EP4CE15F1717N - Cyclone IV E FPGA, 15K LE, 256-BGA | Altera/Intel
MPN: EP4CE15F1717N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $49.86 | $49.86 |
| 10 | $46.5 | $465.00 |
| 100 | $42.1 | $4,210.00 |
| 500 | $38.5 | $19,250.00 |
| 1,000 | $35.2 | $35,200.00 |
EP4CE15F1717N Overview
A Cyclone IV E FPGA is a SRAM-based programmable logic device that combines configurable logic blocks (LABs), embedded M9K memory blocks, embedded 18x18 multipliers, and a programmable interconnect fabric on a single die. The Cyclone IV E family sits below Cyclone IV GX and above legacy Cyclone III in Intel's low-cost, low-power FPGA portfolio, targeting cost-sensitive applications where modest logic density, DSP capability, and low static power are required.
Key specifications of the EP4CE15F1717N include 15,408 logic elements, 56 (18x18) hardware multipliers, 516 Kbits of embedded RAM organized as 56 M9K blocks, 4 PLLs, and 165 maximum user I/Os. The device supports up to 343 Mbps LVDS performance and features a commercial speed-grade 7 device with an industrial temperature range option, as encoded by the trailing "I" in similar part numbers.
Architecture-wise, the Cyclone IV E FPGA uses a logic array block (LAB) topology of 16 logic elements per LAB, with each logic element containing a 4-input LUT, programmable register, carry chain, and register chain. The embedded M9K memory blocks support true dual-port, simple dual-port, and single-port RAM configurations, and the embedded multipliers support signed and unsigned multiplication in 9-bit, 18-bit, and 36-bit widths.
Typical applications include industrial motor control, video processing pipelines, PCIe Gen1 endpoint bridging (with external PHY), low-cost ASIC prototyping, embedded vision, and software-defined radio baseband preprocessing. The combination of moderate logic capacity, integrated DSP blocks, and low power makes it well-suited to battery-backed and thermally-constrained industrial designs.
When designing with this device, ensure your Quartus II (or Quartus Prime) project selects the EP4CE15F1717N device, then validate pin assignments against the 256-BGA pinout file. The device is non-volatile-configuration only via an external serial or parallel flash - internal SRAM configuration must be reloaded on every power-up.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone IV E family, and practical design notes not consolidated on a single manufacturer datasheet page.
Drop-in alternatives for EP4CE15F1717N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE15F1717N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE15F17I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE15F17C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE15E22C8N
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →EP4CE15E22C7N
✅ Drop-In✓ In Stock
$105.4 / Unit
View Datasheet →EP4CE10F17C8N
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EP4CE10E22C8N
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EP4CE15F1717N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Logic Elements (LE) | 15,408 |
| Embedded Memory | 516,096 bits (56 M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/Os | 165 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm low-power |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature | 0C to +85C (commercial "N" suffix) |
| Package | 256-ball F-BGA (FBGA-256) |
| Package Pitch | 1.0 mm |
| LVDS Performance | Up to 343 Mbps |
| Speed Grade | 7 |
| Configuration Mode | External serial/parallel flash (volatile SRAM) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
EP4CE15F1717N Pin Configuration
| Pin A1 | VCCIO1 — I/O bank 1 voltage |
| Pin A2 | IO_1_0 — User I/O in bank 1 |
| Pin A3 | IO_1_1 — User I/O in bank 1 |
| Pin B1 | GND — Ground |
| Pin B2 | IO_1_2 — User I/O in bank 1 |
| Pin B3 | IO_1_3 — User I/O in bank 1 |
| Pin C1 | IO_2_0 — User I/O in bank 2 |
| Pin C2 | VCCINT — Core voltage 1.0/1.2 V |
| Pin C3 | IO_2_1 — User I/O in bank 2 |
| Pin D1 | IO_2_2 — User I/O in bank 2 |
| Pin D2 | GND — Ground |
| Pin D3 | IO_3_0 — User I/O in bank 3 |
| Pin E1 | IO_3_1 — User I/O in bank 3 |
| Pin E2 | VCCIO3 — I/O bank 3 voltage |
| Pin E3 | IO_4_0 — User I/O in bank 4 |
| Pin F1 | IO_4_1 — User I/O in bank 4 |
| Pin F2 | GND — Ground |
| Pin F3 | IO_5_0 — User I/O in bank 5 |
| Pin G1 | IO_5_1 — User I/O in bank 5 |
| Pin G2 | IO_6_0 — User I/O in bank 6 |
| Pin G3 | VCCIO6 — I/O bank 6 voltage |
| Pin H1 | IO_6_1 — User I/O in bank 6 |
| Pin H2 | GND — Ground |
| Pin H3 | IO_7_0 — User I/O in bank 7 |
| Pin J1 | IO_7_1 — User I/O in bank 7 |
| Pin J2 | IO_8_0 — User I/O in bank 8 |
| Pin J3 | IO_8_1 — User I/O in bank 8 |
| Pin K1 | GND — Ground |
| Pin K2 | TCK — JTAG test clock |
| Pin K3 | TMS — JTAG test mode select |
| Pin L1 | TDI — JTAG test data in |
| Pin L2 | TDO — JTAG test data out |
| Pin L3 | nCONFIG — Configuration reset (active low) |
| Pin M1 | nSTATUS — Configuration status (active low) |
| Pin M2 | CONFIG_DONE — Configuration complete |
| Pin M3 | DCLK — Configuration clock |
| Pin N1 | DATA0 — Configuration data 0 |
| Pin N2 | GND — Ground |
| Pin N3 | nCE — Chip enable (active low) |
Typical Applications
EP4CE15F1717N is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Pipeline, PCIe Gen1 Endpoint Bridging, Software-Defined Radio Baseband, ASIC Prototyping and Emulation, Embedded Vision and Machine Vision.
Industrial Motor Control
The EP4CE15F1717N's 56 embedded 18x18 multipliers and 4 PLLs make it well-suited for industrial motor control loops. The device can run FOC (field-oriented control) algorithms for three-phase PMSM or BLDC motors with PWM frequencies above 100 kHz and current loop rates above 20 kHz. The 165 user I/Os comfortably handle multi-axis encoder inputs (QEP), Hall sensors, and PWM outputs to gate drivers, while 516 Kbits of embedded RAM buffer speed/position traces for diagnostics. Engineers typically route the 256-FBGA onto 4-layer FR-4 with a continuous ground pour for EMI control in factory-floor environments.
Recommended
Video Processing and Image Pipeline
For video applications, the EP4CE15F1717N's 343 Mbps LVDS receivers can capture parallel digital video from image sensors or HDMI bridges at resolutions up to 720p60. The 56 M9K blocks (516 Kbits total) double as line buffers for scaling, color-space conversion, and on-screen-display composition, while 56 hardware multipliers accelerate 2D filter kernels and motion estimation. A typical design instantiates a Bayer-to-RGB pipeline plus an OSD overlay, fitting comfortably in 12K-14K LEs. The 256-FBGA package provides adequate signal integrity for DDR2 video frame buffers when paired with matched-length routing.
Recommended
PCIe Gen1 Endpoint Bridging
With the Cyclone IV E hard IP for PCIe Gen1 (root complex or endpoint, x1 lane), the EP4CE15F1717N can implement protocol bridges between PCIe and parallel local buses such as Avalon or Wishbone. This is a common building block for low-cost FPGA-based compute cards in test and measurement, industrial PCs, and edge AI inference nodes. The 15,408 LEs accommodate a custom DMA engine plus application logic, while the 4 PLLs generate the 100 MHz PCIe reference clock and lane-specific serialization clocks. Software enumeration on the host side requires a standard TLP handling block plus MSI/MSI-X capability registers.
Recommended
Software-Defined Radio Baseband
The EP4CE15F1717N is a strong fit for narrowband SDR baseband preprocessing in HF/VHF/UHF receivers. The 56 hardware 18x18 multipliers implement digital downconversion (DDC) FIR filters and channelization polyphase filterbanks, while the 4 PLLs generate independent sample clocks for the ADC and the digital mixer. Designers typically consume 8-12K LEs for the DDC chain plus AGC, leaving headroom for protocol decoding stacks like AX.25 or LoRa. The commercial temperature range is acceptable for lab and field-deployable enclosures with thermal management.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping, the EP4CE15F1717N's 15,408 LEs map comfortably onto RTL blocks in the 5K-10K-gate range. The 256-FBGA package provides sufficient I/Os for chip-level bring-up, and Quartus Prime supports industry-standard synthesis flows from Synopsys Design Compiler or Cadence Genus. Common applications include pre-silicon validation of custom RISC-V cores, DMA controllers, and image signal processors. Multi-FPGA partitioning tools like Synopsys Certify or Mentor Precision can split larger ASIC designs across multiple EP4CE15F1717N boards.
Recommended
Embedded Vision and Machine Vision
In machine vision systems such as AOI (automated optical inspection) and barcode sorting lines, the EP4CE15F1717N's parallel processing fabric enables real-time pixel pipelines at line rates up to 100 MHz. The 56 multipliers accelerate Sobel, Laplacian, and morphology operators, while 516 Kbits of block RAM holds template libraries and intermediate frame buffers. Engineers typically pair the FPGA with a 5 MP CMOS sensor over a parallel LVDS sub-LVDS interface. The 256-FBGA package's 165 user I/Os accommodate 24-bit RGB buses plus Ethernet RMII for factory-network connectivity.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE15F1717N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE15F17I7N | EP4CE15F17C8N | EP4CE15E22C8N | EP4CE15E22C7N | EP4CE10F17C8N | EP4CE10E22C8N |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA (E22) - same footprint | 256-FBGA (E22) - same footprint | 256-FBGA - same | 256-FBGA (E22) - same footprint |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 15,408 | 15,408 - same | 15,408 - same | 15,408 - same | 15,408 - same | 10,320 (-33%) | 10,320 (-33%) |
| Embedded Memory | 516 Kbits (56 M9K) | 516 Kbits - same | 516 Kbits - same | 516 Kbits - same | 516 Kbits - same | 414 Kbits (46 M9K) -20% | 414 Kbits (46 M9K) -20% |
| 18x18 Multipliers | 56 | 56 - same | 56 - same | 56 - same | 56 - same | 46 (-18%) | 46 (-18%) |
| User I/Os | 165 | 165 - same | 165 - same | 165 - same | 165 - same | 165 - same | 165 - same |
| Speed Grade | 7 | 7 - same | 8 (slower Fmax) | 8 (slower Fmax) | 7 - same | 8 (slower Fmax) | 8 (slower Fmax) |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
Key Differentiators
- Standard F17 speed bin offers best Fmax in same package (vs EP4CE15F17C8N)
- Commercial temperature with industrial alternative available (vs EP4CE15F17I7N)
- Higher logic capacity than Cyclone IV E 10K family (vs EP4CE10F17C8N)
Design Notes
The EP4CE15F1717N requires four separate power rails: VCCINT (1.0 V or 1.2 V core), VCCIO (1.2-3.3 V I/O banks, must match bank voltage per pin group), VCCA (1.2 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Use a dedicated LDO for VCCA to minimize jitter on PLL outputs - switching noise on the analog PLL supply directly translates to clock jitter on derived clocks. Decoupling: at least 16 x 100 nF ceramic caps within 5 mm of the package, plus 4 x 10 uF bulk caps on VCCINT and VCCIO. Estimate core current at 0.5-1 A typical, with peaks above 2 A during configuration.
The 256-FBGA package uses a 1.0 mm ball pitch - PCB design requires laser-drilled or precision-mechanical vias in a 0.4 mm via-pad grid with 0.2 mm drill. Use a 4-layer or 6-layer stackup with one continuous ground plane directly under the BGA for return-path integrity. Matched-length routing on LVDS pairs (skew under 50 ps) is required for DDR memory interfaces and parallel video buses. The BGA requires X-ray inspection post-reflow to verify joint quality; tombstoning on adjacent balls is a common reflow-profile defect.
Estimated: Configuration time from a serial EPCS flash is ~50-200 ms depending on compressed bitstream size - design your host system to wait for CONF_DONE high before releasing downstream resets. A common pitfall is using the same JTAG chain for multiple EP4CE15 devices without TCK buffering - add a JTAG buffer (such as SN74AVC8T245) for chains above 4 devices. Another frequent mistake is leaving unused I/O pins floating - they must be set to tri-state with internal weak pull-up to avoid spurious current draw.
Cyclone IV E I/O banks support LVDS up to 343 Mbps, but matching differential pair lengths is mandatory - aim for skew under 50 ps (about 10 mil at FR-4 dielectric). Place 100 ohm differential termination resistors within 5 mm of the receiver. For DDR/DDR2/DDR3 memory interfaces, place the controller PHY macro in the dedicated DQS logic array block to minimize skew across the byte lane. Use the Quartus Prime TimeQuest timing analyzer with Synopsys Design Constraints (SDC) to validate setup/hold margins on every interface.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified; for automotive applications consider Cyclone IV E -A speed grade variants or migrate to a newer AEC-qualified family. Lead-free and halogen-free per Intel material declaration.
