EPF10K50VR1240-4 - 50K FLEX 10K FPGA, 240-Pin BFQFP | Altera
MPN: EPF10K50VR1240-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 500 | $47.25 | $23,625.00 |
| 1,000 | $42 | $42,000.00 |
EPF10K50VR1240-4 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), interconnect, and I/O cells. FPGAs belong to the larger hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The FLEX 10K family was Altera's first to embed array blocks, a predecessor of modern FPGA embedded Block RAM.
Key features include roughly 2,880 logic elements (per the DigiKey listing of the related I240 variant), 20,480 typical gates, dedicated embedded array blocks for memory, 5V-tolerant I/O on the V-series, and JTAG-based in-system programmability via the ByteBlaster or BitBlaster cable. The architecture supports asynchronous and synchronous RAM and ROM, multipliers via lookup tables, and cascaded EABs for wide memory functions.
The EPF10K50VR1240-4 is fabricated on a 0.42 µm CMOS SRAM process and operates from a 5V core supply with 5V/3.3V multi-voltage I/O. The 240-pin BFQFP package exposes approximately 189 user I/O pins, sufficient for glue logic, bus interfacing, and moderate-density state-machine replacement in legacy industrial designs.
Typical applications include industrial control and instrumentation, glue logic replacement, telecommunications backplane interfacing, prototyping of ASIC designs, and embedded control planes where moderate logic density, deterministic timing, and 5V tolerance outweigh the need for modern high-speed transceivers.
Designers should treat the -4 speed grade as the slowest in the FLEX 10K V-series; pin-compatible -3, -2, and -1 variants yield faster timing closure. A 0.1 µF decoupling cap per VCC pin plus a bulk cap near the package are essential for SRAM configuration-supply noise margin.
This page consolidates distributor pricing, parametric comparisons against speed-grade and package variants, and practical design notes for the FLEX 10K family not found in the standalone datasheet.
Drop-in alternatives for EPF10K50VR1240-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VR1240-4 (same form factor and footprint) — differing in Package, Family, Operating Temperature, Configuration Method, Embedded Array Blocks (EABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRI240-4N
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K50VRC240-4
✅ Drop-In✓ In Stock
$85.3 / Unit
View Datasheet →EPF10K50VRC240-3
✅ Drop-In✓ In Stock
$61.75 / Unit
View Datasheet →EPF10K50RC240-4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$36.5 / Unit
View Datasheet →EPF10K50RC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$58.75 / Unit
View Datasheet →EPF10K50VR1240-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K Embedded Programmable Logic Device |
| Series | FLEX 10K (V-series, 5V core) |
| Typical Gates | 20,480 |
| Maximum Logic Elements | 2,880 |
| Embedded Array Blocks (EABs) | Yes (per family datasheet) |
| Package | 240-BFQFP Exposed Pad |
| Pin/Pinout Code | R1240 (240-pin BFQFP) |
| Speed Grade | -4 (slowest in family) |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 5 V |
| I/O Supply Voltage | 5 V / 3.3 V (multi-voltage I/O) |
| Configuration Method | SRAM, JTAG (ByteBlaster/BitBlaster) |
| Mounting Type | Surface Mount |
EPF10K50VR1240-4 240-bfqfp exposed pad Pin Configuration Guide
Pin configuration for EPF10K50VR1240-4 (240-bfqfp exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VR1240-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VR1240-4 is suitable for 6 applications: Industrial Control Logic, Telecommunications Backplane Glue Logic, ASIC Prototyping and Emulation, Legacy Test and Measurement Instrumentation, Aerospace and Defense Avionics (Legacy), Medical Imaging Backend Processing.
Industrial Control Logic
The EPF10K50VR1240-4 is widely deployed in industrial PLC-style controllers and machine automation, where its 20,480 gates and 5V-tolerant I/O directly interface to 24V sensor rails through external level shifters. The 240-BFQFP package exposes 189 user I/O, enough for parallel 16/32-bit data paths plus dedicated encoder inputs. The 0.42 µm CMOS core is robust against the electrical noise of motor drives, and the JTAG-based SRAM configuration lets engineers iterate glue-logic designs without inventory churn.
Recommended
Telecommunications Backplane Glue Logic
In legacy telecom backplanes, the EPF10K50VR1240-4 implements bus-bridging, FIFO management, and protocol-conversion glue logic between E1/T1 framers and switch fabrics. Its embedded array blocks (EABs) implement dual-port RAM for packet buffering without external SRAM, saving board area. The 5V I/O tolerates older TTL backplane voltage rails, and 189 user I/O pins are sufficient to handle a full 32-bit data bus plus control and clock signals. Modern alternatives cannot match this 5V-tolerance in the same footprint.
Recommended
ASIC Prototyping and Emulation
The EPF10K50VR1240-4 was a popular platform for prototyping mid-complexity ASICs (10K-30K gates) before modern FPGA prototyping boards existed. The embedded array blocks let designers map dual-port RAM, ROM, and small multipliers without external logic, while the 5V core simplifies IO emulation of legacy ASICs. The -4 speed grade limits maximum clock rates to roughly 50 MHz for register-intensive designs, sufficient for functional verification. Migration to Cyclone IV EP4CE6 delivers 10x the density in a smaller package.
Recommended
Legacy Test and Measurement Instrumentation
Bench-top instruments manufactured in the late 1990s and 2000s use the EPF10K50VR1240-4 for waveform synthesis, trigger logic, and DSP datapath control. The 5V-tolerant I/O interfaces directly to legacy ADC/DAC chips (e.g., AD976, AD1862) without level shifters, reducing BOM. The 240-BFQFP exposed pad provides a low-thermal-resistance path for sustained operation inside sealed instrument enclosures. Service and repair of these legacy instruments is the primary 2026 demand driver for remaining inventory.
Recommended
Aerospace and Defense Avionics (Legacy)
The EPF10K50V family was designed into military and avionics platforms in the late 1990s, where its 5V tolerance and wide operating temperature range suited the harsh electrical environment of aircraft buses. While new designs have migrated to radiation-tolerant FPGAs (Microsemi RTG4, Xilinx Virtex-5QV), the EPF10K50VR1240-4 still appears in support contracts for legacy platforms. Lead times on remaining inventory can exceed 26 weeks, and parts should be procured through authorized defense distributors with traceability documentation.
Recommended
Medical Imaging Backend Processing
Diagnostic imaging platforms (ultrasound beamformers, MRI controllers) used the EPF10K50VR1240-4 to implement channel-multiplexing, FIR filter control, and DMA engines feeding DSP processors. The embedded array blocks implement coefficient tables for FIR filters without external memory, saving PCB space inside the densely-packed imaging head. The 5V core simplifies integration with legacy analog front-ends, and the FLEX 10K deterministic routing simplifies IEC 60601 EMI certification, which is why so many 2000s-era medical platforms still rely on it.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VR1240-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRI240-4N | EPF10K50VRC240-4 | EPF10K50VRC240-3 | EPF10K50RC240-4 | EPF10K50RC240-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-BFQFP Exposed Pad (R1240) | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-RQFP - same footprint family | 240-RQFP - same footprint family |
| Speed Grade | -4 (slowest) | -4 (industrial) | -4 (commercial) | -3 (faster) | -4 (commercial PQFP) | -3 (faster PQFP) |
| Temperature Range | Commercial (per V-series non-N) | Industrial (-40C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Lead-Free / RoHS | Not specified in verified data | Yes (N suffix = lead-free) | Non-RoHS | Non-RoHS | Non-RoHS | Non-RoHS |
| Typical Gates | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 |
| Core Voltage | 5 V (V-series) | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature range available in identical 240-BFQFP footprint (vs EPF10K50VR1240-4 (commercial) vs EPF10K50VRI240-4N (industrial))
- Faster speed grade available in identical footprint (vs EPF10K50VR1240-4 (speed grade -4) vs EPF10K50VRC240-3 (speed grade -3))
- PQFP package alternative for hand-solder and rework (vs EPF10K50VR1240-4 (BFQFP) vs EPF10K50RC240-4 (RQFP / PQFP))
Design Notes
The EPF10K50VR1240-4 requires both 5V VCCINT (core) and 5V or 3.3V VCCIO (I/O) supplies. During configuration the SRAM cell array draws transient currents up to 500 mA; place a 100 µF bulk tantalum capacitor plus 0.1 µF ceramic decoupling on every VCCINT/VCCIO pair. Without adequate decoupling, configuration failures manifest as CONF_DONE never asserting. Per FLEX 10K design guidelines, route VCC and GND on adjacent inner PCB layers.
The 240-BFQFP exposed pad must be soldered to a copper pad of at least 1 square inch to dissipate the worst-case 1.5 W core power. Without a thermal pad, junction temperature can exceed 125 C and trigger thermal shutdown-like behavior (configuration corruption). Use four thermal vias in the exposed pad to a ground plane for best results. Estimated: at VCCINT=5V, ICCINT=300 mA, the dissipated power is approximately 1.5 W; with 28 C/W theta_JA the junction rises 42 C above ambient.
Do not confuse the EPF10K50V (5V core) with the EPF10K50E (3.3V core) - they are not pin-compatible because VCCINT and VCCIO pin assignments differ. Many second-source suppliers offer EPF10K50E parts as 'drop-in' for the V series - always verify the device marking. Quartus versions 14.0 and later have dropped support for FLEX 10K; retain Quartus II 13.0sp1 for programming.
Route JTAG signals TCK, TMS, TDI, TDO with 50 ohm characteristic impedance and keep total chain length below 150 mm if chaining multiple FLEX 10K devices. Add 10 kohm pull-ups on nCONFIG and 1 kohm pull-down on nSTATUS. The DCLK line should be guarded by ground traces because configuration bitstream corruption occurs if DCLK has more than 1 ns of jitter.
FLEX 10K 5V outputs have asymmetric rise/fall times (typically 2 ns rise, 3 ns fall at 50 pF); undershoot on heavily loaded clocks can exceed -2V and trigger input-latchup. Add 33 ohm series termination on clock outputs driving more than 4 loads. Hold-time violations on the -4 speed grade become visible above 50 MHz, so design clocks at or below 40 MHz unless timing closure is verified in Quartus.
Compliance Information
The EPF10K50VR1240-4 (non-N suffix) is widely understood to be the pre-RoHS commercial variant; the EPF10K50VRI240-4N is the lead-free industrial variant. Verified web data does not confirm RoHS/REACH for the -4 suffix part specifically; marking should be cross-checked against physical samples.
