EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
MPN: EPF10K200SBC600-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $588.63 | $588.63 |
| 10 | $540 | $5,400.00 |
| 100 | $495 | $49,500.00 |
| 500 | $460 | $230,000.00 |
| 1,000 | $425 | $425,000.00 |
EPF10K200SBC600-1 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic after manufacturing. FPGAs sit in the broader semiconductor taxonomy alongside CPLDs, ASICs, and microcontrollers, and are used to implement glue logic, custom datapaths, and full system-on-chip designs without the NRE cost of an ASIC. The FLEX-10KS architecture introduced the embedded array block (EAB) concept, allowing designers to instantiate on-chip RAM or ROM in addition to standard logic.
Key specifications for this part include 4,992 logic elements, 24,576 RAM bits distributed across embedded array blocks, 470 user I/Os, and a 2.5 V core supply (VCCINT 2.375 V to 2.625 V). The 600-BGA package exposes all 470 I/Os on the top side and supports JTAG IEEE Std 1149.1 boundary-scan testing, with 4 JTAG-related pins adding up to 31,250 equivalent gates of overhead. The device operates over a commercial 0 °C to 70 °C ambient range.
The FLEX-10KS architecture combines a sea-of-logic fine-grained fabric with coarse-grained EABs that can be configured as 256×8, 512×4, 1024×2, or 2048×1 memory blocks, or as wide lookup-based logic. Designers interface to the device via Altera's MAX+PLUS II or Quartus design tools, with configuration typically loaded from a serial PROM (e.g. EPC2 or EPC8 configuration devices).
Typical applications include high-density glue logic replacement, custom DSP datapaths, telecommunications backplane interface cards, and industrial control systems requiring parallel I/O and moderate on-chip memory. Its 470 user I/O count makes it suitable for protocol bridging, video/graphics bus aggregation, and parallel data acquisition systems.
Designers should ensure proper decoupling on the 2.5 V VCCINT and VCCIO rails, observe the 1.27 mm BGA pitch PCB layout constraints, and confirm configuration mode and JTAG chain wiring before committing to layout. The device is now in Altera's mature-product lifecycle, so second-source and obsolescence planning is recommended.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the FLEX-10KS / FLEX-10KE family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EPF10K200SBC600-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SBC600-1 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, RoHS Status, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EBC600-1
✅ Drop-In✓ In Stock
$322.17445 / Unit
View Datasheet →EPF10K200EBC600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200EBC600-3
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EPF10K200SBC600-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SBC600-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200EBI600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200SBC600-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX-10KS |
| Series | EPF10K200 |
| Logic Elements / Cells | 9,984 |
| Gate Count (typical) | 200,000 gates |
| Logic Array Blocks (LABs) | 1,248 |
| Number of User I/Os | 470 |
| Number of Logic Cells | 4,992 |
| Embedded RAM (bits) | 24,576 (across EABs) |
| Max Internal Frequency | 250 MHz |
| Propagation Delay | 0.4 ns |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) |
| Speed Grade | -1 (fastest commercial) |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Package | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| Mounting Type | Surface Mount |
| JTAG Support | IEEE Std 1149.1 |
| Configuration | Serial via EPC2/EPC8 configuration devices |
| RoHS Status | Non-compliant (per third-party listing) |
EPF10K200SBC600-1 600-ball bga, 45 × 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SBC600-1 (600-ball bga, 45 × 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SBC600-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SBC600-1 is suitable for 6 applications: Legacy Telecommunications Backplane Interface, Industrial Control PLC Backplane, Custom DSP Datapath / Co-processor, Medical Imaging Data Acquisition Front-End, Video / Graphics Bus Aggregation Card, Aerospace / Defense Ruggedized Subsystem.
Legacy Telecommunications Backplane Interface
The EPF10K200SBC600-1 fits legacy telecom backplane-interface cards because of its 470 user I/Os and 9,984 logic cells on the 600-ball BGA package, providing enough parallel bandwidth to bridge multiple T1/E1 framers, HDLC controllers, and TDM buses to a host CPU. Its 250 MHz internal performance and 0.4 ns propagation delay are sufficient for STS-1/STM-0 class interface glue, while the 24,576 bits of embedded RAM (organized as EABs) can absorb small elastic-store FIFOs and per-channel state tables without an external SRAM. For long-lifecycle telecom equipment still in field service, the FLEX-10KS architecture is often the lowest-risk reuse path versus a redesign.
Recommended
Industrial Control PLC Backplane
The EPF10K200SBC600-1 suits PLC backplane designs that aggregate hundreds of 24 V digital I/O channels, encoder inputs, and high-speed counter/timer signals into a central control processor. With 470 user I/Os on the 600-BGA package, it can directly interface to opto-isolated input cards, PWM output modules, and RS-485 / CAN bus controllers without intermediate bus-switch ICs. The 0.4 ns propagation delay supports deterministic logic response, which is important for safety-rated PLC designs. The commercial 0 °C to 70 °C operating range covers most indoor control cabinets.
Recommended
Custom DSP Datapath / Co-processor
The EPF10K200SBC600-1 can implement custom DSP datapaths - FIR filters, FFT butterflies, or radar pulse compression engines - by combining its 9,984 logic cells with the EAB-based 24,576-bit embedded memory. The 250 MHz internal frequency and 0.4 ns propagation delay support sustained pipelined arithmetic at sample rates beyond 100 MHz, sufficient for software-defined radio baseband, ultrasound beamforming, or vibration-analysis front ends. Designers typically instantiate FIR coefficients and tap-delay lines in the EABs to avoid the latency of external SRAM.
Recommended
Medical Imaging Data Acquisition Front-End
The EPF10K200SBC600-1 is used in legacy ultrasound and patient-monitoring front-end PCBs because its 470 user I/Os can simultaneously service multi-channel ADC banks (e.g. 16-channel 12-bit 50 MSPS ADCs), memory buses, and host interface logic, while its 24,576-bit embedded RAM absorbs per-channel sample buffers. The 0.4 ns propagation delay and 250 MHz internal frequency ensure deterministic timing for sampling control. Although the part is now obsolete, medical-equipment OEMs with multi-decade service commitments continue to specify this FPGA due to regulatory qualification history.
Recommended
Video / Graphics Bus Aggregation Card
The EPF10K200SBC600-1 fits video-capture, scan-converter, and graphics-aggregator boards where dozens of TTL/CMOS data lanes, sync generators, and pixel-clock PLLs must be combined into a single wide host bus. With 470 user I/Os, the device can simultaneously interface to multiple RGB / DVI / LVDS input ports and a 64-bit PCI bus without external transceivers. The EAB-based memory blocks are well suited to line-buffer and chroma-key LUT storage. Designers typically pair the FPGA with an EPC2 configuration PROM and an external frame buffer.
Recommended
Aerospace / Defense Ruggedized Subsystem
The EPF10K200SBC600-1 remains in use on legacy avionics, radar, and electronic-warfare subsystems because its 600-ball BGA offers high-density interconnect for ruggedized PCB layouts, its 470 user I/Os accommodate dense MIL-STD-1553 / ARINC 429 channel counts, and its 0.4 ns propagation delay supports deterministic protocol timing. The 24,576-bit embedded RAM allows per-message buffer storage on the FPGA itself. For these programs, factory-conditioned "X" or "N" variants of the same part are often qualified and preferred over redesigns.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SBC600-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EBC600-1 | EPF10K200EBC600-2 | EPF10K200EBC600-3 | EPF10K200SBC600-1X | EPF10K200EBI600-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 600-ball BGA (45x45 mm, 1.27 mm pitch) | 600-ball BGA (45x45 mm, 1.27 mm pitch) - same | 600-ball BGA (45x45 mm, 1.27 mm pitch) - same | 600-ball BGA (45x45 mm, 1.27 mm pitch) - same | 600-ball BGA (45x45 mm, 1.27 mm pitch) - same | 600-ball BGA (45x45 mm, 1.27 mm pitch) - same |
| Family | FLEX-10KS | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KS | FLEX-10KE |
| Speed Grade | -1 | -1 | -2 | -3 | -1 | -2 |
| Number of User I/Os | 470 | 470 | 470 | 470 | 470 | 470 |
| Logic Cells | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Core Voltage (VCCINT) | 2.5 V (2.375-2.625 V) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 2.5 V (FLEX-10KE) | 2.5 V | 2.5 V (industrial) |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial) | -40 °C to +100 °C (Industrial) |
| Lifecycle Status | Obsolete | Obsolete / last-time-buy | Obsolete / last-time-buy | Obsolete / last-time-buy | Obsolete / ruggedized variant | Obsolete / industrial variant |
Key Differentiators
- Highest I/O density option for the EPF10K200 die (vs EPF10K200SBC356-3)
- Faster -1 speed grade than the -2 and -3 alternatives (vs EPF10K200EBC600-3)
- Same drop-in package as FLEX-10KE upgrade family (vs EPF10K200EBC600-1)
- Commercial temperature range vs industrial variant (vs EPF10K200EBI600-2)
Design Notes
The EPF10K200SBC600-1 requires a tightly regulated 2.5 V VCCINT rail (2.375 V to 2.625 V). At 250 MHz with all 9,984 logic cells active, typical ICCINT can exceed 1 A. Designers should use a low-noise LDO or DC-DC followed by bulk decoupling (e.g. 220 µF tantalum + 10 µF ceramic) directly at each VCCINT ball cluster, and add 0.1 µF + 0.01 µF high-frequency bypass caps within 5 mm of every fourth ball to limit switching-noise-induced logic errors. VCCIO banks must be set independently and decoupled per bank.
The 600-ball BGA on a 1.27 mm pitch requires a multi-layer PCB with microvia or via-in-pad technology to escape all signal balls. Plan for at least 6 PCB layers: top signal, GND, inner signal/power, inner signal, power, bottom signal. Maintain a continuous GND plane under the BGA; a split or missing plane can cause logic-level errors and JTAG-chain failures. Thermal vias beneath the die-attach pad are recommended to conduct heat from the package to an internal GND plane acting as a heat spreader.
Estimated: configuration mode and JTAG chain must match between EPC2/EPC8 PROM and FPGA. A common failure mode is wiring MSEL0/MSEL1 pins incorrectly, which prevents the FPGA from recognizing the bitstream and leaves all I/Os in tri-state. Also note: when migrating from FLEX-10KS (this part) to FLEX-10KE (EBC600 variants), the configuration bitstream format is forward-compatible, but the Quartus II fitter output differs - recompile the design before programming the new chip. Do not assume SRAM contents are preserved across a hard reset.
At maximum toggle rate (250 MHz across all 9,984 cells), the package can dissipate 2-3 W. The 600-ball BGA's thermal performance is dominated by the PCB thermal via array; without a thermal pad connection to internal planes, junction temperature can exceed 100 °C in still air. Recommended: 4×4 thermal-via array under the center die-attach pad, tied to GND planes on multiple layers. Avoid placing the FPGA directly next to high-heat components (>2 W) without intervening copper pour or forced-air cooling.
Compliance Information
RoHS non-compliant per third-party listing (Alterachips). Lead-free / N-suffix variants (EPF10K200SBC600-1N) may be available from factory-conditioned stock. AEC-Q100 not applicable - FPGAs are not qualified to automotive AEC-Q100. Conflict-mineral status not stated in available data.
