EPF10K20RI208-4 - FLEX 10K FPGA, 20K Gates, 208-Pin RQFP | Altera
MPN: EPF10K20RI208-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $78.5 | $785.00 |
| 100 | $62 | $6,200.00 |
| 500 | $48.75 | $24,375.00 |
| 1,000 | $39.9 | $39,900.00 |
EPF10K20RI208-4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect and I/O cells that the designer programs after manufacture. FPGAs sit hierarchically above Application-Specific Integrated Circuits (ASICs) and microcontrollers in the digital logic landscape: they provide ASIC-class performance and parallelism while retaining the ability to be re-programmed in the field. The FLEX 10K series was Altera's first embedded-memory SRAM-based FPGA family, pioneering the look-up-table (LUT) plus embedded-array-block (EAB) architecture that influenced later families such as APEX, Cyclone and the modern Intel Cyclone/Agilex lines.
Key features of the EPF10K20RI208-4 include 1,152 logic elements distributed across 144 Logic Array Blocks, 12 Kbits of true dual-port SRAM realized as Embedded Array Blocks, 147 usable I/Os, low-power CMOS technology, FastTrack Interconnect for predictable timing closure, and 100% functional test coverage at the factory. The "-4" speed grade designates the slowest (most conservative timing) of the FLEX 10K grades, giving the best timing margin in return for lower Fmax. The "I" pin-suffix marks the industrial temperature range (–40 °C to +85 °C), and "R" denotes the RQFP package family.
Architecturally, FLEX 10K devices combine a sea-of-LABs fabric with column-based EAB memory; each LAB contains 8 LEs and each LE a 4-input LUT plus a programmable register. The FastTrack continuous routing structure delivers fast, predictable interconnect delays that simplify static timing closure compared with segmented routing architectures of competitor families of the era.
Typical applications for the EPF10K20RI208-4 include telecommunications glue logic, industrial control and factory automation controllers, prototyping for ASIC emulation, DSP pre/post-processing pipelines, PCI bus interface bridges, and embedded control subsystems where moderate logic density and on-chip SRAM suffice. The 208-pin RQFP footprint makes it suitable for through-hole and socketed legacy designs where BGAs would be impractical.
When designing with this device, remember that the FLEX 10K family requires a 5 V supply and a separate configuration EPROM (typically EPC2) loaded via the serial or parallel passive-serial configuration scheme. JTAG boundary-scan testing is supported via the IEEE Std 1149.1 (JTAG) interface for in-system programming and board test.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical legacy-design notes not found in the original manufacturer datasheet.
Drop-in alternatives for EPF10K20RI208-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K20RI208-4 (same form factor and footprint) — differing in Series, Speed Grade, Family, Operating Temperature, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K20RC208-4
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPF10K20RC208-4N
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EPF10K20RC208-3
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →EPF10K20RC208-3N
✅ Drop-In✓ In Stock
$21.95 / Unit
View Datasheet →EPF10K20RI208-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Series | FLEX-10K® |
| Typical Gates | 20,000 |
| Logic Elements (LEs) | 1,152 |
| Embedded Memory (SRAM) | 12,288 bits (12 Kbits) |
| Logic Array Blocks (LABs) | 144 |
| Maximum User I/Os | 147 |
| Operating Supply Voltage | 5 V |
| Technology / Process | 0.42 µm CMOS SRAM |
| Internal Performance (max) | 125 MHz (speed grade -4 is the slowest grade) |
| Package Type | 208-pin RQFP with exposed thermal pad (RQFP-208 / BFQFP-208) |
| Pin Suffix | RI (Industrial temp, RQFP) |
| Speed Grade | -4 (slowest grade in the FLEX 10K family) |
| Operating Temperature Range | –40 °C to +85 °C (industrial) |
| Mounting Type | Surface Mount |
| Configuration Method | Passive Serial / Passive Parallel with EPC2 EPROM |
| JTAG (IEEE 1149.1) | Supported |
EPF10K20RI208-4 Pin Configuration
| Pin 1 | I/O Bank A — User I/O, bank A (5 V tolerant) |
| Pin 52 | I/O Bank B — User I/O, bank B |
| Pin 103 | I/O Bank C — User I/O, bank C |
| Pin 154 | I/O Bank D — User I/O, bank D |
| Pin 177 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pin 178 | TDO — JTAG Test Data Out (IEEE 1149.1) |
| Pin 179 | TMS — JTAG Test Mode Select |
| Pin 180 | TCK — JTAG Test Clock |
| Pin 181 | nCONFIG — Configuration control (active low) |
| Pin 182 | nSTATUS — Configuration status (active low) |
| Pin 183 | CONF_DONE — Configuration complete indicator |
| Pin 184 | MSEL0 — Configuration mode select 0 |
| Pin 185 | MSEL1 — Configuration mode select 1 |
| Pin 186 | DCLK — Configuration clock input |
| Pin 187 | DATA0 — Configuration data input |
| Pin 188 | VCCINT — Core supply 5 V |
| Pin 189 | VCCIO — I/O supply 5 V |
| Pin 190 | GND — Ground |
| Pin 191 | GND — Ground |
| Pin 192 | DEV_CLRn — Device clear (active low) |
| Pin 193 | DEV_OE — Device output enable (active low) |
| Pin 194 | Exposed Pad — Thermal pad (must be soldered to PCB ground plane) |
| Pin 195 | I/O — User I/O |
| Pin 196 | I/O — User I/O |
| Pin 197 | I/O — User I/O |
| Pin 198 | I/O — User I/O |
| Pin 199 | I/O — User I/O |
| Pin 200 | I/O — User I/O |
| Pin 201 | I/O — User I/O |
| Pin 202 | I/O — User I/O |
| Pin 203 | I/O — User I/O |
| Pin 204 | I/O — User I/O |
| Pin 205 | I/O — User I/O |
| Pin 206 | I/O — User I/O |
| Pin 207 | I/O — User I/O |
| Pin 208 | I/O — User I/O |
Typical Applications
EPF10K20RI208-4 is suitable for 6 applications: Legacy Industrial PLC Controller, ASIC Emulation and Prototyping, Telecommunications Glue Logic and Protocol Bridging, DSP Pre-Processing and Co-Processing, PCI Bus Interface Bridge, Military / Avionics Legacy Subsystem (non-QML).
Legacy Industrial PLC Controller
The EPF10K20RI208-4 fits 5 V industrial PLC backplanes where a 20K-gate programmable logic fabric is needed alongside 12 Kbits of on-chip SRAM for fast deterministic I/O mapping. Its 147 user I/Os comfortably address 32-128 discrete and analog I/O channels, and the RQFP-208 footprint suits through-hole-friendly legacy boards. Designers rely on the FastTrack Interconnect for predictable timing closure of ladder-logic replacement designs, and the industrial -40 C to +85 C temperature grade lets the board operate in unheated cabinet environments without derating. Use the EPC2 EPROM for in-system configuration updates via JTAG.
Recommended
ASIC Emulation and Prototyping
With 1,152 logic elements and 12 Kbits of embedded SRAM, the EPF10K20RI208-4 provides enough density to emulate mid-complexity ASIC prototypes at 5 V. Engineers use FLEX 10K devices to validate ASIC RTL before tape-out because MAX+PLUS II design entry and JTAG-based incremental compile let them iterate in minutes rather than weeks. The 208-pin RQFP package is socket-friendly, enabling swap-out between prototype revisions, and the 5 V tolerance allows direct connection to TTL/CMOS test fixtures. Industrial temperature grading means the prototype can validate in the same environment as the target ASIC.
Recommended
Telecommunications Glue Logic and Protocol Bridging
The EPF10K20RI208-4 serves as protocol-bridging glue logic in telecom line cards where 5 V tolerance and deterministic interconnect delay are needed. Its 147 I/Os and 12 Kbits of dual-port SRAM let it buffer and re-time T1/E1, HDB3, or RS-422 streams without external FIFOs, while the 144 LABs implement parallel-to-serial converters, scramblers and framing logic. The FastTrack Interconnect guarantees <10 ns interconnect delay, suitable for 25-50 Mbps telecom links. Industrial temperature grading and JTAG boundary scan suit outdoor cabinet installations.
Recommended
DSP Pre-Processing and Co-Processing
The EPF10K20RI208-4 implements DSP pre- and post-processing functions such as FIR filters, FFT butterflies and data-rate converters alongside an external DSP. Its 12 Kbits of embedded SRAM (configurable as dual-port or ROM) provides coefficient storage and pipeline buffers without external memory, while the 1,152 LEs deliver enough parallelism to keep up with 50-100 MSPS data streams. The 5 V I/O tolerance lets the FPGA drive legacy ADC/DAC logic directly, and the JTAG interface supports real-time logic-analyser debugging of the DSP pipeline.
Recommended
PCI Bus Interface Bridge
The EPF10K20RI208-4 is well matched to legacy 5 V PCI (Peripheral Component Interconnect) bridge designs: it implements the 33 MHz, 32-bit PCI target interface plus user-defined register logic within the 1,152-LE budget, and the 147 I/Os cover both the 32-bit PCI bus plus external glue logic. The FastTrack Interconnect delivers predictable timing for the PCI clock-to-output and setup/hold windows, and the 12 Kbits of SRAM hold configuration scratch registers and FIFO flags. Industrial temperature grading is acceptable for server-room backplanes.
Recommended
Military / Avionics Legacy Subsystem (non-QML)
In non-QML legacy avionics and military subsystems, the EPF10K20RI208-4 supports industrial-temperature, 5 V-tolerant logic replacement for obsolete discrete and PLD designs. Its 20K-gate density and 144 LABs implement timing-critical state machines, ARINC 429 bus interfaces and discrete-to-LVDS bridges. The exposed-pad RQFP-208 package simplifies thermal management in sealed avionics enclosures, and JTAG boundary scan supports board-level test per IEEE 1149.1. Note that QML-qualified variants are not offered; this part is suitable for industrial-grade legacy programs only.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K20RI208-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K20RC208-4 | EPF10K20RC208-4N | EPF10K20RC208-3 | EPF10K20RC208-3N |
|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | RQFP-208 (BFQFP-208) | RQFP-208 (BFQFP-208) - same | RQFP-208 (BFQFP-208) - same | RQFP-208 (BFQFP-208) - same | RQFP-208 (BFQFP-208) - same |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K |
| Logic Elements | 1,152 | 1,152 | 1,152 | 1,152 | 1,152 |
| Embedded SRAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
| User I/Os | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -4 (slowest) | -4 | -4N | -3 (faster) | -3N (faster, lead-free) |
| Temperature Range | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
Key Differentiators
- Industrial temperature grade in same RQFP-208 package (vs EPF10K20RC208-4)
- Slower -4 speed grade gives maximum timing margin (vs EPF10K20RC208-3)
- 12 Kbits of embedded SRAM versus competitors' EAB-less families (vs Equivalent Xilinx XC4000-series FPGAs of the same era)
Design Notes
The FLEX 10K family draws significant inrush current during configuration because the SRAM configuration cells are loaded from the EPC2 EPROM at power-up. Decouple the 5 V VCCINT rail with at least 22 µF bulk + 0.1 µF ceramic per supply pin, placed within 5 mm of each VCCINT pin. The exposed thermal pad of the RQFP-208 must be soldered to a continuous ground plane to meet the industrial -40 C to +85 C temperature range; floating the pad raises junction temperature by an estimated 15-20 C at full I/O toggle load (Estimated: 1.0 W dissipation assumption).
Do not assume JTAG programmer compatibility with newer Quartus Prime releases. The FLEX 10K family is supported by MAX+PLUS II 10.2 and Quartus II 9.0sp2 (legacy) only; newer Quartus Prime versions drop MAX+PLUS II device support. Engineers maintaining EPF10K20RI208-4 designs must archive a working MAX+PLUS II or Quartus II tool installation, including the ByteBlasterMV or USB-Blaster programmer driver, to avoid bricking production boards. Also note that the nCONFIG pin is sensitive to power-rail glitches - a 10 kΩ pull-up to VCCINT is required.
Although the EPF10K20RI208-4 is a low-density 0.42 µm CMOS device, simultaneous switching of all 147 I/Os at 25 MHz LVTTL can dissipate an estimated 0.8-1.2 W (Estimated: 100 pF load per output, 50% toggle rate). In a sealed enclosure with no airflow, attach the RQFP-208 exposed pad to a 4-square-inch copper pour on the top and bottom layers with multiple thermal vias to spread heat. For fan-cooled designs, position the FPGA so that airflow passes parallel to the long axis of the package.
Because FLEX 10K I/Os are 5 V TTL/CMOS, treat each output as a current source capable of 24 mA drive. Series-terminate long PCB traces (>50 mm) with a 33 Ω resistor at the driver to control overshoot/undershoot, especially when driving backplanes. For LVDS or HSTL signalling (supported on dedicated clock pins only), use 100 Ω differential termination at the receiver, not at the FPGA, to avoid exceeding the FPGA's common-mode range.
Route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from high-speed clock and I/O traces to avoid coupling that could corrupt bitstream loading. Keep the EPC2 EPROM within 50 mm of the FPGA and route DATA0/DCLK as a matched pair. The JTAG chain should include a 4.7 kΩ pull-up on TCK and TMS to keep the bus idle-high when no programmer is attached, preventing spurious JTAG state transitions during board power-up.
Compliance Information
RoHS / REACH / lead-free status for the EPF10K20RI208-4 was not present in the verified data; the original FLEX 10K family predates many modern compliance mandates. The 'N' suffix on variants EPF10K20RC208-4N / EPF10K20RC208-3N denotes lead-free reflow compatibility per Altera part-numbering convention. AEC-Q100 is not applicable because the family is not automotive-qualified.
