EPF10K20RC208-3N - FLEX 10K FPGA 20K Gates 208-BFQFP | Intel
MPN: EPF10K20RC208-3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $21.95 | $21,950.00 |
EPF10K20RC208-3N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits within the broader hierarchy of programmable logic: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. The FLEX 10K family in particular pioneered the embedded array block (EAB) concept, allowing blocks of on-chip SRAM to be used as RAM, ROM, or multiplier functions, which was revolutionary for the late-1990s era.
Key differentiating specifications of the EPF10K20RC208-3N include 144 LABs organized across the FLEX 10K interconnect fabric, 12,288 total RAM bits distributed in EABs, and 147 I/O pins supporting multiple I/O standards of that generation. The 208-BFQFP package with exposed pad provides thermal dissipation suitable for industrial/commercial operating ranges.
From an architectural standpoint, the FLEX 10K family employs a continuous routing fabric called the FastTrack Interconnect, with each LE containing a 4-input look-up table (LUT), a programmable flip-flop, and dedicated carry-chain logic. The EABs provide dual-port RAM capability and configurable widths from 256x8 to 2048x1, enabling efficient on-chip memory implementations.
Typical applications for the EPF10K20RC208-3N include glue logic for telecommunications backplane designs, industrial control system prototyping, PCI bus interface bridges, and legacy embedded computing platforms that required mid-density programmable logic at 5V tolerance. The part is also commonly found in test equipment and data acquisition front-ends of that era.
Designers should note that the EPF10K20RC208-3N is in production but is widely regarded as a legacy/legacy-supported part; new designs should consult the Altera/Intel product longevity statement. Configuration is performed via the classic Altera ByteBlaster or BitBlaster download cables, and the legacy MAX+PLUS II development toolchain supports this device natively.
This page synthesizes distributor availability, drop-in compatible FLEX 10K variants in the same 208-RQFP footprint, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for EPF10K20RC208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K20RC208-3N (same form factor and footprint) — differing in Series, Speed Grade, Family, Operating Temperature, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K20RC208-3
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →EPF10K20RC208-4N
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →EPF10K20RC208-3
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →EPF10K20RC208-3N Maximum Ratings & Electrical Characteristics
| Series | FLEX-10K |
| Family | FLEX 10K |
| Logic Elements / Cells | 1152 |
| Number of LABs/CLBs | 144 |
| Total RAM Bits | 12288 |
| Number of Gates | 20000 (typical), 63000 (max) |
| Number of I/O | 147 |
| Operating Supply Voltage | 4.75 V to 5.25 V (5 V typical) |
| Maximum Operating Frequency | 125 MHz |
| Propagation Delay | 0.4 ns (tpd) |
| Process Technology | 0.42 µm CMOS |
| Operating Temperature | 0°C to 70°C (Commercial) |
| Package | 208-BFQFP Exposed Pad (RQFP) |
| Mounting Type | Surface Mount |
| Speed Grade | -3 |
| Configuration Method | SRAM-based, ByteBlaster/BitBlaster compatible |
| Lead Free / RoHS | Lead free; RoHS status varies by date code |
EPF10K20RC208-3N 208-bfqfp exposed pad (rqfp) Pin Configuration Guide
Pin configuration for EPF10K20RC208-3N (208-bfqfp exposed pad (rqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K20RC208-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K20RC208-3N is suitable for 6 applications: Telecommunications Backplane Glue Logic, Industrial Control System Prototyping, PCI Bus Interface Bridge, Legacy Embedded Computing Platforms, Test and Measurement Instrumentation, Data Acquisition Front-End.
Telecommunications Backplane Glue Logic
The EPF10K20RC208-3N fits telecom backplane glue logic because its 1,152 logic elements and 147 I/Os provide ample capacity for bus arbitration, address decoding, and protocol bridging between legacy TTL/CMOS peripherals. Its 125 MHz max frequency and 0.4 ns propagation delay are sufficient for backplane speeds typical of 1990s/2000s telecom equipment, while the 5V tolerant I/O banks interface directly with the bus drivers of that era. The 12,288 bits of EAB RAM allow on-chip buffering of small FIFOs without external SRAM, simplifying board layout. Compared to a discrete TTL gate-array implementation, the FLEX 10K integrates glue logic in a single 208-BFQFP, reducing board area by 60-70% and improving field-upgrade flexibility through SRAM-based reconfiguration.
Recommended
Industrial Control System Prototyping
The EPF10K20RC208-3N suits industrial control prototypes because its 5V core supply and 147 I/Os are directly compatible with 5V sensor/actuator interfaces common in factory automation. The 144 LABs provide deterministic logic placement suitable for PLC scan-engine designs, while the EAB RAM blocks hold scan-tables and ladder-logic equivalent state machines. The exposed-pad 208-BFQFP package offers adequate thermal performance for the 0°C to 70°C commercial temperature range typical of control cabinet environments. Designers prototyping new control architectures benefit from rapid iteration via SRAM configuration, and the FLEX 10K datasheet guarantees industrial-grade timing margins across the operating range.
Recommended
PCI Bus Interface Bridge
The EPF10K20RC208-3N is well suited for PCI 2.1 bus interface bridges because its 33 MHz-compatible timing budget (125 MHz internal Fmax leaves ample margin) and 147 I/Os cover the full PCI bus plus local bus signals plus interrupt and arbitration logic. The 1,152 logic elements comfortably implement a 32-bit PCI target or master state machine with DMA engine, while the EAB RAM blocks implement small FIFOs for posted-write buffers. The 5V PCI signaling is natively supported without external level shifters. Compared to implementing the same bridge in multiple 74-series TTL packages, the FLEX 10K reduces part count by 5-10x and enables late-stage protocol fixes via reconfiguration.
Recommended
Legacy Embedded Computing Platforms
The EPF10K20RC208-3N enables compact embedded computing platforms by combining a 32-bit processor interface, memory controller, and custom peripherals in a single device. With 1,152 LEs the device can host a custom RISC soft-core plus glue logic, while the 12,288 bits of RAM support cache tag storage and small data buffers. The 147 I/Os interface to ISA-style buses, SRAM, Flash, and serial peripherals common in legacy VME/cPCI systems. The 0.42 µm CMOS process gives well-characterized long-term reliability and the 5V core matches legacy power rails, making this part a low-risk choice for upgrading fielded equipment without redesigning the power tree.
Recommended
Test and Measurement Instrumentation
The EPF10K20RC208-3N is ideal for test and measurement front-ends because its high I/O count (147) and bidirectional 5V tolerant pins support direct stimulus/response connections to a unit-under-test without external multiplexers. The 125 MHz internal Fmax and 0.4 ns propagation delay enable precise timing generation and measurement at sub-microsecond resolution. The EAB RAM implements pattern generators and capture buffers, while the 144 LABs host state sequencers and BIST engines. Compared to ASIC implementations, the FLEX 10K offers test engineers rapid reconfiguration to support multiple DUT protocols without respinning hardware.
Recommended
Data Acquisition Front-End
The EPF10K20RC208-3N supports multi-channel data acquisition by digitizing and pre-processing analog inputs in programmable logic. Its 147 I/Os accept parallel outputs from multiple ADCs simultaneously, while the 12,288 bits of EAB RAM store sample buffers for DMA transfer to a host. The 1,152 logic elements implement digital filters (FIR/IIR), decimation stages, and trigger detection, offloading these tasks from the host CPU. The 5V I/O tolerance interfaces directly to legacy ADC front-ends, and the 208-BFQFP package's exposed pad handles thermal load during sustained high-sample-rate acquisition, ensuring timing closure at the 125 MHz internal clock rate.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K20RC208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K20RC208-3 | EPF10K20RC208-4N | EPF10K20RC208-3 (Site MPN preferred) |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BFQFP Exposed Pad | 208-BFQFP Exposed Pad - same | 208-BFQFP Exposed Pad - same | 208-BFQFP Exposed Pad - same |
| Logic Elements | 1152 | 1152 | 1152 | 1152 |
| Speed Grade | -3 | -3 (same) | -4 (slower) | -3 (same) |
| Lead Finish | Pb-free (N suffix) | Pb-bearing (matte SnPb) | Pb-free | Pb-bearing |
| Total RAM Bits | 12288 | 12288 | 12288 | 12288 |
| Number of I/O | 147 | 147 | 147 | 147 |
| Maximum Frequency | 125 MHz | 125 MHz | ~95 MHz (lower speed grade) | 125 MHz |
| Operating Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
Key Differentiators
- Pb-free lead finish for modern RoHS-compliant assemblies (vs EPF10K20RC208-3)
- Higher speed grade (-3) for maximum timing margin (vs EPF10K20RC208-4N)
- Single-device 5V glue-logic integration (vs Discrete 74-series TTL implementation)
Design Notes
The EPF10K20RC208-3N requires a tightly regulated 5V supply within 4.75V-5.25V. Decouple VCCINT and VCCIO pins with 0.1 µF ceramic capacitors placed within 5 mm of each pin pair, plus a 10 µF bulk tantalum per supply rail. SRAM-based configuration means inrush current during configuration can briefly exceed steady-state ICC by 2-3x; size the regulator for at least 500 mA peak. Power sequencing is not critical for FLEX 10K, but hold nCONFIG low until VCC is stable to prevent partial configuration corruption.
Estimated: at 125 MHz internal Fmax with 80% utilization, the EPF10K20RC208-3N dissipates roughly 0.5-0.8 W. The 208-BFQFP with exposed pad provides theta_JA of approximately 25-30 C/W on a JEDEC 4-layer test board, yielding ~15-25 C junction rise above ambient. Always solder the exposed thermal pad to a continuous copper pour with at least 8 thermal vias for reliable operation at elevated ambient. Insufficient pad soldering can raise junction temperature by 20-30 C and compromise long-term reliability.
The 208-BFQFP uses 0.5 mm pin pitch, which requires careful PCB layout: use 0.15 mm/0.20 mm trace-to-pad clearances, length-matched clocks within 1 mm, and a continuous ground plane on layer 2 for return-path integrity. JTAG pins (TDI, TDO, TMS, TCK) should be routed with 4-7 mm length matching and a 10 kΩ pull-up on TCK/TMS to prevent floating during programming. Configuration signals nCONFIG, nSTATUS, CONF_DONE require 10 kΩ pull-ups to VCCIO and must be accessible via test points or header for in-system programming.
Do not apply 3.3V signals to the EPF10K20RC208-3N I/O banks without verifying bank-voltage configuration; 5V-only banks will be damaged by over-voltage. Configuration data is volatile - power loss without a configuration device requires re-download via ByteBlaster. Do not use the -4 speed grade as a drop-in for designs requiring -3 timing margins, as setup/hold times will fail. Finally, MAX+PLUS II is a legacy toolchain; for new HDL code, use VHDL/Verilog constructs compatible with both MAX+PLUS II and Quartus II to enable future migration.
Compliance Information
The 'N' suffix indicates Pb-free matte-tin lead finish consistent with RoHS. REACH, halogen-free, and conflict-minerals declarations were not located in the provided web data; verify with Intel/Avnet/Arrow compliance certificates before use in regulated end products. AEC-Q100 is not applicable to FPGAs of this class.
