Intel

EP4CGX75DF27I8N - Cyclone IV GX FPGA, 73,920 LEs, 672-FBGA | Intel

MPN: EP4CGX75DF27I8N ✓ Active

In Stock Ships in 1-3 business days

1.2 V Vdss 672-ball FBGA (F27) Package 4,257,792 Memory

From $89.95 USD / Unit

MOQ: 1 |

Price updated: 2026-09-10

Volume Pricing

Qty	Unit Price	Extended
1	$145	$145.00
10	$132.5	$1,325.00
100	$118.75	$11,875.00
500	$102.4	$51,200.00
1,000	$89.95	$89,950.00

ℹ️ All prices are in USD

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EP4CGX75DF27I8N Overview

The Intel (formerly Altera) EP4CGX75DF27I8N is a Cyclone IV GX field-programmable gate array (FPGA) delivering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball fine-pitch BGA package. Manufactured on a 60 nm low-power process and powered from a 1.2 V core supply, it targets cost-sensitive, low-power, high-volume applications requiring integrated transceivers.

A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated I/O, allowing designers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Cyclone IV GX family specifically adds high-speed serial transceivers, making it suitable for protocols such as PCI Express Gen1, Gigabit Ethernet, and serial RapidIO.

Key features include 3.125 Gbps transceivers, 8 transceiver channels, dedicated 18x18 multipliers for DSP, and a hard memory controller. The device supports a JTAG interface for boundary-scan and configuration via Altera/Intel Quartus Prime design software. Industrial temperature grade (-40C to +100C junction) and high I/O count support applications ranging from industrial motor control to wireless baseband processing.

The Cyclone IV GX architecture combines a logic fabric with embedded transceivers, providing up to 5,136 Kbits of RAM distributed as M9K blocks and 414 Kbits as M144K blocks. Hard IP blocks include the memory controller and PCIe interface, reducing soft logic utilization. The 672-FBGA package supports high I/O density for complex system designs.

Typical applications include industrial motor control, video processing, software-defined radio, wireline and wireless communication infrastructure, automotive driver assistance, and test and measurement equipment. The integrated transceivers and PCIe support make it ideal for protocol bridging and low-cost serial connectivity. Designers should consult the Quartus Prime toolchain for configuration bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design considerations not found in the manufacturer datasheet alone.

Drop-in alternatives for EP4CGX75DF27I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX75DF27I8N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Mounting Type, Configuration Method.

EP4CGX110DF27I7N

Intel

Package: 672-ball FBGA, 1.0 mm pitch

Operating Temperature: -40C to +100C (Industrial)

Mounting Type: Surface Mount

Compare with EP4CGX75DF27I8N →

EP4CGX75CF23I8N

Intel

Package: 484-ball FBGA

Process Technology: 60 nm

Mounting Type: Surface Mount (BGA)

Compare with EP4CGX75DF27I8N →

EP4CGX75DF27C7N

Intel

Package: 672-FBGA (27 x 27 mm, 1.0 mm pitch)

Operating Temperature: 0C to +85C (commercial, C7 suffix)

Process Technology: 60 nm low-power

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EP4CGX75DF27C8N

Intel

Mounting Type: Surface Mount

Configuration Method: SRAM-based, requires external config device

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✅ Drop-In

Intel

📦 672-FBGA (F27)

Cyclone IV GX · EP4CGX110 · 109,424 · 6,422 · 5,621,760 · 610 · 280 · 393

✓ In Stock

$198 / Unit

View Datasheet →

EP4CGX75DF27I8N Maximum Ratings & Electrical Characteristics

Family	Cyclone IV GX
Logic Elements	73,920
Total Memory Bits	4,257,792
User I/O Pins	310
Transceiver Channels	8
Max Transceiver Data Rate	3.125 Gbps
Process Technology	60 nm low-power CMOS
Core Voltage	1.2 V
Package	672-ball FBGA (F27)
Operating Temperature	-40C to +100C (Industrial, I-suffix)
Hard IP	PCIe Gen1, memory controller
Configuration Interface	JTAG, serial, passive parallel

EP4CGX75DF27I8N 672-ball fbga (f27) Pin Configuration Guide

Pin configuration for EP4CGX75DF27I8N (672-ball fbga (f27) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-ball fbga (f27) package pinout diagram for EP4CGX75DF27I8N

No detailed pinout data available for EP4CGX75DF27I8N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX75DF27I8N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Bridging, Software-Defined Radio Baseband, PCIe Endpoint Card Design, Wireline Telecom Bridge and Aggregation, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP4CGX75DF27I8N's 73,920 logic elements, integrated 8-channel 3.125 Gbps transceivers, and industrial -40C to +100C temperature range make it ideal for high-axis-count servo drives and AC inverter control. The device can implement multiple field-oriented control (FOC) loops, sigma-delta modulator interfaces for current sensing, and encoder feedback handling in parallel. Industrial motor control designs benefit from the dedicated 18x18 multipliers enabling fast Park/Clarke transforms. Place the FPGA between the host MCU/DSP and the power-stage gate drivers, using isolated SPI interfaces to manage IGBT/MOSFET timing-critical events. Compared with microcontroller-only solutions, the Cyclone IV GX offloads the real-time control loops, freeing the processor for supervisory tasks.

Recommended

📺

Video Processing and Display Bridging

With 310 user I/Os, 8 dedicated transceivers, and 4,257,792 bits of embedded memory, the EP4CGX75DF27I8N handles multi-stream video bridging between HDMI, DisplayPort, LVDS, and SDI interfaces. The device supports real-time color-space conversion, scaling, and overlay generation at 1080p60 or dual 720p streams. Memory is sufficient for line buffering in pipelined video architectures. The 3.125 Gbps transceivers deliver uncompressed SDI at HD rates; LVDS pairs (up to 155 on the package) handle parallel RGB/YCbCr buses. Place the FPGA between the video source ASIC and the display panel, with DDR2 memory connected via dedicated DQS pins for frame buffering. Hard memory controllers simplify external SDRAM interfacing.

Recommended

EP4CGX110DF27I7N · Intel EP4CGX75DF27I7N · Intel

🌐

Software-Defined Radio Baseband

The EP4CGX75DF27I8N's 8 integrated 3.125 Gbps transceivers and 73,920 LEs are well-matched to baseband processing for software-defined radio platforms targeting sub-6 GHz wireless protocols. The device can implement digital down/up-conversion, channelization filters, FFT engines, and MAC-layer processing in parallel. The industrial temperature grade supports outdoor small-cell and picocell deployments. The hard PCIe Gen1 IP enables direct connection to host baseband processors over PCIe x1. Compared with ASIC implementations, the Cyclone IV GX allows post-deployment protocol updates - critical for evolving cellular standards. Place the FPGA between the RF front-end ADC/DAC and the host CPU, with transceivers connected to JESD204B converters or direct RF sampling ADCs.

Recommended

EP4CGX110DF27I7N · Intel EP4CGX75DF27C8N · Intel

🖥️

PCIe Endpoint Card Design

The EP4CGX75DF27I8N's hard PCIe Gen1 IP and integrated transceivers enable direct connection to a PCIe x1 or x4 host slot without external PHY chips. The device is well-suited to industrial I/O cards, data acquisition modules, and protocol analyzer endpoints. 73,920 LEs are sufficient for typical endpoint designs with DMA engines, scatter-gather logic, and user I/O handling. Industrial temperature grading allows use in uncontrolled chassis. Place the FPGA on a PCIe card with the device's PCIe hard IP connected to the slot edge fingers, and use remaining user I/Os for the application's external interfaces. Compared with PCIe bridge chips, the FPGA allows custom protocol implementation and register-level optimization.

Recommended

EP4CGX50DF27I7N · Altera EP4CGX110DF27I7N · Intel

🌐

Wireline Telecom Bridge and Aggregation

With 8 transceivers and abundant logic, the EP4CGX75DF27I8N implements multi-protocol wireline bridges including GbE, SGMII, serial RapidIO, and proprietary serial links. The device supports line-card aggregation, framer/mapper functions, and TDM-to-packet conversion in carrier-grade equipment. Hard memory controllers simplify connection to RLDRAM or DDR2 for packet buffering. The industrial temperature grade and high I/O count make it appropriate for central-office line cards. Place the FPGA between the network processor ASIC and the SFP/QSFP cages, with transceivers handling the SERDES lanes. Compared with dedicated ASSPs, the FPGA supports multiple protocols on the same hardware platform.

Recommended

EP4CGX110DF31I7N · Intel EP4CGX150DF31I7N · Intel

🔧

Test and Measurement Instrumentation

The EP4CGX75DF27I8N delivers the DSP horsepower and high-speed serial bandwidth required for protocol analyzers, logic analyzers, and bit-error-rate testers. 18x18 hardware multipliers accelerate FFT and PRBS generation/checking in real time. The 3.125 Gbps transceivers support testing of PCIe, GbE, SATA, and custom serial protocols up to 3 Gbps. Industrial temperature grading enables portable and field-instrument deployment. Place the FPGA as the central timing and signal-processing element, with transceivers connected to the DUT probe interface and parallel I/Os driving the front-panel display. Compared with DSP-only solutions, the FPGA allows real-time triggering and statistics with deterministic latency.

Recommended

EP4CGX110DF27I7N · Intel EP4CGX75DF27C8N · Intel

Recommended Products Summary

EP4CGX50DF27I7N Altera Used in: Industrial Motor Control, PCIe Endpoint Card Design EP4CE75F29I7N Intel Used in: Industrial Motor Control EP4CGX110DF27I7N Intel Used in: Video Processing and Display Bridging, Software-Defined Radio Baseband, PCIe Endpoint Card Design, Test and Measurement Instrumentation EP4CGX75DF27I7N Intel Used in: Video Processing and Display Bridging EP4CGX75DF27C8N Intel Used in: Software-Defined Radio Baseband, Test and Measurement Instrumentation EP4CGX110DF31I7N Intel Used in: Wireline Telecom Bridge and Aggregation EP4CGX150DF31I7N Intel Used in: Wireline Telecom Bridge and Aggregation

What is the logic element count of EP4CGX75DF27I8N?

The EP4CGX75DF27I8N contains 73,920 logic elements (LEs) per Altera Cyclone IV device family datasheet. This LE count places it in the mid-to-high density range of the Cyclone IV GX family. Each LE contains a 4-input look-up table, register, and arithmetic logic, supporting up to 4,257,792 bits of user-accessible embedded memory.

How many transceivers does EP4CGX75DF27I8N support?

The EP4CGX75DF27I8N integrates 8 high-speed serial transceiver channels operating up to 3.125 Gbps each. These transceivers support protocols including PCI Express Gen1, Gigabit Ethernet, serial RapidIO, and SDI. The transceiver channels are hardened in silicon, freeing logic fabric for application processing.

What package does EP4CGX75DF27I8N use?

The EP4CGX75DF27I8N ships in a 672-ball fine-pitch BGA package (F27 designation). The F27 code identifies this specific BGA footprint and ball pitch per Altera/Intel packaging convention. The package supports 310 user I/O pins plus transceiver and supply balls. PCB layout requires microvia stack-up due to the fine pitch.

Where can I download the EP4CGX75DF27I8N datasheet PDF?

The Cyclone IV device family overview datasheet containing EP4CGX75 specifications is available at https://www.alldatasheet.com/datasheet-pdf/pdf/543883/ALTERA/EP4CGX75.html. For full ordering-part-number detail, the Intel/Altera product page for F27 package variants contains OPN-specific pinout and ordering information. Registration with Intel may be required for the latest revision.

What is the difference between EP4CGX75DF27I8N and EP4CGX75DF27I7N?

Both parts share the same 672-FBGA F27 footprint and 73,920 LE Cyclone IV GX silicon. The I8N variant is industrial temperature grade with speed grade 8, while the I7N variant uses speed grade 7 (slightly lower timing performance). They are functionally drop-in compatible; choose I8N when timing margin is critical and I7N when slightly relaxed timing is acceptable.

Where to buy EP4CGX75DF27I8N online?

The EP4CGX75DF27I8N is available through authorized distributors including Jotrin, Vemeko, and Ampheo (as of 2026-09-10). Authorized distributors provide traceability documentation for FPGA components. Contact XAIPART sales for current stock and lead time, as FPGAs often have 8-16 week lead times depending on wafer availability.

What is the price of EP4CGX75DF27I8N?

The EP4CGX75DF27I8N unit price starts at approximately $145.00 at qty 1, dropping to around $89.95 at qty 1000 (as of 2026-09-10). Pricing varies by distributor; industrial-grade Cyclone IV GX FPGAs typically command $80-$150 per unit in production volumes. Volume quotes should be requested directly for orders above 100 pieces.

What is the lead time for EP4CGX75DF27I8N?

Lead time for EP4CGX75DF27I8N is typically 8-16 weeks from authorized distributors as of 2026-09-10. Industrial-grade Cyclone IV GX FPGAs are mature products with stable supply, but BGA package variants occasionally face wafer allocation. Check distributor inventory for in-stock reels or request scheduled orders for production quantities.

Is EP4CGX75DF27I8N in stock?

Stock availability for EP4CGX75DF27I8N varies by distributor (as of 2026-09-10). Ampheo and Jotrin list it as quote-on-request with order-on-demand fulfillment. For confirmed stock counts, contact authorized distributors directly with required quantities and target delivery dates. Industrial-grade parts often have 8-12 week production slots.

EP4CGX75DF27I8N vs EP4CGX75DF27I7N - which is better for industrial control?

Both the I8N and I7N speed-grade variants share the -40C to +100C industrial temperature range and 672-FBGA F27 footprint. The I8N variant offers a faster speed grade (8) providing approximately 15% better Fmax performance, while the I7N uses speed grade 7. For motor control at typical PWM frequencies under 100 kHz, both are sufficient; choose I8N for higher-speed DSP or video processing.

When should I choose EP4CGX75DF27I8N over EP4CGX110DF27I7N?

Choose the EP4CGX75DF27I8N when 73,920 LEs meet your design requirement, as it is lower cost than the larger EP4CGX110DF27I7N (which has 109,560 LEs). Select the EP4CGX110 only when the additional 35,640 LEs, expanded memory, or extra transceiver resources are required. Both share the Cyclone IV GX family architecture and 1.2 V core supply.

What is the best drop-in replacement for EP4CGX75DF27I8N?

The best drop-in replacement is EP4CGX75DF27I7N (industrial temp, speed grade 7) or EP4CGX75DF27C8N (commercial temp, speed grade 8) - both share the 672-FBGA F27 footprint and pin-compatible pinout. Cross-brand Cyclone IV GX equivalents from other manufacturers are not available; the Cyclone IV family is unique to Intel/Altera with no direct second-source FPGA supplier for the same silicon.

Can EP4CE75F29I7N replace EP4CGX75DF27I8N?

No - the EP4CE75F29I7N belongs to the Cyclone IV E (non-GX) family and lacks integrated transceivers, so it is not a drop-in replacement for the EP4CGX75DF27I8N. Additionally, the EP4CE75 uses a different F29 package, not the F27 footprint. For transceiver-based designs, stay within the Cyclone IV GX family and choose a same-footprint variant.

What are the key specifications of EP4CGX75DF27I8N that engineers should know?

Key specs: 73,920 logic elements, 4,257,792 bits embedded memory, 310 user I/O, 8 transceiver channels at 3.125 Gbps, 672-ball FBGA F27 package, 1.2 V core, -40C to +100C industrial temp, hard PCIe Gen1 IP, and 60 nm low-power CMOS process. The combination of mid-density logic and integrated transceivers distinguishes it from non-GX Cyclone IV variants.

Hey Google, can EP4CGX75DF27I8N be replaced by any Xilinx or Lattice equivalent?

There is no direct Xilinx or Lattice drop-in replacement for the EP4CGX75DF27I8N because it uses Intel/Altera's proprietary Cyclone IV GX silicon in a 672-ball FBGA F27 footprint. Closest Xilinx alternatives would be the Spartan-6 LXT family in a different package, requiring PCB redesign. Lattice ECP3 or ECP5M families are also cross-package equivalents - none share the same ball map.

Engineering reference data for EP4CGX75DF27I8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CGX75DF27I8N when you need mid-to-high density Cyclone IV GX logic (73,920 LEs) with industrial temperature grading in the 672-ball F27 BGA footprint. It is the right choice for designs requiring 3.125 Gbps transceivers, hard PCIe Gen1 IP, and operation in -40C to +100C environments. If your design requires faster timing margins, stay with the I8N speed grade; if your design runs at lower clock rates and you want cost savings, drop to the I7N variant (pin-compatible). For designs needing only commercial temperature, the C8N variant offers identical silicon at lower cost. If your logic requirements exceed 73,920 LEs, move to the EP4CGX110DF27I7N in the same F27 footprint. If your design does not require transceivers, consider the Cyclone IV E family (e.g., EP4CE75F29I7N) which uses a different F29 package and lacks SERDES, providing cost savings at the expense of a PCB redesign.

Comparison with Alternatives

Parameter	This Product	EP4CGX75DF27I7N	EP4CGX75DF27C8N	EP4CGX75DF27C7N	EP4CGX75CF23I8N	EP4CGX110DF27I7N
Package	672-FBGA (F27)	672-FBGA (F27) - same	672-FBGA (F27) - same	672-FBGA (F27) - same	672-FBGA (F23) - different ball map	672-FBGA (F27) - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	73,920	73,920	73,920	73,920	73,920	109,560
Transceiver Channels	8	8	8	8	8	8
Speed Grade	8	7	8	7	8	7
Temperature Grade	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Process Technology	60 nm	60 nm	60 nm	60 nm	60 nm	60 nm
Transceiver Data Rate (max)	3.125 Gbps	3.125 Gbps	3.125 Gbps	3.125 Gbps	3.125 Gbps	3.125 Gbps

Key Differentiators

Fastest speed grade in F27 footprint (vs EP4CGX75DF27I7N)
Industrial temperature range for harsh environments (vs EP4CGX75DF27C8N)
Highest LE density within F27 footprint (vs EP4CGX110DF27I7N (smaller variant))

Design Notes

The 672-ball F27 FBGA package requires a high-density PCB stack-up with microvias and controlled-impedance routing for SERDES lanes. Use Intel/Altera's Cyclone IV GX pin connection guidelines: each transceiver channel needs precise 100-ohm differential routing and DC-blocking capacitors on the TX/RX pairs. Decoupling: place 100nF capacitors within 100 mils of every power pin and 10uF bulk capacitors near each power island. PCIe hard IP requires specific REFCLK routing and a 100 MHz reference clock source with sub-300 ppm accuracy.

Estimated: at typical industrial motor-control utilization of 50,000 LEs at 200 MHz toggling, the EP4CGX75DF27I8N dissipates approximately 2-3 W. The 672-FBGA package requires a thermal pad or thermal vias to an internal copper pour; with proper layout, theta_JA can reach 15-20 C/W, keeping Tj below 85°C at room ambient. Without thermal vias, junction temperature may rise above the industrial max, derating performance. Use a thermal camera or on-chip temperature diode for verification during bring-up.

Cyclone IV GX configuration requires careful attention to MSEL pin strapping for the correct configuration mode (AS, PS, JTAG). Wrong MSEL values cause configuration failure. The device also requires proper power sequencing: 1.2 V core must ramp before 2.5 V/3.3 V I/O banks, or the I/Os may back-power the core. Always use the Altera/Intel Quartus Prime Pin Planner to verify pin assignments, especially for transceiver channel placement (GXBN pins) which have dedicated locations and cannot be reassigned arbitrarily.

For 3.125 Gbps transceiver operation, follow Intel's Cyclone IV GX Transceiver User Guide for board design. Maintain 100-ohm differential impedance on TX/RX pairs with intra-pair skew below 1 ps and AC-coupling capacitors placed symmetrically. Use a continuous reference plane beneath the SERDES lanes; avoid routing over power-plane splits. For PCIe Gen1 operation, ensure REFCLK meets PCIe CEM specification (300 ppm accuracy, -8 dBm to -16 dBm amplitude). Use IBIS-AMI models for channel simulation during design sign-off.

Compliance Information

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

Lead-free and RoHS compliance should be confirmed from the manufacturer product page; industrial-grade Intel/Altera FPGAs are typically RoHS compliant but exact compliance docs vary by OPN. Not AEC-Q100 qualified - this part is industrial-grade (-40C to +100C), not automotive-grade.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Manufacturer_Datasheet, Manufacturer_Product_Page, Manufacturer_Product_Page, Distributor, Distributor, Distributor

Related Components & Terms

Intel Altera EP4CGX75DF27I8N EP4CGX75DF27I7N EP4CGX75DF27C8N EP4CGX75DF27C7N EP4CGX75CF23I8N EP4CGX110DF27I7N Cyclone IV GX FPGA Field-Programmable Gate Array Programmable Logic Device PLD Logic IC Integrated Circuit 672-FBGA BGA Fine-pitch BGA PCI Express Gen1 PCIe hard IP SERDES 3.125 Gbps transceiver 60 nm CMOS JTAG Quartus Prime Industrial temperature grade IEC 60721-3-3 RoHS M9K memory block M144K memory block hard memory controller DDR2 controller PCIe endpoint FPGA fabric logic element look-up table DSP block 18x18 multiplier PLL phase-locked loop video processing motor control field-oriented control software-defined radio serial RapidIO Gigabit Ethernet SGMII bit-error-rate tester logic analyzer test and measurement industrial automation