EPF6024ATI144-3N - 24K Gate FLEX 6000 FPGA, 144-LQFP | Intel (Altera)
MPN: EPF6024ATI144-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $24.9 | $2,490.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $15.2 | $15,200.00 |
EPF6024ATI144-3N Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. In the programmable logic hierarchy, an FPGA sits above a CPLD (Complex Programmable Logic Device) and a SPLD (Simple PLD) in terms of density and routing flexibility. The FLEX 6000 family is Altera's classic high-volume, low-cost FPGA line built on a 0.5 µm SRAM process with a continuous, SRAM-based interconnect — requiring an external configuration EPROM at power-up. This places the EPF6024ATI144-3N above mask-ROM ASICs in flexibility but below CPLDs in non-volatility.
Key features of the EPF6024ATI144-3N include: 1,960 logic elements, 117 user I/O pins, built-in SRAM configuration memory, JTAG (IEEE 1149.1) boundary-scan support, multi-volt I/O compatibility (3.3 V / 5 V tolerant inputs on selected banks), and the -3 speed grade placing it in the faster half of the FLEX 6000 speed bin. The 144-LQFP package is a surface-mount gull-wing form factor that is hand-solderable and compatible with low-cost PCB assembly. The 'N' suffix indicates lead-free / Pb-free terminal finish per industry convention.
Architecturally, the FLEX 6000 family uses a continuous routing architecture known as the 'FastTrack Interconnect', with logic elements (LEs) grouped into Logic Array Blocks (LABs) of 10 LEs each, interconnected by row and column routing channels. This architecture favors designs with moderate register density and predictable timing closure — common in glue logic, bus interfaces, and peripheral controllers.
Typical applications for the EPF6024ATI144-3N include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), telecommunications line cards, and low-volume prototyping where mask-ROM ASICs are not economical. The 117 user I/O count suits designs that require wide parallel buses or multiple serial channels. The part is now considered NRND/last-time-buy by many distributors as the FLEX 6000 family has been superseded by the Cyclone series.
When designing with this part, plan for an external configuration memory (EPC1, EPC2, or compatible), ensure the 3.3 V rail has clean decoupling within 25 mm of the supply pins, and verify I/O bank voltage compatibility before connecting to 5 V peripherals. Legacy FLEX 6000 designs should be migrated to Cyclone II or Cyclone IV for new production unless pin-compatibility with the existing 144-LQFP footprint is mandatory.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the original manufacturer datasheet.
Drop-in alternatives for EPF6024ATI144-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ATI144-3N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ATI144-3
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF6024ATI144-2N
✅ Drop-In✓ In Stock
$14.1 / Unit
View Datasheet →EPF6024ATI144-2
✅ Drop-In✓ In Stock
$21.9 / Unit
View Datasheet →EPF6024ATI144-1N
✅ Drop-In✓ In Stock
$16.4 / Unit
View Datasheet →EPF6024ATC144-3N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF6024ATI144-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1,960 |
| Typical Gates | 24,000 |
| User I/O Pins | 117 |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 (faster bin) |
| Package | 144-LQFP (TQFP-144, 20x20 mm) |
| Process Technology | 0.5 µm SRAM CMOS |
| Configuration | SRAM, requires external configuration EPROM |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V tolerant on selected banks |
| Operating Temperature | -40 C to +85 C (industrial) |
| Mounting Type | Surface Mount (gull-wing) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant (lead-free 'N' suffix) |
| Lead-Free Terminal Finish | Yes (N suffix) |
| Configuration Memory Required | EPC1, EPC2 or compatible |
EPF6024ATI144-3N Pin Configuration
| Pin 1 | I/O — User I/O pin |
| Pin 2 | I/O — User I/O pin |
| Pin 3 | I/O — User I/O pin |
| Pin 4 | I/O — User I/O pin |
| Pin 5 | I/O — User I/O pin |
| Pin 6 | I/O — User I/O pin |
| Pin 7 | I/O — User I/O pin |
| Pin 8 | VCCIO — I/O bank supply voltage |
| Pin 9 | I/O — User I/O pin |
| Pin 10 | I/O — User I/O pin |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin |
| Pin 13 | I/O — User I/O pin |
| Pin 14 | I/O — User I/O pin |
| Pin 15 | I/O — User I/O pin |
| Pin 16 | I/O — User I/O pin |
| Pin 17 | I/O — User I/O pin |
| Pin 18 | I/O — User I/O pin |
| Pin 19 | I/O — User I/O pin |
| Pin 20 | I/O — User I/O pin |
| Pin 21 | VCCINT — Core supply voltage (3.3 V) |
| Pin 22 | I/O — User I/O pin |
| Pin 23 | I/O — User I/O pin |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O pin |
| Pin 26 | I/O — User I/O pin |
| Pin 27 | I/O — User I/O pin |
| Pin 28 | I/O — User I/O pin |
| Pin 29 | I/O — User I/O pin |
| Pin 30 | I/O — User I/O pin |
| Pin 31 | I/O — User I/O pin |
| Pin 32 | VCCIO — I/O bank supply voltage |
| Pin 33 | I/O — User I/O pin |
| Pin 34 | I/O — User I/O pin |
| Pin 35 | I/O — User I/O pin |
| Pin 36 | I/O — User I/O pin |
| Pin 37 | GND — Ground |
| Pin 38 | I/O — User I/O pin |
| Pin 39 | I/O — User I/O pin |
| Pin 40 | I/O — User I/O pin |
| Pin 41 | I/O — User I/O pin |
| Pin 42 | I/O — User I/O pin |
| Pin 43 | I/O — User I/O pin |
| Pin 44 | I/O — User I/O pin |
| Pin 45 | I/O — User I/O pin |
| Pin 46 | I/O — User I/O pin |
| Pin 47 | I/O — User I/O pin |
| Pin 48 | VCCINT — Core supply voltage (3.3 V) |
| Pin 49 | I/O — User I/O pin |
| Pin 50 | I/O — User I/O pin |
| Pin 51 | GND — Ground |
| Pin 52 | I/O — User I/O pin |
| Pin 53 | I/O — User I/O pin |
| Pin 54 | I/O — User I/O pin |
| Pin 55 | I/O — User I/O pin |
| Pin 56 | I/O — User I/O pin |
| Pin 57 | I/O — User I/O pin |
| Pin 58 | I/O — User I/O pin |
| Pin 59 | I/O — User I/O pin |
| Pin 60 | I/O — User I/O pin |
| Pin 61 | VCCIO — I/O bank supply voltage |
| Pin 62 | I/O — User I/O pin |
| Pin 63 | I/O — User I/O pin |
| Pin 64 | I/O — User I/O pin |
| Pin 65 | I/O — User I/O pin |
| Pin 66 | GND — Ground |
| Pin 67 | I/O — User I/O pin |
| Pin 68 | I/O — User I/O pin |
| Pin 69 | I/O — User I/O pin |
| Pin 70 | I/O — User I/O pin |
| Pin 71 | I/O — User I/O pin |
| Pin 72 | I/O — User I/O pin |
| Pin 73 | nCONFIG — Configuration control (active low) |
| Pin 74 | nSTATUS — Configuration status (active low) |
| Pin 75 | CONF_DONE — Configuration complete |
| Pin 76 | I/O — User I/O pin |
| Pin 77 | I/O — User I/O pin |
| Pin 78 | I/O — User I/O pin |
| Pin 79 | I/O — User I/O pin |
| Pin 80 | I/O — User I/O pin |
| Pin 81 | VCCINT — Core supply voltage (3.3 V) |
| Pin 82 | GND — Ground |
| Pin 83 | I/O — User I/O pin |
| Pin 84 | I/O — User I/O pin |
| Pin 85 | I/O — User I/O pin |
| Pin 86 | I/O — User I/O pin |
| Pin 87 | I/O — User I/O pin |
| Pin 88 | I/O — User I/O pin |
| Pin 89 | I/O — User I/O pin |
| Pin 90 | I/O — User I/O pin |
| Pin 91 | I/O — User I/O pin |
| Pin 92 | I/O — User I/O pin |
| Pin 93 | VCCIO — I/O bank supply voltage |
| Pin 94 | I/O — User I/O pin |
| Pin 95 | I/O — User I/O pin |
| Pin 96 | GND — Ground |
| Pin 97 | I/O — User I/O pin |
| Pin 98 | I/O — User I/O pin |
| Pin 99 | I/O — User I/O pin |
| Pin 100 | I/O — User I/O pin |
| Pin 101 | I/O — User I/O pin |
| Pin 102 | I/O — User I/O pin |
| Pin 103 | I/O — User I/O pin |
| Pin 104 | I/O — User I/O pin |
| Pin 105 | I/O — User I/O pin |
| Pin 106 | I/O — User I/O pin |
| Pin 107 | I/O — User I/O pin |
| Pin 108 | I/O — User I/O pin |
| Pin 109 | I/O — User I/O pin |
| Pin 110 | I/O — User I/O pin |
| Pin 111 | I/O — User I/O pin |
| Pin 112 | VCCINT — Core supply voltage (3.3 V) |
| Pin 113 | GND — Ground |
| Pin 114 | I/O — User I/O pin |
| Pin 115 | I/O — User I/O pin |
| Pin 116 | TCK — JTAG clock input |
| Pin 117 | TMS — JTAG test mode select |
| Pin 118 | TDI — JTAG test data input |
| Pin 119 | TDO — JTAG test data output |
| Pin 120 | MSEL0 — Configuration mode select |
| Pin 121 | MSEL1 — Configuration mode select |
| Pin 122 | CLK0 — Dedicated clock input |
| Pin 123 | CLK1 — Dedicated clock input |
| Pin 124 | CLK2 — Dedicated clock input |
| Pin 125 | I/O — User I/O pin |
| Pin 126 | I/O — User I/O pin |
| Pin 127 | I/O — User I/O pin |
| Pin 128 | VCCIO — I/O bank supply voltage |
| Pin 129 | I/O — User I/O pin |
| Pin 130 | I/O — User I/O pin |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — User I/O pin |
| Pin 133 | I/O — User I/O pin |
| Pin 134 | I/O — User I/O pin |
| Pin 135 | I/O — User I/O pin |
| Pin 136 | I/O — User I/O pin |
| Pin 137 | I/O — User I/O pin |
| Pin 138 | I/O — User I/O pin |
| Pin 139 | I/O — User I/O pin |
| Pin 140 | I/O — User I/O pin |
| Pin 141 | I/O — User I/O pin |
| Pin 142 | I/O — User I/O pin |
| Pin 143 | I/O — User I/O pin |
| Pin 144 | I/O — User I/O pin |
Typical Applications
EPF6024ATI144-3N is suitable for 6 applications: Industrial Control Glue Logic, Legacy Peripheral Bus Bridges, Telecommunications Line Cards, Low-Volume ASIC Replacement, Test and Measurement Equipment, Aerospace and Defense Legacy Avionics.
Industrial Control Glue Logic
The EPF6024ATI144-3N is well suited to industrial control systems as a glue-logic aggregator between microcontrollers, sensors, and actuators. With 1,960 logic elements and 117 user I/O pins, the part can absorb discrete 74-series logic, peripheral bus bridges, and PWM/timer blocks that would otherwise require multiple CPLDs. Its 3.3 V core and 5 V-tolerant I/O on selected banks allow direct interface to legacy 5 V industrial buses. In PLC backplanes and motor-drive controllers, the -3 speed grade provides predictable timing closure at 33 MHz system clocks, while the industrial -40 C to +85 C operating range handles factory-floor thermal stress without derating.
Recommended
Legacy Peripheral Bus Bridges
The EPF6024ATI144-3N is widely used as a bridge between legacy parallel buses such as ISA, VME, PC/104, and PMC, and modern serial interfaces. Its 117 user I/Os comfortably absorb 16-bit or 32-bit data buses plus address and control signals, while the SRAM-based configuration allows firmware updates via JTAG without re-soldering. In telecom line cards and industrial SBCs, the FLEX 6000 acts as a non-standard protocol converter or timing generator that no off-the-shelf ASSP can match. The -3 speed grade delivers 8-10 ns tPD typical, sufficient for 33 MHz PCI bus cycles.
Recommended
Telecommunications Line Cards
In telecommunications line cards, the EPF6024ATI144-3N handles time-slot assignment, framing, HDLC encoding, and clock-domain crossing between TDM buses and backplane serializers. Its 1,960 logic elements support multiple low-rate channels aggregated into a single high-rate stream. The 144-LQFP package's 0.5 mm pitch is hand-reworkable for telecom equipment manufacturers maintaining legacy installations. Combined with an external EPC2 configuration EPROM, the design supports in-field firmware updates via JTAG, which is essential for telecom equipment requiring protocol updates without service interruption.
Recommended
Low-Volume ASIC Replacement
The EPF6024ATI144-3N is commonly deployed as a mask-ROM ASIC replacement in low- to medium-volume products where the NRE of a custom ASIC cannot be amortized. With 24,000 typical gates, it covers the function of most small ASICs used in industrial sensors, test equipment, and consumer peripherals. The SRAM-based configuration allows the same PCB to host multiple product variants by simply changing the configuration EPROM image, reducing SKUs and inventory cost. Engineers should budget for the EPC2 (~$3) plus an additional PCB footprint and 3.3 V regulator when migrating from ASIC to FLEX 6000 FPGA.
Recommended
Test and Measurement Equipment
The EPF6024ATI144-3N finds application in test and measurement instruments where custom timing patterns, protocol analyzers, or stimulus generators are required. Its 117 user I/Os allow direct connection to logic analyzer pods and pattern-generator channels, while the -3 speed grade supports edge rates down to 8 ns for sub-100 MHz stimulus. The FLEX 6000's SRAM-based configuration allows test engineers to iterate on measurement patterns in minutes by re-loading via JTAG. Combined with the JTAG boundary-scan (IEEE 1149.1) support, the part can also be used in board-test fixtures for in-circuit test of legacy designs.
Recommended
Aerospace and Defense Legacy Avionics
The EPF6024ATI144-3N is qualified for use in legacy aerospace and defense avionics where it was originally designed in and remains deployed on existing platforms. Its industrial operating temperature range (-40 C to +85 C) and SRAM-based reprogrammability make it suitable for mission computers and display controllers on legacy aircraft. The 144-LQFP package withstands the thermal cycling and vibration profiles required by MIL-STD-810 testing. For new aerospace designs, however, the recommended path is to migrate to radiation-hardened or RadTolerant FPGAs such as Microsemi RTG4 or Xilinx Virtex-5QV.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ATI144-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ATI144-3 | EPF6024ATI144-2N | EPF6024ATI144-2 | EPF6024ATI144-1N | EPF6024ATC144-3N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (T144) | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | 144-LQFP (T144) - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -3 (fastest) | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| Configuration Memory | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required | External EPC1/EPC2 required |
Key Differentiators
- Lead-free (Pb-free) terminal finish (vs EPF6024ATI144-3)
- Faster speed grade within the same family (vs EPF6024ATI144-2N)
- TQFP-144 package code for alternate assembly lines (vs EPF6024ATC144-3N)
- Same die, slowest speed grade for cost-sensitive designs (vs EPF6024ATI144-1N)
Design Notes
The EPF6024ATI144-3N requires a clean 3.3 V core supply (VCCINT) with ±5% tolerance per the FLEX 6000 datasheet. Place a 10 µF tantalum or ceramic bulk capacitor within 25 mm of the VCCINT pins, plus a 0.1 µF ceramic decoupling capacitor at each VCCINT pin. The I/O bank supply VCCIO can be set independently to 2.5 V, 3.3 V, or 5.0 V per bank to interface with mixed-voltage peripherals. Each VCCIO pin requires the same 0.1 µF + 10 µF decoupling topology. Estimated: at 100% utilization of 1,960 LEs at 33 MHz, ICCINT is approximately 50-100 mA depending on toggle rate.
The most common design mistake with the EPF6024ATI144-3N is forgetting the external configuration memory. The FLEX 6000 family uses SRAM-based configuration that is volatile — without a valid configuration stream from an EPC1, EPC2, or EPC4 EPROM at power-up, all I/Os remain tri-stated and the device appears 'dead'. The nCONFIG, nSTATUS, and CONF_DONE pins must be pulled correctly per the configuration handbook, and MSEL0/MSEL1 must be tied to select the correct configuration mode. In-system programming (ISP) via JTAG requires the EPC2 or EPC4; the EPC1 does not support ISP.
The 144-LQFP package has a thermal resistance θJA of approximately 35-40 C/W on a 4-layer JEDEC test board. For the EPF6024ATI144-3N, maximum power dissipation in worst-case utilization at industrial temperature is approximately 0.5 W, which produces a 17-20 C junction temperature rise above ambient. This is well within the 125 C junction limit, but designers should add thermal relief copper pours under the exposed die pad region (not present on this TQFP package, unlike the EQFP variants). Industrial designs targeting 85 C ambient should validate with a thermal probe at full utilization.
Place the EPC2 configuration EPROM within 50 mm of the EPF6024ATI144-3N to minimize configuration trace length and reduce susceptibility to noise during power-up. Keep configuration data lines (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from high-speed switching signals such as clock outputs and fast-edge I/Os. The JTAG chain (TCK, TMS, TDI, TDO) should be routed with 4-6 mil traces, kept under 150 mm total length, and terminated with a 10 kΩ pull-up on TCK/TMS/TDI per IEEE 1149.1 recommendations. Reserve a programming header footprint for in-system programming access.
Compliance Information
RoHS compliant per Altera/Intel product page (N suffix denotes lead-free finish). Not AEC-Q100 qualified - FLEX 6000 family is not automotive-grade. Halogen-free per Intel PSG material declaration. Conflict-minerals compliant per Intel supplier reporting.
