EP4CGX110DF27C7N - 109K LE Cyclone IV GX FPGA 672-BGA | Intel
MPN: EP4CGX110DF27C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $312.5 | $312.50 |
| 10 | $289 | $2,890.00 |
| 100 | $256.4 | $25,640.00 |
| 500 | $228.75 | $114,375.00 |
| 1,000 | $204.2 | $204,200.00 |
EP4CGX110DF27C7N Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that engineers configure after manufacturing to implement arbitrary digital circuits, DSP blocks, memory controllers, and high-speed serial interfaces. Within the broader taxonomy, FPGAs belong to programmable logic, which is a subset of digital semiconductors alongside ASICs, microcontrollers, and DSP processors. Cyclone IV GX specifically sits inside Intel's low-cost, transceiver-equipped FPGA family and shares the same 60 nm process technology as Cyclone IV E, with the addition of integrated PHY transceivers.
Key specifications of the EP4CGX110DF27C7N include 109,424 logic elements, 5,621,760 RAM bits (approximately 686 Kbytes of block RAM), 393 user I/O pins, eight 3.125 Gbps transceivers, 4 PLLs, and 60 nm process technology. The supply voltage core is 1.2 V, with multi-voltage I/O support (LVDS, LVTTL, LVCMOS, HSTL, SSTL) on every user pin. The 672-ball FBGA package operates across the commercial 0C to +85C junction temperature range.
The Cyclone IV GX architecture combines logic array blocks (LABs), M9K embedded memory blocks, and embedded 18x18 multipliers for DSP operations. Hard IP blocks include transceivers, PCIe controllers, and memory controllers, which significantly reduce the logic resources consumed by common functions and improve deterministic performance. Configuration is typically stored in serial flash and loaded by the FPGA at power-up.
Typical applications for the EP4CGX110DF27C7N include industrial control and machine vision (Camera Link, GigE Vision), video processing and broadcast equipment, low-cost PCIe cards and embedded compute, wireless baseband and small-cell base stations, and test & measurement instrumentation. The integrated transceivers enable 3G-SDI, PCIe Gen1, and Gigabit Ethernet links without external PHYs.
Designers should note that the 672-BGA FineLine package requires careful PCB layout with microvia stack-ups and matched-length routing for the transceiver channels. Power sequencing between 1.2V core, 2.5V/3.3V aux, and I/O banks must follow the Cyclone IV GX handbook to avoid latch-up. Quartus II software is the primary toolchain.
This page synthesizes distributor stock and pricing, parametric alternatives in the same package, and PCB-level design notes that go beyond what is reproduced in the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX110DF27C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF27C7N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX110DF27C8N
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View Datasheet βEP4CGX110DF27I7N
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View Datasheet βEP4CGX110DF27C7
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View Datasheet βEP4CGX110DF27C6N
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View Datasheet βEP4CGX110DF27C7N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Cyclone IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 109,424 |
| Total RAM Bits | 5,621,760 (686 Kbytes) |
| Maximum User I/Os | 393 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | up to 3.125 Gbps |
| Number of PLLs | 4 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.2 V to 3.3 V (multi-voltage) |
| Operating Temperature Range | 0C to +85C (commercial) |
| Package | 672-ball FBGA (F27) |
| Mounting Type | Surface Mount |
| Configuration Memory | External serial flash (active serial) |
| RoHS Status | Compliant |
EP4CGX110DF27C7N 672-ball fbga (f27) Pin Configuration Guide
Pin configuration for EP4CGX110DF27C7N (672-ball fbga (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF27C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF27C7N is suitable for 6 applications: Industrial Machine Vision, Video Processing and Broadcast Equipment, Low-Cost PCIe Add-in Cards, Wireless Small-Cell Base Station, Test and Measurement Instrumentation, Software-Defined Radio Front End.
Industrial Machine Vision
The EP4CGX110DF27C7N suits machine vision pipelines that aggregate multiple Camera Link or GigE Vision streams. With 109,424 logic elements it can implement real-time image preprocessing (filtering, thresholding, Bayer-to-RGB) for two or three simultaneous cameras at 1080p60. The eight 3.125 Gbps transceivers accept 10 GigE Vision, CoaXPress, or dual Camera Link Base streams directly without external PHY parts. The 672-FBGA package is large enough for a 4-layer PCB fan-out, lowering BOM cost versus BGA-484 alternatives. Designers typically place a TI TPS54302 DDR3 termination regulator alongside the FPGA to generate 1.2V core, with 10uF ceramic decoupling on every VCC ball. Compared to a CPU+GPU approach, the FPGA offers deterministic latency for vision-triggered robotic actuation.
Recommended
Video Processing and Broadcast Equipment
The EP4CGX110DF27C7N is well suited to broadcast video processing such as SDI routing, multi-viewers, and lightweight format converters. Its eight transceivers natively drive or receive 3G-SDI, HD-SDI, and SD-SDI simultaneously, eliminating external cable equalizers on receive paths. The 109K logic elements fit HD-SDI cross-point switches up to 16x16 plus ancillary data parsing. Designers benefit from Quartus II IP for SDI and built-in PCIe Gen1 endpoints for host I/O. Compared to discrete ASSPs, the Cyclone IV GX allows rapid feature upgrades via firmware reconfiguration. PCB layout uses controlled-impedance 75-ohm traces routed directly to the BGA balls with reference planes on layer 2.
Recommended
Low-Cost PCIe Add-in Cards
The EP4CGX110DF27C7N integrates a PCIe Gen1 hard IP block, enabling compact half-height PCIe x1 or x4 cards for low-cost data acquisition, protocol bridging, or FPGA-based accelerators. The 109K logic elements can host a custom soft processor (Nios II) plus DMA engines and I/O logic. Power consumption under 5W at 50% utilization simplifies thermal design - no heatsink is required on standard PCIe card form factors. The 672-FBGA package is sufficient to break out 8 PCIe lanes if needed, and the eight transceivers can serve GbE, SATA, or USB 3.0 channels when those are required. Compared to ASIC-based PCIe cards, this FPGA allows post-deployment functionality changes.
Recommended
Wireless Small-Cell Base Station
Small-cell and picocell base stations benefit from the EP4CGX110DF27C7N's combination of high-density logic and transceivers. The 109K logic elements can implement baseband processing for LTE PHY at 20 MHz bandwidth, plus CPRI or OBSAI fronthaul. Eight 3.125 Gbps transceivers handle multiple CPRI links at 2.4576 Gbps or 3.072 Gbps to RRH (remote radio head) modules without external SerDes. Designers can pair it with a TI TCI6630x DSP for higher layer processing. The commercial 0-85C range is acceptable for indoor small-cell deployments; outdoor units should specify the EP4CGX110DF27I7N industrial variant. The 60nm process keeps active power low.
Recommended
Test and Measurement Instrumentation
In test and measurement equipment - protocol analyzers, logic analyzers, pattern generators - the EP4CGX110DF27C7N offers the right balance of high-speed I/O and logic capacity. Its transceivers can be configured for PCIe Gen1, SATA, or GbE for protocol capture; the 109K logic elements implement trigger, sequencing, and display logic for a 32-channel LA. The FPGA's deterministic timing helps capture intermittent glitches that microcontrollers would miss. The 672-FBGA package provides ample pins for parallel test interfaces and front-panel buttons/LEDs. Compared to all-ASIC designs, the FPGA enables rapid customization for new protocols in the field.
Recommended
Software-Defined Radio Front End
Software-defined radio (SDR) front ends leverage the EP4CGX110DF27C7N's transceivers as ADC interface and digital down-conversion (DDC) engine. Eight transceivers at 3.125 Gbps support JESD204B Class 1 connections to modern RF ADCs, while the 109K logic elements implement multiple DDC channels, FFT cores, and channelizers. The M9K memory blocks serve as sample buffers between ADC data and host interface. The commercial temperature grade suits indoor base-station or laboratory SDR; military/aerospace SDR should specify extended-temperature variants. The Quartus II DSP Builder accelerates FIR filter implementation, reducing development time versus handwritten HDL.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF27C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF27C8N | EP4CGX110DF27I7N | EP4CGX110DF27C7 | EP4CGX110DF27C6N |
|---|---|---|---|---|---|
| Package | 672-FBGA (F27) | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Total RAM Bits | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| Maximum User I/Os | 393 | 393 | 393 | 393 | 393 |
| Transceiver Count | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | C7 (speed grade 7) | C8 (speed grade 8) | I7 (industrial, speed grade 7) | C7 (speed grade 7) | C6 (speed grade 6) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Integrated 3.125 Gbps transceivers vs Cyclone IV E devices (vs EP4CE115F23C8N)
- Faster speed grade available (vs EP4CGX110DF27C8N)
- Same Cyclone IV GX die, different package (vs EP4CGX110CF23C7N)
Design Notes
The 672-ball F27 FBGA uses 1.0 mm ball pitch and requires a microvia PCB stack-up with at least 6 layers (signal, GND, signal, PWR, GND, signal). Per Cyclone IV GX handbook recommendations, place at least one decoupling capacitor pair (10uF bulk + 0.1uF HF) per 6 VCC balls. Escape routing on layer 1 should use via-in-pad microvias to maximize break-out density under the BGA.
Estimated: at typical design utilization (50% logic, 50% transceivers active), the EP4CGX110DF27C7N dissipates approximately 2.5W. With the F27 package theta_JA of approximately 13.4 C/W (still air, JEDEC JESD51 test board), junction rises roughly 33C above ambient. Active cooling (small heatsink or 100 LFM airflow) is recommended when transceivers run at full 3.125 Gbps data rate or when ambient exceeds 50C.
Power sequencing must follow the Cyclone IV GX handbook: VCCINT (1.2V core) must reach valid threshold before VCCAUX (2.5V) and VCCIO, or latch-up may occur. Use a TI TPS3808 reset supervisor to sequence rails. Configuration flash (EPCS16 or compatible) must be sized for compressed bitstream - typical 109K LE designs generate 5-8 Mbit compressed images.
Transceiver channels require 85-ohm differential impedance routing with intra-pair length matching within 150 mils. Use GND shielding vias (stitching vias spaced every lambda/20) along the length to suppress crosstalk into adjacent channels. DC-blocking capacitors on the transceiver TX/RX pairs must be 100nF RF-grade (e.g., Murata GRM1555C1H101J) placed within 1 cm of the FPGA ball.
Compliance Information
RoHS compliant per Altera/Intel product page; Pb-free FBGA ball finish. Industrial variant EP4CGX110DF27I7N is AEC-Q100 applicable for harsh environments; the standard C7N part is not AEC-Q100 qualified.
