EPF10K200SBC356-2 - 200K Gate FLEX 10KS FPGA | Altera | BGA-356
MPN: EPF10K200SBC356-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
EPF10K200SBC356-2 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike ASICs, FPGAs are programmed post-manufacturing via SRAM, Flash, or antifuse cells. The FLEX 10KS family added embedded array blocks (EABs) - small SRAM blocks ideal for FIFO, RAM, ROM, and DSP functions - giving the part both fine-grained logic density and coarse-grained memory. This hybrid architecture is the direct ancestor of modern structured-ASIC fabrics and places the device in the hierarchy: programmable logic -> PLD -> CPLD/FPGA -> structured ASIC -> ASIC -> semiconductor IC.
Key features include 200K system gates, 9,984 logic elements, 98,304 bits of embedded memory distributed across EABs, multi-volt I/O support (2.5 V core with 3.3 V / 5.0 V PCI-compatible I/O options), an on-chip Phase-Locked Loop (PLL), boundary-scan (JTAG IEEE 1149.1) support, and 274 usable I/Os out of the 356-ball BGA. The embedded array blocks can be configured as dual-port RAM, ROM, or synchronous FIFOs, eliminating the need for an external memory chip in many glue-logic designs.
The FLEX 10KS architecture separates logic into LABs (groups of 8 LEs) connected by a continuous FastTrack Interconnect routing fabric. Each LE contains a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions. This combination lets designers implement state machines, datapaths, FIFOs, and bus interfaces in pure programmable fabric while preserving PCI-compliant I/O drive strength.
Typical applications include telecommunications line-card glue logic, PCI bus interface bridges, industrial control and factory automation controllers, legacy networking equipment replacement, and test-and-measurement instrumentation. The wide I/O count and large embedded memory make it a strong fit for designs that previously required a discrete CPLD plus external SRAM.
When designing with this part, ensure the 2.5 V core supply is decoupled with at least 100 uF bulk plus 0.1 uF ceramic capacitors per supply pin, and respect the JTAG configuration timing diagram in the datasheet during in-system programming. The -2 commercial grade is not AEC-Q100 qualified; for harsh environments select the industrial -3 or military / MIL-STD grade.
This page synthesizes distributor pricing, drop-in alternatives (same-family FLEX 10K variants in 356-BGA), and practical design notes not found in the original datasheet.
Drop-in alternatives for EPF10K200SBC356-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SBC356-2 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Family, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SBC356-2X
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EPF10K200SBC356-1
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →EPF10K200SBC356-1X
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EPF10K130EBC356-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185 / Unit
View Datasheet →EPF10K100EBC356-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92 / Unit
View Datasheet →EPF10K200SBC356-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KS |
| Family | FLEX 10KS (Embedded Programmable Logic) |
| Logic Elements / Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Embedded Memory Bits (EAB) | 98304 |
| System Gates | 200,000 |
| User I/Os | 274 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant |
| Propagation Delay | 0.4 ns (per datasheet) |
| Process Technology | 0.22 um CMOS |
| Operating Temperature | 0C to +70C (Commercial) |
| Speed Grade | -2 |
| Package | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration | SRAM-based (volatile, requires configuration device) |
| Boundary Scan | Yes (JTAG IEEE 1149.1) |
| PLL | Yes (on-chip) |
| RoHS Status | Non-compliant (legacy part) |
EPF10K200SBC356-2 Pin Configuration
| Pin A1 | I/O — User I/O (bank-specific) |
| Pin B1 | I/O — User I/O (bank-specific) |
| Pin C1 | VCCIO — I/O supply voltage |
| Pin D1 | GND — Ground |
| Pin E1 | I/O — User I/O (bank-specific) |
| Pin F1 | VCCINT — Core 2.5 V supply |
| Pin G1 | I/O — User I/O (bank-specific) |
| Pin H1 | GND — Ground |
| Pin J1 | I/O — User I/O (bank-specific) |
| Pin K1 | VCCIO — I/O supply voltage |
| Pin L1 | I/O — User I/O (bank-specific) |
| Pin M1 | I/O — User I/O (bank-specific) |
| Pin N1 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin P1 | TMS — JTAG test mode select |
| Pin R1 | TDI — JTAG test data in |
| Pin T1 | TDO — JTAG test data out |
| Pin U1 | nCONFIG — Configuration control (active low) |
| Pin V1 | nSTATUS — Configuration status (active low) |
| Pin W1 | DCLK — Configuration clock |
| Pin Y1 | DATA0 — Configuration data input |
Typical Applications
EPF10K200SBC356-2 is suitable for 6 applications: Telecommunications Line-Card Glue Logic, PCI Bus Interface Bridge, Industrial Control and Factory Automation, Legacy Networking Equipment Replacement, Test and Measurement Instrumentation, Military / Avionics Retrofit Programs.
Telecommunications Line-Card Glue Logic
The EPF10K200SBC356-2 is well suited for telecom line-card glue logic because its 9984 logic elements and 98304 bits of EAB memory (configurable as dual-port RAM or FIFO) implement packet buffers, framer interfaces, and ATM/TDM bus bridges on a single device. The 274 user I/Os across 8 banks handle multiple parallel backplane interfaces without external bus switches. The 0.4 ns propagation delay supports 50 MHz backplane timing, while the 2.5 V core with 5.0 V PCI-tolerant I/O interfaces directly to legacy bus drivers. Replace multiple 74-series TTL packages with one FLEX 10KS device to reduce BOM cost and board area.
Recommended
PCI Bus Interface Bridge
The EPF10K200SBC356-2 is ideal for PCI bus bridge applications because of its PCI-compliant 5.0 V tolerant I/O on selected banks, 32-bit / 33 MHz operation, and the 0.4 ns propagation delay that comfortably meets the 30 ns PCI bus turn-around timing. The 9984 LEs implement the PCI target state machine, configuration-space registers, and the local-bus interface, while the 98304 bits of EAB memory serve as scatter-gather DMA buffers. Its JTAG (IEEE 1149.1) boundary-scan chain supports board-level manufacturing test, reducing factory test cost for PCI add-in-card designs.
Recommended
Industrial Control and Factory Automation
The EPF10K200SBC356-2 in its -2X industrial temperature variant is suited for factory-automation controllers that need flexible I/O mapping and deterministic glue-logic response. The 274 I/Os handle multiple parallel sensor inputs, encoder interfaces (quadrature decode), and PWM outputs without external mux logic. The 98304 bits of EAB memory build motion-control trajectory tables and recipe storage. The on-chip PLL generates clock domains for CAN, SPI, and stepper-motor PWM from a single 50 MHz reference, simplifying BOM. For harsh environments, the -2X grade extends operation to 85C, covering most cabinet-rated installations.
Recommended
Legacy Networking Equipment Replacement
The EPF10K200SBC356-2 supports legacy router and switch line-card replacement programs where original FLEX 10K designs must be rebuilt on new boards. Its SRAM-based configuration allows field firmware updates via JTAG, simplifying network-rollout logistics for service providers. The 9984 LEs and 274 I/Os accept modern packet-lookup engines, MII / GMII interfaces, and serial PHY glue logic. The 0.4 ns propagation delay supports 100 Mbit Ethernet MAC timing with margin. The 356-BGA footprint uses the industry-standard 1.27 mm pitch that matches existing PCB layouts, reducing re-spin cost.
Recommended
Test and Measurement Instrumentation
The EPF10K200SBC356-2 fits in mid-range test instruments because its 9984 logic elements implement custom stimulus engines, response capture logic, and timing-pattern generators in one device. The 98304 bits of EAB memory serve as pattern buffers and waveform lookup tables, replacing a separate SRAM chip. The 0.4 ns internal delay and on-chip PLL support 200 MHz internal operation with low jitter. The 274 I/Os handle parallel test-vector buses and instrument-on-a-bus (VXI / PXI) backplane interfaces. JTAG (IEEE 1149.1) boundary scan verifies fixture continuity during board bring-up.
Recommended
Military / Avionics Retrofit Programs
The EPF10K200SBC356-2 in extended-temperature grade (-2X or MIL-STD-883 variants) is widely used in defense retrofit programs where PCB layouts are fixed and the original FLEX 10K design must be maintained. The 356-LBGA FineLine BGA footprint matches legacy avionics boards, eliminating costly re-spin during avionics upgrades. The 9984 LEs implement MIL-STD-1553 bus bridges, ARINC 429 interfaces, and discrete-to-LVDS conversion in one device. Rochester Electronics holds qualified MIL-PRF-38535 inventory for long-life defense programs through 2030+.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SBC356-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SBC356-2X | EPF10K200SBC356-1 | EPF10K200SBC356-1X | EPF10K130EBC356-2 | EPF10K100EBC356-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same |
| Series / Family | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KE (130K gates) | FLEX 10KE (100K gates) |
| Logic Elements | 9984 | 9984 (same) | 9984 (same) | 9984 (same) | 8320 (-17%) | 4992 (-50%) |
| Embedded Memory Bits (EAB) | 98304 | 98304 (same) | 98304 (same) | 98304 (same) | 98304 (same) | 49152 (-50%) |
| User I/Os | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) | 274 (same) |
| Speed Grade | -2 (commercial fast) | -2 extended temp | -1 (slower) | -1 extended temp (slower) | -2 (commercial fast) | -1 (slower) |
| Operating Temperature | 0C to 70C (commercial) | 0C to 85C (industrial) | 0C to 70C (commercial) | 0C to 85C (industrial) | 0C to 70C (commercial) | 0C to 70C (commercial) |
Key Differentiators
- Highest-density FLEX 10KS variant in 356-BGA (vs EPF10K130EBC356-2)
- Largest embedded memory in FLEX 10KS family (vs EPF10K100EBC356-1)
- Pin-compatible across FLEX 10K family (vs Cyclone IV EP4CE115F29C8N)
- Faster speed grade within same part number (vs EPF10K200SBC356-1)
Design Notes
The EPF10K200SBC356-2 requires a clean 2.5 V core supply within the 2.375 V to 2.625 V datasheet tolerance, with at least 100 uF bulk decoupling plus 0.1 uF ceramic capacitors adjacent to every VCCINT and VCCIO ball. Estimated: based on the 200K-gate FLEX 10K design, quiescent ICC is approximately 50 mA and dynamic current at 100 MHz can exceed 1.5 A; a low-impedance power plane is required. Add a ferrite bead to isolate VCCINT from VCCIO if I/O switching noise couples into the core rail.
The 356-LBGA FineLine BGA package has a theta_JA of approximately 18 C/W with a 4-layer PCB and adequate thermal vias under the die flag. Estimated: at 2.5 V core and 1.5 A worst-case, internal dissipation reaches 3.75 W and the junction rises about 67C above ambient. For 70C commercial operation, ambient should not exceed 0C + (70C - 3.75 W * 18 C/W) = effectively derate at 1.2 W typical. Add thermal vias and bottom-side copper pours for reliability.
Place all VCCINT and GND balls on inner power/ground planes and stitch them with 8-mil via arrays directly under the BGA pads. The 1.27 mm pitch of the 356-LBGA permits 4 mil traces between adjacent pads; escape routing must use 0.2 mm via-in-pad if you need to fan out 4+ signals per quadrant. JTAG chain signals (TCK, TMS, TDI, TDO) should be length-matched within 50 mils to avoid boundary-scan failures on long chains.
The FLEX 10KS is SRAM-based, so configuration is volatile and must reload on every power-up via the EPC configuration EEPROM (EPC2, EPC4, EPC8) or through JTAG. The nCONFIG, nSTATUS, DCLK, and DATA0 signals follow a strict power-on sequence; pulling nCONFIG low during power-up resets the configuration state machine. For multi-device chains, daisy-chain DATA from device N to device N+1 with each nCASC pin controlling cascade timing.
Do not hot-plug a powered FLEX 10K into a live backplane - the absence of I/O clamp diodes on legacy 5.0 V tolerant banks can cause latch-up. Always sequence core power before I/O power, and ensure unused I/O pins are configured as outputs driving low or tri-stated inputs with internal weak pull-up enabled. Do not exceed the maximum 274 used I/Os even though 356 BGA balls are present - 82 balls are reserved for power, ground, JTAG, and configuration.
Compliance Information
Legacy FLEX 10KS part predates RoHS compliance programs; Microchip USA listing indicates 'RoHS non-compliant'. No AEC-Q100 grade available for automotive. Lead-free (Pb-free) reflow profile is not guaranteed on this 356-LBGA variant - confirm with Rochester Electronics or manufacturer datasheet before lead-free assembly. REACH and conflict-minerals status not published; mark unknown.
