EPF10K200SRC240-3N - FLEX 10KE FPGA 200K Gates 9984 Cells | Intel
MPN: EPF10K200SRC240-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $218 | $21,800.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $162 | $162,000.00 |
EPF10K200SRC240-3N Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration density of an Application-Specific Integrated Circuit (ASIC) with the field-programmability of a Complex PLD (CPLD). Within the broader taxonomy, the FLEX 10KE belongs to the PLD -> CPLD/FPGA -> SRAM-based FPGA -> low-power FPGA hierarchy, intended for system-on-a-programmable-chip (SOPC) designs that require embedded memory, embedded logic, and substantial user I/O in a single device.
Key differentiating features include a 2.5 V core supply, multi-volt I/O support for 2.5 V and 3.3 V interfaces, embedded IEEE Std 1149.1 JTAG boundary-scan test circuitry (contributing up to 31,250 gates of test logic), built-in phase-locked loops (PLLs) for clock management, and on-chip memory configured via Embedded Array Blocks (EABs). The -3N speed grade denotes a commercial-temperature device with a maximum propagation delay of 0.40 ns at the fastest logic path.
The FLEX 10KE architecture combines a coarse-grained Logic Array Block fabric with fine-grained Logic Element cells and dedicated EAB SRAM blocks, allowing designers to implement both register-rich glue logic and moderately sized dual-port or ROM memories without external components. MultiVolt I/O pins enable seamless interfacing with 2.5 V, 3.3 V, and 5 V devices through configurable voltage-reference and PCI-compliant I/O standards.
Typical applications include telecommunications line-card glue logic, industrial control and factory-automation backplanes, test-and-measurement instrumentation front-ends, PCI bridge prototyping, image and video pipeline prototyping, and low-volume ASIC replacement designs that benefit from embedded memory and the FLEX 10KE's high I/O count.
Designers should remember that FLEX 10KE devices are SRAM-based, requiring a configuration ROM on the board for power-up loading, and the exposed thermal pad of the 240-pin RQFP must be soldered to a sufficiently large copper pour to meet the device's thermal dissipation envelope under continuous switching loads.
This page synthesizes distributor pricing across 10 channels, drop-in FLEX 10KE alternatives in the same 240-pin RQFP footprint, and practical design notes that the manufacturer datasheet alone does not provide, including speed-grade trade-offs and configuration-ROM selection guidance.
Drop-in alternatives for EPF10K200SRC240-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SRC240-3N (same form factor and footprint) — differing in Process Technology, Speed Grade, Family, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SRC240-3
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →EPF10K200SRC240-2X
✅ Drop-In✓ In Stock
$70.05 / Unit
View Datasheet →EPF10K200SRC240-2
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →EPF10K200SRC240-1X
✅ Drop-In✓ In Stock
$540 / Unit
View Datasheet →EPF10K200SRC240-1N
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EPF10K200SRC240-1
✅ Drop-In✓ In Stock
$112 / Unit
View Datasheet →EPF10K200SRC240-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical System Gates | 200,000 |
| Logic Elements (LEs) | 9,984 |
| Maximum Logic Elements | 9,984 |
| Embedded Array Blocks (EABs) | 24 |
| Maximum User RAM Bits | 98,304 |
| Logic Array Blocks (LABs) | 1,248 |
| User I/Os | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions |
| Propagation Delay (tPD) | 0.40 ns |
| Internal Operating Frequency | 166.67 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V |
| MultiVolt I/O Support | 2.5 V and 3.3 V interfaces |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Package | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) |
| Configuration Method | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading |
| Speed Grade | -3 (commercial) |
EPF10K200SRC240-3N 240-pin rqfp (power qfp) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SRC240-3N (240-pin rqfp (power qfp) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SRC240-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SRC240-3N is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Factory-Automation Backplanes, Test and Measurement Instrumentation Front-Ends, PCI Bridge and Bus-Interface Prototyping, Image and Video Pipeline Prototyping, Low-Volume ASIC Replacement and SOPC Integration.
Telecommunications Line-Card Glue Logic
The EPF10K200SRC240-3N's combination of 9,984 logic elements, 24 EABs (98,304 RAM bits), and up to 470 user I/Os makes it well-suited to telecommunications line-card glue-logic applications where it can implement backplane interface logic, framing/deframing state machines, and protocol-conversion bridges. The 0.40 ns propagation delay and 166.67 MHz internal frequency comfortably handle OC-3/STM-1 cell-processing paths at 155 MHz, while the 24 EABs allow designers to absorb small per-channel lookup tables and rate-matching FIFOs without external SRAM. The 240-pin RQFP's exposed thermal pad simplifies thermal management in the convection-cooled chassis of central-office line cards.
Recommended
Industrial Control and Factory-Automation Backplanes
Factory-automation backplanes demand a programmable device with abundant user I/O, embedded memory for control-loop lookup tables, and robust industrial-temperature tolerance. The EPF10K200SRC240-3N provides 470 user I/Os for sensor and actuator multiplexing, 24 EABs for storing motion-control profiles and PID coefficients, and 9,984 logic elements for state-machine sequencing of conveyor, robotic, and PLC interfaces. The 2.5 V core and 3.3 V I/O MultiVolt capability let designers interface directly to legacy 3.3 V industrial buses without level shifters, while the 0.22 µm CMOS process provides proven long-term reliability in industrial environments.
Recommended
Test and Measurement Instrumentation Front-Ends
Test-and-measurement front-ends require high-density programmable logic with predictable timing for capturing, formatting, and forwarding high-speed data. The EPF10K200SRC240-3N's 166.67 MHz internal frequency and 0.40 ns propagation delay deliver deterministic pipeline timing for parallel ADCs and digital oscilloscope acquisition channels, while 24 EABs (98,304 bits) implement deep capture FIFOs and trigger-pattern lookup tables directly on-chip. The 240-pin RQFP's 0.5 mm pitch enables fine-pitch PCB layout suitable for dense multi-channel instrument boards.
Recommended
PCI Bridge and Bus-Interface Prototyping
PCI bus-interface prototyping demands a programmable device with 3.3 V I/O support, deterministic timing, and enough logic to implement 32-bit PCI target or master state machines. The EPF10K200SRC240-3N's MultiVolt I/O standard supports 3.3 V PCI signaling directly, and its 9,984 logic elements easily absorb a full 32-bit, 33 MHz PCI core plus user-defined transaction logic. The 24 EABs can be configured as small FIFOs or configuration-space registers, and the 240-pin RQFP footprint provides 470 user I/Os for parallel expansion buses.
Recommended
Image and Video Pipeline Prototyping
Image-processing and video-pipeline prototyping require a programmable device with substantial RAM, parallel data paths, and many user I/Os for pixel buses. The EPF10K200SRC240-3N's 24 EABs deliver 98,304 bits of on-chip dual-port RAM suitable for line buffers and small color-space conversion tables, while the 9,984 logic elements implement pipelined RGB-to-YCrCb, scaling, and filtering datapaths. The 470 user I/Os accommodate wide pixel buses plus control/status interfaces to external video ADCs and DACs, and the 166.67 MHz internal frequency supports standard-definition video rates.
Recommended
Low-Volume ASIC Replacement and SOPC Integration
Low-volume ASIC replacement designs benefit from the EPF10K200SRC240-3N's high integration: 200K gates, 9,984 logic elements, 24 EABs with 98,304 RAM bits, and 470 user I/Os - enough to absorb an entire board's worth of glue logic, memory, and bus interfaces into a single programmable chip. The exposed thermal pad on the 240-pin RQFP enables fanless operation in space-constrained enclosures, while JTAG support (IEEE 1149.1) accelerates boundary-scan test on the manufacturing line. Designers can later migrate to Cyclone or MAX II devices for cost reduction while preserving the architectural reference design.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SRC240-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SRC240-3 | EPF10K200SRC240-2X | EPF10K200SRC240-2 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-1 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same |
| Speed Grade | -3N (commercial, fastest) | -3 (commercial) | -2X (commercial, intermediate) | -2 (commercial) | -1X (commercial, slowest) | -1N (commercial, lead-free, slowest) | -1 (commercial, slowest) |
| Typical System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Embedded Array Blocks (EABs) | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum User RAM Bits | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
Key Differentiators
- Fastest -3N speed grade in the 240-pin RQFP FLEX 10KE family (vs EPF10K200SRC240-2X)
- Lead-free ('N' suffix) designation for RoHS-conscious builds (vs EPF10K200SRC240-3)
- Largest on-chip memory of all 240-pin RQFP FLEX 10KE variants (vs EPF10K200SRC240-1X)
Design Notes
The FLEX 10KE EPF10K200SRC240-3N requires both a 2.5 V VCCINT core rail and a separate VCCIO rail (set to 2.5 V or 3.3 V per bank) with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per power pin group. Estimated: at 166.67 MHz with 50 % toggle activity, the ICCINT draw is approximately 250 mA (0.625 W); a switching buck regulator with at least 80 % efficiency is recommended. The exposed thermal pad on the 240-pin RQFP must be soldered to at least 1 square inch of inner-layer copper to keep junction temperature below 125 °C.
Because the FLEX 10KE is SRAM-based, the EPF10K200SRC240-3N loses its configuration on every power-down and must boot from an external configuration EPROM (EPC2, EPC4, EPC8, or EPC16). Designers should not omit the configuration ROM, must wire nCONFIG to VCC through a 10 kΩ pull-up, and must connect nSTATUS and CONF_DONE to monitor configuration status. JTAG pins (TDI, TDO, TMS, TCK) require 10 kΩ pull-ups on TDI, TMS, and TCK per IEEE 1149.1 if the JTAG port is unused.
The 240-pin RQFP has a 0.5 mm pitch which demands a minimum of 4-layer PCB with 0.2 mm traces and 0.1 mm clearances per IPC-2222 fine-pitch guidelines. Place all VCCINT and VCCIO decoupling capacitors within 5 mm of their respective pins, route clock signals on inner layers with controlled impedance, and provide a continuous ground plane beneath the FPGA. The exposed thermal pad requires thermal vias (0.3 mm drill, 1.0 mm pitch) to an inner copper pour for heat spreading.
Compliance Information
RoHS status not explicitly stated in verified web data; the 'N' suffix typically indicates lead-free terminal finish for Intel/Altera FLEX 10KE family parts but the datasheet should be consulted for the precise compliance statement. AEC-Q100 not applicable - this is a commercial-grade FPGA.
