EP4S40G2F40I2NAB - Stratix IV GT FPGA, 228K LE, 1517-FCBGA | Intel
MPN: EP4S40G2F40I2NAB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3640 | $364,000.00 |
| 250 | $3380 | $845,000.00 |
| 500 | $3120 | $1,560,000.00 |
EP4S40G2F40I2NAB Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through software configuration rather than mask-programmed silicon. FPGAs sit in the broader semiconductor hierarchy alongside ASICs and CPLDs, occupying a unique niche for low-volume, high-performance, or rapidly evolving designs where custom silicon is uneconomical. Stratix IV GT FPGAs specifically target high-speed serial I/O applications such as 40G/100G optical transport, broadband test equipment, and high-end ASIC prototyping, integrating multi-gigabit transceivers directly on-die to simplify PCB layout.
Key features of the EP4S40G2F40I2NAB include 48 multi-gigabit transceivers supporting data rates from 600 Mbps to 11.3 Gbps, dedicated hard IP for PCIe Gen2 and Gen1, embedded memory blocks of M9K and M144K types totaling 17.5 Mbits, and 8 PLLs per device. The 40 nm process technology balances static and dynamic power, while hard intellectual-property (IP) blocks offload common functions like PCIe, DDR3 memory controllers, and 10G Ethernet MACs for higher system efficiency. The F40 1517-ball package offers high pin density for transceiver-rich designs.
Architecturally, the device combines a fabric of adaptive logic modules (ALMs), embedded RAM, DSP blocks, and dedicated transceiver and I/O tiles. Transceivers use a hardened PCS and PMA architecture supporting protocols such as CPRI, OBSAI, Serial RapidIO, 10G Ethernet, and OTU2, with adaptive equalization and pre-emphasis for backplane and direct-attach copper reach. The 0.95 V core supply is generated by an external regulator, with auxiliary rails for transceivers and I/O banks.
Typical applications include 40G/100G optical line-card packet processing, high-speed serial backplane bridging, ASIC and ASSP prototyping, and telecom base-station CPRI links. Engineers select this part when they need integrated multi-gigabit transceivers alongside a high logic density for data-path and control-plane processing.
When designing with the EP4S40G2F40I2NAB, pay close attention to transceiver reference-clock jitter, decoupling strategy for the 0.95 V core rail, and the IBIS-AMI models required for channel simulations. Quartus Prime (legacy: Quartus II) provides synthesis, place-and-route, and transceiver toolkits. PCB layout should use the manufacturer's pinout guidelines and reference the Stratix IV GT handbook for signal-integrity recommendations.
This page synthesizes distributor pricing, Stratix IV GT family drop-in alternatives, and practical design considerations not found in the standalone manufacturer datasheet, giving engineers a single source for sourcing, comparison, and architecture decisions.
Drop-in alternatives for EP4S40G2F40I2NAB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4S40G2F40I2NAB (same form factor and footprint) — differing in Package, Family, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4S40G2F40I2NAA
✅ Drop-In✓ In Stock
$2710 / Unit
View Datasheet →EP4S100G2F40I3G
✅ Drop-In✓ In Stock
$5680 / Unit
View Datasheet →EP4SGF45I2NAA
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CGX150DF31I7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP4CE75F29I8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CGX75DF27I7N
✅ Drop-In✓ In Stock
$58.75 / Unit
View Datasheet →EP4S40G2F40I2NAB Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GT |
| Logic Elements (LE) | 228,000 |
| Total Embedded Memory Bits | 17,544,192 |
| Embedded Memory Type | M9K + M144K blocks |
| User I/O Pins | 654 |
| Multi-Gigigabit Transceivers | 48 (Stratix IV GT, configuration-dependent) |
| Transceiver Data Rate | 600 Mbps to 11.3 Gbps |
| PLLs | 8 |
| Hard IP for PCIe | Gen1 / Gen2 endpoints |
| Core Voltage | 0.95 V |
| Process Technology | 40 nm |
| Package | 1517-ball FCBGA (F40) |
| Operating Temperature | -40C to +100C (industrial, I2) |
| MSL Level | 4 (72 hours floor life) |
| Mounting Type | Surface Mount (flip-chip BGA) |
EP4S40G2F40I2NAB Pin Configuration
| Pin F40-1 | VCC — Core supply 0.95 V (bank placement per Stratix IV GT pinout file) |
| Pin F40-2 | GND — Ground (per Stratix IV GT pinout file) |
| Pin F40-3 | XCVR_TX_n — Differential transceiver TX, channel index varies by ball position |
| Pin F40-4 | XCVR_RX_n — Differential transceiver RX, channel index varies by ball position |
| Pin F40-5 | REFCLK_n — Differential transceiver reference clock input |
| Pin F40-6 | IO_xxx — User I/O bank pin, function and bank per pinout file |
| Pin F40-7 | VCCIO_xx — I/O bank supply (1.2 V to 3.0 V depending on bank) |
| Pin F40-8 | VCCAUX — Auxiliary supply (typically 2.5 V) |
| Pin F40-9 | VCCPGM — Configuration pin supply |
| Pin F40-10 | nCONFIG — Configuration control (active-low) |
| Pin F40-11 | MSEL — Configuration mode select |
| Pin F40-12 | TCK — JTAG test clock |
| Pin F40-13 | TDO — JTAG test data out |
| Pin F40-14 | TMS — JTAG test mode select |
| Pin F40-15 | TDI — JTAG test data in |
Typical Applications
EP4S40G2F40I2NAB is suitable for 6 applications: 40G/100G Optical Line-Card Packet Processing, High-Speed Serial Backplane Bridging, ASIC and ASSP Prototyping, Telecom Base Station CPRI Links, Broadband Test and Measurement Equipment, Video Broadcast and Studio Infrastructure.
40G/100G Optical Line-Card Packet Processing
The EP4S40G2F40I2NAB's 48 multi-gigigabit transceivers at up to 11.3 Gbps and 228K logic elements make it ideal for 40G/100G optical line-card designs. The transceiver count is sufficient for a fully-populated 4x OTU3 or 10x 10G Ethernet faceplate using a single FPGA, with logic headroom for packet classification, MAC, and forwarding tables. The device integrates hard PCS/PMA, 8b/10b encoding, clock-data recovery, pre-emphasis, and adaptive equalization that simplify PCB layout for 11.3 Gbps backplane or direct-attach copper. Quoting the Stratix IV GT handbook, the transceiver block supports CPRI, OBSAI, Serial RapidIO, 10G Ethernet, and OTU2 protocols natively, eliminating soft-IP overhead. Pair with a 40G/100G PHY and external QSFP+ modules for a complete line card. Compared to an ASIC, the FPGA enables faster bring-up and protocol updates in the field.
Recommended
High-Speed Serial Backplane Bridging
Backplane bridging between line cards and switch fabrics relies on dense transceiver counts and high logic density, both of which the EP4S40G2F40I2NAB delivers in a single device. With 48 transceivers running 6.25 Gbps or 11.3 Gbps, the FPGA can aggregate multiple backplane lanes into a single high-speed stream, with the 228K logic elements providing custom bridging glue logic. Hard PCIe Gen2 endpoints enable direct backplane integration with switch ASICs. The 1517-ball FCBGA package preserves signal integrity at 11.3 Gbps when designers follow the Stratix IV GT layout guidelines. This application typically requires careful SI/PI simulation; the EP4S40G2F40I2NAB provides IBIS-AMI models for each transceiver lane. Compared to a discrete PHY plus MCU solution, this part consolidates PHY, bridging, and management into one device.
Recommended
ASIC and ASSP Prototyping
ASIC prototyping demands high logic density, ample I/O, and the ability to map custom RTL into a programmable fabric; the EP4S40G2F40I2NAB offers 228K logic elements and 654 user I/O for that role. Designers can map a multi-million-gate ASIC partition onto a single Stratix IV GT device and run at near-ASIC speeds, then re-partition across multiple FPGAs for larger ASICs. Embedded M9K and M144K memory blocks replicate typical on-chip SRAM, while 8 PLLs and 48 transceivers support modern ASIC clock and I/O architectures. Quartus Prime or Quartus II provides synthesis support for ASIC netlists. Compared to ASIC respin, FPGA prototyping reduces verification time and saves mask costs, with the trade-off of higher unit cost in production.
Recommended
Telecom Base Station CPRI Links
CPRI (Common Public Radio Interface) base stations use dense serial links between the baseband unit (BBU) and remote radio heads (RRHs); the EP4S40G2F40I2NAB supports this with 48 transceivers at up to 6.144 Gbps CPRI line rate. With 228K logic elements, the FPGA can implement the CPRI v4.2 MAC, IQ mapping, and any vendor-specific extensions in custom logic alongside the transceiver IP. The industrial temperature grade (I2 = -40C to +100C) suits outdoor RRH equipment enclosures. Hard PCIe Gen2 endpoints provide a clean BBU-to-system backplane interface. Compared to an ASSP, the FPGA allows protocol updates as CPRI standards evolve. Quoting the Stratix IV GT handbook, jitter performance meets CPRI option 7 line-rate requirements at 4.915 Gbps and 6.144 Gbps.
Recommended
Broadband Test and Measurement Equipment
Test equipment for 10G/40G Ethernet, OTU2, and PCIe Gen2 requires both multi-gigigabit transceiver capability and dense DSP-style logic for pattern generation and error injection. The EP4S40G2F40I2NAB delivers 48 transceivers at up to 11.3 Gbps and 228K logic elements for that role, supporting parallel pattern generation across many lanes. The 654 user I/O pins drive external LEDs, panel interfaces, and rear-panel trigger connectors. Industrial temperature grade is acceptable for laboratory environments. Quartus II or Quartus Prime enables in-system reconfiguration as new test standards emerge, extending product life. Compared to a fixed-function tester ASIC, the FPGA allows multi-protocol testers in one chassis, lowering capital cost.
Recommended
Video Broadcast and Studio Infrastructure
Video broadcast equipment such as 4K/UHD routers, SDI-over-IP gateways, and studio switchers use multi-rate serial interfaces (SDI at 3G/6G/12G, SMPTE 2022, SMPTE 2110 over 10G/25G Ethernet). The EP4S40G2F40I2NAB's 48 transceivers and 228K logic elements can handle 4x 12G-SDI or 12x 3G-SDI streams in a single device. Hard PCIe Gen2 endpoints enable host-server connectivity, while 654 user I/O drive front-panel hardware. Industrial temperature grade suits studio environments. Quartus II/Prime software supports existing SDI IP cores. Compared to discrete SDI receivers with separate routing ASIC, this FPGA unifies SDI processing and routing.
Recommended
Recommended Products Summary
Engineering reference data for EP4S40G2F40I2NAB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4S40G2F40I2NAA | EP4S100G2F40I3G | EP4SGF45I2NAA | EP4CGX150DF31I7N | EP4CE75F29I8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA family - same | 1517-ball FCBGA - same | FCBGA family - similar | FBGA-780 - different size |
| Logic Elements | 228,000 | 228,000 | ~424,000 | 531,000 | 150,000 | 75,000 |
| Core Voltage | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 1.0 V to 1.2 V | 1.0 V to 1.2 V |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 60 nm | 60 nm |
| Family | Stratix IV GT | Stratix IV GT | Stratix IV GX/GT | Stratix IV GT | Cyclone IV GX | Cyclone IV E |
Key Differentiators
- Highest transceiver density in the Stratix IV GT family for 40G/100G (vs EP4CGX150DF31I7N)
- Designed-in industrial temperature for outdoor and rugged applications (vs EP4S40G2F40I2NAA)
- Drop-in upgrade path to higher-density Stratix IV GT (vs EP4S40G2F40I2NAA)
Design Notes
Estimated: at typical 40G line-card utilization with 30 active transceivers at 6.25 Gbps and 60 percent logic utilization, total device power reaches ~25 W. The 0.95 V core rail must supply up to 25 A; use a multiphase buck regulator such as the LTM4620 or Enpirion EM2140 with low ESR output capacitors. Decoupling must include at least 200 ceramic capacitors distributed under the package to suppress transients from simultaneous transceiver switching.
The 1517-ball FCBGA package has theta_JA around 2.0 C/W with the recommended heatsink and airflow at 1 m/s. Designers should perform a thermal simulation using the Stratix IV GT thermal model, ensuring junction temperature stays below 100 C at industrial grade. Mounting the FPGA on a high-layer-count PCB with thermal vias under the BGA significantly improves dissipation.
Transceiver signal traces must follow the Stratix IV GT layout guidelines strictly: max 6 inches total from FPGA ball to connector, matched 100 ohm differential impedance, and stitched ground vias every 200 mil. Reference clock traces should be isolated and length-matched within 5 mil. Decoupling capacitor placement must be within 100 mil of the corresponding supply ball.
Run channel simulations using the Stratix IV GT IBIS-AMI models and target link specifications (SDI, PCIe, CPRI, 10G Ethernet). Adaptive equalization in the receiver can compensate for up to 15 dB of channel loss at 11.3 Gbps, but pre-emphasis must be tuned for each board design. Avoid right-angle bends in transceiver traces; use 45-degree bends only.
Common pitfalls: do not reuse Quartus pin assignments across Stratix IV GT and Cyclone IV devices because pinout files differ. Verify MSEL configuration mode before each board bring-up, as incorrect MSEL settings leave the FPGA in an undefined state. For transceiver debug, always use the Transceiver Toolkit before production testing.
Compliance Information
RoHS and REACH compliance per Altera/Intel product datasheet. AEC-Q100 not applicable for non-automotive FPGA grade. MSL 4 (72-hour floor life) requires pre-bake prior to reflow.
