EPF10K200SRC240-3 - FLEX 10KE 200K-Gate FPGA, 240-RQFP | Intel EPF10K200SRC240-3 by Intel - electronic component
Intel

EPF10K200SRC240-3 - FLEX 10KE 200K-Gate FPGA, 240-RQFP | Intel

MPN: EPF10K200SRC240-3 ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V Vdss 240-BFQFP Exposed Pad (RQFP-240) Package 166.67 MHz Speed
From $132 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $245 $2,450.00
100 $195 $19,500.00
500 $158 $79,000.00
1,000 $132 $132,000.00
ℹ️ All prices are in USD
View Datasheet (PDF) View Alternatives

EPF10K200SRC240-3 Overview

The Intel (formerly Altera) EPF10K200SRC240-3 is a member of the FLEX 10KE family of SRAM-based FPGAs, integrating 200,000 system gates, 9,984 logic elements, and 98,304 bits of embedded memory in a 240-pin RQFP (Power Quad Flat Pack) package with exposed pad. Built on a 0.22 um CMOS process and operating from a 2.5 V core supply, this device provides 470 user I/Os at a 0.5 mm pitch and is rated for the commercial 0 C to 70 C temperature range.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) that combine programmable logic with on-chip dual-port RAM and ROM, enabling System-on-a-Programmable-Chip (SOPC) integration in a single device - a precursor to modern SoC FPGAs. FPGAs sit above ASICs and CPLDs in density while remaining reprogrammable.

Key features of the EPF10K200SRC240-3 include 1,248 Logic Array Blocks / Configurable Logic Blocks (LABs/CLBs), four Delay-Locked Loops (DLLs) for clock skew management, 12 Embedded Array Blocks providing up to 98 Kbits of RAM, MultiVolt I/O supporting mixed-voltage interfacing, and an in-system programmability (ISP) interface via the passive serial or ByteBlaster configuration schemes. The device consumes approximately 0.4 ns propagation delay per logic element and runs at internal clock rates up to 166.67 MHz.

Typical applications include telecommunications line cards, industrial control and factory automation, high-speed data acquisition front-ends, and legacy telecommunications and imaging systems designed during the late 1990s and early 2000s. The wide 470 I/O count makes it well suited for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP pipelines.

When designing with this device, ensure the Quartus II or MAX+PLUS II toolchain is used for synthesis, place-and-route, and bitstream generation. The exposed pad of the RQFP-240 must be soldered to a copper pour to meet thermal specifications, and decoupling capacitors must be placed within 5 mm of every VCCINT and VCCIO pin pair.

Drop-in alternatives for EPF10K200SRC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K200SRC240-3 (same form factor and footprint) — differing in Process Technology, Family, Speed Grade, Operating Temperature, Package.

Intel
Family: FLEX 10K Embedded Programmable Logic
Speed Grade: -1 (fastest)
Operating Temperature: -40C to +85C (industrial)
Compare with EPF10K200SRC240-3 →
Intel
Process Technology: 0.22 µm CMOS
Compare with EPF10K200SRC240-3 →
Intel
Process Technology: 0.22 um / 0.3 um CMOS
Family: FLEX 10KS
Speed Grade: -1 (fastest commercial)
Compare with EPF10K200SRC240-3 →
Intel
Process Technology: 0.42 micrometer CMOS SRAM
Family: FLEX 10KS (FLEX 10KE/10KA generation)
Speed Grade: -2 (~80 MHz internal, typical)
Compare with EPF10K200SRC240-3 →
Altera
Process Technology: CMOS
Speed Grade: -2X (industrial, upper-mid speed)
Operating Temperature: 0 C to +70 C (Commercial)
Compare with EPF10K200SRC240-3 →
Intel
Process Technology: 0.22 µm CMOS SRAM
Speed Grade: -3 (commercial)
Operating Temperature: 0 °C to +70 °C (Commercial)
Compare with EPF10K200SRC240-3 →
Intel
Process Technology: 0.42 µm CMOS, 5 metal layers
Family: FLEX 10K
Speed Grade: -3
Compare with EPF10K200SRC240-3 →
Altera
Process Technology: 0.3 µm CMOS
Family: FLEX-10KA
Speed Grade: -3
Compare with EPF10K200SRC240-3 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K200SRC240-2

✅ Drop-In
Intel
📦 240-RQFP Exposed Pad
FLEX 10KS · FLEX 10KS (FLEX 10KE/10KA generation) · 9984 · 1248 · 98304 · 182 · 513000 · 2.375 V to 2.625 V (nominal 2.5 V)

✓ In Stock

$62.5 / Unit

View Datasheet →

EPF10K200SRC240-1

✅ Drop-In
Intel
📦 240-RQFP Exposed Pad
Intel (formerly Altera) · FLEX-10KS · FLEX 10K Embedded Programmable Logic · FPGA - Field Programmable Gate Array · 9984 · 1248 · 24 · 40960

✓ In Stock

$112 / Unit

View Datasheet →

EPF10K200SRC240-1N

✅ Drop-In
Intel
📦 240-RQFP Exposed Pad
FLEX 10KE · EPF10K200 · 9,984 · 200,000 · 1,248 · 182 · 2.5 V · 250 MHz

✓ In Stock

$68.4 / Unit

View Datasheet →

EPF10K200SRC240-2X

✅ Drop-In
Altera
📦 240-RQFP Exposed Pad
FLEX 10KS · FLEX 10KE · 9984 · 1248 · 200,000 · 98 Kbits · 470 · 182

✓ In Stock

$70.05 / Unit

View Datasheet →

EPF10K200SRC240-3N

✅ Drop-In
Intel
📦 240-RQFP Exposed Pad
FLEX 10KE · 200,000 · 9,984 · 9,984 · 24 · 98,304 · 1,248 · 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions

✓ In Stock

$162 / Unit

View Datasheet →

EPF10K200SRC240-1X

✅ Drop-In
Intel
📦 240-RQFP Exposed Pad
FLEX-10KS · FLEX 10KS · 9984 · 200,000 · 1248 · 98,304 bits · 182 · 4

✓ In Stock

$540 / Unit

View Datasheet →

EPF10K200SRC240-3 Maximum Ratings & Electrical Characteristics

Family FLEX 10KE
Series FLEX-10KS
Logic Elements / Cells 9984
Total System Gates 200,000
Total RAM Bits 98,304
Number of LABs/CLBs 1248
Number of I/Os 470
Number of DLLs 4
Package 240-BFQFP Exposed Pad (RQFP-240)
Package Dimensions 34.60 x 34.6 mm, 0.5 mm pitch
Process Technology 0.22 um CMOS
Core Voltage (VCCINT) 2.5 V
I/O Voltage (VCCIO) MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant)
Maximum Internal Frequency 166.67 MHz
Propagation Delay 0.4 ns
Operating Temperature 0 C to 70 C (Commercial)
Mounting Type Surface Mount

EPF10K200SRC240-3 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
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Pin 61 VCCINT — Core supply (2.5 V) - one of multiple VCCINT pins
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Pin 121 VCCIO — I/O supply (MultiVolt) - one of multiple VCCIO pins
Pin 122 GND — Ground - one of multiple GND pins
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Pin 181 GND — Ground - one of multiple GND pins
Pin 182 I/O — User I/O - function per pin-out file
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Typical Applications

EPF10K200SRC240-3 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, High-Speed Data Acquisition Front-Ends, PCI Bridge and Bus Interface Logic, Legacy Imaging and Video Processing Systems, Test and Measurement Instrumentation.

🌐

Telecommunications Line Cards

The EPF10K200SRC240-3 is well suited to legacy telecom line-card designs that require 470 user I/Os to aggregate T1/E1 framers, HDLC controllers, and time-slot interchangers. Its four on-chip DLLs let designers deskew multi-rate clocks arriving from a backplane, while the 12 Embedded Array Blocks (EABs) provide 98 Kbits of dual-port RAM for per-channel buffer storage. The 2.5 V core with MultiVolt-tolerant I/O interfaces directly to 3.3 V and 5 V framer ASICs without external level shifters, simplifying board layout. Engineers typically place the device between a TDM backplane transceiver and a network processor, using the FPGA to perform glue logic, DMA steering, and protocol encapsulation.

Recommended

EPF10K200SRC240-3N · Intel EPF10K200SRC240-2 · Intel
🏭

Industrial Control and Factory Automation

The 200,000-gate density of the EPF10K200SRC240-3 makes it appropriate for Programmable Logic Controller (PLC) backplanes, motor-control co-processors, and field-bus gateway logic in industrial environments. Designers implement custom Profibus, DeviceNet, or CANopen state machines alongside deterministic timer logic, with the four DLLs synchronising encoder feedback and PWM generation. The commercial 0 C to 70 C temperature range covers most factory-floor enclosures, and the 240-RQFP exposed-pad package provides robust mechanical lead compliance for industrial through-hole and reflow processes. The embedded array blocks can hold vibration-monitoring look-up tables and PID coefficient tables for adaptive-control applications.

Recommended

EPF10K200SRC240-1 · Intel EPF10K130EQC240-3 · Altera
🖥️

High-Speed Data Acquisition Front-Ends

Data-acquisition systems designed in the late 1990s frequently used the EPF10K200SRC240-3 to perform parallel DSP pre-processing on ADC sample streams. The 9,984 logic elements support 16- or 32-bit finite-impulse-response (FIR) filters, digital down-converters, and trigger-detection engines operating at 100+ MHz. The 98 Kbits of distributed RAM is sufficient for sample-rate conversion buffers, while the 470 I/Os accept wide parallel LVCMOS or LVTTL buses from 12- to 16-bit ADCs. Engineers still maintain these designs in long-lifecycle applications such as medical imaging test equipment and physics-instrumentation racks, where the original bitstream has been validated and qualified.

Recommended

EPF10K200SFC484-3 · Intel EPF10K200SRC240-2 · Intel
🖥️

PCI Bridge and Bus Interface Logic

The 240-RQFP EPF10K200SRC240-3 is a classic PCI 2.1 / PCI-X bridge implementation target. Its 470 user I/Os easily accommodate a 64-bit, 66 MHz PCI bus alongside local SRAM, NVRAM, and an embedded processor bus. The MultiVolt I/O feature lets the same FPGA interface to 5 V PCI slots and 3.3 V processor buses simultaneously, while the four DLLs maintain the 33 or 66 MHz clock domain relationship. EABs implement transaction-queue RAM for posted-write and delayed-read buffers. This application remains relevant for maintaining legacy server, RAID controller, and industrial-PMC card designs in active production at specialized OEMs.

Recommended

EPF10K200SRC240-3N · Intel EPF10K200SRC240-2X · Altera
📺

Legacy Imaging and Video Processing Systems

Pre-HD-era broadcast and machine-vision equipment often used the EPF10K200SRC240-3 to perform real-time video scaling, color-space conversion, and on-screen-display overlay. The 9,984 logic elements implement two-dimensional FIR filters and chroma-key engines, while the 12 EABs provide line buffers for horizontal scaling. At 166.67 MHz internal clock, the device processes CCIR-601 (27 MHz) and standard-definition digital video with significant margin for additional processing stages. Maintenance of installed broadcast, security, and medical-imaging bases requires ongoing supply of this part, often sourced from authorized brokers holding date-coded inventory.

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EPF10K200SRC240-1N · Intel EPF10K200SFC484-3 · Intel
🔧

Test and Measurement Instrumentation

The EPF10K200SRC240-3 served as a flexible pattern-generation and protocol-analyzer engine in bench-top test equipment such as logic analyzers, protocol exercisers, and bit-error-rate testers. Its 470 I/Os can drive or sample up to 470 channels at once, while the 12 EABs provide stimulus-pattern RAM and capture-buffer storage. The four DLLs phase-align multi-channel outputs and recover clocks from incoming data streams. The exposed thermal pad of the RQFP-240 package supports continuous full-gate utilization in densely instrumented rack-mount chassis where cooling is constrained. Many test-equipment vendors continue to support installed instruments and rely on broker stock of this part.

Recommended

EPF10K200SRC240-2 · Intel EPF10K200SRC240-3N · Intel

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EPF10K200SRC240-3N Intel Used in: Telecommunications Line Cards, PCI Bridge and Bus Interface Logic, Test and Measurement Instrumentation EPF10K200SRC240-2 Intel Used in: Telecommunications Line Cards, High-Speed Data Acquisition Front-Ends, Test and Measurement Instrumentation EPF10K200SRC240-1 Intel Used in: Industrial Control and Factory Automation EPF10K130EQC240-3 Altera Used in: Industrial Control and Factory Automation EPF10K200SFC484-3 Intel Used in: High-Speed Data Acquisition Front-Ends, Legacy Imaging and Video Processing Systems EPF10K200SRC240-2X Altera Used in: PCI Bridge and Bus Interface Logic EPF10K200SRC240-1N Intel Used in: Legacy Imaging and Video Processing Systems
What is the EPF10K200SRC240-3?
The EPF10K200SRC240-3 is a member of the Altera/Intel FLEX 10KE family of SRAM-based FPGAs. It integrates 200,000 system gates, 9,984 logic elements, and 98,304 bits of embedded memory. Housed in a 240-pin RQFP exposed-pad package, it operates from a 2.5 V core supply and is specified for the commercial 0 C to 70 C temperature range.
How many user I/Os does the EPF10K200SRC240-3 provide?
The EPF10K200SRC240-3 provides 470 user I/O pins via its 240-pin RQFP exposed-pad package. This high pin count supports bus-intensive designs such as PCI bridges and parallel memory interfaces. The MultiVolt I/O feature allows these pins to interface with 2.5 V, 3.3 V, or 5.0 V logic families without external level shifters.
How much embedded memory does the EPF10K200SRC240-3 contain?
The EPF10K200SRC240-3 contains 98,304 bits (12 Kbytes) of embedded SRAM organized across 12 Embedded Array Blocks (EABs). Each EAB can be configured as dual-port RAM, ROM, or used as a wide logic function generator, enabling System-on-a-Programmable-Chip (SOPC) integration in a single device.
What is the maximum operating frequency of the EPF10K200SRC240-3?
The EPF10K200SRC240-3 supports a maximum internal clock frequency of 166.67 MHz on a 0.22 um CMOS process at a 2.5 V core supply. The device includes four on-chip Delay-Locked Loops (DLLs) that compensate for clock distribution skew, allowing reliable operation across all 1,248 Logic Array Blocks.
Where can I download the EPF10K200SRC240-3 datasheet PDF?
The official Altera FLEX 10KE datasheet is available at the Altera legacy literature archive. The most common direct URL is https://www.altera.com/literature/ds/dsf10ke.pdf. The file covers the full FLEX 10KE family including the EPF10K200S device variants. Source citation: Altera FLEX 10KE Device Datasheet, legacy literature.
Where can I buy an EPF10K200SRC240-3 online?
The EPF10K200SRC240-3 is available in limited stock from distributors including DigiKey, Mouser, and specialized brokers such as Win Source, Kynix, Veswin Electronics, and Wolfchip. Distributor listings often show third-party inventory rather than franchise stock, so request a quote and confirm date code before placing production orders.
What is the price of the EPF10K200SRC240-3?
As of 2026-09-11, the EPF10K200SRC240-3 is priced at approximately USD 285.00 per unit in single-piece quantities, with significant volume discounts down to about USD 132.00 at 1,000-piece quantities. Prices fluctuate with market availability because the part is now in the Altera/Intel legacy portfolio.
What is the lead time for the EPF10K200SRC240-3?
Lead time for the EPF10K200SRC240-3 typically ranges from 6 to 16 weeks depending on distributor stock. The part is not in active production; inventory is held by brokers and franchise distributors. For new designs, consider migrating to a Cyclone IV or Cyclone 10 LP device from the current Intel FPGA portfolio.
Is the EPF10K200SRC240-3 in stock right now?
As of 2026-09-11, the EPF10K200SRC240-3 is listed in stock at multiple third-party distributors with quantities ranging from hundreds to over 36,000 pieces at Wolfchip. For high-volume production orders, contact the distributor directly because stock is variable and replenishment is uncertain.
What is the pinout of the EPF10K200SRC240-3?
The EPF10K200SRC240-3 uses a 240-pin RQFP (Power Quad Flat Pack) package with an exposed thermal pad. The exposed pad must be soldered to the PCB ground plane for thermal and electrical performance. Refer to the Pin-Out File in the Altera FLEX 10KE device datasheet for the per-pin function table.
What is the difference between EPF10K200SRC240-2 and EPF10K200SRC240-3?
The EPF10K200SRC240-2 and EPF10K200SRC240-3 differ in their speed grade: the -2 is a faster grade than the -3. Both share the identical 240-pin RQFP exposed-pad package, the same 200,000 gate / 9,984 logic-element die, and identical pinout. The -3 is fully compatible as a drop-in replacement in the slower position; the -2 cannot be substituted into a -3 design without timing re-analysis.
What is the difference between EPF10K200SRC240-3 and EPF10K200SRC240-3N?
The EPF10K200SRC240-3 and EPF10K200SRC240-3N share the same -3 speed grade and the same 240-pin RQFP exposed-pad package, but the -3N suffix denotes a lead-free (Pb-free) finish on the device leads. The two parts are pin-to-pin compatible; the N variant is the preferred choice for RoHS-compliant assembly lines.
Is the EPF10K200SRC240-3 a drop-in replacement for EPF10K200SFC484-3?
No - the EPF10K200SRC240-3 (240-RQFP) and EPF10K200SFC484-3 (484-BGA) share the same die and speed grade but use different packages. They cannot be used as drop-in replacements because the ball grid and lead pitch differ. PCB redesign is required to migrate between these two packages.
When should I choose the EPF10K200SRC240-3 over a Cyclone IV device?
Choose the EPF10K200SRC240-3 only when maintaining an existing legacy design that already has a verified bitstream and proven board layout. For new designs, choose a Cyclone IV E (EP4CE6/10/22) or Cyclone 10 LP device, which offer higher logic density, more modern I/O features, lower power, and active production support from Intel.
What tools are required to program the EPF10K200SRC240-3?
The EPF10K200SRC240-3 is supported by Altera MAX+PLUS II (legacy) and the Quartus II Web Edition toolchain. Configuration requires a ByteBlasterMV or MasterBlaster download cable, or a third-party programmer such as the Terasic USB-Blaster. Bitstream generation, simulation, and place-and-route are documented in the FLEX 10KE handbook.

Engineering reference data for EPF10K200SRC240-3 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K200SRC240-3 when you need a 200K-gate FLEX 10KE FPGA in a 240-RQFP exposed-pad package with the standard SnPb lead finish and the slowest (-3) speed grade. The -3 grade is sufficient for designs clocked below ~100 MHz and is generally the lowest-cost option of the speed-grade family. Choose the EPF10K200SRC240-2 if your design requires the fastest timing closure at the same density. Choose the EPF10K200SRC240-1 for the lowest-cost option in timing-non-critical applications. Choose the EPF10K200SRC240-3N for new RoHS-compliant production lines. The 240-RQFP package is preferred over the 484-BGA variant when board-level inspection and rework are required; both share the same die, so a Quartus II bitstream is portable across packages after re-assignment of pinout.

Comparison with Alternatives

Parameter This Product EPF10K200SRC240-2 EPF10K200SRC240-1 EPF10K200SRC240-3N
Brand Intel (formerly Altera) Intel Intel Intel
Package 240-RQFP Exposed Pad 240-RQFP Exposed Pad (same) 240-RQFP Exposed Pad (same) 240-RQFP Exposed Pad (same)
Speed Grade -3 -2 (faster) -1 (slower) -3 (identical)
Lead Finish SnPb (standard) SnPb (standard) SnPb (standard) Pb-free (matte tin)
Logic Elements 9984 9984 9984 9984
System Gates 200,000 200,000 200,000 200,000
Embedded RAM 98,304 bits 98,304 bits 98,304 bits 98,304 bits
User I/Os 470 470 470 470
Core Voltage 2.5 V 2.5 V 2.5 V 2.5 V
Lifecycle Status Obsolete / Legacy stock Obsolete / Legacy stock Obsolete / Legacy stock Obsolete / Legacy stock

Key Differentiators

  • Faster performance than the -1 grade (vs EPF10K200SRC240-1)
  • Lead-free (Pb-free) finish option for RoHS assembly (vs EPF10K200SRC240-3N)
  • 240-RQFP exposed-pad for high-I/O legacy designs (vs EPF10K200SFC484-3 (484-BGA same die))

Design Notes

The EPF10K200SRC240-3 requires a clean 2.5 V core supply (VCCINT) and a separate MultiVolt VCCIO rail. The VCCINT rail should be sourced from a low-noise LDO or DC-DC converter followed by LC filtering; load step transients at high utilization can exceed 1 A. Place a 100 uF bulk capacitor near the package, with 0.1 uF and 1 nF decoupling within 5 mm of every VCCINT/VCCIO pin pair. Estimated: typical Icc at full utilization is in the 0.5 to 1.0 A range; check Quartus II PowerPlay for an exact value once the design is compiled.

Solder the exposed thermal pad of the RQFP-240 to a copper pour on the top layer, stitched with thermal vias to an internal ground plane. The pad is the primary heat-removal path; without it the junction temperature can rise 20 to 30 C above the rated maximum at high gate utilization. For high-utilization designs, increase the copper area to at least 1 square inch and consider airflow of 200 LFM. Estimated: theta_JA is in the 15 to 20 C/W range with a properly stitched exposed pad.

Use a four-layer PCB with continuous VCCINT and GND planes to provide low-impedance power distribution and to control simultaneous-switching noise (SSN) on the 470 user I/Os. Keep configuration EEPROM traces (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and shielded with ground. Place the configuration EEPROM within 50 mm of the FPGA to avoid JTAG/PS-mode signal-integrity issues. Use controlled-impedance traces (50 ohm single-ended) for clock inputs that exceed 100 MHz.

Do not confuse the EPF10K200SRC240-3 (240-RQFP, 200K gates) with the EPF10K200SFC484-3 (484-BGA, 200K gates) - they share the same die but use different packages and are NOT drop-in compatible. The 240-RQFP and 484-BGA pinout tables differ, and PCB layout cannot be reused. Also note that the -3 speed grade is the slowest; substituting a -2 or -1 may be possible but requires timing re-analysis in Quartus II.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

The EPF10K200SRC240-3 uses the standard SnPb lead finish; the -3N suffix denotes the lead-free (Pb-free) variant for RoHS assembly. The part is part of the Altera (now Intel) legacy FLEX 10KE family and is no longer in active production.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EPF10K200SRC240-3 FLEX 10KE FLEX-10KS FPGA Field-Programmable Gate Array System-on-a-Programmable-Chip SOPC Logic Array Block LAB Embedded Array Block EAB Delay-Locked Loop DLL MultiVolt I/O RQFP-240 RQFP Power Quad Flat Pack exposed pad 240-BFQFP CMOS 0.22 um process ByteBlaster Quartus II MAX+PLUS II telecommunications line card industrial automation PCI bridge lead-free (Pb-free) RoHS AEC-Q100
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