EP4CGX75DF27I7 - Cyclone IV GX FPGA 73.9kLE 672-FBGA | Intel
MPN: EP4CGX75DF27I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $312.5 | $312.50 |
| 10 | $281.2 | $2,812.00 |
| 100 | $250 | $25,000.00 |
| 250 | $228.4 | $57,100.00 |
| 500 | $210 | $105,000.00 |
EP4CGX75DF27I7 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which evolved from simple PALs and GALs into complex SoC-class silicon. Modern FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital logic hierarchy, offering hardware-level parallelism that CPUs cannot match, while remaining in-system reprogrammable for iterative design and field updates.
Key features of the EP4CGX75DF27I7 include 4,257,792 bits of embedded RAM (approximately 4 Mbit), embedded 18x18 multipliers for DSP workloads, and high-speed transceivers supporting protocols such as PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The Cyclone IV GX family is fabricated on a low-power 60nm process, providing an attractive balance between performance and static power consumption. The device also integrates dedicated hard IP for memory controllers (DDR/DDR2 SDRAM) and PLL-based clock management.
The FBGA-672 package exposes 310 general-purpose I/Os alongside the transceiver and memory interfaces, enabling dense board-level integration. Configuration is supported through multiple modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP), giving designers flexibility during prototyping and production. The industrial temperature grade makes the part suitable for environments beyond benign commercial conditions.
Typical applications for the EP4CGX75DF27I7 include industrial video processing and broadcast equipment, automotive driver assistance and infotainment, telecommunications line cards, machine vision and factory automation, and low-cost PCIe endpoint cards. Its combination of transceiver bandwidth, logic density, and modest power profile makes it particularly well-suited to high-volume cost-sensitive designs.
When designing with this FPGA, careful power-rail sequencing is required for the 1.2V core, 2.5V/3.3V I/O banks, and the 1.2V PLL/transceiver analog supply. Decoupling must follow the reference design's recommended capacitor mix near each supply pin, and the JTAG chain should include pull-ups per the device handbook. For signal integrity, the transceiver channels require controlled-impedance routing and length matching per the protocol specification.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP4CGX75DF27I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75DF27I7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Number of Transceivers, Device Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX75DF27C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$96.4 / Unit
View Datasheet →EP4CGX75DF27C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.9 / Unit
View Datasheet →EP4CGX110DF27I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP4CGX150DF27I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175.6 / Unit
View Datasheet →EP4CGX50DF27I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$155.4 / Unit
View Datasheet →EP4CGX75DF27I7 Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone IV GX |
| Logic Elements | 73,920 LE |
| Embedded Memory | 4,257,792 bits (4.06 Mbit) |
| Maximum User I/Os | 310 |
| Package | 672-ball FBGA (F27) |
| Operating Supply Voltage (Core) | 1.2 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Process Technology | 60 nm low-power |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
EP4CGX75DF27I7 672-ball fbga (f27) Pin Configuration Guide
Pin configuration for EP4CGX75DF27I7 (672-ball fbga (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75DF27I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75DF27I7 is suitable for 7 applications: Industrial Machine Vision, PCIe Endpoint Cards, Broadcast Video Processing, Automotive Infotainment, Telecom Line Cards, Factory Automation Controllers, Software Defined Radio Front End.
Industrial Machine Vision
The EP4CGX75DF27I7 fits machine vision preprocessing with its 73,920 logic elements and 4.06 Mbit embedded memory, enough to handle line-scan buffering, Bayer demosaicing, and basic edge-detection pipelines at GigE Vision frame rates. The 310 user I/Os in FBGA-672 support parallel camera interfaces and GPIO for trigger synchronization, while the high-speed transceivers carry GigE Vision or CoaXPress links up to 3.125 Gbps. The industrial -40C to +85C temperature range matches factory-floor conditions. Designers typically pair it with external DDR2 SDRAM via the dedicated memory controller, and use the device's hard PCIe endpoint for host offload.
Recommended
PCIe Endpoint Cards
The Cyclone IV GX family integrates a hard PCIe Gen1 IP core, making the EP4CGX75DF27I7 ideal for low-cost PCIe endpoint cards such as data-acquisition boards, software-defined radio front ends, and protocol analyzers. With 73,920 LEs for application logic, 4 Mbit embedded RAM for packet buffering, and high-speed transceivers supporting PCIe Gen1 x1/x2/x4, the device meets low-volume, cost-sensitive I/O expansion needs. Industrial temperature grade and FBGA-672 package support dense add-in card layouts. Quartus Prime software includes a complete PCIe reference design with example application logic and driver examples.
Recommended
Broadcast Video Processing
The EP4CGX75DF27I7's combination of 73,920 logic elements, 4.06 Mbit embedded memory, and 310 user I/Os makes it well-suited for broadcast video processing equipment such as up/down/cross converters, multiviewers, and signal generators. Its 18x18 multipliers handle color-space conversion and scaling interpolation, while high-speed transceivers support SDI interfaces (up to 3G-SDI via external PHY or soft IP). The FBGA-672 footprint integrates 310 I/Os sufficient for multi-channel SDI and audio embed/de-embed logic. Industrial temperature grade suits both studio and outside-broadcast deployment. The device supports JTAG boundary-scan for production test.
Recommended
Automotive Infotainment
The EP4CGX75DF27I7 can be deployed in automotive infotainment head units, driver information displays, and rear-seat entertainment systems. Its 73,920 LEs handle H.264 decode assist, video scaling, and graphics compositing, while 4 Mbit embedded memory provides frame-buffer and lookup-table storage. The 672-ball FBGA package supports 310 I/Os for display panels, touch controllers, MOST network interfaces, and automotive Ethernet PHYs. Industrial temperature grade suits cabin environments; for under-hood or AEC-Q100 qualified applications, designers should select an automotive-grade Cyclone IV variant. Quartus Prime supports CAN, LIN, and FlexRay soft IP.
Recommended
Telecom Line Cards
The EP4CGX75DF27I7 supports low-density telecom line cards, including channelized T1/E1 aggregation, framer/mapper functions, and CPRI baseband for small-cell radio units. The high-speed transceivers support CPRI up to 3.1 Gbps and OBSAI, while 73,920 LEs provide capacity for header processing, encryption, and traffic management. The 4.06 Mbit embedded RAM and external DDR2 memory interface (via dedicated hard memory controller) accommodate packet buffers. Industrial temperature grade and FBGA-672 with 310 I/Os suit ATCA/AMC and proprietary backplane designs.
Recommended
Factory Automation Controllers
The EP4CGX75DF27I7 serves in PLCs, motion controllers, and EtherCAT/PROFINET slave modules where deterministic real-time performance is critical. The 73,920 logic elements implement the application CPU fabric and EtherCAT slave controller with distributed-clock jitter below 1 microsecond. The 310 I/Os in FBGA-672 provide digital I/O, encoder interfaces, and fieldbus connections. Industrial -40C to +85C operation handles cabinet temperatures and outdoor installations. The transceivers carry industrial Ethernet at 100 Mbit/s and 1 Gbit/s. Quartus Prime's Qsys toolchain accelerates integration of soft IP cores for common fieldbus protocols.
Recommended
Software Defined Radio Front End
The EP4CGX75DF27I7 is suited to low-cost SDR front-end cards for spectrum monitoring, amateur radio, and educational platforms. Its 73,920 LEs implement digital down-conversion, filtering, and FFT processing; the 18x18 multipliers handle complex-mixer math; 4.06 Mbit embedded RAM serves as sample buffers. The high-speed transceivers digitize IF signals via external ADC/DAC interfaces and feed processed data to a host over PCIe Gen1. The FBGA-672's 310 I/Os expose LVDS pairs for ADC/DAC connections. Industrial temperature grade supports portable and vehicle-mounted SDR. Quartus Prime DSP Builder accelerates MATLAB-to-FPGA workflows.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75DF27I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75DF27C7N | EP4CGX75DF27C6N | EP4CGX110DF27I7N | EP4CGX150DF27I7N | EP4CGX50DF27I7N |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 73,920 LE | 73,920 LE - same | 73,920 LE - same | 109,424 LE (+48%) | 149,760 LE (+103%) | 49,888 LE (-32%) |
| Embedded Memory | 4,257,792 bits (4.06 Mbit) | 4,257,792 bits - same | 4,257,792 bits - same | 5,490,432 bits (+29%) | 6,635,520 bits (+56%) | 2,502,144 bits (-41%) |
| Maximum User I/Os | 310 | 310 - same | 310 - same | 310 - same | 310 - same | 290 (-6%) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Speed Grade | I7 (Industrial, fast) | C7 (Commercial, fast) | C6 (Commercial, slower) | I7 (Industrial, fast) | I7 (Industrial, fast) | I7 (Industrial, fast) |
| Core Voltage | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same |
| Transceivers | Up to 3.125 Gbps (per family) | Up to 3.125 Gbps - same | Up to 3.125 Gbps - same | Up to 3.125 Gbps - same | Up to 3.125 Gbps - same | Up to 3.125 Gbps - same |
Key Differentiators
- Mid-density sweet spot in the Cyclone IV GX family (vs EP4CGX50DF27I7N)
- Lower cost than higher-density siblings in the same package (vs EP4CGX150DF27I7N)
- Industrial temperature grade for harsh environments (vs EP4CGX75DF27C7N)
Design Notes
The EP4CGX75DF27I7 requires four supply rails: 1.2V core (VCCINT), 2.5V or 3.3V I/O banks (VCCIO), 1.2V analog supply for transceivers and PLLs (VCCA), and a 2.5V/3.0V charge-pump supply (VCCD_PLL). Per the Cyclone IV GX device handbook, all four rails must power up within 100 ms of each other to prevent latch-up. Place 0.1 uF and 10 uF decoupling capacitors adjacent to each supply pin group, and use a ferrite bead to isolate PLL analog supply from digital noise. Power sequencing: VCCINT first, then VCCIO, then VCCA. Reverse sequencing is not supported. Use a power supervisor with adjustable timing to guarantee monotonic ramp.
The 672-ball FBGA package has a 1.0 mm ball pitch. Per the Cyclone IV GX handbook, use 0.5 mm-diameter solder-ball land pads with non-solder-mask-defined (NSMD) finish for best BGA-attach yield. Inner-layer escape routing requires microvia stack-ups (e.g., 1-2-1 or 1-4-1 HDI). For 8-layer stack-up, dedicate one full ground plane adjacent to signal layers for controlled-impedance single-ended (50 ohm) and differential (100 ohm) routing. Transceiver channels demand length matching within 0.127 mm of intra-pair, and within 6.35 mm channel-to-channel for multi-lane protocols (PCIe, XAUI). Reference the device handbook pinout tables before finalizing escape.
Estimated: at full logic utilization (75% LE usage) and 3.125 Gbps transceiver activity, the EP4CGX75DF27I7 can dissipate 2-3 W. Without a heatsink, the 1.0 mm FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board, giving 30-45 C rise above ambient. Industrial applications at 85C ambient can approach 130C junction - within the device limit but with little margin. To reduce junction temperature, increase the number of thermal vias under the package, expand the inner copper ground planes beneath the BGA, or attach a small BGA-compatible heatsink with thermal interface material.
High-speed transceiver channels of the EP4CGX75DF27I7 (up to 3.125 Gbps) require controlled-impedance differential routing per PCIe, Gigabit Ethernet, or SDI specifications. Use 100 ohm differential impedance with intra-pair length matching tighter than 0.127 mm. AC-coupling capacitors (typically 100 nF) are required on transmit paths; place them close to the FPGA pin. Reference the device handbook's per-protocol reference designs for pre-emphasis and equalization settings. The receiver requires a clean reference clock from a low-jitter oscillator (e.g., 100 MHz LVDS); route this clock on an inner layer with ground shielding.
Common pitfalls when designing with the EP4CGX75DF27I7: (1) Forgetting the 2.5V/3.0V charge-pump supply (VCCD_PLL) - this rail is separate from VCCA and is required for PLL operation. (2) Driving JTAG TCK with a non-3.3V signal - the JTAG pins require 2.5V or 3.3V VCCIO, and TCK should be pulled up per the handbook. (3) Mixing transceiver and non-transceiver I/O standards in the same bank - the Cyclone IV GX has dedicated transceiver banks that must be left at default settings if unused. (4) Failing to program the configuration mode pins MSEL[3:0] to the correct state for AS, PS, or FPP modes. (5) Not connecting the unused transceiver channels to ground through the recommended resistor network.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified; for automotive applications requiring AEC-Q100, select a designated automotive-grade variant. Lead-free (Pb-free) finish standard for FBGA-672. Halogen-free status not stated in the verified data.
