EPF10K100EQC208-3 - FLEX-10KE FPGA, 100K Gates, 208-PQFP | Altera
MPN: EPF10K100EQC208-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.4 | $2,740.00 |
| 500 | $22.95 | $11,475.00 |
| 1,000 | $19.8 | $19,800.00 |
EPF10K100EQC208-3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can program after manufacture to implement custom digital logic. The FLEX 10KE family belongs to the broader programmable logic device (PLD) taxonomy, alongside CPLDs and SPLDs, and occupies the high-density end of that hierarchy. Within the system, FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism and reconfigurability for glue logic, prototyping, and low-volume production.
The EPF10K100EQC208-3 includes 624 logic array blocks (LABs) and embedded array blocks (EABs) used for implementing RAM, ROM, and multiplier functions. Speed grade "-3" denotes the slowest commercial timing bin in the FLEX-10KE lineup, trading off Fmax for cost savings in designs where timing closure is not critical. The 208-PQFP package uses gull-wing leads suitable for surface-mount assembly on standard 0.5 mm-pitch footprints.
Typical applications include telecommunications line cards, factory automation controllers, data-acquisition front-ends, legacy industrial bus bridges, and educational digital design platforms. The combination of embedded memory and configurable logic makes it suitable for systems requiring custom state machines, glue logic between microprocessors and peripherals, and bus interface adaptation.
When designing with this device, note that the FLEX-10KE architecture is two decades old and the part is in the Intel/Altera legacy lifecycle. Quartus II software (or MAX+PLUS II) is required for place-and-route, and the on-chip configuration memory uses SRAM cells that must be loaded from a PROM or microcontroller on every power-up. Engineers should evaluate the modern Cyclone family for new designs.
Drop-in alternatives for EPF10K100EQC208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC208-3 (same form factor and footprint) — differing in Operating Temperature, RoHS Status, Process Technology, Total RAM Bits, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC208-2N
✅ Drop-In✓ In Stock
$172 / Unit
View Datasheet →EPF10K100EQC208-1N
✅ Drop-In✓ In Stock
$54.9 / Unit
View Datasheet →EPF10K100EQC208-2
✅ Drop-In✓ In Stock
$155.85 / Unit
View Datasheet →EPF10K100EQC208-2X
✅ Drop-In✓ In Stock
$59.5 / Unit
View Datasheet →EPF10K100BQC208-3
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →EPF10K100EFC208-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EQC208-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gate Count | 100,000 gates |
| Logic Elements / Cells | 4,992 |
| Embedded Memory Bits | 49,152 bits |
| Logic Array Blocks (LABs) | 624 |
| User I/Os | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V (operating range 2.375 V to 2.625 V) |
| Propagation Delay | 0.6 ns |
| Internal Performance | 200 MHz |
| Speed Grade | -3 |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Package | 208-BFQFP (PQFP), gull-wing |
| Pin Count | 208 |
| Mounting Type | Surface Mount |
| Logic Family | CMOS, SRAM-based |
| Configuration | SRAM, volatile (requires external PROM) |
| RoHS Status | unknown |
EPF10K100EQC208-3 208-bfqfp (pqfp), gull-wing Pin Configuration Guide
Pin configuration for EPF10K100EQC208-3 (208-bfqfp (pqfp), gull-wing package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EQC208-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EQC208-3 is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Automation Controller, Data Acquisition Front-End, Legacy Custom Bus Interface Adapter, Educational Digital Design Platform, Test & Measurement Instrumentation.
Telecommunications Line Card Glue Logic
The EPF10K100EQC208-3 fits telecommunications line-card glue-logic roles where 4,992 logic elements and 49,152 bits of embedded memory are sufficient to implement custom protocol bridges, FIFO controllers, and bus-format converters between network processors and PHY devices. Its 147 user I/Os and 0.22 µm CMOS architecture deliver the legacy timing margin required by 50-100 MHz TDM and packet interfaces, while the 208-PQFP package supports the high pin-count required for parallel backplane connections. Although the FLEX-10KE family is obsolete, many installed telecom systems continue to operate reliably with these parts, and the embedded array blocks enable on-chip RAM for lookup tables and small packet buffers without external memory.
Recommended
Industrial Automation Controller
In industrial automation and motor-control systems, the EPF10K100EQC208-3 is well-suited as a custom state-machine and timing controller. The 100K-gate capacity enables integration of multiple encoder counters, PWM generators, and fieldbus glue logic on a single device, while the 624 LABs and 4,992 logic elements provide ample headroom for complex sequencing functions. Its 2.5 V core and 0-70 °C commercial temperature range match typical factory-floor cabinet environments. The 208-BFQFP package is mechanically robust for vibration-prone installations, and the SRAM-based configuration supports field firmware updates via JTAG for commissioning and diagnostics on installed equipment.
Recommended
Data Acquisition Front-End
The EPF10K100EQC208-3 serves well in multi-channel data acquisition front-ends where it implements timing generators, channel multiplexers, and digital signal-conditioning logic between ADCs and a host processor. Its 49,152 bits of embedded memory (configured as dual-port RAM via EAB blocks) provide on-chip sample buffers, reducing host CPU interrupt load. The 147 I/Os accommodate parallel ADC interfaces and LVDS-compatible high-speed data paths. Engineers targeting retrofit and replacement of legacy systems benefit from the device's mature Quartus II tool support and abundant application notes, while the 208-PQFP package simplifies field-serviceable through-hole rework.
Recommended
Legacy Custom Bus Interface Adapter
The EPF10K100EQC208-3 is a classic fit for legacy parallel-bus adapters (VME, ISA, PC/104, custom backplanes) where ASIC development is uneconomical. Its 147 user I/Os can be partitioned across multiple I/O standards (3.3 V LVTTL, 5 V PCI) by configuring per-bank VCCIO supplies, enabling direct interface to mixed-voltage buses without external level shifters. The 0.6 ns propagation delay supports 50 MHz bus operations, adequate for most industrial legacy interfaces. The 208-PQFP package exposes enough pins for 32-bit data plus full address/control buses with comfortable margin, while Quartus II legacy support allows maintenance engineers to recompile bitstreams for installed boards.
Recommended
Educational Digital Design Platform
The EPF10K100EQC208-3 is suitable for university digital-logic laboratories and FPGA teaching platforms because the FLEX-10KE architecture exposes clean, well-documented CLB and EAB primitives that map directly to textbook concepts. Students can implement register-transfer level designs, finite state machines, and small RISC cores using MAX+PLUS II or Quartus II Web Edition. The 4,992 logic elements and 49,152 memory bits provide enough capacity for full MIPS or Nios-equivalent soft-core designs, while the 147 I/Os accommodate LEDs, switches, and 7-segment displays typical of training boards. The 208-BFQFP package on development boards remains hand-solderable for student rework exercises.
Recommended
Test & Measurement Instrumentation
In test and measurement instruments, the EPF10K100EQC208-3 implements pattern generators, custom timing engines, and protocol-aware stimulus/response logic. The 200 MHz internal performance and 0.6 ns propagation delay enable precise timing-edge placement for digital pattern generation, while 49,152 bits of embedded RAM store test vectors and expected-response signatures. The 147 I/Os support direct connection to 32-channel logic-analyzer pods or boundary-scan controllers. The 208-BFQFP package's thermal performance is adequate for the typical 1-3 W dissipation of an instrument-card FPGA, and the SRAM-based reconfigurability lets the same hardware serve multiple test profiles loaded from disk.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC208-2N | EPF10K100EQC208-1N | EPF10K100EQC208-2 | EPF10K100EQC208-2X | EPF10K100BQC208-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same |
| Family | FLEX 10KE | FLEX 10KE (same die) | FLEX 10KE (same die) | FLEX 10KE (same die) | FLEX 10KE (same die) | FLEX 10KB (predecessor) |
| Speed Grade | -3 (slowest) | -2N (faster) | -1N (fastest) | -2 (mid-grade) | -2X (extended temp) | -3 (B-series, slower die) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | ~4,992 (B-series) |
| Typical Gates | 100K | 100K | 100K | 100K | 100K | 100K |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits (B-series EABs) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete (2026) | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) | Obsolete (legacy) |
Key Differentiators
- Speed grade -3 offers the lowest unit cost in the FLEX-10KE EQC208 family (vs EPF10K100EQC208-2N)
- Identical die and pinout to faster speed grades for predictable migration (vs EPF10K100EQC208-1N)
- FLEX-10KE EAB-based embedded memory block structure (vs EPF10K100BQC208-3)
Design Notes
The EPF10K100EQC208-3 requires a clean 2.5 V ±5% core supply plus separate VCCIO banks (typically 3.3 V) for I/O. Use at least 10 µF bulk and 0.1 µF decoupling capacitors close to each power pin. Estimated core current at 200 MHz toggling is ~250 mA; add 30% margin for the regulator. The 208-BFQFP package's pin-pitch allows standard power-plane routing on a 4-layer PCB.
The FLEX-10KE is SRAM-based and volatile - the bitstream must be loaded on every power-up from an EPC configuration PROM (EPC2LC20, EPC1PC8) or a microcontroller. Failure to provide a valid configuration results in all I/Os being tri-stated. Do not assume the device retains its design after power-down. Verified against Altera FLEX-10KE family handbook configuration chapter.
The 208-BFQFP package uses gull-wing leads on a 0.5 mm pitch equivalent (PQFP). Route all 147 user I/O signals on inner signal layers and place decoupling within 5 mm of each VCC pin. Maintain a continuous ground plane under the device; the exposed pad on this package is not present, so thermal dissipation occurs through the leads and top-side copper pour. Estimated: 1 square inch of top-side copper keeps junction rise under 30 °C at 1 W dissipation.
Compliance Information
Compliance status not stated in verified web data. As a legacy commercial-grade part introduced circa 2000, RoHS/REACH status is not specified in current distributor listings.
