EPF6024ABC256-1 - FLEX 6000 FPGA 24K Gates 256-BGA | Altera
MPN: EPF6024ABC256-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $27.2 | $2,720.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.85 | $19,850.00 |
EPF6024ABC256-1 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. After fabrication, the device can be electrically configured to implement arbitrary digital logic functions. The FLEX 6000 family uses a register-rich, look-up-table (LUT)-based architecture with Altera's OptiFLEX routing structure, balancing logic capacity, performance, and cost. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside CPLDs and anti-fuse devices, and are used wherever high gate counts, fast time-to-market, or field-upgradable logic are required.
Key features include a 5.0V core voltage, 3.3V I/O compatibility option, in-system programmability via JTAG, and support for PCI, PCI-X, and other standard I/O interfaces. The 256-BBGA package provides a compact footprint and supports high-density board designs. The 218 I/O count, combined with 1,960 logic cells, allows designers to integrate multiple glue-logic functions, state machines, and bus controllers into a single device.
Architecturally, the EPF6024A employs a SRAM-based configuration memory, fast-row interconnect (OptiFLEX), and dedicated carry chains for arithmetic. The LUT-based logic cells (LEs) deliver predictable timing through fast deterministic interconnect paths. Configuration is loaded from a serial EPROM, JTAG, or microcontroller on power-up, allowing design changes to be made at any time.
Typical applications include telecommunications line cards, industrial control boards, prototype gate-array replacement, PCI/PCI-X bus bridges, and embedded control logic. The part's 5.0V tolerance also makes it attractive for legacy designs migrating from discrete TTL.
When designing with this part, note that the FLEX 6000 family is no longer recommended for new designs - the device is in NRND/EOL status with limited inventory. Designers should evaluate Altera/Intel MAX series or Cyclone family for new designs and use EPF6024ABC256-1 only when matching existing hardware.
This page synthesizes distributor inventory, same-family FLEX 6000 drop-in alternatives, lifecycle observations, and practical design considerations not consolidated on the manufacturer datasheet.
Drop-in alternatives for EPF6024ABC256-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ABC256-1 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Mounting Type, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ABC256-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF6024ABC256-2N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6024ABC256-3
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →EPF6024ABC256-1 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Equivalent Gate Count | 24,000 |
| Number of LABs/CLBs | 196 |
| Number of User I/Os | 218 |
| Core Voltage | 5.0 V |
| I/O Voltage | 5.0 V / 3.3 V |
| Maximum Operating Frequency | 142.86 MHz |
| Package | 256-BBGA |
| Package Code | BGA |
| Package Shape | SQUARE |
| Number of Terminals | 256 |
| Form of Terminal | BALL |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | OTHER (commercial) |
EPF6024ABC256-1 square Pin Configuration Guide
Pin configuration for EPF6024ABC256-1 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024ABC256-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024ABC256-1 is suitable for 6 applications: PCI/PCI-X Bus Bridge and Glue Logic, Telecommunications Line Card Interface Logic, Industrial Control and Factory Automation Logic, Prototype Gate-Array Replacement, Legacy Computing Backplane and Peripheral Logic, Test Equipment and Instrumentation Custom Logic.
PCI/PCI-X Bus Bridge and Glue Logic
The EPF6024ABC256-1's 218 user I/Os and dedicated 5.0V PCI I/O standards make it well-suited for legacy PCI and PCI-X bus bridge designs common in industrial and telecom line cards. With 1,960 logic cells and 196 LABs, the device can host a 32-bit/33 MHz PCI target or master controller plus surrounding glue logic (address decoding, wait-state generation, interrupt controllers) in a single chip. The 142.86 MHz internal Fmax easily meets 33 MHz PCI timing budgets with margin. Unlike CPLDs, this FLEX 6000 device provides enough logic capacity to implement both bus bridge and protocol translation logic on one part, reducing board area. The 256-BGA footprint supports high-density boards where 218 signals must be routed.
Recommended
Telecommunications Line Card Interface Logic
In telecom line cards (T1/E1, ISDN, early DSLAM), the EPF6024ABC256-1 integrates HDLC controllers, framer interfaces, time-slot interchangers, and bus arbitration logic. The 24K equivalent gates provide enough headroom for a multi-channel HDLC engine plus TDM bus switching fabric. Its 5.0V core tolerance matches legacy telecom backplane supplies, and the 218 I/Os support multi-drop TDM buses and parallel datapath connections to network processors. The OptiFLEX interconnect delivers deterministic timing for synchronous TDM streams, and SRAM-based configuration allows late-stage design changes during carrier qualification.
Recommended
Industrial Control and Factory Automation Logic
Factory automation controllers use the EPF6024ABC256-1 to implement custom PLC instruction sets, motor-control state machines, encoder interfaces, and fieldbus (Profibus, CANopen) glue logic. The 218 I/Os connect directly to discrete sensors, relays, and quadrature encoders without external bus expanders. The 1,960-cell capacity supports complete motion-control algorithms (PID loops, trapezoidal profiles) for 2-3 axis machines in a single device. The 5.0V tolerance accepts 24V-sensor signals after simple resistive dividers. Configuration can be loaded from parallel EPROM for deterministic power-on startup in safety-relevant machinery.
Recommended
Prototype Gate-Array Replacement
The FLEX 6000 family was specifically designed as a low-cost programmable alternative to high-volume gate arrays, and the EPF6024ABC256-1 is a typical 24K-gate choice for prototyping mask-programmed gate arrays. Designers use it to validate logic, develop firmware, and pre-qualify boards before committing to NRE-funded gate-array tooling. The 256-BGA package and 218 I/Os match typical gate-array pad-ring configurations, allowing pin-compatible conversion. In-system programmability via JTAG enables rapid iteration during prototyping. Once the design stabilizes, the same RTL can be migrated to a HardCopy or structured ASIC for volume production.
Recommended
Legacy Computing Backplane and Peripheral Logic
VME, ISA, and early PCI bus peripherals use the EPF6024ABC256-1 to implement bus interface controllers, DMA engines, and interrupt arbiters. The 5.0V tolerance matches VME backplane signal levels, and the 218 I/Os accommodate wide parallel buses plus sideband control signals. With 1,960 logic cells, designers integrate complete bus master controllers plus on-board memory controllers in one device. The OptiFLEX routing provides deterministic timing for bus-cycle-critical paths. Designers use SRAM-based configuration to support firmware updates across deployed fielded equipment without hardware rework.
Recommended
Test Equipment and Instrumentation Custom Logic
ATE (automatic test equipment) and bench-instrumentation designers use the EPF6024ABC256-1 to implement custom pattern generators, timing generators, and protocol-aware measurement engines. The 218 I/Os support multi-channel parallel stimulus/response interfaces, and the 1,960-cell capacity accommodates complete timing-state machines plus result-capture FIFOs. The 142.86 MHz internal frequency supports pattern rates up to 100 MHz in pipelined designs. SRAM-based reconfigurability lets engineers update test patterns for new DUTs without board changes. The 256-BGA package provides the mechanical robustness required for production ATE environments.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ABC256-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ABC256-2 | EPF6024ABC256-2N | EPF6024ABC256-3 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 256-BBGA | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Speed Grade | -1 (slowest) | -2 (medium) | -2 (medium) | -3 (fastest) |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 |
| Equivalent Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| User I/Os | 218 | 218 | 218 | 218 |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
Key Differentiators
- Slowest speed grade gives lowest cost in FLEX 6000 family (vs EPF6024ABC256-3)
- Lead-free / RoHS-compliant 256-BGA drop-in option (vs EPF6024ABC256-2)
- Same die and logic capacity across all 256-BGA speed grades (vs EPF6016BC256-3)
Design Notes
The FLEX 6000 EPF6024ABC256-1 requires a stable 5.0V VCCINT supply; ripple should be held below 100 mV peak-peak to avoid configuration-memory corruption. Each VCCINT and VCCIO pin must be decoupled with a 0.1 uF ceramic capacitor placed within 5 mm of the package ball, plus a bulk 10 uF tantalum per supply rail. Estimated: with 218 I/Os switching at 33 MHz, total dynamic current can exceed 500 mA; verify with the FLEX 6000 PowerPlay estimator in MAX+PLUS II.
The 256-BGA package requires a 1.27 mm pitch land pattern with NSMD (non-solder mask defined) pads for reliable assembly. All BGA balls should be X-ray inspected post-reflow to confirm coplanarity and joint integrity. Use at least 6 ground balls and 4 VCCINT balls distributed around the package to minimize inductance; place decoupling capacitors on the opposite PCB layer directly under their respective BGA balls via short vias.
Common pitfalls when designing with the EPF6024ABC256-1 include: (1) failing to hold nCONFIG low during power-up until VCCINT is stable - this prevents partial configuration corruption; (2) mixing 5.0V and 3.3V I/O banks without proper VCCIO isolation - I/O banks are independent but adjacent pins share ESD protection; (3) omitting CONF_DONE pull-up, which can leave the FPGA in an undefined state if the configuration EPROM is missing; (4) using JTAG during in-system programming without isolating the MSEL pins.
Route all 218 user I/Os with 50 ohm controlled impedance if any signal exceeds 50 MHz; slower signals may use 75 ohm. Match trace lengths within each bus to within 1 mm (PCI) or 5 mm (general-purpose) to avoid skew. Keep configuration (nCONFIG, nSTATUS, CONF_DONE, DCLK) traces short and away from switching I/O to prevent crosstalk during configuration. Use a separate ground pour under the BGA and stitch with vias every 5 mm.
Compliance Information
Compliance status not present in verified web data; the EPF6024ABC256-2N 'N' suffix typically indicates lead-free/RoHS on Altera FLEX 6000 family, but the standard -1 part lacks this suffix. AEC-Q100 not applicable (FPGAs are not AEC-Q100 qualified in this family).
