EPF10K200SRC240-1X - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
MPN: EPF10K200SRC240-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $740.86 | $740.86 |
| 10 | $685 | $6,850.00 |
| 100 | $620 | $62,000.00 |
| 500 | $580 | $290,000.00 |
| 1,000 | $540 | $540,000.00 |
EPF10K200SRC240-1X Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that an engineer can rewire after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) between traditional CPLDs (smaller, non-volatile, deterministic timing) and ASICs (custom-silicon performance at high NRE cost). The FLEX 10KS architecture introduced by Altera in the late 1990s was among the first commercial FPGAs to embed dedicated SRAM blocks (EABs/ESBs), making it suitable for data-path, DSP, and memory-intensive glue logic.
Key features of the EPF10K200SRC240-1X include 9,984 logic elements, 1248 Logic Array Blocks (LABs), 98,304 embedded SRAM bits organized into Embedded Array Blocks (EABs), 182 maximum user I/O across 4 I/O banks, and multi-voltage I/O support (5.0 V, 3.3 V, 2.5 V). The device supports in-system configuration via serial or parallel EPROM/Flash, and is pin-compatible within the FLEX 10KS 240-pin RQFP family, enabling SameFrame migration to smaller or larger density parts without PCB rework.
The FLEX 10KS architecture pairs a fine-grained logic fabric with row/column interconnect, an embedded array of SRAM blocks for wide-word memory or lookup-table expansion, and four I/O banks with independent V/CCIO rails for mixed-voltage interfacing. The '-1X' speed grade typically yields internal toggle rates around 250 MHz for simple counter paths, making the device adequate for legacy telecom, industrial control, and bus-bridging applications rather than high-speed SERDES work.
Typical applications include legacy telecom line-card glue logic, industrial PLC backplanes, MIL-STD-1553 / ARINC 429 protocol bridges, parallel bus expansion (ISA, VME, PC/104), and pin-compatible upgrades for designs originally built on EPF10K100 / EPF10K130 / EPF10K200E FLEX 10K family members. The 240-RQFP package is also attractive for hand-solderable prototypes and field-repair scenarios where BGA rework equipment is unavailable.
When designing with this part, verify that the chosen JTAG chain programmer supports the FLEX 10KS family (Quartus II 13.0 or MAX+PLUS II 10.2 are the last fully supported toolchains). For new designs, consider Cyclone IV or MAX II as modern pin-compatible migration targets; for drop-in replacement of an obsolete or EOL FLEX 10KS board, the part is currently available through authorized distributors and franchised brokers.
This page consolidates distributor stock, drop-in same-package alternatives within the FLEX 10KS family, and practical sourcing notes that are not present in the legacy FLEX 10KS datasheet volume.
Drop-in alternatives for EPF10K200SRC240-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SRC240-1X (same form factor and footprint) — differing in Family, Process Technology, Operating Temperature, Package, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SRC240-1N
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EPF10K200SRC240-1
✅ Drop-In✓ In Stock
$112 / Unit
View Datasheet →EPF10K130EQC240-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.8 / Unit
View Datasheet →EPF10K100EQC240-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K100BQC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.95 / Unit
View Datasheet →EPF10K50EQC240-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$59.5 / Unit
View Datasheet →EPF10K200SRC240-1X Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KS |
| Family | FLEX 10KS |
| Logic Elements / Cells | 9984 |
| Gates | 200,000 |
| Logic Array Blocks (LABs) | 1248 |
| Embedded SRAM (EABs) | 98,304 bits |
| Maximum User I/O | 182 |
| I/O Banks | 4 |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (multi-voltage I/O) |
| Speed Grade | -1 (fastest commercial) |
| Operating Temperature | -40C to +85C (industrial) |
| Process Technology | 0.22 um / 0.3 um CMOS |
| Package | 240-RQFP (32x32 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | Non-Compliant (legacy FLEX 10KS) |
| Configuration Mode | Serial / Parallel EPROM or JTAG |
EPF10K200SRC240-1X 240-rqfp (32x32 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K200SRC240-1X (240-rqfp (32x32 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SRC240-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SRC240-1X is suitable for 6 applications: Legacy Telecom Line-Card Glue Logic, Industrial PLC Backplane Bridging, MIL-STD-1553 / ARINC 429 Protocol Bridge, Parallel Bus Expansion (ISA / VME / PC/104), SameFrame Footprint Migration to Lower-Cost Boards, VME / VXS Legacy Card Repair and Field Service.
Legacy Telecom Line-Card Glue Logic
The EPF10K200SRC240-1X fits legacy telecom line-card glue-logic designs because its 9,984 logic elements and 98,304 embedded SRAM bits provide ample capacity to bridge TDM buses, E1/T1 framers, and HDLC controllers without external memory. Its multi-voltage I/O banks (5.0 V / 3.3 V / 2.5 V) interface directly to legacy TTL and CMOS telecom ASICs, eliminating level shifters. The 240-RQFP package is hand-repairable for field-installed cards. Industrial temperature grade (-40C to +85C) covers the central-office environment and outdoor cabinet use. For a new telecom design today, however, consider Cyclone IV or Cyclone V as modern lower-power replacements.
Recommended
Industrial PLC Backplane Bridging
Industrial PLC backplanes frequently require non-deterministic glue logic to bridge sensor buses, encoder interfaces, and proprietary fieldbus protocols, and the EPF10K200SRC240-1X is a strong fit with 9,984 logic elements and 182 user I/O. The 240-RQFP footprint accepts through-hole-style PCB assemblies still common in long-life industrial control designs, and the industrial temperature range covers harsh factory-floor ambient conditions. Embedded SRAM (EABs) can implement dual-port lookup tables for protocol-stack acceleration. Pair it with the EPF10K130EQC240-1N for backplane redundancy designs requiring lower-cost secondary controllers.
Recommended
MIL-STD-1553 / ARINC 429 Protocol Bridge
Avionics and military embedded systems still rely on MIL-STD-1553 and ARINC 429 protocol bridges, and the EPF10K200SRC240-1X is well-suited because its 9,984 logic elements can implement dual redundant Manchester encoder/decoders, RT validation, and timing logic without external state machines. The 240-RQFP package is favorable for through-hole PCB layouts typical of legacy avionics LRUs where BGA rework equipment is unavailable. Industrial temperature grade supports the broader avionics thermal envelope; for actual flight-qualified builds, the EPF10K200SFC484-1X in a more thermally robust FineLine BGA-484 is sometimes preferred.
Recommended
Parallel Bus Expansion (ISA / VME / PC/104)
The EPF10K200SRC240-1X is commonly used as an ISA, VME, or PC/104 bus-master bridge and protocol converter in legacy industrial PCs and test equipment, where its 182 user I/O and four I/O banks with independent VCCIO rails (5 V / 3.3 V / 2.5 V) directly interface to multiple parallel bus standards on the same die. The 240-RQFP package remains attractive for hand-repairable boards in field-deployed test stations. Embedded SRAM blocks (98,304 bits) are sufficient to implement FIFO buffers and lookup tables for bus-arbitration logic, reducing external RAM requirements.
Recommended
SameFrame Footprint Migration to Lower-Cost Boards
For designs originally built around the EPF10K200SRC240-1X, the 240-RQFP SameFrame pinout allows migration to lower-cost FLEX 10K family members on the same PCB without redesign: EPF10K130EQC240 (13,248 LEs) and EPF10K100EQC240 (10,000 LEs) both share the 240-RQFP footprint. This is the cheapest way to reduce BoM cost on lower-density product variants. Pin compatibility is documented in the FLEX 10KS datasheet SameFrame pin-migration section. Always re-run Quartus II place-and-route and timing analysis after migration to verify the smaller part has enough logic and routing resources for the design.
Recommended
VME / VXS Legacy Card Repair and Field Service
The EPF10K200SRC240-1X remains in demand for repair of legacy VME and VXS-based defense and aerospace cards where original-equipment replacement requires the exact FLEX 10KS 240-RQFP footprint. Industrial temperature range, the proven 240-RQFP package (which accepts through-hole pin-in-paste rework), and the multi-sourced distributor network (Rochester Electronics, Heisener, Arrow) make the part readily available for field service. The '-1X' speed grade ensures timing-equivalent replacement for cards originally built around the same suffix. For new designs, however, designers should plan a forward migration to Cyclone IV or Cyclone 10 LP families to avoid future obsolescence.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SRC240-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SRC240-1N | EPF10K200SRC240-1 | EPF10K130EQC240-3N | EPF10K100EQC240-3N | EPF10K50EQC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP (32x32) | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same | 240-RQFP (32x32) - same |
| Logic Elements | 9984 | 9984 | 9984 | 13,248 | 10,000 | 4980 |
| Maximum User I/O | 182 | 182 | 182 | 186 | 186 | 189 |
| Embedded SRAM | 98,304 bits | 98,304 bits | 98,304 bits | 131,072 bits | 94,208 bits | 40,960 bits |
| Speed Grade | -1X (fastest commercial) | -1N (standard) | -1 (standard commercial temp) | -3N (3rd slowest) | -3N (3rd slowest) | -3N (3rd slowest) |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Same-frame 240-RQFP pin compatibility across the FLEX 10K/10KS/10KE family (vs EPF10K200EBC600-2 (BGA-600 package))
- Fastest commercial speed grade in the FLEX 10KS 240-RQFP family (vs EPF10K200SRC240-1N (standard speed grade))
- Industrial temperature range coverage on the fastest speed grade (vs EPF10K200SRC240-1 (commercial temp, standard speed))
- 9,984 logic elements vs lower-density same-footprint alternatives (vs EPF10K100EQC240-3N (10,000 LEs))
Design Notes
The EPF10K200SRC240-1X requires a tightly regulated 2.5 V core supply on VCCINT (2.375 V to 2.625 V) plus one or more VCCIO rails (5.0 V / 3.3 V / 2.5 V) for the four I/O banks. Decouple VCCINT and VCCIO separately with bulk 100 uF plus 0.1 uF + 10 uF ceramic networks placed within 5 mm of the package pins; shared inductance between the two rails causes VCCINT droop during simultaneous I/O switching events on the FLEX 10KS family. Estimated: with 9984 logic elements at typical 20% toggle utilization at 50 MHz, dynamic current draw on VCCINT is approximately 200-300 mA.
At 9984 logic elements running near 100% utilization, the EPF10K200SRC240-1X 240-RQFP package dissipates approximately 2-3 W continuous. The 240-RQFP (32x32 mm) has no exposed thermal pad, so heat removal relies on the lead frame and copper pours on the top and bottom PCB layers; ensure at least 4 layer PCB with 1 oz copper on outer layers and unbroken ground planes on inner layers to keep junction temperature below 100C in industrial environments. Forced-air cooling is recommended for high-altitude or sealed enclosures.
Place the configuration EPROM (e.g., EPC2 or EPC4) within 50 mm of the EPF10K200SRC240-1X DATA, DCLK, nCONFIG, and nSTATUS pins to avoid configuration clock skew; route DCLK as a 50 ohm controlled-impedance microstrip trace and avoid splitting its reference plane. For JTAG programming, route TMS, TDI, TDO, TCK into the JTAG chain with TCK buffered only at the chain source. Boundary-scan tests on the FLEX 10KS family require the JTAG pins to be inaccessible to other devices - add series 33 ohm ferrite beads if the JTAG pins are shared with user I/O.
Do not confuse the EPF10K200SRC240-1X (industrial temp, fastest speed grade) with the EPF10K200SRC240-1 (commercial temp, standard speed grade) or the EPF10K200SRC240-1N (industrial temp, standard speed grade). They share the same package, but their timing and temperature specs do not. Also avoid hand-modifying FLEX 10KS JTAG chain order in production PCBs: pin 1 of the 240-RQFP is at the top-left dot marker, and pin numbering is counter-clockwise - reverse-engineered pinout images on the internet are sometimes flipped, so always verify against the FLEX 10KS datasheet pin table before prototype builds.
For LVTTL or LVCMOS 3.3 V outputs on the EPF10K200SRC240-1X, place a 33 ohm series damping resistor within 5 mm of the FPGA pin to control edge rates below 2 V/ns and minimize reflections on traces longer than 50 mm. SSTL or LVDS I/O standards on the FLEX 10KS family are NOT supported - choose LVCMOS or LVTTL only, and ensure the I/O standard for each bank matches the VCCIO voltage (5.0 V bank cannot drive 3.3 V LVTTL reliably). Verify output drive strength in Quartus II pin planner - default 12 mA may need to be reduced to 8 mA for high-density boards.
Compliance Information
FLEX 10KS family (1990s architecture) is generally non-RoHS (lead-bearing) per legacy datasheet compliance information. Reach and conflict-minerals status is compliable per Altera/Intel documentation; AEC-Q100 is not applicable for FPGAs.
