EP3SL50F484I4G - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
MPN: EP3SL50F484I4G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $235.97 | $235.97 |
| 10 | $218.5 | $2,185.00 |
| 100 | $195 | $19,500.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $165 | $165,000.00 |
EP3SL50F484I4G Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined post-fabrication by a user-loaded configuration bitstream. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs, offering ASIC-class parallel processing throughput without the NRE cost of mask-set fabrication. The Stratix III family specifically targeted high-performance logic, digital signal processing (DSP), and embedded designs that demand multi-Gbps transceivers, rich on-chip memory, and DSP blocks in a single silicon device.
Key features include a maximum internal operating frequency of approximately 450 MHz, dedicated 18 x 18 multipliers and DSP blocks for high-throughput arithmetic, on-chip memory totaling 2,184,192 bits distributed across M9K/M144K blocks, and support for high-speed external memory interfaces (DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM). The 484-pin FBGA package provides 296 general-purpose I/O, with Programmable Drive Strength, slew-rate control, and dynamic on-chip termination (OCT) optimizing signal integrity on dense, high-speed parallel buses.
From an architectural standpoint, the Stratix III L variant of the EP3SL50 trades the high-speed transceivers of the standard Stratix III for lower static and dynamic power, making it well suited to systems where the design is logic/DSP bound rather than serial-link bound. The ALM-based logic fabric, multi-tier routing hierarchy, and per-LAB power management (via the Quartus II Programmable Power Technology feature) allow unused regions of the device to enter low-power states while active logic continues at full speed.
Typical applications include high-performance digital signal processing (radar baseband, beamforming, software-defined radio front ends), high-speed packet processing in networking line cards, military/aerospace signal processing, medical imaging (ultrasound beamformers, CT reconstruction engines), and ASIC prototyping where designers map RTL directly onto the FPGA before tape-out. The 484-BGA package is also attractive for production-grade designs that require a thermally enhanced flip-chip substrate with controlled impedance for DDR3 interfaces.
When designing with this part, engineers must pay attention to power-rail sequencing (1.1 V core must ramp before 2.5 V/3.3 V I/O supplies per Altera reference designs), thermal management of the FC-BGA substrate, and pin-out compatibility with the wider Stratix III family to enable migration between EP3SL50, EP3SL110, and EP3SL200 densities without PCB rework.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SL50F484I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484I4G (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Embedded Memory, Lead-Free / RoHS.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL50F484C4G
✅ Drop-In✓ In Stock
$122.1 / Unit
View Datasheet →EP3SL50F484I4
✅ Drop-In✓ In Stock
$558 / Unit
View Datasheet →EP3SL50F484I3N
✅ Drop-In✓ In Stock
$552.3 / Unit
View Datasheet →EP3SL50F484I3G
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3SL50F484C4
✅ Drop-In✓ In Stock
$364.63 / Unit
View Datasheet →EP3SL50F484I4G Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 47,500 |
| LABs/CLBs | 1,900 |
| Total Memory Bits | 2,184,192 bits |
| Number of I/O | 296 user I/O |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm CMOS |
| Maximum Internal Frequency | 450 MHz |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 484-BBGA, FC-BGA (FineLine BGA) 23 x 23 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Method | SRAM-based, loaded via JTAG, Active Serial, or Active Parallel |
EP3SL50F484I4G 484-bbga, fc-bga (fineline bga) 23 x 23 mm Pin Configuration Guide
Pin configuration for EP3SL50F484I4G (484-bbga, fc-bga (fineline bga) 23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484I4G is suitable for 6 applications: High-Performance Digital Signal Processing, Networking Line Card Packet Processing, Military and Aerospace Signal Processing, Medical Imaging (Ultrasound and CT), ASIC Prototyping and Emulation, Industrial Control and Automation.
High-Performance Digital Signal Processing
The EP3SL50F484I4G's 47,500 logic elements and dedicated 18x18 multipliers make it a strong fit for high-throughput DSP workloads such as radar baseband processing, beamforming, and software-defined radio (SDR) front ends. At a 1.1 V core on 65 nm CMOS, the Stratix III L family delivers several hundred MHz of DSP throughput while the on-chip 2,184,192 bits of distributed and block RAM provide the coefficient and sample storage needed for FIR, FFT, and matrix operations. The 296 user I/O pins accommodate multi-channel LVDS ADC/DAC interfaces and DDR2/DDR3 SDRAM data paths commonly used in DSP pipelines. Designers benefit from the Quartus II DSP Builder tool flow that maps MATLAB/Simulink models directly onto the device fabric.
Recommended
Networking Line Card Packet Processing
For telecom line cards and edge routers, the EP3SL50F484I4G provides the parallel logic fabric and on-chip memory bandwidth required to sustain multi-Gbps packet classification, deep-packet inspection, and traffic management at wire rate. The Stratix III L variant is optimized for low static power, an important consideration in densely populated line-card chassis where thermal budget is constrained. Its 296 user I/O support multiple SGMII/SPI4.2 interfaces to network processors plus DDR3 SDRAM for packet buffering, and its on-chip RAM delivers the queue and table lookups needed for QoS scheduling. The 484-FBGA package offers controlled-impedance signal integrity for parallel data buses.
Recommended
Military and Aerospace Signal Processing
The EP3SL50F484I4G's industrial operating temperature range (-40C to +100C) and established position on defense qualified vendor lists make it a common choice for avionics, EW, and radar processing subsystems. The 65 nm Stratix III L silicon is mature, well-characterized for radiation-tolerant environments, and supported by long-life defense programs. Designers exploit the on-chip DSP blocks for channelization, the embedded memory for sample and weight storage, and the high I/O count for interfacing to MIL-STD-1553, ARINC 429, and rapidIO peripherals. The 484-FBGA package's fine pitch supports the miniaturization required for SWaP-constrained platforms.
Recommended
Medical Imaging (Ultrasound and CT)
The EP3SL50F484I4G's parallel architecture and abundant on-chip memory support the demanding beamforming and image-reconstruction pipelines of ultrasound scanners and CT imaging systems. The 296 user I/O accommodate multiple high-channel-count analog front-end ADCs, while the 18x18 multipliers and DSP blocks execute the delay-and-sum beamforming math across 64 to 256 channels in real time. The 2,184,192 bits of on-chip memory provide coefficient storage for apodization windows and intermediate image buffers, while external DDR2/DDR3 SDRAM interfaces capture full-resolution RF frames. The low-power Stratix III L variant helps meet medical equipment thermal and acoustic-noise budgets in clinical environments.
Recommended
ASIC Prototyping and Emulation
For ASIC emulation and RTL prototyping, the EP3SL50F484I4G provides enough logic capacity (47,500 LE / 1,900 LABs) to host moderate-complexity ASIC RTL with realistic timing closure against Quartus II synthesis. The Stratix III L family is widely used in multi-FPGAs prototyping partitions because the on-chip RAM and DSP blocks map common ASIC structures (memories, MAC units) directly. The 484-FBGA package also exposes enough user I/O for in-circuit emulation headers and inter-FPGA trace connections used in partitioning large ASICs across multiple devices. Mature Quartus II support ensures reliable bitstream generation throughout the prototype lifecycle.
Recommended
Industrial Control and Automation
The EP3SL50F484I4G suits industrial controllers that combine deterministic logic, high-speed I/O, and on-the-fly reconfiguration to support multiple machine variants from a single board. The 296 user I/O accept multiple Ethernet, EtherCAT, PROFINET, and parallel LVDS sensor interfaces, while the 65 nm Stratix III L silicon provides the industrial temperature grade (-40C to +100C) needed for factory floor deployment. Designers can use partial reconfiguration to swap in different control loops or motion profiles without halting the machine. The 484-BGA's flip-chip thermal performance supports continuous operation in enclosed cabinets.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C4G | EP3SL50F484I4 | EP3SL50F484I3N | EP3SL50F484I3G | EP3SL50F484C4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FC-BGA (23x23 mm) | 484-BBGA, FC-BGA (23x23 mm) - same | 484-BBGA, FC-BGA (23x23 mm) - same | 484-BBGA, FC-BGA (23x23 mm) - same | 484-BBGA, FC-BGA (23x23 mm) - same | 484-BBGA, FC-BGA (23x23 mm) - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | -4 (fastest industrial) | -4 (fastest commercial) | -4 (fastest industrial, non-RoHS) | -3 (mid-speed industrial) | -3 (mid-speed industrial, RoHS) | -4 (fastest commercial, non-RoHS) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Embedded Memory Bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits | 2,184,192 bits |
| User I/O Count | 296 | 296 | 296 | 296 | 296 | 296 |
Key Differentiators
- Lowest static power among Stratix III family (vs EP3SE50F484I4G (Stratix III E with transceivers))
- Highest speed grade in 484-BGA package (vs EP3SL50F484I3N (-3 speed grade))
- Industrial temperature grade with RoHS compliance (vs EP3SL50F484I4 (industrial, non-RoHS))
Design Notes
The Stratix III L family requires multiple power rails (1.1 V core, 2.5 V PLL analog, 1.8 V/2.5 V/3.3 V I/O banks) that must ramp in a specific sequence per Altera's Power Management Design Guidelines. The 1.1 V core must reach 90 percent of its nominal value before any I/O supply exceeds 1.1 V, otherwise latch-up can occur in the I/O buffers. Use the Altera PowerPlay early power estimator to size the switching regulator current before schematic capture, and consider a sequencer IC (e.g. LTC2923) to manage rail ramp order.
The 484-FBGA flip-chip package has a theta-JA of approximately 11 C/W with a properly designed thermal via array underneath the die (per Altera's thermal characterization). For typical Stratix III L designs at 50-70 percent utilization, junction-to-ambient temperature rise is in the 15-25 C range, which keeps the device within the -40C to +100C industrial envelope with adequate margin. In enclosed enclosures with limited airflow, attach a heatsink or thermal interface material to the package top and verify with a thermocouple on a stress-test board.
The 484-BGA uses a 1.0 mm pitch ball array; PCB fabrication requires laser-drilled microvias and ENIG or OSP surface finish. Use the Altera Stratix III BGA PCB Design Guidelines to define stack-up: minimum 8 layers with 2 dedicated ground planes adjacent to the BGA escape layer to control impedance on DDR2/DDR3 interfaces. Place 0.1 uF + 10 uF decoupling caps within 100 mil of every VCC pin, and use wide (20 mil) power traces from the BGA to the regulator outputs to minimize IR drop during simultaneous-switching events.
Do not assume that any EP3SL50 in the 484-BGA package is a drop-in replacement - the speed grade (-3 vs -4) and temperature grade (commercial vs industrial) affect both timing closure and qualification. Also, JTAG TCK, TMS, TDI, TDO pins and the configuration mode pins (MSEL) must follow Altera's reference schematic exactly, otherwise the configuration controller may fail to enter user mode after POR. Lastly, treat the EP3SL50 vs EP3SE50 prefix as a critical distinction: the 'L' (low-power) version has no transceivers, while the 'E' (enhanced) version does, and the package pinout differs in those banks.
Compliance Information
RoHS compliance per Intel/Altera material declaration for Stratix III family; AEC-Q100 not applicable (FPGAs are not automotive-qualified at the silicon level). Halogen-free status not confirmed in the verified web data.
