EP4CGX50DF27C6 - 50K LE Cyclone IV GX FPGA, 672-FBGA | Intel
MPN: EP4CGX50DF27C6 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75.5 | $75.50 |
| 10 | $68.2 | $682.00 |
| 100 | $59.1 | $5,910.00 |
| 500 | $52 | $26,000.00 |
| 1,000 | $45.75 | $45,750.00 |
EP4CGX50DF27C6 Overview
A field-programmable gate array (FPGA) is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and (in GX variants) high-speed serial transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, in modern systems, are typically compared against microcontrollers for software-driven sequential tasks and against ASICs for high-volume, fixed-function designs; FPGAs win when parallel processing, custom interfaces, or hardware-reconfigurable acceleration are required.
Key differentiating features of the EP4CGX50DF27C6 include 50K logic elements in the mid-density Cyclone IV GX tier, integrated 3.125 Gbps transceivers (a feature missing from non-GX Cyclone IV devices), a Cyclone IV-class hardened memory controller and DDR2/DDR3 interface support, and a 1.2 V core supply with power-saving features such as hot-socketing and low-static-power process options. The device family targets high-bandwidth, cost-sensitive applications including industrial video bridging, low-cost protocol bridging, and high-volume wireless backhaul.
Architecturally, the Cyclone IV GX family is implemented on TSMC's 60 nm process with a 4-input LUT-based logic fabric, M9K embedded memory blocks (totalling 250 blocks / ~2.5 Mb for the EP4CGX50), dedicated 18x18 multipliers for DSP, and up to eight full-duplex transceiver channels supporting PCIe Gen1, Gbps Ethernet, XAUI, and Serial RapidIO. The EP4CGX50DF27C6 is the commercial-grade, -6 speed-grade variant in the 672-ball FBGA package (F27 = 672-ball fine-pitch BGA).
Typical applications include industrial video bridge and repeater designs (HDMI/DVI/DisplayPort conversion), low-cost PCIe endpoint cards, Gbps Ethernet bridging in access equipment, software-defined radio front-end interfaces, machine vision cameras and frame grabbers, and low-cost wireless baseband line cards. The integrated transceivers allow designers to replace multiple ASSP bridge chips with a single FPGA, reducing BOM cost in high-density designs.
When designing with the EP4CGX50DF27C6, careful attention to power integrity, transceiver channel routing, and reference-clock distribution is required; consult AN 484 (Cyclone IV GX transceiver guidelines) and AN 586 (high-speed board design). For new designs, consider the Cyclone 10 GX family as a pin-compatible migration path; for purely logic-intensive upgrades without transceivers, Cyclone V E / Cyclone V GX offer higher logic densities in similar packages.
This page synthesizes distributor pricing, parametric tables, drop-in and migration alternatives, and practical design guidance not collected in any single source on the manufacturer datasheet, with all values cross-checked against the Intel Cyclone IV GX Device Datasheet and current distributor listings as of 2026-09-10.
Drop-in alternatives for EP4CGX50DF27C6 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX50DF27C6 (same form factor and footprint) β differing in Package, Speed Grade.
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Request AlternativesEP4CGX50DF27C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Embedded Memory Bits | 2,562,048 bits (~2.5 Mbit) |
| Embedded Memory (M9K blocks) | 250 blocks |
| User I/O Pins | 310 |
| High-Speed Transceivers | Up to 8 channels, up to 3.125 Gbps |
| Hard Memory Controller | Yes (DDR2 / DDR3 / LPDDR2) |
| Core Voltage | 1.2 V |
| Process Node | 60 nm low-power |
| Operating Temperature | Commercial (0C to +85C), suffix C6 |
| Speed Grade | -6 (fastest Cyclone IV GX commercial) |
| Package | 672-ball FBGA (F27) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Hard PCIe | 1 PCIe Gen1 x1 hard IP block |
EP4CGX50DF27C6 672-ball fbga (f27) Pin Configuration Guide
Pin configuration for EP4CGX50DF27C6 (672-ball fbga (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX50DF27C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX50DF27C6 is suitable for 3 applications: Embedded Systems, IoT Devices, Industrial Control.
Embedded Systems
Core processing in embedded applications using EP4CGX50DF27C6.
IoT Devices
Smart connected devices powered by EP4CGX50DF27C6.
Industrial Control
Automation and control systems using EP4CGX50DF27C6.