EPF6024ABC256-3 - FLEX 6000 FPGA, 24K Gates, 256-BGA | Altera
MPN: EPF6024ABC256-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.75 | $20,750.00 |
EPF6024ABC256-3 Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit in the hierarchy: PLD -> FPGA -> SRAM-based FPGA -> FLEX 6000 family -> low-cost programmable logic, offering an alternative to gate arrays and ASICs for medium-volume designs. The FLEX 6000 series was Altera's first SRAM-based family targeting low-cost, high-volume applications previously served by masked gate arrays.
Key features include 196 Logic Array Blocks (LABs) with Embedded System Blocks (ESBs) for memory, 4 phases of delay-locked loop (DLL) for clock skew management, multiVolt I/O supporting 3.3 V and 5.0 V mixed-voltage systems, and in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface. The device supports JTAG-based configuration and the Altera EPC configuration devices for serial/parallel loading of the SRAM configuration memory.
Architecturally, the EPF6024ABC256-3 uses a continuous SRAM configuration cell powered by a 0.42 µm four-layer-metal CMOS process. Each LAB contains 10 Logic Elements (LEs), each LE implementing a 4-input look-up table (LUT), a programmable flip-flop, and dedicated carry and cascade chains. This LUT-based fabric provides fast, predictable combinational and sequential logic with deterministic timing.
Typical applications include glue logic, bus interfaces, peripheral controllers, telecommunications glue, industrial control, and prototyping of gate-array designs. It was widely adopted as a low-cost programmable alternative to high-volume gate-array applications and allows fast design changes during prototyping or design testing.
When designing with this device, ensure adequate decoupling on all VCCINT and VCCIO pins and follow the IBIS models for signal-integrity simulations. Designers should also note that the FLEX 6000 family has reached end-of-life and is no longer recommended for new designs — consider Cyclone or MAX series for new projects.
This page synthesizes distributor pricing, drop-in FLEX 6000 alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF6024ABC256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ABC256-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Method, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ABC256-2N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6024ABC256-1
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPF6016BC256-3
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →EPF6016BC256-3N
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6016BC256-2
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EPF6016AFC256-3
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016AFC256-2
✅ Drop-In✓ In Stock
$33.05 / Unit
View Datasheet →EPF6024ABC256-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gates | 24,000 |
| Logic Cells | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 218 |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 3.3 V or 5.0 V (multiVolt) |
| Process Technology | 0.42 µm CMOS, 4-layer metal |
| Internal Frequency (max) | 142.86 MHz |
| Package | 256-BBGA (Ball Grid Array) |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Configuration | SRAM-based, JTAG (IEEE 1149.1) and EPC device serial/parallel |
| Speed Grade | -3 |
EPF6024ABC256-3 256-bbga (ball grid array) Pin Configuration Guide
Pin configuration for EPF6024ABC256-3 (256-bbga (ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024ABC256-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024ABC256-3 is suitable for 6 applications: Glue Logic Replacement, Bus Interface Bridge, Telecommunications Glue, Industrial Control Logic, Gate-Array Prototyping, Legacy System Sustainment.
Glue Logic Replacement
The EPF6024ABC256-3 fits glue-logic replacement because its 24,000 typical gates and 1,960 logic cells implement dense combinational/sequential functions previously served by multiple 74-series TTL chips. The 218 user I/Os in a 256-BBGA footprint absorb wide bus and control signals; designers route the FPGA as a single IC replacing dozens of discrete logic packages. The 3.3 V core and multiVolt I/O let it bridge 3.3 V processors with 5.0 V peripherals without external level shifters. Trade-off vs discrete logic: the SRAM configuration requires an EPC configuration device or JTAG loader at every power-up.
Recommended
Bus Interface Bridge
The EPF6024ABC256-3 serves as a bus-interface bridge (PCI to local bus, ISA to memory-mapped peripherals) because its 218 I/Os and fast carry chains handle wide parallel buses at 33-66 MHz. The FLEX 6000 LUT-based fabric implements state machines for bus arbitration and DMA control in a single chip. The 142.86 MHz internal frequency is comfortable for 66 MHz PCI and PC-card interfaces; for higher-speed buses the -2 or -1 speed grade (drop-in compatible in the same 256-BBGA footprint) should be selected.
Recommended
Telecommunications Glue
The EPF6024ABC256-3 fits telecommunications glue logic — channelized framing, HDLC controllers, and serial-to-parallel converters — because 24K gates provide enough headroom for multi-channel state machines and small FIFOs in FLEX 6000 ESBs. The 0-85 °C commercial temperature range supports central-office deployments; the 3.3 V core simplifies power design for telecom backplanes. Trade-off vs ASIC: higher per-unit cost, but design changes are free of NRE charges.
Recommended
Industrial Control Logic
The EPF6024ABC256-3 suits industrial-control logic where PLC-style sequential control, motor-control glue, and sensor-fusion pre-processing must be re-programmed per application. The 218 I/Os drive many optocoupler-isolated inputs and relay-driver outputs in a single FPGA; the 256-BBGA provides strong thermal performance for continuous 24/7 industrial duty. Designers appreciate the in-system JTAG re-programmability for firmware updates over the equipment lifetime.
Recommended
Gate-Array Prototyping
The EPF6024ABC256-3 was originally positioned by Altera as a low-cost programmable alternative to high-volume gate arrays, enabling prototyping of masked gate-array designs. Designers port a planned gate-array netlist into FLEX 6000 logic to validate system behavior in silicon before committing to mask NRE; once the design is frozen, it can be migrated to a lower-cost gate array for volume production. The 1,960-cell capacity approximates a small-to-medium gate array, and JTAG configuration accelerates design-iteration cycles.
Recommended
Legacy System Sustainment
The EPF6024ABC256-3 is used to sustain fielded legacy equipment where the original FPGA failed and a pin-compatible replacement is required. Defense, aerospace, medical, and industrial-control systems designed in the late 1990s often contain this device; the 256-BBGA footprint allows drop-in board replacement with the same -3, -2N, or -1 speed grade. For long-life sustainment programs, stocking multiple speed grades of this part ensures repair availability for decades.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ABC256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ABC256-2N | EPF6024ABC256-1 | EPF6016BC256-3 | EPF6016BC256-3N | EPF6016BC256-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-BBGA | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 16,000 (-33%) | 16,000 (-33%) | 16,000 (-33%) |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,320 (-33%) | 1,320 (-33%) | 1,320 (-33%) |
| User I/Os | 218 | 218 | 218 | 218 | 218 | 218 |
| Speed Grade | -3 (slowest) | -2N (faster) | -1 (fastest) | -3 (slowest) | -3N (commercial lead-free) | -2 (faster) |
| Supply Voltage | 3.3 V (multiVolt I/O 3.3/5.0 V) | 3.3 V (multiVolt I/O) | 3.3 V (multiVolt I/O) | 3.3 V (multiVolt I/O) | 3.3 V (multiVolt I/O) | 3.3 V (multiVolt I/O) |
| Max Internal Frequency | 142.86 MHz | Higher (faster grade) | Highest (-1 grade) | 142.86 MHz | 142.86 MHz | Higher (faster grade) |
Key Differentiators
- Highest-density FLEX 6000 in 256-BBGA package (vs EPF6016BC256-3)
- Identical package across speed grades (vs EPF6024ABC256-2N)
- Largest I/O count in FLEX 6000 family (vs EPF6024AQC208-3)
Design Notes
The EPF6024ABC256-3 requires VCCINT (3.3 V core) and VCCIO (3.3 V or 5.0 V I/O) rails with decoupling on every supply ball. Place 0.1 µF ceramic capacitors within 100 mils of each VCCINT/VCCIO ball, plus bulk 10-100 µF tantalum capacitors on the supply planes. During configuration (before CONF_DONE asserts), the device draws a higher inrush current — size the EPC configuration device regulator to handle the worst-case transient. Reference: Altera FLEX 6000 datasheet, Application Note 74 (Power Sequencing & Decoupling).
Estimated: at VCCINT = 3.3 V and 80% logic utilization with 100 MHz toggle, the EPF6024ABC256-3 dissipates approximately 0.5-1.0 W. The 256-BBGA package provides adequate thermal dissipation for commercial (0 to +85 °C) applications without external heatsinks. Designers should still provide a continuous ground plane beneath the BGA to spread heat and improve signal integrity.
The 256-BBGA uses a 1.0 mm ball pitch requiring 0.5-0.6 mm via-in-pad or dog-bone fanout. Use 4-layer or 6-layer PCB stackup with continuous ground and power planes directly beneath the BGA. Match trace impedance to 50 Ω single-ended / 100 Ω differential per the IBIS model. Keep high-speed clock traces short and length-matched; route JTAG (TCK/TMS/TDO/TDI) with 4.7 kΩ pull-ups on TCK/TMS and TDI as recommended.
Three common pitfalls: (1) Forgetting that FLEX 6000 is SRAM-based — without an EPC configuration device or JTAG bootloader, the FPGA remains unconfigured at power-up and outputs random state; (2) Mixing VCCIO voltage rails — VCCIO must be supplied to all dedicated I/O voltage balls, not just user I/O banks, or I/O behavior is undefined; (3) Ignoring the -3 speed grade timing — designs targeting >50 MHz state machines must use -2 or -1 grade (drop-in compatible).
Compliance Information
Compliance status not stated in the verified web data — FLEX 6000 family predates many modern compliance declarations. Mark as unknown until confirmed against manufacturer documentation.
