EP4CGX15CF23C7 - Cyclone IV GX FPGA 15K LEs | Intel | F484
MPN: EP4CGX15CF23C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $73.2 | $732.00 |
| 25 | $68.95 | $1,723.75 |
| 100 | $62.4 | $6,240.00 |
| 500 | $54.8 | $27,400.00 |
EP4CGX15CF23C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that can be reconfigured by the designer after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital logic ICs -> integrated circuits, and are typically used for parallel processing, custom I/O protocols, hardware acceleration, and rapid prototyping when an ASIC is not economically justified.
Key features of the EP4CGX15CF23C7 include up to 72 user I/O pins, two embedded hard memory controllers, eight 3.125 Gbps transceiver channels (in select package options), and support for PCI Express Gen1 (x1/x2) and a wide range of external memory interfaces including DDR2, DDR3, LPDDR2, and QDR II+. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using commodity EPCS serial configuration devices.
Architecturally, the Cyclone IV GX family uses a 60 nm process with a low-k dielectric, 8-input adaptive logic modules (ALMs) that pack into logic array blocks (LABs), and dedicated 18x18 multipliers for DSP workloads. Embedded transceivers are hardened for CPRI, OBSAI, Serial RapidIO, and Gigabit Ethernet PHY connectivity, enabling direct optical/copper backplane interfaces without external PHY devices in many designs.
Typical applications include industrial video bridging, machine vision cameras, broadcast video processing, low-cost wireless backhaul baseband, industrial control and protocol bridging (PROFIBUS, CAN, EtherCAT), PCI Express endpoint cards, and motor control with encoder feedback. The integrated transceivers make it especially attractive for designs that previously required a discrete PHY.
When designing with this FPGA, pay close attention to the transceiver reference clock routing, decoupling network (typically a 100 nF + 1 uF + 10 uF stack per VCC/GXC pair), and JTAG chain access through the dedicated nCONFIG, nSTATUS, and DCLK pins. Programming files (.sof for SRAM, .pof for configuration device) are generated by Intel Quartus II / Quartus Prime.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX15CF23C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX15CF23C7 (same form factor and footprint) β differing in Operating Temperature, Package, Transceivers, Core Voltage, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX15CF23C8N
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX15CF23I7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX15CF23C7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX15CF23C6N
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX15CF23C8
β Drop-Inπ Reference alternative (not in catalog)
EP4CGX15CF23C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 14,400 |
| Embedded Memory | 540 Kbits |
| Embedded 18x18 Multipliers | 0 (DSP blocks absent on this die, use fabric multipliers via IP) |
| Maximum User I/O | 72 |
| Transceivers | Up to 8 channels at 3.125 Gbps (package-dependent) |
| Package | 484-pin FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Operating Temperature | 0C to +85C (Commercial, 'C' suffix) |
| Speed Grade | 7 (medium-speed) |
| Core Voltage | 1.2 V (VCCINT) |
| Process Technology | 60 nm low-power CMOS with low-k dielectric |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG, Active Serial via EPCS |
| Memory Interfaces | DDR2, DDR3, LPDDR2, QDR II+ (via hard memory controllers) |
| PCIe Hard IP | 1 PCIe Gen1 x1/x2 endpoint (in transceiver-capable variants) |
| RoHS Status | Compliant |
| MSL Level | MSL3 (per JEDEC J-STD-020) |
| Mounting Type | Surface Mount, BGA |
| Programming Software | Intel Quartus II / Quartus Prime (subscription or free Lite edition) |
EP4CGX15CF23C7 Pin Configuration
| Pin A1 | VCCIO8A β I/O bank 8A power supply |
| Pin A2 | IO_8A_1 β User I/O, bank 8A |
| Pin B1 | GND β Ground |
| Pin B2 | IO_8A_2 β User I/O, bank 8A |
| Pin C1 | VCCINT β Core voltage 1.2 V |
| Pin C2 | GXB_RX0_CH0_p β Transceiver channel 0 RX positive |
| Pin D1 | VCC_GXB β Transceiver analog supply |
| Pin D2 | GXB_RX0_CH0_n β Transceiver channel 0 RX negative |
| Pin E1 | nCONFIG β Configuration control (active-low reset) |
| Pin E2 | GXB_TX0_CH0_p β Transceiver channel 0 TX positive |
| Pin F1 | nSTATUS β Configuration status (active-low) |
| Pin F2 | GXB_TX0_CH0_n β Transceiver channel 0 TX negative |
| Pin G1 | DCLK β Configuration clock input |
| Pin G2 | DATA0 β Configuration data input |
| Pin H1 | TMS β JTAG test mode select |
| Pin H2 | TCK β JTAG test clock |
| Pin J1 | TDI β JTAG test data input |
| Pin J2 | TDO β JTAG test data output |
| Pin K1 | VCCPD8A β Pre-driver I/O supply bank 8A |
| Pin K2 | GND β Ground |
Typical Applications
EP4CGX15CF23C7 is suitable for 7 applications: Industrial Video Bridging, Machine Vision and Inspection, PCI Express Endpoint Card, Industrial Protocol Bridging, Wireless Backhaul Baseband, Broadcast Video Processing, Motor Control with Encoder Feedback.
Industrial Video Bridging
The EP4CGX15CF23C7 is well-suited for industrial video bridging applications where multiple camera interfaces (GigE Vision, CoaXPress, Camera Link) must be aggregated and forwarded. Its 14,400 logic elements provide ample capacity for protocol state machines and pixel processing, while the integrated 3.125 Gbps transceivers enable direct CoaXPress or 10GigE Base-R connectivity without an external PHY. The 540 Kbits of embedded RAM store line buffers, and the hard PCIe Gen1 endpoint IP simplifies host-side integration in frame grabber cards. The F484 package exposes sufficient user I/O for parallel GPIO and LVDS control paths, while the commercial 0C to +85C temperature range covers most factory-floor enclosures.
Recommended
Machine Vision and Inspection
Machine vision systems benefit from the EP4CGX15CF23C7's combination of low static power and embedded transceivers, which together reduce board area and BOM cost versus an FPGA-plus-discrete-PHY architecture. With 14,400 LEs and 540 Kbits of RAM, the device can host Bayer demosaic, color matrix conversion, and basic blob analysis IP, while the LVDS-capable I/O lanes connect directly to CMOS image sensors. The hard PCIe Gen1 x1/x2 endpoint enables direct image transfer to a host CPU without glue logic. Designers should allocate sufficient PCB layers (typically 6-8) for high-speed transceiver routing and 100-ohm differential impedance control.
Recommended
PCI Express Endpoint Card
The EP4CGX15CF23C7 includes a hard PCIe Gen1 endpoint supporting x1 or x2 lane configurations, making it ideal for low-cost PCIe add-in cards such as data acquisition, software-defined radio front-ends, and protocol analyzers. The hard IP block frees the 14,400 LEs for application logic, while the integrated transceivers eliminate the need for a separate PCIe PHY chip. Per the Cyclone IV GX handbook, the PCIe hard IP supports MSI, MSI-X, and legacy interrupts, plus 64-bit addressing for memory-mapped transfers. The F484 BGA package accommodates both the PCIe edge connector signals and additional GPIO for mezzanine expansion.
Recommended
Industrial Protocol Bridging
Industrial protocol gateways converting between fieldbus standards (PROFIBUS, CANopen, EtherCAT, Modbus, PROFINET) benefit from the EP4CGX15CF23C7's flexible I/O and 14,400 LEs of fabric for protocol state machines. The F484 package exposes up to 72 user I/Os, sufficient for multi-channel isolated transceiver connections to industrial networks. The 540 Kbits of embedded RAM is well-matched to buffer cycle-time-critical frames in EtherCAT slave controllers, while the 3.125 Gbps transceivers can drive 100 Mbit Ethernet PHYs. The commercial temperature grade covers most control cabinet environments, while the EP4CGX15CF23I7N variant handles harsher installations.
Recommended
Wireless Backhaul Baseband
Small-cell and pico-cell wireless backhaul baseband designs can use the EP4CGX15CF23C7 to implement CPRI or OBSAI fronthaul interfacing at up to 3.072 Gbps over the integrated transceivers. The 14,400 LEs accommodate PHY-layer processing, scrambling/descrambling, and antenna-mapping state machines, while the 540 Kbits of M9K RAM serves as data buffers between the air interface and the backhaul Ethernet link. The hard PCIe Gen1 IP enables connection to a host baseband SoC for higher-layer processing. Low static power (~250 mW typical) suits thermally constrained outdoor small-cell enclosures.
Recommended
Broadcast Video Processing
Broadcast video routers, format converters, and multiviewer systems can leverage the EP4CGX15CF23C7's LVDS I/O bandwidth to handle SDI and HDMI bridging alongside general-purpose GPIO for control panels. The 14,400 LEs host scaling, deinterlacing, and on-screen-display engines, while the M9K blocks provide line-store and frame-store memory. The integrated transceivers support 3G-SDI over coaxial cable with external adaptive cable equalizers, reducing board complexity. The commercial temperature range suits studio and headend environments, while the F484 BGA package simplifies high-density PCB layout with controlled-impedance LVDS pairs.
Recommended
Motor Control with Encoder Feedback
Multi-axis servo drives benefit from the EP4CGX15CF23C7's combination of high-speed LVDS I/O for encoder feedback (EnDat, BiSS, SSI) and flexible logic for current-loop and PWM generation. The 14,400 LEs implement field-oriented control (FOC) IP for multiple motor axes, while the 540 Kbits of M9K memory buffers encoder history and adaptive filter coefficients. The integrated transceivers can drive industrial Ethernet protocols such as EtherCAT slave or PROFINET IRT for real-time motion control networks. The commercial temperature range covers cabinet-mounted drives, with the EP4CGX15CF23I7N variant available for harsh-environment installations.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX15CF23C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX15CF23C8N | EP4CGX15CF23I7N | EP4CGX15CF23C7N | EP4CGX15CF23C6N | EP4CGX15CF23C8 |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (F484), 23x23 mm | FBGA-484 (F484) - same | FBGA-484 (F484) - same | FBGA-484 (F484) - same | FBGA-484 (F484) - same | FBGA-484 (F484) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| Embedded Memory | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits | 540 Kbits |
| Speed Grade | 7 | 8 (faster) | 7 (same) | 7 (same) | 6 (slower) | 8 (faster) |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Transceivers | Up to 8 ch @ 3.125 Gbps | Up to 8 ch @ 3.125 Gbps | Up to 8 ch @ 3.125 Gbps | Up to 8 ch @ 3.125 Gbps | Up to 8 ch @ 3.125 Gbps | Up to 8 ch @ 3.125 Gbps |
| Hard PCIe Gen1 Endpoint | Yes (x1/x2) | Yes (x1/x2) | Yes (x1/x2) | Yes (x1/x2) | Yes (x1/x2) | Yes (x1/x2) |
| Unit Price (qty 100, as of 2026-09-10) | $62.40 | ~$68.50 (faster speed grade premium) | ~$70.20 (industrial temp premium) | ~$62.40 (similar) | ~$58.10 (slower speed grade discount) | ~$68.50 (faster speed grade premium) |
Key Differentiators
- Industrial temperature option without redesign (vs EP4CGX15CF23I7N)
- Faster speed grade for higher pixel-clock headroom (vs EP4CGX15CF23C8N)
- Lower-cost variant with relaxed timing (vs EP4CGX15CF23C6N)
Design Notes
Decouple each VCC/VCCINT/VCC_GXB/VCCIO pin with a 100 nF X7R ceramic capacitor placed as close to the BGA ball as possible, and add a 10 uF bulk capacitor per power rail. The Cyclone IV GX power consumption is highly dependent on transceiver utilization: a design with all 8 transceivers active at 3.125 Gbps can reach ~3 W, while a static design with no transceivers may draw only ~250 mW. Use the Intel PowerPlay early power estimator before PCB layout.
Route the GXB transceiver channels using 100-ohm differential striplines on a low-loss PCB stack-up (typically Megtron-6 or Rogers RO4003C for >5 Gbps). Maintain at least 3W spacing between transceiver pairs and other high-speed signals to minimize crosstalk. The transceiver reference clock input requires an ultra-low jitter source (typically <100 fs RMS for 3.125 Gbps operation). Match P and N trace lengths to within 5 mils over the entire channel.
The EP4CGX15CF23C7 supports LVDS inputs and outputs at data rates up to 840 Mbps per channel. For DDR2/DDR3 memory interfaces, use the hard memory controllers and follow the Cyclone IV GX external memory interface guidelines for read/write deskew, fly-by routing, and OCT calibration. External memory interfaces typically require 4-layer PCB with continuous reference planes for impedance-controlled 50-ohm single-ended or 100-ohm differential routing.
Do not mix 1.5 V and 1.8 V VCCIO on the same I/O bank - I/O banks are powered independently, so always consult the Quartus Pin Planner for bank voltage grouping. The configuration scheme (AS, PS, FPP, JTAG) must be selected via MSEL pins before power-up; incorrect MSEL settings cause configuration failure. The MSL3 moisture sensitivity of the F484 BGA requires dry-bag handling and bake-out before reflow if the factory floor humidity exceeds 30 C/60% RH for >8 hours.
Although the EP4CGX15CF23C7 is rated for commercial 0C to +85C, transceiver-heavy designs at high ambient temperature can exceed 100C junction temperature without adequate thermal relief. The F484 BGA has a theta_JA of approximately 15 C/W with a 4-layer JEDEC test board, but real-world designs with limited copper pour may see theta_JA up to 25 C/W. Use thermal vias under the central BGA balls and a continuous ground plane on the inner PCB layers for best thermal performance.
Compliance Information
RoHS compliant per Intel Cyclone IV GX product page. Not AEC-Q100 qualified; the EP4CGX15CF23I7N industrial variant is recommended for harsh-environment applications but is not automotive-grade. MSL3 moisture sensitivity per JEDEC J-STD-020 requires dry-pack handling.
