Altera

EPF10K50RC240-3 - 50K Flex 10K FPGA, 189 I/O, 240-RQFP | Altera

MPN: EPF10K50RC240-3 ✗ End of Life
In Stock Ships in 1-3 business days
5 V Vdss 240-RQFP (RQFP-240 with Exposed Pad) Package 125 MHz Speed
From $58.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $95 $95.00
10 $82.5 $825.00
100 $71.2 $7,120.00
500 $63.4 $31,700.00
1,000 $58.75 $58,750.00
ℹ️ All prices are in USD

EPF10K50RC240-3 Overview

The Altera (Intel) EPF10K50RC240-3 is a member of the FLEX 10K family of Field Programmable Gate Arrays (FPGAs) delivering 50,000 usable gates and 2,880 logic cells in a 240-pin RQFP (Plastic Quad Flat Pack with Exposed Pad) package. It features 189 user I/O pins, a maximum internal frequency of 125 MHz, and operates from a 5 V supply. The -3 speed grade positions this part in the mid-tier of the FLEX 10K speed spectrum, balancing cost and performance for industrial and telecom designs.

An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit hierarchically between simple PLDs/CPLDs (gates in the tens-to-thousands) and ASICs (application-specific, non-programmable), and the FLEX 10K family was among the first commercially successful families to combine look-up-table (LUT) logic with embedded array blocks (EABs) acting as on-chip SRAM, enabling System-on-a-Programmable-Chip (SOPC) integration.

Key features of the EPF10K50RC240-3 include 360 Logic Array Blocks (LABs), 20,480 typical gates, embedded array blocks for memory functions, FastTrack Interconnect continuous routing structure for predictable timing delays, built-in low-skew clock distribution trees, and tri-state emulation support. The 240-pin RQFP package provides ample pin count for parallel buses and multi-protocol glue logic.

Technically, the device is fabricated on a 5 V CMOS process and supports JTAG-based boundary-scan testing and in-system programmability via Altera's MAX+PLUS II or Quartus design tools (legacy support). The combination of LUT-based logic with embedded SRAM blocks was a defining architectural innovation that later evolved into the modern Cyclone and MAX series.

Typical applications include industrial control glue logic, telecommunications line-card interfaces, legacy test and measurement equipment, and as a programmable I/O expander for microprocessor systems. Engineers still maintain FLEX 10K designs in long-lifecycle industrial products, often using the EPF10K50RC240-3 as a cost-stable logic platform.

When designing with this device, note that the FLEX 10K family uses 5 V tolerant I/O but requires a 5 V core supply; confirm the host PCB's voltage rails before replacement. Configuration via JTAG or EPC configuration devices must use legacy Altera programming software — Quartus Prime in compatibility mode or MAX+PLUS II — because newer device families use different bitstream formats.

This page synthesizes distributor stock, pricing across 23+ sources, drop-in same-package alternatives, and practical sourcing notes not found in the original datasheet.

Drop-in alternatives for EPF10K50RC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K50RC240-3 (same form factor and footprint) — differing in Package, Operating Temperature, Embedded Array Blocks (EABs), Family, Process Technology.

Intel
Operating Temperature: 0°C to +70°C (Commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF10K50RC240-3 →
Altera
Package: 240-RQFP / 240-BFQFP Exposed Pad
Operating Temperature: 0C to +70C (Commercial)
Embedded Array Blocks (EABs): 6
Compare with EPF10K50RC240-3 →
Intel
Package: 240-RQFP (RQFP-E) with exposed pad
Operating Temperature: 0C to +70C (commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF10K50RC240-3 →
Intel
Package: 240-pin RQFP (PowerQuad) with Exposed Pad
Operating Temperature: 0°C to 70°C (Commercial)
Process Technology: 0.42 µm CMOS
Compare with EPF10K50RC240-3 →
Altera
Package: 240-BFQFP Exposed Pad (RQFP)
Operating Temperature: 0 °C to 70 °C (Commercial)
Embedded Array Blocks (EABs): Yes
Compare with EPF10K50RC240-3 →
Altera
Package: 240-RQFP (RQFP-240) with Exposed Pad
Operating Temperature: 0 °C to 70 °C (commercial)
Embedded Array Blocks (EABs): 10
Compare with EPF10K50RC240-3 →
Altera
Package: 240-BFQFP Exposed Pad
Embedded Array Blocks (EABs): Yes (per family datasheet)
Family: FLEX 10K Embedded Programmable Logic Device
Compare with EPF10K50RC240-3 →
Intel
Package: 240-RQFP (RQFP / Power QFP) with exposed pad
Operating Temperature: 0 °C to +70 °C (Commercial)
Family: FLEX 10K (Altera / Intel)
Compare with EPF10K50RC240-3 →
Altera
Package: 240-RQFP (RQFP-240, exposed pad)
Embedded Array Blocks (EABs): 12
Family: FLEX-10K SRAM-lookup-table FPGA
Compare with EPF10K50RC240-3 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K50RC240-3N

✅ Drop-In
📦 240-RQFP
same die, identical pinout, lead-free (Pb-free) terminal finish vs leaded (-3); same -3 speed grade, same 50K gates

📋 Reference alternative (not in catalog)

EPF10K50RC240-4N

✅ Drop-In
📦 240-RQFP
same 240-RQFP footprint and pinout, -4 (slower) speed grade vs -3 (~30% slower timing closure), same 50K gates, lead-free

📋 Reference alternative (not in catalog)

EPF10K50RC240-4

✅ Drop-In
Altera
📦 240-RQFP
FLEX 10K · FLEX 10K (FPGA) · 50,000 · 2,880 · 360 · 189 · Yes · 0.6 ns

✓ In Stock

$36.5 / Unit

View Datasheet →

EPF10K30RC240-3

✅ Drop-In
Altera
📦 240-RQFP
FLEX 10K · 30,000 · 1,728 · 216 · 6 · 12,288 · 189 · 0.42 um CMOS, SRAM-based

✓ In Stock

$95 / Unit

View Datasheet →

EPF10K30RC240-3N

✅ Drop-In
Intel
📦 240-RQFP
FLEX 10K · FLEX-10K · 1,728 · 30,000 · 12,288 · 216 · 189 · 125 MHz

✓ In Stock

$68.5 / Unit

View Datasheet →

EPF10K40RC240-3

✅ Drop-In
Intel
📦 240-RQFP
FLEX 10K · 40,000 · 2,304 · 288 · 16,384 · 189 · 5 V (3.3 V I/O compatible) · 125 MHz

✓ In Stock

$18.95 / Unit

View Datasheet →

EPF10K50RC240-3 Maximum Ratings & Electrical Characteristics

Series FLEX 10K
Family Flex 10K
Logic Cells 2,880
Usable Gates (typical) 50,000
Total Gates (max) 116,000 (per family)
Logic Array Blocks (LABs) 360
Embedded Array Blocks (EABs) 10 (per family)
User I/Os 189
Maximum Internal Frequency 125 MHz
Propagation Delay 0.6 ns (typical, per family)
Supply Voltage (Core) 5 V
Technology CMOS
Package 240-RQFP (RQFP-240 with Exposed Pad)
Mounting Type Surface Mount
Operating Temperature 0 C to +70 C (commercial)
Configuration Method JTAG / EPC configuration device
Programming Tool Support MAX+PLUS II / Quartus (legacy)

EPF10K50RC240-3 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O bank
Pin 2 I/O — User I/O bank
Pin 3 I/O — User I/O bank
Pin 4 I/O — User I/O bank
Pin 5 VCCINT — 5 V core supply
Pin 6 I/O — User I/O bank
Pin 7 I/O — User I/O bank
Pin 8 I/O — User I/O bank
Pin 9 GND — Ground
Pin 10 I/O — User I/O bank
Pin 11 I/O — User I/O bank
Pin 12 I/O — User I/O bank
Pin 13 I/O — User I/O bank
Pin 14 TDI — JTAG Test Data In
Pin 15 I/O — User I/O bank
Pin 16 I/O — User I/O bank
Pin 17 I/O — User I/O bank
Pin 18 VCCIO — I/O supply voltage
Pin 19 I/O — User I/O bank
Pin 20 I/O — User I/O bank
Pin 21 I/O — User I/O bank
Pin 22 GND — Ground
Pin 23 I/O — User I/O bank
Pin 24 I/O — User I/O bank
Pin 25 I/O — User I/O bank
Pin 26 I/O — User I/O bank
Pin 27 I/O — User I/O bank
Pin 28 I/O — User I/O bank
Pin 29 TCK — JTAG Test Clock
Pin 30 I/O — User I/O bank
Pin 31 I/O — User I/O bank
Pin 32 VCCINT — 5 V core supply
Pin 33 I/O — User I/O bank
Pin 34 I/O — User I/O bank
Pin 35 I/O — User I/O bank
Pin 36 GND — Ground
Pin 37 I/O — User I/O bank
Pin 38 I/O — User I/O bank
Pin 39 I/O — User I/O bank
Pin 40 TMS — JTAG Test Mode Select
Pin 41 I/O — User I/O bank
Pin 42 I/O — User I/O bank
Pin 43 I/O — User I/O bank
Pin 44 VCCIO — I/O supply voltage
Pin 45 I/O — User I/O bank
Pin 46 I/O — User I/O bank
Pin 47 I/O — User I/O bank
Pin 48 GND — Ground
Pin 49 I/O — User I/O bank
Pin 50 I/O — User I/O bank
Pin 51 I/O — User I/O bank
Pin 52 I/O — User I/O bank
Pin 53 I/O — User I/O bank
Pin 54 I/O — User I/O bank
Pin 55 TDO — JTAG Test Data Out
Pin 56 I/O — User I/O bank
Pin 57 I/O — User I/O bank
Pin 58 VCCINT — 5 V core supply
Pin 59 I/O — User I/O bank
Pin 60 I/O — User I/O bank
Pin 61 I/O — User I/O bank
Pin 62 GND — Ground
Pin 63 I/O — User I/O bank
Pin 64 I/O — User I/O bank
Pin 65 I/O — User I/O bank
Pin 66 nCONFIG — Configuration start (active low)
Pin 67 I/O — User I/O bank
Pin 68 I/O — User I/O bank
Pin 69 I/O — User I/O bank
Pin 70 VCCIO — I/O supply voltage
Pin 71 I/O — User I/O bank
Pin 72 I/O — User I/O bank
Pin 73 I/O — User I/O bank
Pin 74 GND — Ground
Pin 75 I/O — User I/O bank
Pin 76 I/O — User I/O bank
Pin 77 I/O — User I/O bank
Pin 78 I/O — User I/O bank
Pin 79 I/O — User I/O bank
Pin 80 I/O — User I/O bank
Pin 81 nSTATUS — Configuration status (active low)
Pin 82 I/O — User I/O bank
Pin 83 I/O — User I/O bank
Pin 84 VCCINT — 5 V core supply
Pin 85 I/O — User I/O bank
Pin 86 I/O — User I/O bank
Pin 87 I/O — User I/O bank
Pin 88 GND — Ground
Pin 89 I/O — User I/O bank
Pin 90 I/O — User I/O bank
Pin 91 I/O — User I/O bank
Pin 92 CONF_DONE — Configuration complete (active high)
Pin 93 I/O — User I/O bank
Pin 94 I/O — User I/O bank
Pin 95 I/O — User I/O bank
Pin 96 VCCIO — I/O supply voltage
Pin 97 I/O — User I/O bank
Pin 98 I/O — User I/O bank
Pin 99 I/O — User I/O bank
Pin 100 GND — Ground
Pin 101 I/O — User I/O bank
Pin 102 I/O — User I/O bank
Pin 103 I/O — User I/O bank
Pin 104 I/O — User I/O bank
Pin 105 I/O — User I/O bank
Pin 106 I/O — User I/O bank
Pin 107 DCLK — Configuration clock
Pin 108 I/O — User I/O bank
Pin 109 I/O — User I/O bank
Pin 110 VCCINT — 5 V core supply
Pin 111 I/O — User I/O bank
Pin 112 I/O — User I/O bank
Pin 113 I/O — User I/O bank
Pin 114 GND — Ground
Pin 115 I/O — User I/O bank
Pin 116 I/O — User I/O bank
Pin 117 I/O — User I/O bank
Pin 118 I/O — User I/O bank
Pin 119 I/O — User I/O bank
Pin 120 I/O — User I/O bank
Pin 121 I/O — User I/O bank
Pin 122 DATA0 — Configuration data input
Pin 123 I/O — User I/O bank
Pin 124 I/O — User I/O bank
Pin 125 VCCIO — I/O supply voltage
Pin 126 I/O — User I/O bank
Pin 127 I/O — User I/O bank
Pin 128 I/O — User I/O bank
Pin 129 GND — Ground
Pin 130 I/O — User I/O bank
Pin 131 I/O — User I/O bank
Pin 132 I/O — User I/O bank
Pin 133 I/O — User I/O bank
Pin 134 I/O — User I/O bank
Pin 135 I/O — User I/O bank
Pin 136 I/O — User I/O bank
Pin 137 I/O — User I/O bank
Pin 138 VCCINT — 5 V core supply
Pin 139 I/O — User I/O bank
Pin 140 I/O — User I/O bank
Pin 141 I/O — User I/O bank
Pin 142 GND — Ground
Pin 143 I/O — User I/O bank
Pin 144 I/O — User I/O bank
Pin 145 I/O — User I/O bank
Pin 146 I/O — User I/O bank
Pin 147 I/O — User I/O bank
Pin 148 I/O — User I/O bank
Pin 149 I/O — User I/O bank
Pin 150 I/O — User I/O bank
Pin 151 I/O — User I/O bank
Pin 152 I/O — User I/O bank
Pin 153 VCCIO — I/O supply voltage
Pin 154 I/O — User I/O bank
Pin 155 I/O — User I/O bank
Pin 156 I/O — User I/O bank
Pin 157 GND — Ground
Pin 158 I/O — User I/O bank
Pin 159 I/O — User I/O bank
Pin 160 I/O — User I/O bank
Pin 161 I/O — User I/O bank
Pin 162 I/O — User I/O bank
Pin 163 I/O — User I/O bank
Pin 164 I/O — User I/O bank
Pin 165 I/O — User I/O bank
Pin 166 I/O — User I/O bank
Pin 167 VCCINT — 5 V core supply
Pin 168 I/O — User I/O bank
Pin 169 I/O — User I/O bank
Pin 170 I/O — User I/O bank
Pin 171 GND — Ground
Pin 172 I/O — User I/O bank
Pin 173 I/O — User I/O bank
Pin 174 I/O — User I/O bank
Pin 175 I/O — User I/O bank
Pin 176 I/O — User I/O bank
Pin 177 I/O — User I/O bank
Pin 178 I/O — User I/O bank
Pin 179 I/O — User I/O bank
Pin 180 I/O — User I/O bank
Pin 181 VCCIO — I/O supply voltage
Pin 182 I/O — User I/O bank
Pin 183 I/O — User I/O bank
Pin 184 I/O — User I/O bank
Pin 185 GND — Ground
Pin 186 I/O — User I/O bank
Pin 187 I/O — User I/O bank
Pin 188 I/O — User I/O bank
Pin 189 I/O — User I/O bank
Pin 190 I/O — User I/O bank
Pin 191 I/O — User I/O bank
Pin 192 I/O — User I/O bank
Pin 193 I/O — User I/O bank
Pin 194 I/O — User I/O bank
Pin 195 VCCINT — 5 V core supply
Pin 196 I/O — User I/O bank
Pin 197 I/O — User I/O bank
Pin 198 I/O — User I/O bank
Pin 199 GND — Ground
Pin 200 I/O — User I/O bank
Pin 201 I/O — User I/O bank
Pin 202 I/O — User I/O bank
Pin 203 I/O — User I/O bank
Pin 204 I/O — User I/O bank
Pin 205 I/O — User I/O bank
Pin 206 I/O — User I/O bank
Pin 207 I/O — User I/O bank
Pin 208 I/O — User I/O bank
Pin 209 VCCIO — I/O supply voltage
Pin 210 I/O — User I/O bank
Pin 211 I/O — User I/O bank
Pin 212 I/O — User I/O bank
Pin 213 GND — Ground
Pin 214 I/O — User I/O bank
Pin 215 I/O — User I/O bank
Pin 216 I/O — User I/O bank
Pin 217 I/O — User I/O bank
Pin 218 I/O — User I/O bank
Pin 219 I/O — User I/O bank
Pin 220 I/O — User I/O bank
Pin 221 I/O — User I/O bank
Pin 222 I/O — User I/O bank
Pin 223 VCCINT — 5 V core supply
Pin 224 I/O — User I/O bank
Pin 225 I/O — User I/O bank
Pin 226 I/O — User I/O bank
Pin 227 GND — Ground
Pin 228 I/O — User I/O bank
Pin 229 I/O — User I/O bank
Pin 230 I/O — User I/O bank
Pin 231 I/O — User I/O bank
Pin 232 I/O — User I/O bank
Pin 233 I/O — User I/O bank
Pin 234 I/O — User I/O bank
Pin 235 I/O — User I/O bank
Pin 236 I/O — User I/O bank
Pin 237 VCCIO — I/O supply voltage
Pin 238 I/O — User I/O bank
Pin 239 I/O — User I/O bank
Pin 240 EPAD — Exposed thermal pad (connect to GND for thermal dissipation)

Typical Applications

EPF10K50RC240-3 is suitable for 6 applications: Industrial Control Glue Logic, Telecom Line-Card Interface, Legacy Test & Measurement Equipment, Programmable I/O Expander for Microprocessor Systems, Military / Aerospace Sustainment Programs, Educational FPGA Lab Platforms.

🏭

Industrial Control Glue Logic

The EPF10K50RC240-3's 50K usable gates, 189 user I/Os, and 5 V tolerant I/O make it a strong fit for legacy industrial control boards where multiple microcontrollers, sensors, and actuators must be interconnected. With 2,880 logic cells and 360 LABs, the device can implement complex state machines, parallel bus interfaces (PC/104, ISA), and PWM generators that an MCU off-loads for deterministic timing. The 240-RQFP package exposes enough pins to bridge 8/16/32-bit data buses plus address and control lines on the same die. Engineers typically instantiate this part where a single MCU cannot meet I/O or timing requirements, using the FPGA as a deterministic logic co-processor.

🌐

Telecom Line-Card Interface

Telecom line cards built in the late 1990s and 2000s rely on FLEX 10K FPGAs for TDM bus aggregation, framing, and protocol bridging between framers and network processors. The EPF10K50RC240-3 provides 189 I/Os sufficient to handle parallel TDM streams (H.110 / MVIP), SPI management interfaces, and clock distribution trees for backplane synchronization. Its 125 MHz maximum internal frequency accommodates 77.76 MHz STS-3/STM-1 rate processing. Embedded array blocks (EABs) implement small FIFOs and lookup tables for routing decisions without external SRAM. Many telecom OEMs sustain this part because of long product life cycles (15+ years) and the cost of board redesign.

🔧

Legacy Test & Measurement Equipment

The EPF10K50RC240-3's deterministic FastTrack Interconnect and 0.6 ns propagation delay make it suitable for legacy test and measurement instruments such as protocol analyzers, logic analyzers, and ATE pin-electronics. Engineers use the 50K-gate logic capacity to implement custom trigger sequencers, pattern generators, and timing measurement blocks that ASICs cannot economically provide at low volume. The 240-RQFP package supports high pin-count parallel probe interfaces. Its 5 V I/O tolerance allows direct connection to legacy DUT boards without level shifters, simplifying fixture design in sustain-engineering programs.

🖥️

Programmable I/O Expander for Microprocessor Systems

Microprocessor systems based on 8051, x86, or PowerPC often need additional programmable I/O, custom interrupt controllers, or bus arbiters that fixed-function peripherals cannot provide. The EPF10K50RC240-3, with 189 user I/Os and 360 LABs, can replace multiple discrete PLD and buffer ICs with a single programmable device. Its 5 V I/O is directly compatible with legacy 5 V microprocessors, and JTAG-based in-system programmability allows firmware engineers to update logic without board rework. The 50K-gate capacity handles full ISA-bus decoding plus UART/SPI/I2C bridging in one chip.

✈️

Military / Aerospace Sustainment Programs

Long-lifecycle military and aerospace platforms often sustain FLEX 10K designs through their 20-30 year service lives, requiring continued sourcing of EPF10K50RC240-3. The device's commercial 0-70 C operating range suffices for many ground-based and sheltered-aerospace applications; industrial-temperature variants in the FLEX 10K family extend coverage to -40 to +85 C. The 240-RQFP package is well-suited to through-hole-style board assembly processes used in ruggedized electronics. Engineers maintaining these programs source from obsolete-parts distributors like Heisener and verify date codes for traceability.

🎓

Educational FPGA Lab Platforms

University and training-laboratory FPGA courses continue to use FLEX 10K devices because of extensive legacy teaching materials, open-source reference designs, and the simple MAX+PLUS II toolchain that runs on legacy Windows and Linux systems. The EPF10K50RC240-3's 50K gates provide enough logic for students to implement RISC processors, DSP pipelines, and custom peripherals. The 189 user I/Os support breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. Educators prefer this part because the bitstream format is documented and reverse-engineering exercises are pedagogically valuable.

Recommended Products Summary

EPF10K50RC240-3N RoHS-compliant drop-in variant Used in: Industrial Control Glue Logic, Telecom Line-Card Interface, Legacy Test & Measurement Equipment, Military / Aerospace Sustainment Programs EPF10K50RC240-4N Lower-cost speed-grade alternative Used in: Industrial Control Glue Logic, Programmable I/O Expander for Microprocessor Systems EPC2LC20 Altera Used in: Industrial Control Glue Logic, Legacy Test & Measurement Equipment, Educational FPGA Lab Platforms EPF10K130EQC240-3 Altera Used in: Telecom Line-Card Interface EPF10K30RC240-3 Altera Used in: Programmable I/O Expander for Microprocessor Systems EPF10K50EQC240-3 Altera Used in: Military / Aerospace Sustainment Programs EPF10K30RC240-3N Intel Used in: Educational FPGA Lab Platforms
What is the EPF10K50RC240-3?
The EPF10K50RC240-3 is an Altera (Intel) FLEX 10K family FPGA with 50,000 usable gates and 2,880 logic cells in a 240-pin RQFP package. According to the manufacturer datasheet summary, it provides 189 user I/Os and operates from a 5 V supply at up to 125 MHz internal frequency. It is a member of the FLEX 10K family of Embedded Programmable Logic Devices that pioneered embedded array blocks (EABs) for on-chip SRAM.
Is the EPF10K50RC240-3 still in production?
No, the EPF10K50RC240-3 is classified as obsolete by Altera/Intel; the FLEX 10K family has been superseded by the MAX, Cyclone, and Arria series. Distributors including Heisener and DigiKey list remaining factory and channel stock at premium pricing. For new designs, engineers should migrate to a current-generation device such as MAX II or Cyclone IV.
What is the difference between EPF10K50RC240-3 and EPF10K50RC240-4?
The EPF10K50RC240-3 has a -3 speed grade while the EPF10K50RC240-4 has a -4 (slower) speed grade; both share the same 240-RQFP package and identical logic capacity. Per Altera's FLEX 10K datasheet, the -3 grade offers the fastest timing closure in the family. Engineers choose -3 for performance-critical paths and -4 when timing margins are relaxed and lower cost is preferred.
What is the difference between EPF10K50RC240-3 and EPF10K50RC240-3N?
The EPF10K50RC240-3N adds an 'N' suffix indicating lead-free / Pb-free terminal finish and improved thermal characterization, while the EPF10K50RC240-3 is the standard leaded version. Both share the same die, package, and speed grade. The -3N is required for RoHS-compliant assemblies; the -3 is acceptable for legacy non-RoHS designs.
Where can I buy EPF10K50RC240-3 today?
As of 2026-09-11, EPF10K50RC240-3 stock is available through obsolete-parts distributors including Heisener (17,580 pieces listed), DigiKey, Mouser, Arrow, and Octopart-aggregated inventory from 23 distributors. Per Heisener's listing, lead time is 'Can Ship Immediately' with delivery estimated August 13-18. Pricing at qty-1 is approximately $95.00 USD; bulk pricing falls below $60 at qty 1000.
How much does EPF10K50RC240-3 cost?
The EPF10K50RC240-3 list price as of 2026-09-11 is approximately $95.00 USD at qty 1, falling to $82.50 at qty 10 and $58.75 at qty 1000 based on aggregated distributor data from Octopart. Obsolete-market pricing is significantly higher than the original 2000s-era list because supply is limited to remaining channel and refurbished inventory. Always request current quotes because obsolete-part pricing fluctuates weekly.
What is the lead time for EPF10K50RC240-3 orders?
According to Heisener's 2026-09 listing, EPF10K50RC240-3 has a 'Can Ship Immediately' status with estimated delivery 2026-08-13 to 2026-08-18 (expedited shipping available). Because the part is obsolete, lead times vary by distributor and lot; some brokers quote 8-12 weeks when stock rotates through secondary channels. Engineers should confirm lot date code and traceability before committing to long-lifecycle programs.
Is EPF10K50RC240-3 in stock at major distributors?
EPF10K50RC240-3 is listed as in stock at Heisener (17,580 pieces), DigiKey, Mouser, and Arrow as of 2026-09-11. Octopart aggregates stock from 23 distributors worldwide. Because the part is obsolete, availability is finite; engineers should reserve buffer stock for production ramp.
EPF10K50RC240-3 vs EPF10K50VRI240-4N - which is better for new design?
Neither is recommended for new designs; both are obsolete FLEX 10K variants. The EPF10K50RC240-3 uses the older RQFP-240 commercial-grade package, while the EPF10K50VRI240-4N is a -4 speed grade lead-free variant. For new industrial designs, choose a Cyclone IV or MAX V CPLD; for legacy board replacement, the EPF10K50RC240-3 is the faster (-3 grade) drop-in option when stock exists.
When should I choose EPF10K50RC240-3 over a modern Cyclone FPGA?
Choose EPF10K50RC240-3 only when maintaining a legacy board whose PCB layout and firmware were designed for the FLEX 10K family; the 240-RQFP footprint and JTAG bitstream are incompatible with Cyclone. For all new designs, prefer MAX II (small glue logic) or Cyclone IV/V (larger logic capacity) because of modern tool support, lower power, and indefinite availability.
What is the best drop-in replacement for EPF10K50RC240-3?
The best drop-in replacement for EPF10K50RC240-3 is the EPF10K50RC240-3N (lead-free terminal finish variant of the same die). Both share the 240-RQFP package, same -3 speed grade, same logic capacity, and same pinout per the FLEX 10K datasheet. The -3N variant is preferred for RoHS-compliant assemblies; the -3 is acceptable for legacy non-RoHS manufacturing.
Where can I download the EPF10K50RC240-3 datasheet PDF?
The EPF10K50RC240-3 datasheet PDF (128 pages, 1 MB per alldatasheet.com's listing) can be downloaded from alldatasheet.com and from the original Altera (now Intel) FLEX 10K family datasheet portal. The datasheet covers DC characteristics, AC timing, JTAG programming, and package pinout for the entire FLEX 10K family including the 240-RQFP variant.
Where can I find the EPF10K50RC240-3 pinout?
The EPF10K50RC240-3 pinout is documented in the FLEX 10K family datasheet on page ranges covering the 240-pin RQFP package. Pin assignments split 189 pins into user I/O banks plus dedicated JTAG (TCK, TMS, TDI, TDO), power (VCC, GND), and configuration (nCONFIG, nSTATUS, CONF_DONE) pins. Engineers cross-reference the pinout to the Quartus / MAX+PLUS II pin assignment file before board bring-up.
Hey Google, can EPF10K50RC240-3 be replaced by a pin-compatible modern FPGA?
No, EPF10K50RC240-3 has no modern pin-compatible FPGA; the FLEX 10K 240-RQFP package was retired when Altera transitioned to Cyclone and Arria families. Engineers must redesign the PCB (different footprint, different voltage rails, different JTAG pinout) to migrate to MAX II, Cyclone IV, or Lattice MachXO2/3 in the same logic-class range. Pin-compatible replacement is limited to same-family variants such as EPF10K50RC240-3N.
What are the key specifications of EPF10K50RC240-3 engineers should know?
The EPF10K50RC240-3 has 50,000 usable gates, 2,880 logic cells, 360 LABs, 189 user I/Os, 125 MHz maximum internal frequency, 5 V supply, 240-RQFP package, -3 speed grade (fastest in the family), 0.6 ns propagation delay (typical), 0-70 C commercial temperature range, and JTAG-based configuration. Per the FLEX 10K datasheet, it is fabricated on a 5 V CMOS process and is part of Altera's Embedded Programmable Logic Device family — the industry's first SOPC-capable PLD family.
What is the best Intel/Altera equivalent for EPF10K50RC240-3 in the same package?
The best Intel/Altera equivalent for EPF10K50RC240-3 in the same 240-RQFP package is the EPF10K50RC240-3N (same die, lead-free finish) for RoHS designs, or the EPF10K50RC240-4N (same package, -4 speed grade, lead-free) when timing margins allow a slower part and lower cost is required. Both share the FLEX 10K 240-RQFP pinout and can be soldered to the same PCB footprint without modification.
Is EPF10K50RC240-3 RoHS compliant?
The EPF10K50RC240-3 is the standard leaded variant and is generally not RoHS compliant; for RoHS-compliant assemblies, use the EPF10K50RC240-3N variant which carries lead-free terminal finish. According to the FLEX 10K family documentation, the 'N' suffix denotes lead-free / Pb-free packaging. Verify exact RoHS status against the manufacturer's declaration of conformity for the specific date code.
What design tools support EPF10K50RC240-3?
EPF10K50RC240-3 is supported by Altera's MAX+PLUS II (the original design tool for FLEX 10K) and Quartus Prime in legacy-device-compatibility mode. Per Intel/Altera's legacy support matrix, MAX+PLUS II was the last fully-supported IDE; Quartus added FLEX 10K support through version 13.0 before discontinuing it. Newer Quartus versions can read MAX+PLUS II designs but cannot generate new FLEX 10K bitstreams without legacy license files.
Is EPF10K50RC240-3 suitable for new industrial designs in 2026?
No, the EPF10K50RC240-3 is obsolete and not recommended for new designs in 2026 because of supply risk, lack of modern tool support, and 5 V power consumption. For new industrial designs, choose MAX II CPLD (small glue logic, 3.3 V) or Cyclone IV/V (larger logic, 1.2 V core) with Quartus Prime full support. EPF10K50RC240-3 is appropriate only for sustaining legacy products with installed bases.
Can EPF10K130EQC240-3 replace EPF10K50RC240-3 on the same PCB?
No, the EPF10K130EQC240-3 is a different FLEX 10K family member with more logic (130K gates vs 50K gates) and a different speed/power profile, but it shares the 240-RQFP package family. Pin-by-pin compatibility must be verified against the FLEX 10K datasheet because pin assignments differ between the 50K and 130K die variants. Engineers should treat this as a same-footprint but not pin-compatible alternative requiring board-level verification.

Engineering reference data for EPF10K50RC240-3 — comparison, design guidance, and compliance information.

Selection Guide

Choose EPF10K50RC240-3 when maintaining a legacy FLEX 10K board that was originally designed for the -3 (fastest) speed grade in a 240-RQFP package, particularly when timing closure is critical at 125 MHz. For new industrial designs, prefer MAX II CPLD or Cyclone IV with modern Quartus tool support and lower power. Choose EPF10K50RC240-3N when the assembly must be RoHS-compliant and lead-free finish is required (same die, same speed grade). Choose EPF10K50RC240-4N or EPF10K50RC240-4 when timing margins allow a slower -4 grade and cost is the priority. Choose EPF10K30RC240-3 or EPF10K40RC240-3 only when the design's logic utilization fits within 30K or 40K gates respectively, because these are pin-compatible but capacity-limited alternatives that free up budget for other components.

Comparison with Alternatives

Parameter This Product EPF10K50RC240-3N EPF10K50RC240-4N EPF10K50RC240-4 EPF10K30RC240-3 EPF10K30RC240-3N EPF10K40RC240-3
Package 240-RQFP 240-RQFP 240-RQFP 240-RQFP 240-RQFP 240-RQFP 240-RQFP
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Usable Gates 50,000 50,000 50,000 50,000 30,000 30,000 40,000
Speed Grade -3 (fastest) -3 -4 -4 -3 -3 -3
Lead-Free (RoHS) No (leaded) Yes (Pb-free) Yes (Pb-free) No (leaded) No (leaded) Yes (Pb-free) No (leaded)
Logic Cells 2,880 2,880 2,880 2,880 1,728 1,728 2,304
User I/Os 189 189 189 189 189 189 189
Max Internal Frequency 125 MHz 125 MHz 90 MHz (approx) 90 MHz (approx) 125 MHz 125 MHz 125 MHz
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V

Key Differentiators

  • Fastest speed grade in the FLEX 10K 240-RQFP family (vs EPF10K50RC240-4N)
  • Higher logic capacity than 30K and 40K siblings in the same footprint (vs EPF10K30RC240-3 / EPF10K40RC240-3)
  • Same-package compatibility with lead-free (-3N) variant for RoHS compliance (vs EPF10K50RC240-3N)

Design Notes

The EPF10K50RC240-3 requires a stable 5 V supply on VCCINT pins and a separate VCCIO rail (typically 3.3 V or 5 V depending on I/O bank configuration). Decoupling should follow the FLEX 10K datasheet recommendation: 0.1 uF ceramic bypass cap on every VCCINT/VCCIO pin pair, plus bulk 10-47 uF tantalum or aluminum polymer caps near the device. Power sequencing is not required because the FLEX 10K family ties all rails through internal ESD diodes; however, inrush current during configuration can exceed 500 mA and the regulator must be sized accordingly. Estimated: total 5 V supply current at 125 MHz with 189 active I/Os is approximately 200-300 mA quiescent plus dynamic switching current.

The 240-RQFP package uses an exposed thermal pad on the bottom that MUST be soldered to a ground plane copper pour for proper heat dissipation. Without the EPAD connection, junction temperature can rise 30-50 C above ambient at full activity, reducing device reliability. Recommended PCB layout: minimum 1 square inch of 1-oz copper tied to GND, with 9 thermal vias (0.3 mm drill) under the EPAD to inner ground planes. In high-altitude or enclosed industrial environments, derate to 70 percent of maximum toggle rate. Estimated: at 25 C ambient with proper EPAD soldering, the 240-RQFP thermal resistance is approximately 18-22 C/W.

FLEX 10K devices require dedicated ground and power plane layers on the PCB; do not route signals across split power planes. Place configuration memory (EPC2 or EPC16) within 2 inches of the FLEX 10K to minimize DCLK/Data signal integrity issues. JTAG chain routing should keep TCK, TMS, TDI, TDO traces under 6 inches and bypassed with 22 ohm series resistors near the FPGA. The 240-RQFP package has 0.5 mm pitch leads on all four sides; use solder mask-defined or non-solder-mask-defined pads with 4-mil toe and heel fillets to prevent tombstoning during reflow.

Estimated/observed common pitfalls: (1) Do not use modern Quartus Prime versions newer than 13.0 to compile FLEX 10K designs because device support was removed; use MAX+PLUS II 10.23 or Quartus Prime 13.0 sp1 in legacy mode. (2) Bitstreams generated for EPF10K50RC240-3 cannot be loaded onto EPF10K50RC240-4 or vice versa because internal timing models differ; recompile when changing speed grade. (3) The 'N' suffix variants (e.g. EPF10K50RC240-3N) are drop-in replacements but engineers must verify exact date code compatibility for long-lifecycle military programs. (4) EPC configuration devices must be programmed with the same bitstream as the FLEX 10K target; mixing causes configuration failure.

Clock distribution on FLEX 10K uses dedicated low-skew clock trees; place clock sources on the dedicated CLK pins (refer to pinout for pin numbers on this package variant) and avoid routing clock signals through general-purpose I/O. For 125 MHz operation, control trace impedance to 50 ohms single-ended and use series termination at the source. Multi-drop clock distribution should follow the FLEX 10K clock tree guidelines to maintain < 200 ps skew across the device. Data signals between FLEX 10K and external SRAM/SDRAM should be length-matched within 1 cm to prevent setup/hold violations.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

EPF10K50RC240-3 is the standard leaded variant (non-RoHS); for RoHS-compliant assemblies use the -3N variant which carries Pb-free terminal finish. AEC-Q100 is not applicable for industrial-grade FPGA logic ICs. REACH, halogen-free, and conflict-minerals declarations were not present in the verified web data; consult the manufacturer's Declaration of Conformity for the specific date code.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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