EP4SGX530NF45C3N - 531K LE Stratix IV GX FPGA, 1932-FCBGA | Altera
MPN: EP4SGX530NF45C3N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11349.92 | $11,349.92 |
| 10 | $11200 | $112,000.00 |
| 50 | $10900 | $545,000.00 |
| 100 | $10500 | $1,050,000.00 |
| 250 | $9850 | $2,462,500.00 |
EP4SGX530NF45C3N Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs) connected via a programmable interconnect fabric and surrounded by hardened I/O and memory resources. Unlike a fixed-function ASIC, the logic, interconnect, and I/O behavior are defined at design time by loading a configuration bitstream. Modern FPGAs such as Stratix IV GX also integrate transceivers, DSP blocks, PCIe hard IP, and external memory controllers on-die, sitting hierarchically between discrete logic ICs and full custom ASICs within the broader category of programmable logic devices (PLDs) used for digital hardware design.
The device integrates up to 24 high-speed transceivers per transceiver bank, 920 user I/Os, and a dedicated PLL network across multiple frequency domains. Embedded memory totals 28 Mbits distributed across M9K and M144K block RAMs, while DSP blocks support variable-precision arithmetic for fixed- and floating-point signal processing. Hard memory controllers support DDR3/DDR2/QDRII+/RLDRAM II external memory interfaces at multi-hundred MHz rates.
The Stratix IV architecture leverages an adaptive logic module that combines fracturable 8-input LUTs, dedicated carry chains, and register-rich structure, delivering industry-leading logic utilization. The 40 nm process node and the Gx variant of the family position the part in the high-performance, transceiver-enabled segment of the Stratix IV lineup, balancing logic density against power and serial bandwidth.
Typical applications include 40G/100G optical transport network line cards, high-definition video switching and processing, ASIC prototyping for high-speed serial interfaces, test and measurement equipment, and defense/aerospace signal processing subsystems. The wide logic capacity plus integrated multi-gigabit transceivers makes the EP4SGX530NF45C3N well-suited for designs that previously required an ASIC plus companion ASSP.
When designing with this device, ensure the PCB supports the 1932-ball FC-BGA land pattern with appropriate microvia stack-up, and verify the thermal solution sustains the chosen junction temperature under the design's worst-case static and dynamic power. Use the Altera Quartus II design suite for synthesis, place-and-route, and power estimation. Plan configuration bitstream storage carefully; the device supports multiple boot modes including external flash and JTAG.
This page synthesizes current distributor pricing, Stratix IV family alternatives, and design notes that are not compiled in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX530NF45C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530NF45C3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX530NF45C3G
β Drop-Inβ In Stock
$3655 / Unit
View Datasheet βEP4SGX530NF45C3
β Drop-Inβ In Stock
$3450 / Unit
View Datasheet βEP4SGX530NF45C2NES
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βEP4SGX530NF45C2N
β Drop-Inβ In Stock
$9450 / Unit
View Datasheet βEP4SGX530NF45C2
β Drop-Inβ In Stock
$11650 / Unit
View Datasheet βEP4SGX360NF45C3N
β Drop-Inβ In Stock
$3300 / Unit
View Datasheet βEP4SGX530NF45C3N Maximum Ratings & Electrical Characteristics
| Device Family | Stratix IV GX |
| Device Logic Elements (LEs) | 531,200 |
| Adaptive Logic Modules (ALMs / LABs) | 21,248 |
| Logic Blocks (CLBs) | 212,480 (per FindIC summary) |
| Embedded Memory (bits) | 28,033,024 |
| User I/Os | 920 |
| Process Technology | 40 nm CMOS (TSMC) |
| Core Voltage | 0.9 V |
| Internal Operating Frequency | up to 800 MHz |
| Package | 1932-ball FC-FBGA (NF45) |
| Package Dimensions | 42.5 mm x 42.5 mm |
| Operating Temperature | 0 C to 85 C (commercial) |
| Lead-Free / RoHS | Lead-free per FBGA-1932 description |
| Configuration Method | Quartus II bitstream, JTAG / serial / parallel flash |
EP4SGX530NF45C3N 42.5 mm x 42.5 mm Pin Configuration Guide
Pin configuration for EP4SGX530NF45C3N (42.5 mm x 42.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530NF45C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530NF45C3N is suitable for 6 applications: 40G / 100G Optical Transport Line Card, High-Definition Video Switching and Processing, ASIC Prototyping for High-Speed Serial Interfaces, Test & Measurement Instrumentation, Defense / Aerospace Signal Processing, Industrial High-Speed Imaging.
40G / 100G Optical Transport Line Card
The EP4SGX530NF45C3N fits 40G/100G OTN line-card designs thanks to its integrated multi-gigabit transceivers and 531,200 LEs. The 1932-ball NF45 FC-BGA exposes 920 user I/Os for the framer/mapper ASIC interface, while 28 Mbits of embedded block RAM absorbs OTN framing overhead without external SSRAM. Per Stratix IV GX datasheet Section 7, transceiver rates up to 8.5 Gbps per channel support OTU2/OTU3, and Quartus II ALM-rich architecture maps framer state machines efficiently.
Recommended
High-Definition Video Switching and Processing
The EP4SGX530NF45C3N suits broadcast video switchers and processing pipelines because of its 531,200 logic elements and embedded memory bandwidth. The 920 user I/Os aggregate multiple SDI/HDMI/DisplayPort streams and the M9K/M144K blocks buffer video frames at multi-megapixel resolution. Per Stratix IV GX documentation, variable-precision DSP blocks enable 4K up/down scaling, color space conversion, and overlay compositing in real time with deterministic latency.
Recommended
ASIC Prototyping for High-Speed Serial Interfaces
The EP4SGX530NF45C3N is a leading candidate for ASIC prototyping because it replicates multiple lane instances in a single chip and exposes them via 920 I/Os. Quartus II supports partitioning multi-million-gate ASIC designs across one or more Stratix IV GX devices, and integrated multi-gigabit transceivers emulate Seria/PCIe/USB 3.0 lanes at full rate. The 28 Mbit embedded RAM models on-chip SRAM, while the Gx family provides hardware validation of high-speed I/O.
Recommended
Test & Measurement Instrumentation
The EP4SGX530NF45C3N suits high-end T&M equipment such as logic analyzers, protocol exercisers, and high-speed digitizers because the 531 K LE fabric can implement deep capture state machines and the 920 user I/Os route multi-channel analog front-end data into the FPGA. Quartus II time-domain closure supports deterministic trigger placement for jitter-sensitive measurements. The 28 Mbits of block RAM holds deep waveform capture while the multi-gigabit transceivers export processed data.
Recommended
Defense / Aerospace Signal Processing
The EP4SGX530NF45C3N targets defense/aerospace radar and SIGINT subsystems thanks to its high logic density combined with embedded DSP blocks and multi-gigabit transceivers for ADC/DAC interfaces. The 920 user I/Os aggregate many parallel analog channels, while 28 Mbits of block RAM implement FFT working buffers. Per Stratix IV GX datasheet Section 8, variable-precision DSP supports fixed- and floating-point radar processing with single-chip integration reducing SWaP-C.
Recommended
Industrial High-Speed Imaging
The EP4SGX530NF45C3N fits line-scan and area-scan industrial cameras and machine vision systems that demand high logic capacity for image processing pipelines and ample I/O for multi-channel MIPI/Sub-LVDS interfaces. The 531 K LEs and embedded DSP blocks deliver real-time Bayer demosaic, noise reduction, and edge detection; the 920 user I/Os aggregate multiple high-resolution image sensors. Quartus II partial reconfiguration lets the same FPGA handle different product SKUs.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530NF45C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530NF45C3G | EP4SGX530NF45C3 | EP4SGX530NF45C2NES | EP4SGX530NF45C2N | EP4SGX530NF45C2 | EP4SGX360NF45C3N |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA | 1932-ball NF45 FC-FBGA |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 359,200 |
| Speed Grade | C3 | C3 | C3 | C2 (ES) | C2 | C2 | C3 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | lower (per SGX360 datasheet) |
| User I/Os | 920 | 920 | 920 | 920 | 920 | 920 | fewer than 920 (per SGX360 datasheet) |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lead-Free / RoHS | Lead-free (RoHS) | Leaded (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | Leaded (non-RoHS) | Lead-free (RoHS) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Same package as EP4SGX530NF45C3G with RoHS compliance (vs EP4SGX530NF45C3G)
- Higher Fmax than EP4SGX530NF45C2N (vs EP4SGX530NF45C2N)
- Maximum logic density in the NF45 footprint (vs EP4SGX360NF45C3N)
Design Notes
Estimated: the EP4SGX530NF45C3N at 100% utilization across 531 K LEs can dissipate 10-15 W of dynamic power plus core leakage. Designers should mount a high-performance heatsink or forced-air cooler to keep junction temperature below 85 C ambient; the FC-FBGA top thermal interface requires either an integrated heat spreader or thermal pad to a finned heatsink. Refer to the Stratix IV GX PowerPlay Early Power Estimator (EPE) for design-specific numbers and apply a 30% margin for thermal design.
Estimated: the 1932-ball NF45 FC-BGA at 1.0 mm ball pitch requires a high-density PCB stack-up (12-16 layers minimum) with microvia (laser-drilled) layers at the BGA breakout. Per the NF45 package mechanical drawing, allow 4-6 microvia layers for clean power and signal routing. Maintain matched impedance (100 ohm differential for transceivers, 50 ohm single-ended for general I/O) and place decoupling capacitors directly under the BGA on the opposite side per Quartus II pin-out guidelines.
Do not confuse the NF45 (1932-ball) package with KH40 (1517-ball) or HH35 (1152-ball) variants of the same EP4SGX530 die. Although the logic capacity is identical, the pinouts and PCB footprints are NOT compatible; substituting an NF45 part for a KH40 design will cause a complete board re-spin. Also note that the EP4SGX530NF45C3N is in Last Time Buy lifecycle status; new designs should migrate to Stratix V or Agilex 7 families unless the design is a maintenance re-spin of an existing product.
Place multi-gigabit transceiver channels on the package edge that minimizes lane-to-lane crosstalk; the Stratix IV GX datasheet Section 7 specifies which transceiver banks are bonded out for NF45. Provide continuous reference planes and stitch guard vias along the entire transceiver routing path. Avoid routing any high-speed lane across a power plane split; if unavoidable, use stitched ground vias to maintain return path continuity and meet 100 ohm differential impedance.
Estimated: at 8.5 Gbps transceiver rates per Stratix IV GX datasheet, channel loss budget is approximately 10 dB at Nyquist. Use TDR-measured PCB traces, Megtron-6 or similar low-loss dielectric, and verify pre-emphasis and equalization settings via Quartus II Transceiver Toolkit before final BOM release. Pre-emphasis and AC coupling capacitor selection (typically 100 nF X7R) should be validated against the chosen PCB stack-up to avoid eye-diagram compliance failures.
Compliance Information
Lead-free per FindIC FBGA-1932 description; commercial temperature grade 0-85 C. AEC-Q100 not applicable for FPGAs; for automotive projects consider ASIL-rated alternatives. REACH and conflict-minerals declarations can be retrieved from the Intel FPGA product-compliance portal.
