EPF6016BC256-3 - 16K Gates FLEX 6000 FPGA, 256-BGA | Intel
MPN: EPF6016BC256-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.1 | $17,100.00 |
EPF6016BC256-3 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing, and I/O cells that the user can define after manufacture via a configuration bitstream. FPGAs sit between simple PLDs/CPLDs (limited logic, deterministic timing) and ASICs (high NRE, long lead time). The FLEX 6000 family in particular targets cost-sensitive, high-volume applications such as consumer electronics, communications glue logic, and peripheral bridging - offering ASIC-like integration with the fast time-to-market of programmable logic.
Key features of the EPF6016BC256-3 include a maximum internal frequency of 172 MHz (per the FLEX 6000 family datasheet), 5.0 V core supply operation, in-system programmability via an SRAM configuration cell, and JTAG-compliant boundary-scan test support (IEEE 1149.1). The 256-pin FineLine BGA offers high board-routing density with 204 usable I/Os - well above comparable 100-pin and 144-pin FLEX 6000 variants, enabling direct parallel-bus and 32-bit datapath interfaces.
The architecture combines four-input look-up tables (LUTs) with fast interconnect and embedded memory, providing deterministic timing across commercial (0 °C to 85 °C) operating conditions. Designers can choose between Verilog HDL, VHDL, or schematic entry using the Altera/Intel Quartus II (or legacy MAX+PLUS II) design environments, with support for IP cores including UARTs, FIFOs, and PCI bridges.
Typical applications include peripheral bridging (e.g., ISA-to-PCI, 8-bit/16-bit microprocessor bus expansion), industrial control glue logic, telecommunications backplane multiplexing, and consumer-electronics I/O expansion. The 5 V I/O tolerance allows direct connection to legacy logic without level shifters.
When designing with this device, ensure the configuration mode (PS, PPS, JTAG, or serial) is selected correctly and that the 5 V core and I/O supplies are properly decoupled. The FineLine BGA-256 package requires careful PCB layout: matched-length traces to the configuration pins and a solid ground plane under the device are mandatory for clean signal integrity at the rated 172 MHz internal frequency.
Drop-in alternatives for EPF6016BC256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016BC256-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Internal Frequency (max), User I/Os.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016BC256-3N
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6016BC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10.85 / Unit
View Datasheet →EPF6024BC256-3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF6016AFC256-3
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016BC256-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements (typical) | 1,320 cells |
| Usable Gates | 16,000 gates |
| User I/O Pins | 204 |
| Maximum Internal Frequency | 172 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 5.0 V |
| I/O Standard | 5.0 V TTL/CMOS |
| Package | 256-ball FineLine BGA |
| Pin Count | 256 |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Configuration | SRAM, in-system programmable |
| Boundary Scan | JTAG IEEE 1149.1 |
| Mounting Type | Surface Mount |
EPF6016BC256-3 256-ball fineline bga Pin Configuration Guide
Pin configuration for EPF6016BC256-3 (256-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016BC256-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016BC256-3 is suitable for 6 applications: Peripheral Bus Bridging (ISA-to-PCI), Industrial Control Glue Logic, Telecommunications Backplane Multiplexing, Consumer Electronics I/O Expansion, Microprocessor Bus Expansion (8/16/32-bit), Test & Measurement Front-End Logic.
Peripheral Bus Bridging (ISA-to-PCI)
The EPF6016BC256-3 is well suited to ISA-to-PCI bridge designs where 16,000 usable gates and 204 user I/Os in a 256-BGA provide enough logic for address decoding, data-path multiplexing, and bus arbitration. The 5 V tolerant I/O connects directly to legacy ISA buses without level shifters, while 1320 logic elements comfortably implement 32-bit datapath state machines and FIFO glue. Per the FLEX 6000 family datasheet, the 172 MHz internal frequency supports 33 MHz PCI clock with margin, and JTAG 1149.1 boundary scan simplifies board test.
Recommended
Industrial Control Glue Logic
Industrial controllers often need custom glue logic to merge sensor arrays, parallel ADCs, and actuator drivers - exactly the use case for the EPF6016BC256-3. With 204 user I/Os the device can scan up to 25 8-bit input registers in a single chip, and 1320 logic elements are enough to debounce, filter, and protocol-encode multiple I/O banks concurrently. The commercial 0-85 °C operating range suits factory-floor enclosures, and 5 V TTL/CMOS I/O drives opto-isolators and relay coils directly. Per the FLEX 6000 datasheet, in-system SRAM programmability enables field firmware updates via JTAG without board removal.
Recommended
Telecommunications Backplane Multiplexing
Telecom backplanes aggregate multiple low-speed serial streams onto higher-speed buses, requiring large I/O counts and deterministic logic timing. The EPF6016BC256-3 provides 204 I/Os to demultiplex T1/E1 framers or parallel LVDS links, while the FLEX 6000's fast interconnect delivers predictable fMAX around the 172 MHz internal clock. JTAG boundary-scan simplifies in-system test on dense backplane cards where probe access is limited. The 256-ball FineLine BGA package keeps trace lengths short for clean signal integrity at 50-100 MHz I/O rates.
Recommended
Consumer Electronics I/O Expansion
Set-top boxes, DVD recorders, and printer controllers often need a high-I/O programmable logic device to glue MPEG decoders, memory buses, and front-panel keypads. The EPF6016BC256-3's 204 user I/Os are ideal for parallel ATA/ATAPI interfaces, IDE drives, and parallel SDRAM controllers, while 1320 logic elements handle DMA engines and bus-arbitration state machines. Per the FLEX 6000 datasheet, the SRAM-based configuration cell lets manufacturers ship field-upgradable firmware - critical for consumer products with long support lifetimes.
Recommended
Microprocessor Bus Expansion (8/16/32-bit)
The EPF6016BC256-3 serves as a flexible address decoder and bus multiplexer for legacy 8-bit (8051), 16-bit (80186), and 32-bit (ARM7) microprocessor systems. Its 5 V tolerant I/O interfaces directly with these legacy MCUs without level shifters, and 16,000 usable gates are sufficient to implement bank-switching, wait-state generators, and interrupt controllers on a single chip. The 256-BGA package provides enough I/O for a full 32-bit address bus plus chip-select outputs for multiple memory banks. Per the FLEX 6000 datasheet, Quartus II design tools support free 8051 / 80186 IP cores.
Recommended
Test & Measurement Front-End Logic
Test instruments need fast, deterministic I/O routing between ADC/DAC arrays, FPGA co-processors, and host processors. The EPF6016BC256-3's 172 MHz internal frequency and 204 user I/Os are sufficient for routing 16-bit ADC data at 50 MSPS, generating timing/trigger signals, and multiplexing front-panel controls. Per the FLEX 6000 datasheet, JTAG boundary-scan simplifies bench characterization and production test, while in-system SRAM programmability allows late-stage design changes. The 256-BGA keeps trace lengths short for the analog-digital split ground plane needed in mixed-signal instruments.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016BC256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016BC256-3N | EPF6016BC256-2 | EPF6024BC256-3 | EPF6016AFC256-3 |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA | 256-ball FineLine BGA | 256-ball FineLine BGA | 256-ball FineLine BGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Usable Gates | 16,000 | 16,000 | 16,000 | 24,000 | 16,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,960 | 1,320 |
| Maximum User I/O | 204 | 204 | 204 | 218 | 204 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 (mid) | -3 (fastest) | -3 (fastest) |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +85 °C (industrial) |
| RoHS Compliance | Non-RoHS (SnPb balls) | RoHS (lead-free balls) | Non-RoHS | Non-RoHS | Non-RoHS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest user I/O count in the FLEX 6000 family BGA package (vs EPF6016ATC144-3 (144-pin TQFP))
- Fastest available speed grade in the FLEX 6000 family (vs EPF6016BC256-2 (speed grade -2))
- Drop-in 24K-gate upgrade path exists in same 256-BGA footprint (vs EPF6024BC256-3)
Design Notes
The 256-ball FineLine BGA uses 1.0 mm ball pitch; PCB pads must be non-solder-mask-defined (NSMD) for reliable joint formation per IPC-7351. Place a continuous ground plane directly under the device to provide low-inductance return paths for the high-speed I/O. Vias-in-pad are acceptable but must be filled and plated over to prevent solder wicking during reflow. Matched-length routing to JTAG TCK, TMS, TDI, TDO, and configuration pins (nSTATUS, CONF_DONE, nCONFIG) is critical because the FLEX 6000 SRAM-based configuration latches these signals at rising edges.
The EPF6016BC256-3 requires two supplies: VCCINT (5.0 V core) and VCCIO (5.0 V or 3.3 V I/O depending on bank configuration). Per the FLEX 6000 datasheet, decouple each supply pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, plus a 10 µF bulk tantalum or ceramic near the device. Power sequencing is not mandatory for FLEX 6000, but ensure VCCINT and VCCIO rise monotonically within 100 ms to avoid latch-up during power-up configuration. The device draws approximately 100-300 mA quiescent depending on logic utilization and clock frequency.
Common mistakes when migrating FLEX 6000 designs: (1) using the obsolete MAX+PLUS II software when Quartus II supports the device and provides better timing analysis; (2) forgetting that FLEX 6000 configuration data is volatile - the bitstream must be reloaded at every power-up from a PROM (e.g., EPC1 or EPC2) or via JTAG; (3) connecting the nCONFIG pin to a slow RC time constant - it must see a clean logic-low to logic-high transition; (4) assuming the 'N' suffix is a different speed grade - it only denotes lead-free finish, not different silicon.
Compliance Information
Standard EPF6016BC256-3 uses tin-lead BGA ball finish and is NOT RoHS compliant. For RoHS-compliant designs use the EPF6016BC256-3N variant with lead-free ball finish. AEC-Q100 not applicable - FPGAs are not automotive-qualified logic devices.
