EP4SGX530NF45I3N - 531K LE Stratix IV GX FPGA, 1932-BGA | Intel
MPN: EP4SGX530NF45I3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3450 | $3,450.00 |
| 10 | $3120 | $31,200.00 |
| 100 | $2780 | $278,000.00 |
| 500 | $2510 | $1,255,000.00 |
| 1,000 | $2295 | $2,295,000.00 |
EP4SGX530NF45I3N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices within the semiconductor hierarchy (PLD -> FPGA -> high-density FPGA with transceivers). Stratix IV GX devices sit at the top of the Altera performance hierarchy, optimized for parallel processing, high-bandwidth I/O, and protocol bridging in communications, test equipment, and high-performance compute.
Key features include 21248 LABs/CLBs, 27376 Kb of embedded block RAM, hard PCI Express Gen1/Gen2 endpoints, dedicated 8B/10B encoder/decoder blocks compliant to IEEE802.3-2005, automatic idle ordered-set generation, ±100 ppm clock compensation, and integrated GbE MAC support. The 1932-ball FC-BGA package supports a 0.9 V core supply and an industrial temperature range from -40 °C to 100 °C, making the EP4SGX530NF45I3N suitable for thermally constrained embedded systems. The device is also RoHS compliant and ships in tray packaging for volume production.
The Stratix IV GX architecture combines a logic fabric with multi-gigabit transceivers (up to 600 Mbps per channel) and hard PCIe cores, enabling designers to implement protocol bridges, high-speed ADAS sensor aggregation, and baseband processing without external PHY chips. Internal memory resources and DSP blocks accelerate FFT, FIR, and baseband processing workloads.
Typical applications include high-end software-defined radio (SDR) baseband, 10G/40G Ethernet line-card processing, radar and signal-intelligence platforms, medical imaging accelerators (CT/MRI reconstruction), and high-speed test and measurement instrumentation. The transceiver-rich architecture also suits broadcast video routers and high-performance ASIC prototyping where protocol bridging and parallel DSP are required.
When designing with the EP4SGX530NF45I3N, plan thermal management around the FC-BGA substrate early - the 1932-ball package requires a multi-layer PCB with continuous via arrays under the die for heat dissipation. Use Quartus II design software (the last officially supported version for Stratix IV) and respect transceiver PCB layout guidelines for 100-ohm differential routing.
This page synthesizes distributor pricing, drop-in Stratix IV family variants, application companion parts, and PCB/thermal design notes not consolidated in the manufacturer datasheet, enabling faster sourcing and design-in decisions.
Drop-in alternatives for EP4SGX530NF45I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530NF45I3N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530NF45I3
✅ Drop-In✓ In Stock
$11599 / Unit
View Datasheet →EP4SGX530NF45C4N
✅ Drop-In✓ In Stock
$3425 / Unit
View Datasheet →EP4SGX530NF45C3N
✅ Drop-In✓ In Stock
$9850 / Unit
View Datasheet →EP4SGX530NF45C2N
✅ Drop-In✓ In Stock
$9450 / Unit
View Datasheet →EP4SGX530NF45I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 531200 |
| LABs/CLBs | 21248 |
| Total RAM Bits | 28033024 (27376 Kb) |
| User I/O Count | 920 |
| Package | 1932-BBGA, FCBGA |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40 °C to 100 °C (industrial) |
| Maximum Operating Frequency | 600 MHz |
| Transceiver Data Rate | 600 Mbps |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Packaging | Tray |
| Hard IP | PCIe Gen1/Gen2, GbE MAC, 8B/10B encoder/decoder |
EP4SGX530NF45I3N Pin Configuration
| Pin 1 | VCC — Core supply voltage (0.9 V) |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO_BANK_A1 — User I/O bank A pin 1 |
| Pin 4 | IO_BANK_A2 — User I/O bank A pin 2 |
| Pin 5 | GXB_TX_CH1 — Transceiver transmit channel 1 |
| Pin 6 | GXB_RX_CH1 — Transceiver receive channel 1 |
| Pin 7 | GXB_TX_CH2 — Transceiver transmit channel 2 |
| Pin 8 | GXB_RX_CH2 — Transceiver receive channel 2 |
| Pin 9 | REFCLK_P — Differential reference clock positive |
| Pin 10 | REFCLK_N — Differential reference clock negative |
Typical Applications
EP4SGX530NF45I3N is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, High-Speed Test and Measurement Instrumentation, 10G/40G Ethernet Line-Card Processing, Radar and Signal-Intelligence Platforms, Medical Imaging Accelerator (CT/MRI Reconstruction), Broadcast Video Routing and Processing.
Software-Defined Radio (SDR) Baseband
The EP4SGX530NF45I3N's 531,200 logic elements and 27,376 Kb of embedded block RAM make it well-suited to multi-channel SDR baseband processing where FFT, channelization, and demodulation run concurrently. The 600 Mbps multi-gigabit transceivers with hard 8B/10B encoder/decoder blocks compliant to IEEE802.3-2005 connect directly to wideband ADC/DAC front ends without an external PHY. Designers can implement 4-8 simultaneous LTE or 5G NR physical-layer channels in a single device, leveraging the dedicated DSP blocks for fixed-point FFT pipelines. Compared with smaller EP4SGX230 or EP4SGX360 FPGAs, the 530K-LE density removes external memory bottlenecks.
Recommended
High-Speed Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and protocol analyzer platforms benefit from the EP4SGX530NF45I3N's 920 user I/Os for parallel sample capture and its PCIe Gen2 hard IP for host streaming at up to 5 Gbps. The 27,376 Kb of embedded block RAM buffers large acquisition windows before transfer, while the 600 Mbps transceivers route serialized trigger or marker data between digitizer channels. Industrial temperature grade (-40 °C to 100 °C) supports lab and field deployment in production ATE racks. Designers commonly pair this FPGA with high-pin-count ADC front ends and DDR3 memory controllers for deep capture instruments.
Recommended
10G/40G Ethernet Line-Card Processing
The Stratix IV GX's hard GbE MAC and 600 Mbps multi-gigabit transceivers are ideal for 10G/40G Ethernet line-card MAC/PCS bridging, where the EP4SGX530NF45I3N's 531K logic elements handle cut-through switching, classification, and traffic shaping. The 1932-ball NF45 package exposes 920 user I/Os for backplane connectivity to switch fabrics, while embedded RAM buffers line-rate packet bursts. Built-in ±100 ppm clock compensation and 8B/10B coding simplify PHY integration. Compared with the EP4SGX360NF45I3N, the 530K-LE variant enables higher port counts and richer feature offload.
Recommended
Radar and Signal-Intelligence Platforms
Phased-array radar and electronic-warfare systems use the EP4SGX530NF45I3N for beamforming, pulse compression, and direction-finding algorithms that demand high logic density and DSP throughput. The integrated 27,376 Kb of embedded RAM stores chirp tables and FFT windows, while 920 I/Os interface to multi-element antenna arrays. Hard PCIe Gen2 endpoints stream processed detections to host processors. Industrial temperature range (-40 °C to 100 °C) supports deployment in outdoor radar enclosures and ruggedized EW pods. Designers implement thousands of multiply-accumulate operations per clock cycle in the DSP blocks.
Recommended
Medical Imaging Accelerator (CT/MRI Reconstruction)
CT and MRI scanners use the EP4SGX530NF45I3N to accelerate filtered back-projection and iterative reconstruction, leveraging the 531K logic elements to run thousands of multiply-accumulate operations per cycle in parallel. The 27,376 Kb embedded block RAM holds projection data and intermediate sinograms, while 920 user I/Os link to high-speed detector arrays via LVDS. Multi-gigabit transceivers stream raw image data from detector front ends. Compared with GPUs, the FPGA delivers deterministic latency critical for real-time fluoroscopy. Industrial temperature range supports equipment-room deployment.
Recommended
Broadcast Video Routing and Processing
Broadcast studios and outside-broadcast trucks deploy the EP4SGX530NF45I3N for SDI/UHD-SDI routing, multiviewer composition, and real-time video effects. The 920 user I/Os and 600 Mbps transceivers handle 12G-SDI streams directly, while hard 8B/10B encoder/decoder blocks simplify SDI physical-layer interfacing. The 531K logic elements and 27,376 Kb block RAM enable 4K/8K multiviewer compositions without external memory thrash. Industrial temperature grade supports OB-truck environments. Designers often pair this FPGA with HDMI 2.0 and SDI retimer companions.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530NF45I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530NF45I3 | EP4SGX530NF45C4N | EP4SGX530NF45C3N | EP4SGX530NF45C2N |
|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531200 | 531200 | 531200 | 531200 | 531200 |
| Total RAM (Kb) | 27376 | 27376 | 27376 | 27376 | 27376 |
| User I/Os | 920 | 920 | 920 | 920 | 920 |
| Temperature Grade | Industrial (-40C to 100C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Speed Grade | I3 | I3 | C4 | C3 | C2 |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
| Approx Unit Price (qty 100) | $2780 | $2780 | $2620 | $2540 | $2380 |
Key Differentiators
- Highest-density Stratix IV GX FPGA in 1932-ball NF45 package with 920 user I/Os (vs EP4SGX360NF45I3N)
- Industrial temperature range (-40 °C to 100 °C) (vs EP4SGX530NF45C4N)
- Hard PCIe Gen1/Gen2 endpoints plus integrated 8B/10B encoder/decoder (vs EP4SGX530KH40I3N)
Design Notes
Estimated: at typical Stratix IV GX utilization (60-70% logic toggle, 0.9 V core, 85 °C ambient), the EP4SGX530NF45I3N in the 1932-ball NF45 FC-BGA dissipates 6-14 W and needs a substrate thermal resistance θJA of roughly 1-2 °C/W to stay below the 100 °C industrial junction limit. Provide a continuous via array under the central die region, multiple thermal vias (0.3 mm drill, 1.0 mm pitch) tied to internal ground planes, and a heat sink or cold plate for production builds. Without thermal mitigation the device may throttle or fail in high-utilization scenarios.
The 1932-ball FC-BGA requires a multi-layer PCB with microvia or stacked-via technology; standard 0.4 mm-pitch BGA breakouts will not route cleanly. Use at least 10 PCB layers with dedicated ground and power planes; route all 920 user I/Os in matched-length groups per bank. Maintain 100-ohm differential impedance for transceiver pairs (GXB_TX/GXB_RX), and apply the Stratix IV GX transceiver layout guidelines for AC-coupling capacitor placement and length matching.
Multi-gigabit transceivers operating up to 600 Mbps require tightly controlled PCB stack-up with low-loss dielectric (Df < 0.005 at 1 GHz). Reference the Stratix IV GX Handbook chapter on High-Speed Transceiver PCB Design for via-stitching patterns and DC-blocking capacitor placement. Use IBIS-AMI models for SI simulation before fabrication, and reserve a ground keep-out region 5x the via pitch around each transceiver ball to control crosstalk.
Do not assume the EP4SGX530NF45I3N is supported by Quartus Prime 21+ - it is officially supported only by Quartus II version 13.x or earlier; new Quartus Prime releases no longer include Stratix IV device support. Plan your design flow accordingly, and verify pin assignments using the Stratix IV GX pin-out file rather than relying on auto-assignment, as bank-voltage mismatches can permanently damage the device.
Compliance Information
RoHS compliant per Verified Web Data (datasheets.com snippet). REACH and halogen-free status not specified in available data; AEC-Q100 not applicable for FPGAs.