EPF10K100EBC356-1 - 100K Gates FLEX 10KE FPGA | Intel
MPN: EPF10K100EBC356-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 250 | $105 | $26,250.00 |
| 500 | $92 | $46,000.00 |
EPF10K100EBC356-1 Overview
A FLEX 10KE FPGA belongs to the PLD (programmable logic device) family, sitting in the broader hierarchy of digital logic ICs -> programmable logic -> field programmable gate array. The 'E' suffix designates the enhanced 'embedded' variant: each logic array block (LAB) is paired with a dedicated Embedded Array Block (EAB) containing 2,048 bits of true dual-port RAM, enabling single-chip System-on-a-Programmable-Chip (SOPC) implementations that combine logic, memory, and I/O on one die.
Key features include 100K system gates, an IEEE Std 1149.1 JTAG boundary-scan test interface that consumes up to 31,250 additional gates, multi-volt I/O supporting 2.5 V/3.3 V operation, and pin-compatibility with other FLEX 10K devices in matching package footprints. The LBGA-356 (1.0 mm pitch, 35 x 35 mm body) maximizes board area efficiency and supports SameFrame pin migration across density points.
The FLEX 10KE architecture combines a fine-grained logic element fabric with coarse-grained embedded memory blocks, allowing designers to implement wide datapaths, FIFOs, and CAMs in distributed EABs without consuming logic resources. The 0.6 ns propagation delay and 333 MHz internal frequency suit the device for glue logic, bus bridging, and peripheral controller duties in mid-complexity designs.
Typical applications include telecommunications line cards, industrial control boards, prototyping platforms for ASIC emulation, and legacy system upgrades. The 356-LBGA package is preferred where board density is at a premium and the design requires more I/O than QFP alternatives can offer. Designers migrating from FLEX 10KA to 10KE retain pin compatibility for shared footprint members.
When designing with this device, ensure the Quartus II or MAX+PLUS II toolchain supports the FLEX 10KE family, and verify that the JTAG chain accounts for the additional 31,250 gates. Static I/O bank assignments must respect the device's I/O standard groupings to avoid contention.
This page synthesizes distributor inventory, parametric drop-in alternatives, and package-level design notes for the EPF10K100EBC356-1, providing information not consolidated in the manufacturer datasheet PDF.
Drop-in alternatives for EPF10K100EBC356-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EBC356-1 (same form factor and footprint) — differing in Process Technology, Family, Operating Temperature, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EBC356-2
✅ Drop-In✓ In Stock
$59.95 / Unit
View Datasheet →EPF10K100ABC356-2
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EPF10K100EBC356-1N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EPF10K100EBC356-1X
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EPF10K100EBC356-1B
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EBC356-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| System Gates | 100,000 |
| Logic Elements | 4,992 |
| Embedded Memory | 49,152 bits |
| User I/Os | 274 |
| Package | 356-LBGA |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 2.5 V |
| I/O Voltage | 2.5 V / 3.3 V |
| Internal Frequency | 333.33 MHz |
| Propagation Delay | 0.6 ns |
| Operating Temperature | 0 °C to 70 °C |
| JTAG (IEEE 1149.1) | Yes |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| RoHS Status | Unknown - pre-RoHS design |
EPF10K100EBC356-1 356-lbga Pin Configuration Guide
Pin configuration for EPF10K100EBC356-1 (356-lbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EBC356-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EBC356-1 is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Control Board Logic Integration, ASIC Prototyping and Emulation Platform, Legacy System Upgrade and Bridge Logic, Peripheral Controller and Co-Processor, Test and Measurement Instrumentation Front-End.
Telecommunications Line Card Glue Logic
The EPF10K100EBC356-1's 100K gates, 4,992 logic elements, and 49,152 bits of embedded SRAM make it well-suited for telecommunications line cards requiring bus bridging, protocol conversion, and FIFO buffering in compact LBGA-356 footprint. The device's 333.33 MHz internal frequency and 0.6 ns propagation delay handle TDM bus multiplexing, HDLC framing, and ATM segmentation at line rates. Embedded Array Blocks provide true dual-port memory for cell buffering without consuming logic resources. The 274 user I/Os accommodate parallel Utopia interfaces, POS-PHY connections, and standard telecom backplane buses.
Recommended
Industrial Control Board Logic Integration
In industrial control applications, the EPF10K100EBC356-1 integrates glue logic between microcontrollers, motor drivers, and I/O expansion chips. Its 274 I/Os interface directly to multi-axis encoder inputs, PWM outputs, and isolated digital I/O banks, while the embedded SRAM supports real-time data tables for PID loops. Commercial 0-70 °C temperature rating suits factory-floor enclosures. The JTAG (IEEE 1149.1) interface enables in-system programming during board bring-up and field firmware updates via standard ByteBlaster cables.
Recommended
ASIC Prototyping and Emulation Platform
Designers use the EPF10K100EBC356-1 as an ASIC prototyping vehicle where 100K gates and 4,992 logic elements map directly onto mid-complexity ASIC netlists. The 0.6 ns propagation delay approximates ASIC timing for pre-silicon validation, while embedded memory blocks model ASIC SRAM macros. Multiple EPF10K100EBC356-1 devices can be chained via JTAG to emulate larger ASICs, making this part a workhorse for ASIC verification teams. MAX+PLUS II and Quartus II synthesis flows support industry-standard Verilog and VHDL inputs.
Recommended
Legacy System Upgrade and Bridge Logic
The EPF10K100EBC356-1 serves as a bus bridge and protocol converter in legacy systems upgrading from discrete TTL/CMOS logic to integrated programmable logic. Its 356-LBGA footprint maximizes board density while providing 274 I/Os to interface with legacy ISA, VME, or proprietary backplanes. Embedded Array Blocks replace external FIFO chips, reducing BOM count and board area. This application is common in military, medical, and industrial systems with multi-decade deployment lifecycles.
Recommended
Peripheral Controller and Co-Processor
Used as a peripheral co-processor alongside a main CPU, the EPF10K100EBC356-1 offloads I/O handling, DMA control, and accelerator functions. The 49,152-bit embedded memory provides local data storage for high-throughput DMA streams, while 274 I/Os connect to multiple peripheral buses simultaneously. The 333.33 MHz internal frequency is well-matched to PCI and similar 33 MHz peripheral buses where the FPGA can implement custom controller state machines.
Recommended
Test and Measurement Instrumentation Front-End
In test equipment, the EPF10K100EBC356-1 implements custom timing generators, pattern sequencers, and signal routing matrices. The high I/O count handles parallel fixture interfaces, while embedded memory stores calibration tables and pattern data. The JTAG boundary-scan chain supports PCB-level interconnect testing per IEEE 1149.1, adding up to 31,250 additional gates of test logic. The commercial temperature grade suits laboratory and production-line environments.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EBC356-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EBC356-2 | EPF10K100ABC356-2 | EPF10K100EBC356-1N | EPF10K100EBC356-1X | EPF10K100EBC356-1B |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 356-LBGA | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) | 356-LBGA (same) |
| Speed Grade | -1 (fastest) | -2 (slower) | -2 (slower) | -1 (same) | -1 (same) | -1 (same) |
| Logic Elements | 4,992 | 4,992 (same) | 4,992 (same) | 4,992 (same) | 4,992 (same) | 4,992 (same) |
| System Gates | 100,000 | 100,000 (same) | 100,000 (same) | 100,000 (same) | 100,000 (same) | 100,000 (same) |
| Embedded SRAM | 49,152 bits | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) | 49,152 bits (same) |
| User I/Os | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) | 274 (same) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (Rochestock) | Obsolete | Obsolete |
Key Differentiators
- Fastest speed grade in the FLEX 10KE LBGA-356 family (vs EPF10K100EBC356-2)
- Same 356-LBGA footprint as BGA-256 variants enables easy migration (vs EPF10K100BFC256-3)
- Embedded Array Blocks for true dual-port RAM (vs EPF10K100BFC256-3)
Design Notes
The EPF10K100EBC356-1 requires a stable 2.5 V core supply with a tolerance of ±5% and separate 2.5 V or 3.3 V I/O bank supplies per the manufacturer datasheet. Decoupling requires at minimum one 100 µF bulk capacitor per supply rail plus 0.1 µF and 0.01 µF ceramic capacitors close to each VCC/GND pair. Estimated: with all 274 I/Os toggling at 33 MHz, Icc core current can exceed 500 mA, so power plane design with low impedance is critical.
In LBGA-356 packages, heat dissipation is primarily through the internal power/ground balls and PCB thermal vias. Per the manufacturer datasheet, the thermal resistance θJA is approximately 18 °C/W with a standard 4-layer JEDEC test board; without thermal vias under the package die-up area, junction temperature can rise above 100 °C at full I/O utilization. Recommend placing a 6x6 thermal via array (0.3 mm drill, 0.5 mm pitch) on all internal GND balls.
The 356-LBGA package has 1.0 mm ball pitch on a 35 x 35 mm body. PCB design requires 0.4 mm laser-drilled vias, microvia-in-pad construction recommended for inner balls, and matched 50 Ω controlled-impedance traces for high-speed I/O. Per the manufacturer datasheet, all VCC and GND balls must be connected to internal planes, and signal traces should not pass beneath the package footprint.
Common pitfalls: (1) Do not assume EPF10K100B (FLEX 10KB) and EPF10K100E (FLEX 10KE) are interchangeable - the 'B' lacks Embedded Array Blocks; (2) JTAG chain consumes up to 31,250 gates per the manufacturer datasheet, which must be included in resource estimation; (3) MAX+PLUS II design files must be resynthesized under Quartus for newer flows; (4) Commercial temperature grade parts will fail outside 0-70 °C.
Compliance Information
RoHS compliance not documented in verified distributor data. FLEX 10KE family predates widespread RoHS adoption in FPGAs; -N suffix variants (EPF10K100EBC356-1N) are likely lead-free but should be verified with the manufacturer's material declaration before RoHS-only assembly.
