EP4SGX530NF45C4N - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel
MPN: EP4SGX530NF45C4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4095 | $40,950.00 |
| 100 | $3880 | $388,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3425 | $3,425,000.00 |
EP4SGX530NF45C4N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks, programmable interconnect, programmable I/O, and on-chip memory into a single semiconductor. Within the system hierarchy, FPGAs sit between Application-Specific ICs (ASICs) and general-purpose processors, offering ASIC-like performance and parallelism with the re-programmability of software. Stratix IV GX devices extend this model with multi-gigabit transceivers, hard PCIe and memory controller IP blocks, and DSP blocks, so the EP4SGX530NF45C4N is used wherever designers need ASIC-class throughput without paying NRE costs.
Key features of the EP4SGX530NF45C4N include 531,200 logic elements (the highest density option in the Stratix IV GX family), 28 Mb of embedded SRAM, 24 transceivers supporting data rates up to 8.5 Gbps, 920 user I/Os in 24 banks, 1,024 18x18 multipliers for DSP, an 0.9 V core voltage, and hard PCI Express Gen1/Gen2 IP blocks. The -C4 speed grade targets the highest performance corner; the N suffix denotes a lead-free, RoHS-compliant package.
Architecturally, the device uses Altera's adaptive logic module (ALM) which combines 8-input fracturable LUTs with two adders, allowing designs to map to either fine-grained logic or arithmetic-heavy structures. Combined with the hard transceiver PCS/PMA blocks and the TriMatrix memory architecture (MLAB, M9K, M144K blocks), the EP4SGX530NF45C4N supports >1500 GMACS of fixed-point DSP performance at typical operating conditions.
Typical applications include high-end telecommunications line cards (100G/40G OTN, packet processing), ASIC prototyping and emulation, high-performance computing fabrics, military/aerospace signal processing, broadcast video processing, medical imaging systems, and test and measurement equipment. Designers choose this density for system-on-chip emulation or when integrating an entire line-card datapath into a single FPGA.
When designing with the EP4SGX530NF45C4N, careful PCB layout is essential: the FC-FBGA-1932 substrate requires microvia stack-up design, length-matched differential pairs for transceivers, and substantial decoupling (typically 100 nF + 10 µF per VCC/GND pair). The 0.9 V core is sensitive to IR drop; use at least four PCB layers dedicated to power/ground. Designers should plan for Quartus II (legacy) or Quartus Prime design software and a 12-16 week lead time given the part is now NRND.
This page synthesizes distributor inventory, Stratix IV GX family drop-in alternatives, and PCB layout considerations not typically consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX530NF45C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530NF45C4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530NF45C4
✅ Drop-In✓ In Stock
$5434.81 / Unit
View Datasheet →EP4SGX530NF45C3N
✅ Drop-In✓ In Stock
$9850 / Unit
View Datasheet →EP4SGX530NF45C2N
✅ Drop-In✓ In Stock
$9450 / Unit
View Datasheet →EP4SGX530NF45C3
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →EP4SGX530NF45C2
✅ Drop-In✓ In Stock
$11650 / Unit
View Datasheet →EP4SGX530NF45C4N Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV |
| Device Logic Elements | 531200 |
| Embedded Memory | 28033024 bit (28 Mb) |
| LABs / CLBs | 21248 |
| User I/O Count | 920 |
| Operating Voltage (Core) | 0.9 V |
| Process Technology | 40 nm |
| Package Type | FC-FBGA-1932 |
| Package Code | NF45 (1932-ball Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| Speed Grade | C4 (highest performance) |
| Operating Temperature | 0 C to 85 C (commercial) |
| RoHS Status | Compliant (lead-free) |
| Lifecycle Status | Not Recommended for New Designs (NRND) |
EP4SGX530NF45C4N nf45 (1932-ball flip-chip bga) Pin Configuration Guide
Pin configuration for EP4SGX530NF45C4N (nf45 (1932-ball flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530NF45C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530NF45C4N is suitable for 6 applications: 100G Optical Transport Networking (OTN), ASIC Prototyping and Emulation, High-Performance DSP (Radar / Beamforming), Broadcast Video Processing, Medical Imaging (CT / MRI Reconstruction), Test and Measurement Instrumentation.
100G Optical Transport Networking (OTN)
The EP4SGX530NF45C4N's 531,200 logic elements, 24 multi-gigabit transceivers at up to 8.5 Gbps, and 28 Mb embedded SRAM make it well suited for 100G/40G OTN line cards. Designers typically implement forward-error-correction (FEC) codecs, framing/mapping, and packet processing in the same fabric, eliminating an external ASIC. The 920 user I/Os drive wide external memory buses (DDR3/QDRII+) for deep packet buffering. Compared with an ASIC, the EP4SGX530NF45C4N offers field upgradability to new OTN standards without NRE.
Recommended
ASIC Prototyping and Emulation
The EP4SGX530NF45C4N's high logic capacity (531K LEs) and large TriMatrix memory (28 Mb) allow engineers to partition a 5-10 million gate ASIC design across multiple FPGAs for pre-silicon validation. The 920 I/Os, organized in 24 banks with multiple I/O standards (LVDS, HSTL, SSTL), ease bring-up of mixed-signal ASIC pads. Quartus II time-driven closure and the C4 speed grade enable compile at near-ASIC frequencies for cycle-accurate emulation.
Recommended
High-Performance DSP (Radar / Beamforming)
The EP4SGX530NF45C4N's on-chip 18x18 multipliers and dedicated DSP blocks deliver multi-thousand GMACS DSP throughput, making it a fit for phased-array radar baseband and digital beamforming. Its 28 Mb embedded memory provides sufficient buffering for FFT windows and beam coefficients without external SRAM. The transceivers digitize ADC data streams directly, while 920 I/Os fan out to DACs and synchronization interfaces. Compared with a discrete DSP+FPGA architecture, the EP4SGX530NF45C4N reduces board area and BOM cost.
Recommended
Broadcast Video Processing
The EP4SGX530NF45C4N's 28 Mb embedded memory and 920 I/Os support uncompressed 4K/UHD video pipelines (e.g. 4:4:4 at 60 fps), including color-space conversion, scaling, and overlay composition. The transceivers accept SDI (Serial Digital Interface) at 6G/12G rates via external PHYs, and the wide memory bandwidth supports multi-frame buffering on external DDR3. Designers typically use the device for studio routers, frame synchronizers, and contribution encoders.
Recommended
Medical Imaging (CT / MRI Reconstruction)
The EP4SGX530NF45C4N's high logic density and embedded DSP blocks accelerate back-projection and iterative reconstruction algorithms in CT and MRI systems. The 28 Mb of on-chip SRAM caches projection slices, while external DDR3 (driven via 920 I/Os) holds full sinogram datasets. Hard PCIe Gen2 IP blocks enable direct connection to host CPUs for image data offload. Designers value the C4 speed grade for sub-frame reconstruction latencies required in real-time imaging.
Recommended
Test and Measurement Instrumentation
The EP4SGX530NF45C4N's 24 transceivers and 920 I/Os serve as the central processing element of arbitrary waveform generators, protocol analyzers, and digitizers. The high logic count supports deep pattern memory and complex modulation/demodulation schemes, while the hard PCIe block enables streaming to host software at multi-GB/s rates. Compared with discrete logic, the EP4SGX530NF45C4N lets vendors ship upgradeable instrument firmware over a 10+ year product lifespan.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530NF45C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530NF45C4 | EP4SGX530NF45C3N | EP4SGX530NF45C2N | EP4SGX530NF45C3 | EP4SGX530NF45C2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) | FC-FBGA-1932 (NF45) |
| Logic Elements | 531200 | 531200 | 531200 | 531200 | 531200 | 531200 |
| Speed Grade | C4 (highest performance) | C4 | C3 (slower by ~15%) | C2 (slowest, ~30%) | C3 | C2 |
| Shipping Media | Tape and Reel (N suffix) | Tray (no N suffix) | Tape and Reel | Tape and Reel | Tray | Tray |
| User I/O | 920 | 920 | 920 | 920 | 920 | 920 |
| Embedded Memory | 28 Mb | 28 Mb | 28 Mb | 28 Mb | 28 Mb | 28 Mb |
| Approx Unit Price (qty 1) | USD 4250 | USD 4200 (tray pricing) | USD 3850 | USD 3400 | USD 3800 | USD 3350 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density Stratix IV GX member with 531K LEs (vs EP4SGX360NF45C4N)
- C4 speed grade provides highest Fmax in the family (vs EP4SGX530NF45C3N)
- Same 1932-ball NF45 package across all drop-in alternatives (vs EP4SGX530KH40C4N)
Design Notes
The 1932-ball FC-FBGA package uses 1.0 mm ball pitch and demands a multilayer PCB stack-up with laser-drilled microvias. Use at least 8 PCB layers: 4 dedicated to GND/PWR for the 0.9 V core (which can draw 15-25 A at full utilization), 2 for signal layers, and 2 for high-speed transceiver routing. Place 100 nF decoupling capacitors on every VCC/GND pair within 5 mm of each BGA ball, plus bulk 10-22 µF tantalum or ceramic capacitors distributed across the package.
Multi-gigabit transceiver channels (up to 8.5 Gbps) require length-matched differential pairs with intra-pair skew under 2 ps. Maintain 100 Ω differential impedance over an unbroken reference ground plane; avoid routing across splits. Use AC-coupling capacitors (typically 100 nF) at the transmitter output. The Stratix IV GX handbook chapter on PCB layout provides reference stack-ups and via patterns - copy them verbatim rather than re-deriving from first principles.
At typical utilization (60-70% LEs, 50% DSP, 60% transceivers at 8.5 Gbps), the EP4SGX530NF45C4N dissipates approximately 18-25 W. Use a heatsink with thermal interface material rated for at least 0.2 C/W junction-to-ambient, with at least 200 LFM of forced-air cooling. Without airflow, derate Tj by 30-40 C below the 100 C maximum. The thermal resistance theta_JA of the NF45 package is approximately 0.5 C/W with the recommended heatsink.
Do not exceed the 0.9 V core voltage by more than +5% (peak 945 mV) or risk oxide breakdown on the 40 nm process. Do not hot-swap the device: ensure all power rails ramp together within 20 ms; floating rails cause latch-up. The configuration JTAG chain shares pins with user I/O bank 1A - explicitly add the AS configuration pins to your pinout before compiling to avoid last-minute rework. The hard PCIe IP block requires a 100 MHz reference clock with 100 ppm accuracy.
Compliance Information
RoHS compliance per Intel product page and the 'N' suffix in the package code NF45. AEC-Q100 is not applicable for FPGAs; industrial variants use the I-suffix temperature grade instead.
