EP4CGX75CF23C8N - 73,920-Cell FPGA | Intel | Embedded
MPN: EP4CGX75CF23C8N β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP4CGX75CF23C8N Overview
A field-programmable gate array is a semiconductor device whose logic functions are configured after manufacturing. In the system hierarchy, an FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware-timed parallel processing while remaining reconfigurable. The Cyclone IV GX family extends this programmable-logic foundation with resources intended for interface, signal-processing, and control functions. This combination allows designers to consolidate glue logic, protocol handling, state machines, and accelerators into one programmable device.
The principal verified characteristics are 73,920 cells, 290 user I/O, 4,257,792 memory bits, and a 484-ball FBGA package. The 290-I/O count provides a substantial connection boundary for parallel buses, memory interfaces, control signals, and communications peripherals. The reported 4,257,792-bit embedded-memory capacity supports data buffering, lookup tables, packet storage, and other moderate-size on-chip functions without consuming all logic resources. The 60 nm process designation and 1.2 V supply place the device in a low-voltage, mature FPGA architecture.
From an architectural perspective, the programmable fabric can implement concurrent datapaths and control logic directly in hardware. Unlike a processor that executes instructions sequentially, an FPGA can sustain multiple operations in parallel, making it useful for deterministic interface bridging and acceleration. Designers map a design into logic elements, route signals through programmable interconnects, and configure dedicated on-chip memory and I/O behavior. Configuration data therefore determines the final digital function while preserving the flexibility to revise the implementation.
Typical applications include industrial automation controllers, communications equipment, real-time signal processing, and custom hardware acceleration. In industrial systems, the device can consolidate machine-control state machines, sensor interfaces, and communication bridges. In communications equipment, its parallel fabric can handle protocol conversion and packet-oriented logic. For signal processing, the same architecture supports high-speed fixed-function datapaths, while the embedded memory can hold coefficients or sample buffers.
Design-in work must verify the exact ball map, supported I/O standards, transceiver capabilities, configuration interface, clocking resources, power rails, thermal limits, and speed-grade implications from the manufacturer documentation before release. PCB planning should accommodate all 484 balls, controlled-impedance connections where appropriate, decoupling near supply entry points, and rigorous signal-integrity review. The available verified data does not provide a complete electrical limit table or pin assignment.
This page combines the verified ordering, logic, memory, I/O, process, supply, and package information with a conservative engineering review. Because the alternative search did not identify a verified same-footprint cross-brand drop-in replacement, no unverified equivalent is presented. That distinction protects procurement and PCB decisions from confusing a functional FPGA alternative with a true drop-in part.
Drop-in alternatives for EP4CGX75CF23C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75CF23C8N (same form factor and footprint) β differing in Package, RoHS Status, Operating Temperature, Embedded Memory, Speed Grade.
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EP4CGX75CF23C8
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View Datasheet βEP4CGX75CF23C8N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array |
| FPGA Family | Cyclone IV GX |
| Logic Cells | 73,920 cells |
| Number of I/O | 290 I/O |
| Embedded Memory | 4,257,792 bits |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package | 484-pin FBGA |
| Mounting Type | Surface Mount |
| Programmable Logic Type | FPGA |
| Primary Application | Real-time signal processing |
| Communications Support | Programmable communications logic |
| Industrial Automation Support | Programmable control logic |
| Hardware Acceleration | Supported |
EP4CGX75CF23C8N 484-pin fbga Pin Configuration Guide
Pin configuration for EP4CGX75CF23C8N (484-pin fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75CF23C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75CF23C8N is suitable for 6 applications: Industrial Automation Controllers, Communications Equipment, Real-Time Signal Processing, Custom Hardware Acceleration, Programmable Interface Bridging, Machine Vision and Inspection Systems.
Industrial Automation Controllers
EP4CGX75CF23C8N fits industrial automation controllers because its verified 73,920 logic cells and 290 I/O provide capacity for parallel machine-control logic, sensor aggregation, protocol conversion, and deterministic state machines. The 4,257,792 embedded-memory bits can hold configuration tables, communication buffers, and operational data close to the logic fabric. Designers can implement multiple control functions in one device instead of relying on several fixed-function ICs. The 1.2 V core supply and 60 nm process support a low-voltage programmable architecture, while the 484-pin FBGA package enables a compact controller footprint. I/O-standard support, temperature range, timing margins, and industrial qualification must be confirmed from the manufacturer documentation before deployment.
Recommended
Communications Equipment
EP4CGX75CF23C8N is suitable for communications equipment that requires programmable protocol handling, packet processing, framing, and hardware-managed control. Its verified 290 I/O allow designers to connect multiple data paths, control signals, memory interfaces, and management peripherals. The 73,920 logic cells can implement parallel datapaths and protocol state machines, while 4,257,792 embedded-memory bits support buffers, lookup tables, and temporary packet storage. The device can therefore bridge interfaces or accelerate repeated communications operations without depending solely on processor execution. The exact supported I/O standards, transceiver functions, clocking resources, and timing limits are not included in the supplied data, so those details must be verified before selecting it for a specific communications standard.
Recommended
Real-Time Signal Processing
EP4CGX75CF23C8N supports real-time signal processing when the algorithm can be expressed as parallel, deterministic hardware operations. The verified 73,920 logic cells allow datapaths, filtering structures, control logic, and interface blocks to operate concurrently rather than sequentially. Its 4,257,792 embedded-memory bits are useful for sample buffers, coefficients, delay lines, and intermediate data, reducing dependence on external memory for moderately sized processing tasks. The 290 I/O can collect sensor or converter data and deliver processed results to downstream systems. The supplied evidence does not specify DSP blocks, maximum clock frequency, latency, or power consumption, so designers should obtain timing and resource-utilization estimates from the official device family documentation before committing the FPGA to a signal-processing design.
Recommended
Custom Hardware Acceleration
EP4CGX75CF23C8N fits custom hardware-acceleration designs that need more parallelism than a conventional processor can provide. The verified 73,920 logic cells support dedicated arithmetic, control, filtering, protocol, or data-routing structures, while 4,257,792 embedded-memory bits can hold coefficients, lookup data, or working buffers. By implementing repeated operations directly in programmable hardware, a system can obtain deterministic timing and concurrent execution for suitable workloads. The 290 I/O provide connectivity to host processors, sensors, memory, or external accelerators. However, the supplied data does not quantify DSP capacity, clock performance, accelerator throughput, or power, so the expected benefit must be demonstrated through synthesis, place-and-route, and timing analysis in the selected Intel toolchain.
Recommended
Programmable Interface Bridging
EP4CGX75CF23C8N can serve as a programmable bridge between processors, sensors, memory devices, and custom peripherals. Its verified 290 I/O provide a broad connection boundary for address, data, control, interrupt, and status signals. The 73,920 logic cells can implement protocol conversion, bus adaptation, serialization, timing translation, and control logic, while the 4,257,792 embedded-memory bits can provide buffering for data crossing interfaces with different speeds. This flexibility can reduce the number of discrete bridge ICs and allow a design to be revised as interface requirements change. The available data does not specify supported I/O voltage levels, standards, termination requirements, or maximum interface rates, so the manufacturer documentation is required for electrical and timing validation.
Recommended
Machine Vision and Inspection Systems
EP4CGX75CF23C8N is a candidate for machine-vision and inspection systems that need deterministic capture, preprocessing, synchronization, and control logic. The verified 73,920 logic cells can implement pixel processing, line buffering, feature extraction, camera timing, and motor-control coordination in parallel. Its 4,257,792 embedded-memory bits can support small image buffers, line stores, coefficients, and lookup tables, while 290 I/O can connect cameras, sensors, actuators, and host controllers. The device is particularly useful when fixed-function timing and parallel processing are more important than sequential software flexibility. The supplied data does not state image-interface standards, maximum clock frequency, DSP resources, thermal limits, or supported camera protocols, so those qualifications must be resolved through the official Cyclone IV GX documentation and target-specific interface analysis.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75CF23C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75CF23C8 | EP4CGX75CF23C7N | EP4CGX75CF23C7 | EP4CGX75CF23C6N | EP4CGX75CF23C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Pin Compatibility Evidence | Verified 484-pin FBGA package | Package listed, pin map unverified | Package listed, pin map unverified | Package listed, pin map unverified | Package listed, pin map unverified | Package listed, pin map unverified |
| Cross-Reference Source | Target ordering part | Site MPN list; not device-level verified | Site MPN list; not device-level verified | Site MPN list; not device-level verified | Site MPN list; not device-level verified | Site MPN list; not device-level verified |
Key Differentiators
- Verified device resource scale (vs EP4CGX75CF23C7N)
- Verified I/O capacity (vs EP4CGX75CF23C6N)
- Manufacturer listing for the exact ordering code (vs EP4CGX75CF23C8)
Design Notes
Use the manufacturer ball map and the exact 484-pin FBGA land pattern for EP4CGX75CF23C8N before routing. The verified results confirm 484 pins and 290 I/O but do not provide a complete ball assignment. Confirm the BGA pitch, ball numbering, escape routing, via arrangement, layer stack-up, via-in-pad policy, and solder-mask definition against the current package drawing. Do not derive a pinout from the ordering code alone. A complete library symbol and footprint should be checked against the official package dimensions before Gerber release.
The verified data specifies a 1.2 V core supply, but it does not provide current consumption, I/O-bank voltage limits, power-up sequencing, or decoupling requirements. Design the power tree only after obtaining the official Cyclone IV GX electrical and hardware-design documentation. Verify whether separate supply rails are required for the core, I/O, and auxiliary functions, then place suitable local decoupling at the relevant supply pins. Include defined ramp and sequencing behavior so that the FPGA does not enter an invalid configuration state during power-up or brownout.
Because EP4CGX75CF23C8N combines 290 I/O with 73,920 logic cells and 4,257,792 embedded-memory bits, floor planning should separate high-speed outputs, clock distribution, memory-intensive blocks, and configuration-related signals. Keep clock and other timing-sensitive routes short and controlled, maintain reference-plane continuity, and review simultaneous-switching-noise effects for wide parallel buses. The supplied data does not specify supported clock frequencies or I/O standards, so timing-sensitive routing requires a complete pin assignment, I/O-standard selection, and timing analysis in the supported Intel design environment.
Do not treat a different speed-grade or package suffix as a confirmed drop-in replacement without comparing the complete ordering codes and official pinouts. The same-family candidates listed here are not supported by complete device-level cross-reference evidence in the supplied data, and no cross-brand drop-in candidate was verified. Confirm the package, temperature grade, speed grade, I/O count, memory configuration, configuration method, and electrical limits before approving substitution. This caution is especially important for an FPGA because a package match alone does not establish ball-level compatibility or functional equivalence.
Compliance Information
The supplied web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not assumed for this industrial-oriented FPGA.
