EP4SGX110HF35C4G - Stratix IV GX 105.6K LEs FPGA | Intel
MPN: EP4SGX110HF35C4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6203.67 | $6,203.67 |
| 10 | $5893.49 | $58,934.90 |
| 100 | $5583.3 | $558,330.00 |
| 250 | $5300 | $1,325,000.00 |
| 500 | $5000 | $2,500,000.00 |
EP4SGX110HF35C4G Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined after manufacturing by a configuration bitstream rather than at the fab. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which themselves belong to the logic IC and semiconductor families. Stratix IV GX specifically adds hardened multi-gigabit transceivers, making it a hybrid between a general-purpose FPGA and a connectivity-oriented ASSP, which is why the family is widely adopted in communications infrastructure, broadcast video, and defense/aerospace signal-processing cards.
Key features of the EP4SGX110HF35C4G include 562 fixed-precision multipliers (18x18) for DSP workloads, dedicated on-chip memory blocks totaling ~9.6 Mbits, up to 8 PLLs for clock management, and 4 speed-grade C4 transceivers capable of multi-gigabit serial rates. It supports commercial temperature range (0C to +85C junction), surface-mount assembly, and the HF35 code indicates a 1.0 V core voltage variant. The device is configured via standard JTAG or in-system serial configuration schemes, and is supported by the Quartus II design toolchain.
Architecturally, the Stratix IV GX uses an Adaptive Logic Module (ALM) of 8 inputs - an evolution of the 4-input LUT used in older Stratix families - giving better logic packing density and shorter critical paths. The transceiver blocks embed Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) features, supporting protocols such as PCI Express Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and Gigabit Ethernet with minimal soft-logic overhead. The large embedded memory pool allows deep packet buffers and lookup tables to be placed directly in silicon rather than external SRAM.
Typical applications include wireless baseband processing, telecom line cards, high-speed serial protocol bridging, military radar and signal intelligence, medical imaging pipelines, and ASIC prototyping. The high transceivers count combined with substantial logic resources makes the EP4SGX110HF35C4G a strong fit when a single device must perform both DSP-style processing and serialized I/O simultaneously.
When designing with this FPGA, ensure the PCB provides sufficient decoupling, matched-length routing for the transceiver channels, and adequate thermal copper to dissipate the ~10-15 W typical power envelope of a fully utilized Stratix IV GX device. Use the Quartus II PowerPlay analyzer early in the design cycle to model junction temperature and rail-current profile before committing to layout. Note that the Altera EP4SGX family is in mature production; verify lifecycle status with Intel before starting new designs.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for EP4SGX110HF35C4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110HF35C4G (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110HF35C3G
✅ Drop-In✓ In Stock
$3128.75 / Unit
View Datasheet →EP4SGX110HF35C2G
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX110FF35C4G
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →EP4SGX110FF35C3G
✅ Drop-In✓ In Stock
$1960 / Unit
View Datasheet →EP4SGX110FF35I4G
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP4SGX110DF29C4G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP4SGX110HF35C4G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Logic Elements (LEs) | 105,600 |
| Logic Array Blocks (LABs) | 4,224 |
| Total RAM Bits | 9,793,536 (about 9.6 Mbit) |
| User I/O Pins | 488 |
| Package | 1152-BBGA, FCBGA (35 x 35 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 40 nm |
| Core Voltage | 1.0 V (typical Stratix IV) |
| Operating Temperature (Junction) | 0C to +85C (commercial, 'C' grade) |
| Speed Grade | C4 |
| Number of PLLs | 8 (per Stratix IV GX family max) |
| DSP Blocks (18x18 Multipliers) | 562 |
| Transceiver Count | Integrated GX transceivers (multi-gigabit) |
| Configuration Interface | JTAG / Passive Serial / Fast Passive Parallel |
| Design Toolchain | Quartus II |
| RoHS Status | Compliant |
EP4SGX110HF35C4G 1152-bbga, fcbga (35 x 35 mm) Pin Configuration Guide
Pin configuration for EP4SGX110HF35C4G (1152-bbga, fcbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110HF35C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110HF35C4G is suitable for 6 applications: Wireless Baseband Processing, Telecom Line Card Protocol Bridging, Military Radar and Signal Intelligence, Broadcast Video Processing, Medical Imaging Pipeline, ASIC Prototyping and Emulation.
Wireless Baseband Processing
The EP4SGX110HF35C4G is well-suited for wireless baseband signal processing where both high logic density and multi-gigabit serial I/O are required. Its 105,600 logic elements and 562 18x18 DSP multipliers enable real-time channel estimation, FFT/iFFT blocks, and symbol-rate processing for LTE, WCDMA, and emerging 5G fronthaul interfaces. The integrated GX transceivers handle CPRI and OBSAI links to remote radio heads at line rates up to multi-Gbps, replacing discrete PHY devices and saving board space. Place the FPGA between the analog RF frontend and the baseband SoC, with the transceiver channels driving optical SFP modules and the user I/O banks interfacing to DDR3 memory for symbol buffers. Designers must budget ~12 W of device power and provide a multi-rail power supply with proper sequencing, since the 1.0 V core and 2.5 V/3.3 V I/O rails must ramp in a defined order to avoid in-rush damage.
Recommended
Telecom Line Card Protocol Bridging
In telecom line cards, the EP4SGX110HF35C4G bridges between backplane serial interfaces and parallel fabric connections. The device's GX transceivers natively support protocols such as Serial RapidIO, XAUI, Interlaken, and 10 Gigabit Ethernet, eliminating the need for external PHY chips. With 488 user I/O pins the FPGA can fan out to multiple SFP/SFP+ cages, backplane SERDES lanes, and a host CPU via PCIe Gen2. The substantial 9.6 Mbit embedded memory pool accommodates deep packet queues and lookup tables, removing pressure on external TCAMs. Designers typically run the FPGA at line rate while a supervisory CPU handles slow-path management, with the FPGA interrupt output driving the host CPU's GPIO. Industrial-temperature variants like EP4SGX110FF35I4G are recommended when the line card sits in an outdoor or unconditioned enclosure.
Recommended
Military Radar and Signal Intelligence
Defense radar and SIGINT systems benefit from the EP4SGX110HF35C4G's combination of hardened transceivers and large logic fabric. Beamforming, pulse compression, and doppler processing fit comfortably within the 105K-LE envelope, while the GX transceivers ingest raw ADC data streams at multi-Gbps rates. The device's industrial-temperature sibling (EP4SGX110FF35I4G) is often preferred for fixed-wing and ground-mobile platforms where ambient swings exceed commercial range. For phased-array front ends the FPGA's 562 multipliers form massive FFT engines running in parallel, and the 9.6 Mbit embedded RAM provides windowed sample buffering without external memory contention. Designers must account for ITAR/export-control review when shipping finished units, but the part itself is commercially available.
Recommended
Broadcast Video Processing
Broadcast studios and outside-broadcast (OB) trucks deploy the EP4SGX110HF35C4G to handle uncompressed SDI and emerging IP-based video formats such as SMPTE ST 2110 and NDI. The GX transceivers accept 3G-SDI, HD-SDI, and 10G Ethernet IP video streams, while the logic fabric performs de-interlacing, color-space conversion, scaling, and on-screen graphics overlay in real time. The 488 user I/Os allow direct connection to HDMI, DisplayPort, and SDI equalizer chips without intermediate glue logic. Designers typically instantiate a soft CPU (Nios II) inside the FPGA to manage ancillary data and tally signals, keeping the BOM lower than a discrete MCU. Power and cooling are the main constraints: a fully loaded design draws 10-15 W and requires a solid thermal copper pour plus a small heatsink in confined rack enclosures.
Recommended
Medical Imaging Pipeline
CT, MRI, and ultrasound imaging systems rely on the EP4SGX110HF35C4G for front-end image reconstruction and back-end image processing. With 562 dedicated 18x18 multipliers the FPGA implements parallel back-projection kernels for CT reconstruction, while the GX transceivers ingest raw data from high-speed ADC banks. The 9.6 Mbit embedded memory serves as line buffers for image-tile rearrangement, and the 488 user I/Os drive LVDS links to display panels and acquisition boards. Designers often pair the EP4SGX110HF35C4G with a host CPU over PCIe for command/status handling while keeping pixel-rate processing on-chip for deterministic latency. Medical deployments must follow IEC 60601 isolation and EMI guidelines - place the FPGA behind the patient-isolation barrier and use optocouplers on any line crossing that barrier.
Recommended
ASIC Prototyping and Emulation
The EP4SGX110HF35C4G serves as a mid-density target for ASIC prototyping and logic emulation, where its 105,600 LEs can host partial ASIC RTL with comfortable margin for debug instrumentation. The Quartus II toolchain provides compile, partition, and time-budget analysis features that map a large ASIC design across multiple Stratix IV GX devices on a multi-FPGA prototyping board. The GX transceivers support high-speed chip-to-chip links between FPGAs, eliminating external SERDES chips on the prototype board. For ASIC designs targeting ~50-80 K gates of synthesized logic plus moderate memory, a single EP4SGX110HF35C4G often fits; larger designs scale to two or four FPGAs on a multi-FPGA partition. Verification engineers benefit from SignalTap II embedded logic analyzer integration, which captures internal signals without external test equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110HF35C4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110HF35C3G | EP4SGX110HF35C2G | EP4SGX110FF35C4G | EP4SGX110FF35C3G | EP4SGX110FF35I4G | EP4SGX110DF29C4G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA (35x35) | 1152-FBGA, FCBGA (35x35) | 1152-FBGA, FCBGA (35x35) | 1152-FBGA, FCBGA (35x35) | 1152-FBGA, FCBGA (35x35) | 1152-FBGA, FCBGA (35x35) | 780-FBGA, FCBGA (29x29) - smaller package |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Speed Grade | C4 | C3 (slower) | C2 (slowest) | C4 | C3 | I4 (industrial temp) | C4 |
| Embedded RAM (bits) | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Transceiver Pin Mapping | HF35 ballmap | HF35 ballmap (same) | HF35 ballmap (same) | FF35 ballmap (different transceiver routing) | FF35 ballmap | FF35 ballmap | DF29 ballmap (smaller package, different pinout) |
Key Differentiators
- Highest speed grade available in this ballmap variant (vs EP4SGX110HF35C3G)
- Most widely stocked 105K-LE Stratix IV GX option (vs EP4SGX110HF35C2G)
- Commercial temperature range with full speed grade (vs EP4SGX110FF35I4G)
Design Notes
Estimated: The 1152-ball flip-chip BGA package requires a 1.0 mm pitch (or finer) PCB footprint with via-in-pad or microvia technology. Plan at least 8 PCB layers: dedicated ground planes above and below the BGA, dedicated 1.0 V core and 2.5 V/3.3 V I/O power planes, and matched-length transceiver trace layers. Use a high-Tg (>=170C) FR-4 or low-loss PCB material when the transceivers operate above 5 Gbps to control insertion loss.
Estimated: A fully utilized Stratix IV GX 110K-LE device typically dissipates 10-15 W. With the FCBGA 35x35 mm package and theta_JA roughly 12-15 C/W (with a moderate thermal copper pour, no heatsink), expect a junction temperature rise of 120-225 C above ambient - which exceeds commercial limits. Provide either a solid copper ground plane (>= 25 cm^2 directly under the BGA) plus a small 15-25 C/W heatsink, or forced airflow. Run the Quartus II PowerPlay early in the design to model worst-case power.
Transceiver channels above 3.125 Gbps require controlled-impedance differential routing (typically 100 ohm differential, with skew matched to <1 ps across P and N). Use length matching within a transceiver channel and across lanes of a multi-lane protocol (XAUI, PCIe, CPRI). Place AC-coupling capacitors as close to the transmitter pins as possible on the FPGA side. Reference the Stratix IV GX Transceiver User Guide and the AltLVDS / ALTGX megafunction documentation for protocol-specific board-layout requirements.
Do not confuse the HF35 ballmap with FF35 or DF29 - they share the same die but route transceivers and I/O banks to different physical balls. Migrating between ballmaps without re-running pin assignments will fail at board bring-up. Also verify the Quartus II device selection matches the speed grade and temperature suffix on the package marking; mismatched ordering codes can cause silent timing failures. Use the Quartus II 'Pin Planner' to import the verified .pin file before tape-out.
Compliance Information
RoHS compliant per Intel product specifications. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Industrial temperature variants available with -I suffix.
