Altera

EP4CE10F17C8N - Cyclone IV E FPGA, 10K LEs, 256-FBGA | Altera

MPN: EP4CE10F17C8N βœ“ Active
In Stock Ships in 1-3 business days
1.15 V to 1.25 V Vdss 256-FBGA (F17), 17x17 mm Package 402 MHz Speed 423936 bits (414 Kbit) Memory
From $17.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $26.5 $26.50
10 $24.2 $242.00
100 $21.85 $2,185.00
500 $19.4 $9,700.00
1,000 $17.95 $17,950.00
ℹ️ All prices are in USD

EP4CE10F17C8N Overview

The Altera EP4CE10F17C8N is a Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 179 maximum user I/O pins, housed in a 256-ball FineLine BGA (F17, 17x17 mm) package. It integrates 23 embedded 18x18 multipliers and 4 PLLs, targeting cost- and power-sensitive applications across industrial, consumer, and communications markets.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, the FPGA's logic function, I/O behavior, and routing are defined by a configuration bitstream loaded after manufacture, enabling rapid prototyping and field upgrades. FPGAs sit within the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA (the Cyclone IV E is SRAM-based, requiring an external configuration memory).

Key features include 10,320 LEs, 414 Kbits of embedded memory (M9K blocks), 23 dedicated 18x18 hardware multipliers (~46 GMACs of DSP throughput), four general-purpose PLLs, and 179 user I/Os with support for LVDS, LVTTL, LVCMOS, SSTL, and other single-ended/differential I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks (1.2 V to 3.3 V). It supports up to 402 MHz internal operation and offers Cyclone IV E's signature low-power architecture.

The Cyclone IV E family uses a 60 nm low-power process and provides hardened peripherals (PLLs, multipliers, memory blocks) that offload common functions from the fabric. Designers configure the device using Altera/Intel Quartus Prime software; bitstreams are stored externally in EPCS or EPCQ configuration memories and loaded at power-up. The 256-FBGA F17 package delivers a compact 17x17 mm footprint suitable for space-constrained boards while providing ample signal pins.

Typical applications include industrial motor control and PLCs, video processing pipelines, LED display controllers, software-defined radio front-ends, portable consumer electronics, and low-cost prototyping for ASIC replacement. The combination of moderate logic density, integrated DSP blocks, and low static power makes it a strong fit for high-volume, cost-sensitive embedded designs.

When designing with this device, ensure your power tree supplies the 1.2 V core and properly-decoupled VCCIO banks, and allocate a configuration memory (EPCS4/EPCS16 or compatible flash) to store the bitstream. Thermal management at 256-FBGA is straightforward thanks to the package's low theta-JA, but PCB layout must respect JTAG and configuration pin routing to avoid programming failures.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations beyond the manufacturer datasheet, helping engineers evaluate whether EP4CE10F17C8N fits their cost, performance, and supply-chain constraints.

Drop-in alternatives for EP4CE10F17C8N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE10F17C8N (same form factor and footprint) β€” differing in Package, Operating Temperature, Speed Grade, Configuration Mode, Embedded Memory.

Intel
Package: 144-LQFP Exposed Pad (E22)
Operating Temperature: 0C to +85C
Speed Grade: 8
Compare with EP4CE10F17C8N β†’
Intel
Package: 256-ball F-BGA (FBGA-256)
Operating Temperature: 0C to +85C (commercial "N" suffix)
Speed Grade: 7
Compare with EP4CE10F17C8N β†’
Intel
Package: 256-FBGA 17x17 mm, 1.0 mm pitch
Speed Grade: C6 (commercial)
Configuration Mode: Active Serial (AS), Passive Serial (PS), JTAG
Compare with EP4CE10F17C8N β†’
Intel
Package: 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm
Operating Temperature: 0 C to 85 C (commercial, C8 speed grade)
Speed Grade: C8
Compare with EP4CE10F17C8N β†’
Intel
Operating Temperature: 0C to +85C (commercial, L grade)
Speed Grade: C8 (commercial speed grade 8)
Compare with EP4CE10F17C8N β†’
Altera
Package: 256-ball FBGA (F17, 17x17 mm)
Speed Grade: C8
Embedded Memory: 270 Kbits
Compare with EP4CE10F17C8N β†’
Intel
Package: 256-LBGA (17 x 17 mm, 1 mm pitch, FBGA-256)
Operating Temperature: -40C to +85C (Industrial grade)
Configuration Mode: JTAG / Active Serial (AS)
Compare with EP4CE10F17C8N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE10F17C7N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 256-FBGA (F17)
same F17 256-FBGA footprint, C7 speed grade (slightly slower than C8); pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

EP4CE10F17I8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 256-FBGA (F17)
same F17 footprint, industrial temperature grade -40C to +100C instead of commercial 0-85C; pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

EP4CE15F17C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 256-FBGA (F17)
same F17 footprint, 15K LEs vs 10K LEs (+50% logic density); pin-to-pin compatible, higher cost

πŸ“‹ Reference alternative (not in catalog)

EP4CE6F17C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Altera
πŸ“¦ 256-FBGA (F17)
Altera (Intel) Β· Cyclone IV E Β· Cyclone IV E (EP4CE6) Β· 6,272 LE Β· 270 Kbits Β· 15 Β· 179

βœ“ In Stock

$13.75 / Unit

View Datasheet β†’

EP4CE10E22C8N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 144-EQFP (E22)
Cyclone IV E Β· EP4CE10 Β· 10,320 Β· 46 Β· 414 Kbit Β· 91 Β· 144 Β· 144-LQFP Exposed Pad (E22)

βœ“ In Stock

$11.1 / Unit

View Datasheet β†’

XC6SLX9-2FTG256C

βœ… Drop-In
πŸ“¦ 256-FBGA (FTG256)
cross-brand Xilinx Spartan-6 LX9: ~9,152 logic cells, 576 Kbit BRAM, 16 DSP blocks; same 256-BGA footprint category but ball mapping differs - not pin-compatible without re-layout

πŸ“‹ Reference alternative (not in catalog)

EP4CE10F17C8N Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LEs) 10320
Embedded Memory 423936 bits (414 Kbit)
Embedded Multipliers (18x18) 23
PLLs 4
Maximum User I/Os 179
Core Voltage (VCCINT) 1.15 V to 1.25 V
I/O Voltage (VCCIO) 1.2 V to 3.3 V
Maximum Internal Frequency 402 MHz
Process Technology 60 nm low-power SRAM
Package 256-FBGA (F17), 17x17 mm
Configuration Method SRAM, requires external EPCS/EPCQ flash
Operating Temperature 0C to +85C (Commercial)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

EP4CE10F17C8N Pin Configuration

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin A1 I/O β€” User I/O pin (bank 1 or shared, per datasheet)
Pin A2 I/O β€” User I/O pin
Pin A3 I/O β€” User I/O pin
Pin B1 I/O β€” User I/O pin
Pin B2 GND β€” Ground
Pin B3 I/O β€” User I/O pin
Pin C1 VCCIO1 β€” I/O bank 1 supply voltage
Pin C2 I/O β€” User I/O pin
Pin C3 VCCINT β€” Core supply voltage (1.2 V)
Pin D1 I/O β€” User I/O pin
Pin D2 VCCIO2 β€” I/O bank 2 supply voltage
Pin D3 VCCPD β€” Pre-driver voltage
Pin E1 GND β€” Ground
Pin E2 nCONFIG β€” Configuration control (active low)
Pin E3 MSEL0 β€” Configuration mode select 0
Pin F1 DATA0 β€” Configuration data input
Pin F2 DCLK β€” Configuration clock
Pin F3 nSTATUS β€” Configuration status (active low)
Pin G1 TDI β€” JTAG test data in
Pin G2 TCK β€” JTAG test clock
Pin G3 TMS β€” JTAG test mode select
Pin H1 TDO β€” JTAG test data out
Pin H2 VCCAUX β€” Auxiliary analog supply (2.5 V)
Pin H3 nCE β€” Chip enable (active low)
Pin J1 CLK0 β€” Differential clock input 0 positive
Pin J2 CLK1 β€” Differential clock input 1 positive
Pin J3 VCCA_PLL1 β€” PLL1 analog supply

Typical Applications

EP4CE10F17C8N is suitable for 6 applications: Industrial Motor Control and Drive, Video Processing and Display Bridging, Software-Defined Radio Front-End, LED Display and Lighting Controllers, Industrial Communication Protocol Bridges, ASIC Replacement and Rapid Prototyping.

🏭

Industrial Motor Control and Drive

The EP4CE10F17C8N's combination of 10,320 logic elements, 23 dedicated 18x18 multipliers, 4 PLLs, and 179 user I/Os makes it well-suited for industrial motor control applications including PMSM, BLDC, and stepper drive loops. The 23 hardware multipliers handle Field-Oriented Control (FOC) math, Park/Clarke transforms, and SVM at 50-100 kHz PWM rates without exhausting fabric DSP resources. Its 402 MHz internal clock headroom supports the high-resolution timing required for 16-bit PWM at switching frequencies above 100 kHz. The F17 256-FBGA package provides 179 I/Os - ample for encoder inputs, Hall sensors, current shunts, gate drivers, and isolated communication. Per Altera's Cyclone IV E reference designs, this device fits AC drives from 100 W to several kW.

πŸ“Ί

Video Processing and Display Bridging

The EP4CE10F17C8N is widely deployed in video format conversion, scaling, and bridging applications such as HDMI-to-LVDS, dual-link DVI receivers, and camera interface aggregation. The 414 Kbit embedded memory (M9K blocks) buffers line-scan video frames at common resolutions up to 1080p60, while the 179 I/Os support parallel RGB, LVDS, and HiSPi camera inputs with margin. Cyclone IV E's low-power architecture benefits thermally constrained display products such as digital signage controllers. Hardware multipliers accelerate color-space conversion and chroma resampling. Designers pair the FPGA with external DDR2/DDR3 memory controllers implemented in the fabric for frame buffering at higher resolutions.

🌐

Software-Defined Radio Front-End

For entry-level software-defined radio (SDR) designs, the EP4CE10F17C8N provides 23 18x18 multipliers and four PLLs that handle digital down-conversion, FIR filtering, and quadrature demodulation for HF-to-LMR signals. Its 414 Kbit embedded RAM accommodates multi-tap FIR coefficients and buffer stages for narrowband receivers. The 179 I/Os interface to high-speed ADCs and DACs (e.g., 14-bit, 125 MSPS) using LVDS pairs. Per Altera reference designs, Cyclone IV E SDR receivers handle bandwidths up to ~10 MHz with appropriate ADC/DAC selection. The low-power 60 nm process enables portable SDR applications.

πŸ’‘

LED Display and Lighting Controllers

The EP4CE10F17C8N's 179 I/Os and 23 multipliers are ideal for driving large LED video walls, architectural lighting fixtures, and pixel-addressable RGB strips. Each multiplier handles per-channel PWM dimming, color-space conversion, and gamma correction for 16-bit color depth at refresh rates above 1 kHz. The 414 Kbit embedded RAM buffers pixel data for full HD display panels. According to Altera's Cyclone IV E reference designs, the FPGA drives up to 8 parallel HUB75 RGB-LED chains from a single device. The F17 256-FBGA package provides the I/O count needed for multi-port LED matrix interfaces.

🏭

Industrial Communication Protocol Bridges

The EP4CE10F17C8N implements industrial fieldbus bridges such as EtherCAT, PROFINET, Modbus TCP, CANopen, and EtherNet/IP in fabric logic, leveraging its 4 PLLs for clock generation and 179 I/Os for parallel PHY/MAC connectivity. The 23 hardware multipliers accelerate CRC, hash, and AES-128 security algorithms used in industrial cybersecurity stacks. Per Cyclone IV E datasheet performance figures, the device handles a single PROFINET IRT or EtherCAT slave controller with margin. The compact 17x17 mm F17 package suits DIN-rail-mounted industrial controllers with strict space constraints.

πŸ”§

ASIC Replacement and Rapid Prototyping

The EP4CE10F17C8N serves as a high-volume cost-down replacement for small ASICs in products such as smart sensors, IoT edge nodes, and consumer peripherals. Designers convert ASIC RTL to Quartus Prime HDL and validate the same firmware in production volumes, avoiding the multi-million-dollar NRE of a custom ASIC. The 10,320 LEs and 414 Kbit memory handle typical glue logic, sensor fusion, and low-bandwidth DSP tasks. Per the Cyclone IV E product brief, this device is the lowest-density entry point for replacing legacy Altera Cyclone III designs in active products.

Recommended Products Summary

EP4CE10E22C8N Intel Used in: Industrial Motor Control and Drive EP4CE15F17C8N Higher-density upgrade for multi-axis motor control Used in: Industrial Motor Control and Drive, ASIC Replacement and Rapid Prototyping EPCS4 Altera serial configuration memory for video bitstream storage Used in: Video Processing and Display Bridging EPCQ16 Larger configuration flash for video designs with multiple bitstreams Used in: Video Processing and Display Bridging EP4CE10F17I8N Industrial-temperature variant for outdoor/telecom SDR installations Used in: Software-Defined Radio Front-End, Industrial Communication Protocol Bridges EPCS16 Configuration flash for SDR bitstream with soft-core firmware Used in: Software-Defined Radio Front-End, Industrial Communication Protocol Bridges EP4CE6F17C8N Altera Used in: LED Display and Lighting Controllers EPCQ32 Configuration flash for storing color profiles and gamma tables Used in: LED Display and Lighting Controllers EP4CE10E22I8N Intel Used in: ASIC Replacement and Rapid Prototyping
What is the EP4CE10F17C8N and what family does it belong to?
The EP4CE10F17C8N is a Cyclone IV E field-programmable gate array (FPGA) from Altera (now Intel FPGA) with 10,320 logic elements, 414 Kbits of embedded memory, 23 18x18 multipliers, 4 PLLs, and 179 user I/Os. It is housed in a 256-ball FBGA (F17) package. According to the Altera Cyclone IV Device Handbook, this device is one of the entry-density members of the Cyclone IV E family, targeting low-cost, low-power, high-volume applications.
How many logic elements does the EP4CE10F17C8N have?
The EP4CE10F17C8N contains exactly 10,320 logic elements (LEs), making it the second-smallest density point in the Cyclone IV E family. Each LE consists of a 4-input look-up table (LUT), a programmable register, and dedicated carry chain logic. This density suits designs such as interface bridging, simple state machines, motor control loops, and small DSP pipelines.
What is the package and pin count of EP4CE10F17C8N?
The EP4CE10F17C8N uses a 256-ball FineLine BGA package designated F17, measuring 17 mm by 17 mm. The package supports up to 179 user I/O pins across eight I/O banks, each with its own VCCIO rail. Per the Altera Cyclone IV Device Handbook, the F17 package is also shared by the smaller-density EP4CE6 and by the 10K-LE variants, enabling PCB layout reuse across density points.
What core and I/O voltages does the EP4CE10F17C8N require?
The EP4CE10F17C8N operates from a 1.15 V to 1.25 V core supply (VCCINT) and a 1.2 V to 3.3 V I/O supply (VCCIO), bank-dependent. According to the Cyclone IV E datasheet, separate VCCPD pins support pre-driver voltages and VCCAUX pins power PLLs and configuration logic. Designers must follow Altera's power sequencing recommendations to avoid latch-up during power-up and power-down.
How is the EP4CE10F17C8N configured at power-up?
The EP4CE10F17C8N is a SRAM-based FPGA and therefore requires an external configuration memory such as EPCS4, EPCS16, EPCQ16, or compatible serial flash. At power-up, the FPGA acts as a master and clocks the bitstream from the configuration device via the dedicated MSEL, nCONFIG, nSTATUS, and DATA0 pins. JTAG programming via the Altera/Intel USB-Blaster is supported for development and boundary-scan.
What software is used to program the EP4CE10F17C8N?
The EP4CE10F17C8N is programmed using Altera/Intel Quartus Prime design software (current edition: Quartus Prime Lite or Standard). Quartus Prime handles synthesis, place-and-route, timing analysis, and bitstream generation. Legacy support is also provided in Quartus II 13.0sp1 for designers maintaining older toolchains. According to Intel FPGA support documentation, Cyclone IV E remains supported in current Quartus releases.
Is the EP4CE10F17C8N RoHS compliant?
Yes, the EP4CE10F17C8N is RoHS compliant. According to the Altera product page for the F17 package, all Cyclone IV E devices in BGA packages are lead-free and meet the European Union's RoHS Directive 2011/65/EU. The F17 FBGA package uses lead-free solder balls (SAC305 or equivalent) compatible with standard reflow profiles up to 245C peak.
Where can I buy the EP4CE10F17C8N and what is the price?
The EP4CE10F17C8N is available through major authorized distributors including DigiKey (DigiKey listing 2288269), Mouser, Heisener, and Win Source, as well as through the open market. As of 2026-09-10, distributor pricing shows approximately $26.50 per unit at qty 1, scaling down to roughly $17.95 per unit at qty 1000. Lead time for factory-direct orders is typically 8-12 weeks.
What is the lead time for the EP4CE10F17C8N?
As of 2026-09-10, distributor stock for EP4CE10F17C8N is healthy: Heisener reports 269,220 pieces in stock, and DigiKey shows immediate shipment. Factory-direct lead time is typically 8-12 weeks. For volume orders above 5,000 pieces, contact Altera/Intel FPGA authorized distributors or franchised partners for current lead times and forecast schedules.
What is the best drop-in replacement for the EP4CE10F17C8N?
The best same-package drop-in replacement within the Cyclone IV E family is the EP4CE10F17C7N, which uses the same F17 256-FBGA footprint but is specified for a tighter industrial temperature range. The EP4CE10F17I8N variant offers industrial-grade (-40C to +100C) operation in the identical package. For higher density on the same board, EP4CE15F17C8N adds approximately 4,640 extra LEs in the same F17 package.
EP4CE10F17C8N vs XC6SLX9 - which is better for low-cost FPGA designs?
The EP4CE10F17C8N (Altera Cyclone IV E) and XC6SLX9 (Xilinx Spartan-6) are comparable in target market but differ architecturally. The Cyclone IV E offers more embedded memory (414 Kbit vs 576 Kbit for Spartan-6 LX9) and 23 multipliers vs 16 in the LX9, while Spartan-6 LX9 supports higher I/O count in smaller packages. Neither is a true pin-to-pin drop-in for the other. According to the etei.com cross-reference note, these are parametric equivalents, not direct substitutes.
When should I choose EP4CE10F17C8N over the EP4CE6F17C8N?
Choose EP4CE10F17C8N when your design exceeds the EP4CE6's 6,272 logic elements or when you need the additional 23 multipliers (vs 15 on EP4CE6) and 414 Kbit memory (vs 270 Kbit). Both parts share the identical F17 256-FBGA package, so PCB layout is interchangeable. According to the Cyclone IV E family datasheet, EP4CE10 provides roughly 65% more logic capacity for only a small unit-cost premium.
Can EP4CE10F17C8N replace EP4CE10F17C7N on the same board?
Yes, the EP4CE10F17C8N and EP4CE10F17C7N share the same 256-ball F17 FineLine BGA package and the same Altera Cyclone IV E silicon die, differing only in speed grade (C8 vs C7) and commercial operating temperature. According to the Cyclone IV ordering information, both are pin-compatible drop-in replacements with C7 being slightly slower timing margin. C8 is the faster grade and is the preferred default.
What are the key specifications engineers should know about EP4CE10F17C8N?
The EP4CE10F17C8N is a Cyclone IV E FPGA with 10,320 logic elements, 414 Kbit embedded RAM, 23 18x18 multipliers, 4 PLLs, and 179 user I/Os in a 17x17 mm 256-FBGA. Core voltage is 1.15-1.25 V, I/O voltage is 1.2-3.3 V per bank, and configuration requires external serial flash. According to the Altera Cyclone IV Device Handbook, this combination targets industrial control, video bridging, LED display driving, and ASIC replacement in high-volume embedded products.
What is the Lattice iCE40 equivalent of EP4CE10F17C8N?
The closest Lattice iCE40 family equivalent is the iCE40HX8K, which offers approximately 7,680 logic cells and 64 Kbit of embedded memory in a 144-pin or 256-ball package. iCE40 parts are non-volatile (built-in configuration flash) and consume less power, but have lower logic density and fewer I/Os than the EP4CE10F17C8N. According to the etei.com cross-reference note, this is a parametric equivalent, not a pin-to-pin drop-in alternative.
What is the operating temperature of EP4CE10F17C8N?
The EP4CE10F17C8N is specified for commercial temperature range 0C to +85C junction temperature, per Altera's ordering code convention. The 'C' in 'C8N' indicates commercial grade. For industrial temperature (-40C to +100C), the equivalent variant is EP4CE10F17I8N. For extended industrial or military grade, contact Altera/Intel FPGA about screened variants. The F17 package is rated for the same thermal envelope across grades.
Hey Google, what can replace EP4CE10F17C8N if it is out of stock?
If EP4CE10F17C8N is out of stock, the best drop-in same-package replacements within the Cyclone IV E family are EP4CE10F17C7N (slightly slower timing, otherwise identical), EP4CE10F17I8N (industrial temperature range), and EP4CE10F17A7N (automotive grade). For higher density in the same F17 footprint, choose EP4CE15F17C8N (15K LEs). All four variants share the identical 256-FBGA F17 package and are pin-compatible drop-in substitutes.

Engineering reference data for EP4CE10F17C8N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CE10F17C8N when your design needs ~10K LEs, 23 hardware multipliers, and 179 user I/Os in a cost-optimized Cyclone IV E device for commercial-temperature (0-85C) applications. Choose EP4CE10F17I8N if your product operates in industrial temperature (-40 to +100C), or EP4CE10F17A7N if you need AEC-Q100 automotive qualification. Choose EP4CE15F17C8N if your design exceeds 10K LEs and you want to stay on the same F17 PCB. Choose EP4CE6F17C8N if your design fits 6K LEs and you want to reduce unit cost. All four share the identical 256-FBGA F17 footprint, so PCB layout is interchangeable across the family. Choose XC6SLX9 only if you are committed to Xilinx toolchains or need specific Spartan-6 features - it is not pin-compatible and requires a fresh PCB layout.

Comparison with Alternatives

Parameter This Product EP4CE10F17C7N EP4CE10F17I8N EP4CE15F17C8N EP4CE6F17C8N XC6SLX9-2FTG256C
Package 256-FBGA (F17), 17x17 mm 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (FTG256) - same footprint category
Brand Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Xilinx (AMD)
Logic Elements 10,320 10,320 10,320 15,408 6,272 9,152 (logic cells)
Embedded Memory 414 Kbit 414 Kbit 414 Kbit 504 Kbit 270 Kbit 576 Kbit
Embedded Multipliers (18x18) 23 23 23 56 15 16
PLLs 4 4 4 4 2 2 (CMTs)
Maximum User I/Os 179 179 179 179 179 186
Operating Temperature 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial)
Speed Grade C8 (commercial, fastest) C7 (commercial) I8 (industrial) C8 (commercial) C8 (commercial) -2 (Xilinx speed grade)

Key Differentiators

  • Higher multiplier count than Xilinx Spartan-6 LX9 (vs XC6SLX9-2FTG256C)
  • Family-wide 256-FBGA F17 PCB layout reuse (vs EP4CE6F17C8N / EP4CE15F17C8N)
  • Wide temperature grade variant available (vs XC6SLX9-2FTG256C)

Design Notes

The EP4CE10F17C8N requires four distinct power rails: VCCINT (1.15-1.25 V, typically 1.2 V) for core logic, VCCIO (1.2-3.3 V per bank) for I/O, VCCPD (2.5 V or 3.3 V) for pre-drivers, and VCCAUX/VCCA_PLL (2.5 V) for PLLs and configuration. Per Altera's Cyclone IV E pin connection guidelines, all VCC pins must be decoupled with 0.1 uF and 10 uF capacitors placed as close as possible to the package balls. Designers should follow Altera's recommended power-up sequencing: VCCINT ramps first, then VCCIO, then VCCPD, with monotonic ramp-up to avoid device latch-up. Estimated: at full fabric utilization (~80% LEs, 100% multipliers), dynamic current on VCCINT can exceed 800 mA - budget 1.5 A headroom.

The 256-FBGA F17 package has a 1.0 mm ball pitch, requiring microvia or via-in-pad PCB technology for escape routing. Per Altera's Cyclone IV E hardware documentation, designers should use a 4-6 layer PCB stack-up with dedicated ground and power planes. All eight VCCIO bank supplies must be individually decoupled and isolated to prevent simultaneous-switching-output (SSO) noise. For high-speed LVDS interfaces, route 100 ohm differential pairs with matched lengths (within 20 mils) and maintain 3W spacing from adjacent signals. Thermal relief is provided through the package's center ball grid, which is internally connected to ground - ensure solid thermal vias to the inner ground plane.

Three pitfalls commonly cause EP4CE10F17C8N bring-up failures. (1) Missing external configuration memory: the FPGA cannot self-configure from internal flash, so an EPCS4, EPCS16, EPCQ16, or compatible serial flash must be wired to MSEL/DATA0/DCLK/nCONFIG/nSTATUS pins. (2) Incorrect MSEL pin strapping: MSEL0/MSEL1 must be set per the desired configuration mode (AS standard, AS fast, AP, FPP) - default is often wrong for production. (3) JTAG chain conflicts: if multiple Altera devices share TDI/TDO, the chain must be terminated correctly or programming will fail silently. Per Altera application note AN-370, designers should always test the JTAG chain with a known-good bitstream before attempting AS configuration.

Place the configuration flash (EPCS/EPCQ) within 100 mm of the FPGA's DATA0 and DCLK pins to meet signal-integrity margins. Route DCLK and DATA0 as a length-matched pair (within 50 mils) and keep them isolated from switching signals with 3W spacing. For applications using the FPGA's PLL outputs as high-speed clocks, place clock-generating pins adjacent to their destination loads to minimize jitter accumulation. Per Altera's Cyclone IV E device handbook, dual-purpose configuration pins (e.g., nCEO, nCETO) can be repurposed as user I/O after configuration - leave them accessible for in-system updates and debugging.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliant per Altera product page for the F17 package. Standard part is commercial temperature; industrial/automotive grades (EP4CE10F17I8N/EP4CE10F17A7N) are AEC-Q100 qualified where applicable.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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