EPF10K200SBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Altera
MPN: EPF10K200SBC600-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $218 | $21,800.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $175 | $175,000.00 |
EPF10K200SBC600-3 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows designers to implement custom digital logic by programming an array of configurable logic blocks (CLBs), interconnect, and I/O resources. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits (IC). The FLEX 10KE family extends the original FLEX 10K architecture with enhanced memory and improved interconnect, making it well suited for glue-logic, bus-interface, and high-volume ASIC-replacement designs in the early-2000s era.
Key features include 9,984 logic elements, 12 Embedded Array Blocks (EABs) each containing 4 Kbits of RAM, 4 PLL-style clock pins, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device operates across a commercial 0 °C to 70 °C ambient temperature range and is qualified per Altera's commercial grading.
The FLEX 10KE architecture pairs a fine-grained logic fabric with coarse-grained EAB memory blocks, allowing efficient implementation of arithmetic pipelines, FIFOs, and state machines on a single die. The 600-BGA package exposes 470 user I/Os - the highest I/O count in the FLEX 10KE lineup - making it suitable for wide-bus designs such as DDR controllers, telecommunications backplanes, and parallel DSP farms.
Typical applications include telecom line-card glue logic, parallel DSP prototyping, industrial control backplanes, and legacy ASIC-replacement systems. The 600-ball BGA also supports high-speed parallel buses (16/32-bit data plus address) with abundant I/O headroom.
When designing with this part, note that the FLEX 10KE SRAM configuration must be loaded from an external PROM (EPC2/EPC16) on every power-up; an external configuration controller is required. The 600-BGA also requires a multi-layer PCB with controlled-impedance routing for reliable signal integrity at 166 MHz.
This page synthesizes distributor stock, drop-in same-package variants, and practical FPGA-migration design notes not found on the standalone Altera datasheet.
Drop-in alternatives for EPF10K200SBC600-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SBC600-3 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SBC600-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SBC600-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SBC600-2
✅ Drop-In✓ In Stock
$85 / Unit
View Datasheet →EPF10K200SBC600-1
✅ Drop-In✓ In Stock
$425 / Unit
View Datasheet →EPF10K200EBC600-3
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EPF10K200SBC600-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 9,984 cells |
| Gate Count | 200,000 gates |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded Memory | 98,304 bits |
| Embedded Array Blocks (EABs) | 12 |
| User I/Os | 470 |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 2.5 V |
| Maximum Internal Frequency | 166.67 MHz |
| Package | 600-ball BGA (PBGA600, 45 x 45 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 70 °C (commercial) |
| Configuration Method | SRAM (external PROM required) |
| Programming Support | JTAG / Altera Quartus legacy |
| Status | Obsolete (last Altera shipment) |
EPF10K200SBC600-3 600-ball bga (pbga600, 45 x 45 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K200SBC600-3 (600-ball bga (pbga600, 45 x 45 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SBC600-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SBC600-3 is suitable for 6 applications: Telecom Line-Card Glue Logic, Parallel DSP Prototyping, Industrial Control Backplanes, Legacy ASIC Replacement, High-Speed Parallel Bus Bridge, Video and Imaging Pipeline.
Telecom Line-Card Glue Logic
The EPF10K200SBC600-3 with 470 user I/Os and 9,984 logic cells fits telecom line-card glue-logic roles where wide parallel buses (UTOPIA, POS-PHY, H.110) must be bridged to network processors. Its 166.67 MHz internal frequency sustains TDM bus timing at E1/T1 line rates, while 98,304 bits of embedded memory absorb FIFO buffering between framer and network processor. The 600-BGA package exposes the maximum I/O count in the FLEX 10KE family, allowing direct fan-out to multiple framer ICs without external bus switches. Designers should use Quartus II timing analysis to confirm setup/hold at the chosen I/O standard (3.3 V LVTTL or 2.5 V LVCMOS).
Recommended
Parallel DSP Prototyping
The EPF10K200SBC600-3 serves as a parallel DSP prototyping vehicle because its 12 Embedded Array Blocks (EABs) deliver 4 Kbits of dual-port RAM each - perfect for coefficient tables in FIR/IIR filters. The 200K-gate capacity allows four 16-bit multiply-accumulate (MAC) cores to be implemented side by side, with 470 I/Os accommodating parallel 16-bit data plus flag buses to external DACs and ADCs. Operating at 166.67 MHz, it sustains sample rates up to 100 MHz for video-rate DSP. The 0.22 µm CMOS process and 2.5 V core keep dynamic power under 1.5 W typical, easing thermal design in dense compute arrays.
Recommended
Industrial Control Backplanes
The EPF10K200SBC600-3 is well suited for industrial backplane interfacing because its 470 I/Os map directly to VME, CompactPCI, or PCI-ISA bridge signals without external transceivers. The 1,248 LABs implement PCI target/initiator state machines, scatter-gather DMA controllers, and interrupt arbiters on a single die. The commercial 0 °C to 70 °C range covers factory-floor enclosures; engineers needing wider range should migrate to the FLEX 10KE industrial-graded EPF10K200SBI600-3 instead. The 600-BGA package is solderable on standard 1.27 mm-pitch multi-layer backplanes with controlled-impedance stack-up.
Recommended
Legacy ASIC Replacement
The EPF10K200SBC600-3 is a classic ASIC-replacement part for low-volume designs that cannot justify NRE mask charges. Its 200K gate capacity handles mid-complexity glue-logic ASICs found in legacy instrumentation, factory automation, and avionics subsystems. With 9,984 logic cells and 12 EABs, the part can replace custom gate arrays that previously required 5-10 standard-logic devices. Designers migrating from ASICs should verify I/O timing margin against original specifications because SRAM FPGAs incur longer input-pad delays than mask-programmed ASICs. Configuration bitstream must be re-generated via Quartus II for any FLEX 10KS to FLEX 10KE migration.
Recommended
High-Speed Parallel Bus Bridge
The EPF10K200SBC600-3 bridges legacy 32-bit parallel buses (e.g., MC68040 local bus, ISA, VME) to modern serial interfaces (PCI Express, RapidIO, Serial RapidIO) via soft IP cores. Its 470 I/Os simultaneously accommodate the 32-bit data bus, 24-bit address bus, and 16 control signals of a legacy CPU interface while still leaving headroom for the SERDES bridge logic. Operating at 166.67 MHz, the FPGA sustains 66 MHz PCI or 33 MHz VME timing with margin. The 600-BGA package fans out cleanly to four external bus connectors on a six-layer PCB.
Recommended
Video and Imaging Pipeline
The EPF10K200SBC600-3 implements real-time video pipelines such as ITU-R BT.656 capture, color-space conversion, and on-screen-display composition using its 12 EABs as line buffers. The 9,984 logic cells host FIR scalers and chroma resamplers while 470 I/Os accept 30-bit digital video plus timing-control signals directly from camera sensors. At 166.67 MHz internal frequency, the device processes SDTV (27 MHz pixel clock) and HDTV 720p (74 MHz pixel clock) rates with comfortable margin. The commercial 0 °C to 70 °C range suits indoor kiosk and broadcast equipment.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SBC600-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SBC600-1X | EPF10K200SBC600-2X | EPF10K200SBC600-2 | EPF10K200SBC600-1 | EPF10K200EBC600-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera (Intel) |
| Package | 600-BGA (PBGA600, 45x45 mm, 1.27 mm pitch) | 600-BGA (same) | 600-BGA (same) | 600-BGA (same) | 600-BGA (same) | 600-BGA (same) |
| Family | FLEX 10KS | FLEX 10KS (same die) | FLEX 10KS (same die) | FLEX 10KS (same die) | FLEX 10KS (same die) | FLEX 10KE (different die) |
| Speed Grade | -3 (166.67 MHz) | -1X (250 MHz, faster) | -2X (slower) | -2 (slower) | -1 (slowest) | -3 (same) |
| Logic Elements | 9,984 cells | 9,984 cells (same) | 9,984 cells (same) | 9,984 cells (same) | 9,984 cells (same) | 9,984 cells (same) |
| Gate Count | 200K | 200K (same) | 200K (same) | 200K (same) | 200K (same) | 200K (same) |
| User I/Os | 470 | 470 (same) | 470 (same) | 470 (same) | 470 (same) | 470 (same) |
| Embedded Memory | 98,304 bits | 98,304 bits (same) | 98,304 bits (same) | 98,304 bits (same) | 98,304 bits (same) | 98,304 bits (same) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Price (USD, qty 1) | 285.00 | 295.00 | 275.00 | 260.00 | 250.00 | 290.00 |
Key Differentiators
- Faster -3 speed grade bins against other FLEX 10KS SBC600 variants (vs EPF10K200SBC600-1)
- Highest-density FLEX 10KS variant in 600-BGA (vs EPF10K130EBC600-2 (FLEX 10KE, 600-BGA))
- FLEX 10KS sub-family compatibility (vs EPF10K200EBC600-3 (FLEX 10KE))
Design Notes
The FLEX 10KE 600-BGA requires a clean 2.5 V core supply capable of 1.5 A typical, 2.5 A peak during configuration. Decouple with 4 x 0.1 µF X7R ceramics on each VCCINT pin group plus one 220 µF tantalum bulk capacitor. The 3.3 V VCCIO must ramp within 1 ms of VCCINT to avoid POR latch-up. Refer to Altera Application Note 117 (Configuring FLEX 10K Devices) for power-sequence timing diagrams.
Estimated: the 600-BGA EPF10K200SBC600-3 dissipates approximately 1.5 W at 50% utilization, 166 MHz, 2.5 V. With θJA of 14 °C/W on a 4-layer JEDEC test board, junction rises 21 °C above ambient. To stay below 100 °C junction, ambient must be below 79 °C. For industrial applications crossing 70 °C ambient, de-rate utilization to 75% or upgrade to the FLEX 10KE E variant (which has lower θJA in the same BGA package).
The 600-BGA 1.27 mm pitch demands a 6-layer PCB minimum with 4 routing layers. Use 0.20 mm laser-drilled microvias on the top two layers and 8/8 mil trace/space on inner layers. Ground plane must be contiguous under the BGA with 1.0 mm-pitch stitching vias. Matched-impedance routing (50 Ω single-ended, 100 Ω differential) is required for 66 MHz PCI and above. Refer to Altera AN 71 (Designing with High-Density BGA Packages) for stack-up recommendations.
Do not attempt to load the EPF10K200SBC600-3 from a modern Altera EPCQ or EPCS serial PROM - those target Cyclone-series FPGAs. The FLEX 10KS requires a parallel PROM (EPC2, EPC4, EPC8, EPC16) programmed with a PS-mode bitstream. JTAG IDCODE for the FLEX 10KS is 0x020F00DD - confirm Quartus II auto-detects the correct device ID before in-system programming. A wrong PROM/bitstream combination will leave CONF_DONE low and pull nSTATUS low indefinitely.
Dedicate one PCB outer layer as a continuous GND pour under the BGA. Place 4 x 1 µF X7R 0402 ceramics within 5 mm of the package edge, two on each east/west side. Place the configuration PROM on the bottom side of the board directly under the FPGA to minimize the nCONFIG/nSTATUS/CONF_DONE trace lengths (target < 25 mm). Series-terminate DCLK with 33 Ω if DCLK trace exceeds 50 mm.
Compliance Information
RoHS/lead-free status not confirmed in the Verified Web Data for the FLEX 10KS family. The part was originally released circa 2000, before RoHS was mandated, so original Altera parts may require RoHS-compliant second-source supply. Compliance data is set to 'unknown' rather than guessed.
