EP4SE820F43C3G - Stratix IV E 813K LEs FPGA | Intel (Altera)
MPN: EP4SE820F43C3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28861.27 | $28,861.27 |
| 10 | $25975.14 | $259,751.40 |
| 25 | $23088.94 | $577,223.50 |
| 50 | $20202.86 | $1,010,143.00 |
| 100 | $17316.76 | $1,731,676.00 |
EP4SE820F43C3G Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver hard IP, all tied together by a hierarchy of routing resources. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors, and are typically deployed where ASIC NRE costs are prohibitive or where post-deployment hardware updates are required. The Stratix IV E family targets applications such as wireline communications, ASIC prototyping, high-performance DSP, and military/aerospace systems.
Key features include 1120 user I/O pins, up to 8.5 Gbps transceivers, hard memory controllers, PCIe hard IP, and DSP blocks capable of 600+ MHz operation. The device integrates dedicated hardware for memory interfaces including DDR3 support, and offers robust SEU mitigation via the soft error detection and correction circuitry inherent to the Stratix IV architecture. Operating at a core voltage of 0.9 V and supporting industrial junction temperatures, it fits both commercial and industrial-grade deployments.
The architecture combines a fine-grained ALM structure with high-efficiency routing, an embedded memory hierarchy with 600 MHz true-dual-port SRAM, and dedicated variable-precision DSP blocks. Hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet reduces soft-logic overhead. The 1760-BBGA package is a flip-chip land-grid-array that maximizes I/O density while delivering excellent thermal performance through a top-side heat-spreader attachment surface.
Typical applications include high-end ASIC prototyping and emulation platforms, 40G/100G wireline communications line cards, radar and electronic warfare DSP pipelines, high-frequency trading accelerators, and high-density memory-interface bridging. The wide logic capacity and abundant I/O make it well-suited for systems that previously required multiple mid-range FPGAs.
When designing with this device, plan the PCB thermal interface carefully - the FCBGA requires a properly mounted heat spreader or heatsink to dissipate 10-25 W typical workloads. Ensure the Quartus II power analyzer is run early in the design cycle; pin assignment, block placement, and toggle rate all significantly affect junction temperature.
This page synthesizes real-time distributor inventory, exact parametric data, drop-in Stratix IV E alternatives, and practical PCB/thermal design notes that complement, rather than duplicate, the official Altera/Intel Stratix IV Handbook.
Drop-in alternatives for EP4SE820F43C3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SE820F43C3G (same form factor and footprint) β differing in Logic Elements, Package, Family, Mounting Type, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SE820F43C3N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SE820F43I3G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SE530F43C3G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XC6VLX760-1FFG1760C
β Drop-Inπ Reference alternative (not in catalog)
EP4SE820F43C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SE820F43C3G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV E |
| Family | Stratix IV |
| Logic Elements | 813,050 LE |
| Adaptive Logic Modules (ALMs) | 325,220 ALM |
| Embedded Memory | 32.51 Mbit |
| User I/O Pins | 1120 |
| DSP Blocks | Yes (variable-precision DSP) |
| Package | 1760-BBGA, FCBGA (F43) |
| Process Node | 40 nm |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Operating Temperature | 0C to +85C (commercial grade C3) |
| MSL Level | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| Packaging | Tray |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SE820F43C3G 1760-bbga, fcbga (f43) Pin Configuration Guide
Pin configuration for EP4SE820F43C3G (1760-bbga, fcbga (f43) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SE820F43C3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SE820F43C3G is suitable for 6 applications: High-End ASIC Prototyping and Emulation, 40G/100G Wireline Communications Line Cards, Radar and Electronic Warfare DSP Pipelines, High-Frequency Trading Accelerators, Broadcast Video Processing and Format Conversion, Medical Imaging Acceleration (CT/MRI Reconstruction).
High-End ASIC Prototyping and Emulation
The EP4SE820F43C3G's 813,050 logic elements and 32.51 Mbit embedded memory enable large ASIC RTL prototypes to be partitioned onto a single device or a small chain, dramatically reducing bring-up time versus multi-FPGA partitioners. The 1120 user I/O permit wide data buses, and the variable-precision DSP blocks allow realistic verification of DSP-heavy ASICs. According to the Stratix IV Device Handbook, FPGAs in this density range are typically deployed for 5-10 million gate ASIC emulation platforms. The C3 commercial temperature grade suits controlled lab and chassis environments where emulators reside.
Recommended
40G/100G Wireline Communications Line Cards
The EP4SE820F43C3G provides 32 high-speed serial transceiver channels up to 8.5 Gbps, sufficient to implement multiple 10G SFP+ interfaces, 40G QSFP, or 100G CFP front-ends on a single line card. Hard PCIe Gen1/Gen2 IP allows direct CPU or switch-ASIC interconnect, while dedicated memory controllers support DDR3 buffers at 533 MHz. The high logic capacity enables full header processing, traffic management, and lookups for 100G forwarding. Its 1760-BBGA package is the standard footprint for Stratix IV E telecom line-card designs.
Recommended
Radar and Electronic Warfare DSP Pipelines
Military radar and EW systems require massive real-time DSP throughput - the EP4SE820F43C3G's variable-precision DSP blocks deliver hundreds of GMACs, enabling FFTs, pulse compression, beamforming, and adaptive filtering directly in fabric. Its 32.51 Mbit embedded memory provides large coefficient and window buffers at the DSP sample rate. The C3 commercial grade suits airborne and ground-mobile applications where controlled thermal environments are practical. The 40 nm Stratix IV process delivers proven SEU tolerance suitable for mission-critical DSP.
Recommended
High-Frequency Trading Accelerators
Latency-critical HFT systems benefit from the EP4SE820F43C3G's abundant DSP blocks, fast on-chip SRAM, and high user I/O count to interface to market-data feeds. 1120 user I/O enable dense parallel connection to multiple 10G SFP+ feeds simultaneously, while the device's deterministic fabric routing and 600 MHz memory blocks support sub-microsecond decision pipelines. The flip-chip BGA package supports the rapid thermal response required by rack-mounted trading servers in temperature-controlled data centers.
Recommended
Broadcast Video Processing and Format Conversion
Broadcast video studios deploy the EP4SE820F43C3G for 4K/UHD format conversion, HDR mapping, and real-time video processing pipelines where the high logic density enables multiple parallel video channels. Hard memory controllers support DDR3 frame buffers, and the 1120 user I/O permit multi-channel SDI and HDMI interfaces plus Ethernet control. The variable-precision DSP blocks accelerate video scaling and color-space conversion, while the flip-chip BGA package supports the thermal headroom required by always-on broadcast equipment.
Recommended
Medical Imaging Acceleration (CT/MRI Reconstruction)
The EP4SE820F43C3G accelerates back-projection, filtered back-projection, and iterative reconstruction algorithms in CT and MRI scanners where real-time image reconstruction is critical. Its DSP blocks deliver tens of GMACs of throughput per device, allowing parallel processing of projection data, while the 32.51 Mbit embedded memory holds filter coefficients and intermediate slices. The C3 commercial temperature grade suits climate-controlled imaging rooms, and Altera's medical-grade lifecycle support matches the long product cycles of medical equipment manufacturers.
Recommended
Recommended Products Summary
Engineering reference data for EP4SE820F43C3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SE820F43C3N | EP4SE820F43I3G | EP4SE530F43C3G | XC6VLX760-1FFG1760C | EP4SE820F43C4G |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Xilinx / AMD | Altera / Intel |
| Package | 1760-BBGA, FCBGA (F43) | 1760-BBGA, FCBGA (F43) - same | 1760-BBGA, FCBGA (F43) - same | 1760-BBGA, FCBGA (F43) - same | 1760-BGA, FF (flip-chip BGA) - same ball count | 1760-BBGA, FCBGA (F43) - same |
| Logic Elements | 813,050 LE | 813,050 LE (identical die) | 813,050 LE (identical die) | 530,000 LE (-35%) | 760,000 LE (-7%) | 813,050 LE (identical die) |
| Adaptive Logic Modules (ALMs) | 325,220 ALM | 325,220 ALM (identical die) | 325,220 ALM (identical die) | 212,000 ALM (-35%) | 118,560 CLBs (Xilinx metric, not directly comparable) | 325,220 ALM (identical die) |
| Embedded Memory | 32.51 Mbit | 32.51 Mbit (identical die) | 32.51 Mbit (identical die) | 20.88 Mbit (-36%) | 25.92 Mbit (-20%) | 32.51 Mbit (identical die) |
| User I/O | 1120 | 1120 (identical die) | 1120 (identical die) | 960 | 1200 | 1120 (identical die) |
| Transceiver Channels | 32 (up to 8.5 Gbps) | 32 (identical die) | 32 (identical die) | 32 | No (LX series); use XC6VLX760T or XC6VHX760T | 32 (identical die) |
| Temperature Grade | Commercial 0C to +85C (C3) | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C (speed grade C4) |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
Key Differentiators
- Highest-density Stratix IV E variant with 813K LEs (vs EP4SE530F43C3G)
- 32 high-speed serial transceivers up to 8.5 Gbps (vs XC6VLX760-1FFG1760C)
- 32.51 Mbit embedded memory enables large on-chip buffers (vs EP4SE530F43C3G)
- 1120 user I/O pins in F43 1760-BBGA (vs EP4SE820F43C3 (no 'G' suffix))
- Hard PCIe Gen1/Gen2 IP block (vs EP4CGX150CF23C8N)
Design Notes
The 1760-BBGA FCBGA package requires a top-side heat spreader or heatsink for typical Stratix IV E workloads of 10-25 W. Estimate power using Quartus II PowerPlay early in the design cycle; pin assignment, toggle rate, and clock tree depth significantly affect junction temperature. Without proper thermal attachment the device will throttle or fail long-term. Reference the Stratix IV Device Handbook thermal design chapter.
Design the PCB land pattern per Altera's package specification for F43 1760-BBGA: 1.0 mm ball pitch, 42.5 x 42.5 mm body, with full ball-grid-array escape routing. Use 4-6 PCB layers with dedicated power planes for core (0.9 V) and I/O rails. Decoupling: 0402 0.1 uF X7R per power pin pair plus bulk capacitors per Altera's PDN design guidelines. Match trace lengths within byte lanes for DDR3 interfaces.
Do not assume any Stratix IV E device in the same F43 footprint is fully pin-compatible - the EP4SE530F43 has fewer user I/O balls routed out, and the EP4SE360/230 in F43 packages have different transceiver ball counts. Always check the Altera pin-out file (.pin) for your specific target device before PCB fab. Confusing different Stratix IV E variants has caused many prototype respins.
The 8.5 Gbps transceivers require strict PCB stackup and via-stub control. Use low-loss PCB material (e.g. Isola FR408HR or equivalent) for backplane channels. Match transceiver ball breakout lengths within 0.5 ps and use reference planes with continuous return paths. AC-coupling capacitors (0.01 uF X7R 0402) are required between the FPGA and external SERDES link partners; consult the Stratix IV Transceiver User Guide for channel loss budgets.
Place configuration flash (EPCS or compatible) and clock sources within 50 mm of the FPGA configuration and clock pins. Keep JTAG chain lengths under the maximum 16-device chain limit and add a 4.7 kohm pull-up on TCK, TMS, and TDI as recommended by Altera. Reserve the dedicated configuration pins per the device handbook, even if your design uses JTAG-only configuration.
Compliance Information
RoHS-compliant per JEDEC JESD97 ('G' suffix). REACH Unaffected per Globalspec datasheet 2026-09-10. MSL 3 (168 hours floor life). Not AEC-Q100 qualified - FPGAs in this class are typically deployed in industrial/commercial equipment, not automotive. Halogen-free and conflict-mineral status not stated in available data.
