP3SL50F484I4
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$558 / Unit
View Datasheet βEP3SL50F484I3N
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$552.3 / Unit
View Datasheet βEP3SL50F484I3G
β Drop-Inβ In Stock
$215 / Unit
View Datasheet βEP3SL50F484I3
β Drop-Inβ In Stock
$701.23 / Unit
View Datasheet βEP3SL50F484I4LN Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix III L |
| Logic Cells | 47,500 |
| Embedded Memory | 2,184,192 bits |
| User I/O | 296 |
| Logic Array Blocks | 1,900 LABs |
| Listed Frequency | 717 MHz |
| Process Technology | CMOS |
| Package | 484-BBGA, FCBGA |
| Package Description | FBGA-484 |
| Terminal Count | 484 |
| Terminal Form | Ball |
| Package Body Material | Plastic/Epoxy |
| Lead-Free Status | Lead free |
| Operating Temperature Grade | Industrial |
EP3SL50F484I4LN plastic/epoxy Pin Configuration Guide
Pin configuration for EP3SL50F484I4LN (plastic/epoxy package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484I4LN is suitable for 6 applications: Telecommunications Line and Packet Processing, Industrial Automation and Machine Control, Test and Measurement Instrumentation, High-Speed Data Acquisition, Image and Video Processing, Communications Infrastructure and Protocol Bridging.
Telecommunications Line and Packet Processing
EP3SL50F484I4LN fits telecommunications line and packet-processing designs that need a configurable datapath, broad external interfacing, and embedded buffering. Its verified 47,500 logic cells, 2,184,192 bits of memory, and 296 I/O support channel aggregation, protocol adaptation, traffic classification, and FIFO-oriented processing. The FPGA can implement parallel logic while retaining local state and packet buffers, reducing the amount of fixed-function logic required elsewhere. Its 717 MHz listed frequency provides a useful device-level reference, but line rate, timing margin, and throughput must be proven in the target design. The 484-ball FBGA package is appropriate for high-density boards, although BGA escape routing, reference continuity, decoupling, and simultaneous-switching-noise control are critical. Use the manufacturer configuration flow and verify that the selected I/O bank voltages and timing characteristics match the connected transceivers, processors, memories, and network interfaces.
Recommended
Industrial Automation and Machine Control
EP3SL50F484I4LN is well suited to industrial automation systems combining deterministic control with multiple sensors, actuators, converters, and field interfaces. The verified 296 I/O provide substantial connectivity for parallel data acquisition, motor-control coordination, encoder processing, and inter-module communication. The FPGAβs 47,500 cells allow multiple control paths, protocol converters, timers, and state machines to share one configurable device, while 2,184,192 embedded memory bits can hold buffering and control-state data. The industrial temperature designation in the supplied result supports initial consideration, but the exact operating range, power rails, and qualification documents must be checked. In a typical design, the FPGA sits between analog or digital front ends and a supervisory processor, handling deterministic logic and reducing host intervention. Robust BGA assembly, local decoupling, signal-integrity analysis, and thermal validation are essential for reliable factory operation.
Recommended
Test and Measurement Instrumentation
EP3SL50F484I4LN can serve as a configurable timing, capture, formatting, and interface engine in test and measurement equipment. Its 47,500 logic cells provide capacity for channel-oriented processing, trigger logic, counters, and protocol-aware state machines. The 2,184,192-bit embedded memory supports sample buffering and event capture, while 296 I/O accommodate parallel ADC or DAC interfaces, control buses, and test points. The 717 MHz listed frequency is a relevant reference for high-speed digital design, but the usable sample rate depends on routing, I/O standards, clock resources, and timing closure. Compared with a fixed-function controller, the FPGA allows instrument behavior to change through bitstream updates and gives designers a path to multiple operating modes on one board. The 484-ball BGA helps achieve high I/O density but requires careful power distribution and signal-return design. Confirm measurement accuracy, calibration access, configuration reliability, and test coverage before production.
Recommended
High-Speed Data Acquisition
EP3SL50F484I4LN is a plausible platform for high-speed data acquisition where incoming samples must be captured, buffered, filtered, formatted, or routed in parallel. The verified 296 I/O are valuable when connecting wide parallel data buses, converter controls, and synchronization signals. The FPGAβs 47,500 logic cells can implement channel alignment, decimation control, trigger generation, and protocol conversion, while the 2,184,192 embedded memory bits provide local buffering before data is transferred to a host or downstream processor. The listed 717 MHz frequency supports a high-performance design direction, but actual converter throughput depends on clocking, I/O timing, board parasitics, and the selected configuration. Place the FPGA close to converter interfaces, maintain controlled-impedance routes, and use matched clock distribution where channel-to-channel skew matters. Because the 484-ball package concentrates many interconnects, engineers should verify via stubs, plane references, decoupling effectiveness, thermal behavior, and assembler inspection before release.
Recommended
Image and Video Processing
EP3SL50F484I4LN can be used in image and video processing systems that require parallel pixel processing, frame buffering, timing generation, and flexible output interfaces. The deviceβs verified 47,500 logic cells support pipelines for synchronization, cropping, color conversion, simple filtering, and format adaptation. The 2,184,192 embedded memory bits can provide line buffers, FIFOs, and intermediate storage for streaming data, while 296 I/O support camera sensors, display controllers, memory interfaces, and control paths. The FPGAβs programmable architecture allows a board to support multiple resolutions or protocols through configuration changes instead of a new hardware spin. The 717 MHz listed frequency is not a substitute for pixel-clock validation; timing closure, I/O bank voltage, signal integrity, and frame-buffer bandwidth must be measured in the actual implementation. A 484-ball BGA supports the required density, but high-speed image routes need short escapes, solid reference planes, careful impedance control, and adequate decoupling.
Recommended
Communications Infrastructure and Protocol Bridging
EP3SL50F484I4LN is applicable to communications infrastructure that needs protocol bridging, clock-domain translation, packet buffering, and deterministic control logic. Its 47,500 logic cells can implement multiple interface adapters and parallel processing blocks, while 2,184,192 embedded memory bits support FIFOs and rate matching. The 296 user I/O provide a wide physical interface for link controllers, processors, memories, and backplane or chassis signals. In a typical bridge, the FPGA receives one clock or protocol domain, performs framing and buffering, and presents a second interface to the system. This can reduce the burden on a host processor and allow firmware-selectable behavior through FPGA configuration. The 717 MHz listed frequency is useful for preliminary architecture work, but link margin, setup and hold timing, clock resources, and I/O electrical standards remain design-specific. The 484-ball BGA requires disciplined escape routing and power delivery, and the obsolete-family status makes lifecycle and authorized inventory checks especially important before deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484I4LN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484I4LG | EP3SL50F484I4L | EP3SL50F484I4G | EP3SL50F484I4 | EP3SL50F484I3N |
|---|---|---|---|---|---|---|
| Package | 484-BBGA, FCBGA / FBGA-484 | 484-BBGA, FCBGA / FBGA-484 | 484-BBGA, FCBGA / FBGA-484 | 484-BBGA, FCBGA / FBGA-484 | 484-BBGA, FCBGA / FBGA-484 | 484-BBGA, FCBGA / FBGA-484 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Terminal Form | Ball | Ball | Ball | Ball | Ball | Ball |
Key Differentiators
- Highest directly verified resource profile (vs EP3C10)
- Same-package family continuity (vs EP3SL50F484I4LG)
- Embedded buffering capacity (vs EP3SL50F484I3N)
- Broad verified I/O count (vs EP3SL50F484I4G)
Design Notes
Treat EP3SL50F484I4LN as a 484-ball BGA layout task, not as a generic perimeter-I/O FPGA. Use the exact manufacturer land pattern and ball map, then verify fanout for the selected PCB stack-up and via technology. Keep power and ground planes continuous beneath the package, provide short return paths for high-speed outputs, and check the escape pattern for via stubs, neck-downs, and reference-plane transitions. The supplied data confirms 296 user I/O, but not usable I/O after bank and power constraints, so reconcile the schematic against the exact pinout before layout.
Use a distributed decoupling network with the smallest capacitors closest to the FPGA supply balls and bulk capacitance sized to the rail transients of the configured design. The verified results do not provide core voltage, I/O voltage, current, or power-consumption limits, so do not infer those values from the 717 MHz listing. Analyze simultaneous switching from 296 I/O and the internal activity factor, include plane spreading resistance and package inductance, and measure rail ripple in the assembled board. A switching regulatorβs phase count and output impedance may need adjustment if transient droop exceeds the FPGAβs margin.
The 717 MHz frequency reference makes signal-integrity validation important even when the designβs external clock is lower. Define I/O standards, drive strengths, slew rates, termination, and receiver thresholds in the FPGA constraints; then simulate or measure the fastest routes, especially clocks, buses, and memory or converter interfaces. Account for package parasitic effects and the 484-ball escape rather than relying on ideal simulation alone. Provide matched clock distribution where channel skew matters, and keep clock and strobe routes away from high-activity outputs. The supplied web data does not state the supported I/O standards or exact timing numbers, so those items require manufacturer documentation.
EP3SL50F484I4LN does not automatically require a heatsink, but a BGA FPGA can heat substantially under high internal utilization and switching activity. The verified data does not include junction-to-ambient resistance, maximum junction temperature, or power limits, so use the manufacturerβs device-specific thermal model after synthesis and place-and-route. Estimate power from clock rate, toggle rate, logic depth, memory use, and I/O loading, then verify with a board-level thermal test. Use a solid PCB thermal path, thermal vias where the footprint permits them, and controlled chassis airflow if measurements show a small margin.
Do not treat the suffix differences among EP3SL50F484I4LN, EP3SL50F484I4LG, EP3SL50F484I4L, EP3SL50F484I4G, EP3SL50F484I4, and I3-family ordering codes as proven drop-in equivalence. The supplied data confirms the 484-ball family context but does not verify every speed, temperature, electrical, or commercial distinction. Before substitution, obtain the manufacturer ordering guide and confirm the exact package pinout, configuration pins, temperature grade, supported I/O banks, and bitstream or software compatibility. Because distributor snippets can be stale, also verify stock, date code, lot traceability, and authorized status before purchase.
Compliance Information
Verified search data explicitly describes the target as lead free. RoHS, REACH, halogen-free, conflict-minerals, and AEC-Q100 status are not explicitly established in the supplied data. The industrial temperature designation in the MPN is not treated as proof of automotive qualification.
