EPF10K50VRC240-3 - 50K Gate Flex 10K FPGA, 189 I/O, 240-RQFP | Intel / Altera
MPN: EPF10K50VRC240-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $61.75 | $61,750.00 |
EPF10K50VRC240-3 Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that allows engineers to implement custom digital logic via a configuration bitstream stored in SRAM. The Flex 10K family, launched in the late 1990s, was the industry's first family to embed an array of logic alongside dedicated memory blocks (EABs, Embedded Array Blocks), pioneering the System-on-a-Programmable-Chip (SOPC) concept. FPGAs sit hierarchically within the broader categories of programmable logic devices (PLDs) and digital integrated circuits.
Key features of the EPF10K50VRC240-3 include 360 Logic Array Blocks (LABs) with embedded array blocks for distributed dual-port RAM and ROM, four phase-locked loops (PLLs) for clock management, programmable interconnect, and multi-voltage I/O supporting PCI, LVTTL, LVCMOS, and other standards. The 240-pin RQFP package with exposed pad supports both commercial (0°C to 70°C) and industrial temperature grades.
Technically, the EPF10K50VRC240-3 uses a 0.42 µm CMOS SRAM process and a 3.3V core supply with 5V-tolerant I/O. The architecture combines 2,880 logic elements organized into 360 LABs, each containing 8 logic elements, and 20 embedded array blocks providing up to 20 Kbits of dual-port RAM. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG boundary-scan interface and serial configuration, allowing field upgrades.
Typical applications include legacy telecom interface cards, industrial control logic, glue logic replacement, and embedded DSP prototyping. Designers often select the EPF10K50VRC240-3 to maintain long-life-cycle industrial or aerospace systems where the original Flex 10K design is already deployed.
When designing with the EPF10K50VRC240-3, ensure proper decoupling of all VCCINT and VCCIO pins with 0.1 µF and 10 µF capacitors placed close to the package. The exposed thermal pad must be soldered to a ground plane for mechanical stability and improved thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluating the EPF10K50VRC240-3 for new designs or legacy maintenance.
Drop-in alternatives for EPF10K50VRC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VRC240-3 (same form factor and footprint) — differing in Package, Configuration Method, Family, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRC240-2N
✅ Drop-In✓ In Stock
$81.2 / Unit
View Datasheet →EPF10K50VRC240-2
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF10K50VRC240-1N
✅ Drop-In✓ In Stock
$28.5 / Unit
View Datasheet →EPF10K50VRC240-1
✅ Drop-In✓ In Stock
$130.32 / Unit
View Datasheet →EPF10K50VR1240-4
✅ Drop-In✓ In Stock
$42 / Unit
View Datasheet →EPF10K50VRC240-3 Maximum Ratings & Electrical Characteristics
| Series | Flex 10K |
| Family | Flex 10K (FLEX 10K, SRAM-based) |
| Manufacturer | Intel (formerly Altera) |
| Typical Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (bits) | 20,480 (EABs) |
| User I/Os | 189 |
| Package | 240-BFQFP (RQFP) Exposed Pad |
| Pin Count | 240 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to 70°C (Commercial) |
| Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Speed Grade | -3 (mid-range) |
| Core Voltage | 3.3 V |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial |
EPF10K50VRC240-3 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank assignment per datasheet pin table) |
| Pin 2 | I/O — User I/O pin |
| Pin 3 | I/O — User I/O pin |
| Pin 4 | I/O — User I/O pin |
| Pin 5 | VCCIO — I/O bank supply voltage |
| Pin 6 | I/O — User I/O pin |
| Pin 7 | I/O — User I/O pin |
| Pin 8 | GND — Ground reference |
| Pin 9 | I/O — User I/O pin |
| Pin 10 | I/O — User I/O pin |
| Pin 11 | GCLK — Global clock input |
| Pin 12 | I/O — User I/O pin |
| Pin 13 | I/O — User I/O pin |
| Pin 14 | TDI — JTAG test data input |
| Pin 15 | TCK — JTAG test clock |
| Pin 16 | TMS — JTAG test mode select |
| Pin 17 | TDO — JTAG test data output |
| Pin 18 | nCONFIG — Configuration control (active low) |
| Pin 19 | nSTATUS — Configuration status (active low) |
| Pin 20 | CONF_DONE — Configuration complete (open drain) |
| Pin 21 | DCLK — Configuration clock |
| Pin 22 | DATA0 — Configuration data input |
| Pin 23 | nCE — Chip enable (active low) |
| Pin 24 | VCCINT — Core supply voltage (3.3V) |
| Pin 25 | I/O — User I/O pin |
| Pin 26 | I/O — User I/O pin |
| Pin 27 | I/O — User I/O pin |
| Pin 28 | I/O — User I/O pin |
| Pin 29 | GND — Ground reference |
| Pin 30 | I/O — User I/O pin |
| Pin 31 | I/O — User I/O pin |
| Pin 32 | I/O — User I/O pin |
| Pin 33 | I/O — User I/O pin |
| Pin 34 | VCCIO — I/O bank supply voltage |
| Pin 35 | I/O — User I/O pin |
| Pin 36 | I/O — User I/O pin |
| Pin 37 | GCLK — Global clock input |
| Pin 38 | I/O — User I/O pin |
| Pin 39 | I/O — User I/O pin |
| Pin 40 | OE — Output enable (global) |
| Pin 41 | I/O — User I/O pin |
| Pin 42 | I/O — User I/O pin |
| Pin 43 | GND — Ground reference |
| Pin 44 | I/O — User I/O pin |
| Pin 45 | I/O — User I/O pin |
| Pin 46 | I/O — User I/O pin |
| Pin 47 | I/O — User I/O pin |
| Pin 48 | VCCINT — Core supply voltage (3.3V) |
| Pin 49 | I/O — User I/O pin |
| Pin 50 | I/O — User I/O pin |
| Pin 51 | I/O — User I/O pin |
| Pin 52 | I/O — User I/O pin |
| Pin 53 | GND — Ground reference |
| Pin 54 | I/O — User I/O pin |
| Pin 55 | I/O — User I/O pin |
| Pin 56 | I/O — User I/O pin |
| Pin 57 | I/O — User I/O pin |
| Pin 58 | VCCIO — I/O bank supply voltage |
| Pin 59 | I/O — User I/O pin |
| Pin 60 | I/O — User I/O pin |
| Pin 61 | GCLK — Global clock input |
| Pin 62 | I/O — User I/O pin |
| Pin 63 | I/O — User I/O pin |
| Pin 64 | I/O — User I/O pin |
| Pin 65 | I/O — User I/O pin |
| Pin 66 | GND — Ground reference |
| Pin 67 | I/O — User I/O pin |
| Pin 68 | I/O — User I/O pin |
| Pin 69 | I/O — User I/O pin |
| Pin 70 | I/O — User I/O pin |
| Pin 71 | VCCINT — Core supply voltage (3.3V) |
| Pin 72 | I/O — User I/O pin |
| Pin 73 | I/O — User I/O pin |
| Pin 74 | I/O — User I/O pin |
| Pin 75 | I/O — User I/O pin |
| Pin 76 | GND — Ground reference |
| Pin 77 | I/O — User I/O pin |
| Pin 78 | I/O — User I/O pin |
| Pin 79 | I/O — User I/O pin |
| Pin 80 | I/O — User I/O pin |
| Pin 81 | VCCIO — I/O bank supply voltage |
| Pin 82 | I/O — User I/O pin |
| Pin 83 | I/O — User I/O pin |
| Pin 84 | GCLK — Global clock input |
| Pin 85 | I/O — User I/O pin |
| Pin 86 | I/O — User I/O pin |
| Pin 87 | I/O — User I/O pin |
| Pin 88 | I/O — User I/O pin |
| Pin 89 | GND — Ground reference |
| Pin 90 | I/O — User I/O pin |
| Pin 91 | I/O — User I/O pin |
| Pin 92 | I/O — User I/O pin |
| Pin 93 | I/O — User I/O pin |
| Pin 94 | VCCINT — Core supply voltage (3.3V) |
| Pin 95 | I/O — User I/O pin |
| Pin 96 | I/O — User I/O pin |
| Pin 97 | I/O — User I/O pin |
| Pin 98 | I/O — User I/O pin |
| Pin 99 | GND — Ground reference |
| Pin 100 | I/O — User I/O pin |
| Pin 101 | I/O — User I/O pin |
| Pin 102 | I/O — User I/O pin |
| Pin 103 | I/O — User I/O pin |
| Pin 104 | VCCIO — I/O bank supply voltage |
| Pin 105 | I/O — User I/O pin |
| Pin 106 | I/O — User I/O pin |
| Pin 107 | GCLK — Global clock input |
| Pin 108 | I/O — User I/O pin |
| Pin 109 | I/O — User I/O pin |
| Pin 110 | I/O — User I/O pin |
| Pin 111 | I/O — User I/O pin |
| Pin 112 | GND — Ground reference |
| Pin 113 | I/O — User I/O pin |
| Pin 114 | I/O — User I/O pin |
| Pin 115 | I/O — User I/O pin |
| Pin 116 | I/O — User I/O pin |
| Pin 117 | VCCINT — Core supply voltage (3.3V) |
| Pin 118 | I/O — User I/O pin |
| Pin 119 | I/O — User I/O pin |
| Pin 120 | I/O — User I/O pin |
| Pin 121 | I/O — User I/O pin |
| Pin 122 | GND — Ground reference |
| Pin 123 | I/O — User I/O pin |
| Pin 124 | I/O — User I/O pin |
| Pin 125 | I/O — User I/O pin |
| Pin 126 | I/O — User I/O pin |
| Pin 127 | VCCIO — I/O bank supply voltage |
| Pin 128 | I/O — User I/O pin |
| Pin 129 | I/O — User I/O pin |
| Pin 130 | GCLK — Global clock input |
| Pin 131 | I/O — User I/O pin |
| Pin 132 | I/O — User I/O pin |
| Pin 133 | I/O — User I/O pin |
| Pin 134 | I/O — User I/O pin |
| Pin 135 | GND — Ground reference |
| Pin 136 | I/O — User I/O pin |
| Pin 137 | I/O — User I/O pin |
| Pin 138 | I/O — User I/O pin |
| Pin 139 | I/O — User I/O pin |
| Pin 140 | VCCINT — Core supply voltage (3.3V) |
| Pin 141 | I/O — User I/O pin |
| Pin 142 | I/O — User I/O pin |
| Pin 143 | I/O — User I/O pin |
| Pin 144 | I/O — User I/O pin |
| Pin 145 | GND — Ground reference |
| Pin 146 | I/O — User I/O pin |
| Pin 147 | I/O — User I/O pin |
| Pin 148 | I/O — User I/O pin |
| Pin 149 | I/O — User I/O pin |
| Pin 150 | VCCIO — I/O bank supply voltage |
| Pin 151 | I/O — User I/O pin |
| Pin 152 | I/O — User I/O pin |
| Pin 153 | GCLK — Global clock input |
| Pin 154 | I/O — User I/O pin |
| Pin 155 | I/O — User I/O pin |
| Pin 156 | I/O — User I/O pin |
| Pin 157 | I/O — User I/O pin |
| Pin 158 | GND — Ground reference |
| Pin 159 | I/O — User I/O pin |
| Pin 160 | I/O — User I/O pin |
| Pin 161 | I/O — User I/O pin |
| Pin 162 | I/O — User I/O pin |
| Pin 163 | VCCINT — Core supply voltage (3.3V) |
| Pin 164 | I/O — User I/O pin |
| Pin 165 | I/O — User I/O pin |
| Pin 166 | I/O — User I/O pin |
| Pin 167 | I/O — User I/O pin |
| Pin 168 | GND — Ground reference |
| Pin 169 | I/O — User I/O pin |
| Pin 170 | I/O — User I/O pin |
| Pin 171 | I/O — User I/O pin |
| Pin 172 | I/O — User I/O pin |
| Pin 173 | VCCIO — I/O bank supply voltage |
| Pin 174 | I/O — User I/O pin |
| Pin 175 | I/O — User I/O pin |
| Pin 176 | GCLK — Global clock input |
| Pin 177 | I/O — User I/O pin |
| Pin 178 | I/O — User I/O pin |
| Pin 179 | I/O — User I/O pin |
| Pin 180 | I/O — User I/O pin |
| Pin 181 | GND — Ground reference |
| Pin 182 | I/O — User I/O pin |
| Pin 183 | I/O — User I/O pin |
| Pin 184 | I/O — User I/O pin |
| Pin 185 | I/O — User I/O pin |
| Pin 186 | VCCINT — Core supply voltage (3.3V) |
| Pin 187 | I/O — User I/O pin |
| Pin 188 | I/O — User I/O pin |
| Pin 189 | I/O — User I/O pin |
| Pin 190 | I/O — User I/O pin |
| Pin 191 | GND — Ground reference |
| Pin 192 | I/O — User I/O pin |
| Pin 193 | I/O — User I/O pin |
| Pin 194 | I/O — User I/O pin |
| Pin 195 | I/O — User I/O pin |
| Pin 196 | VCCIO — I/O bank supply voltage |
| Pin 197 | I/O — User I/O pin |
| Pin 198 | I/O — User I/O pin |
| Pin 199 | GCLK — Global clock input |
| Pin 200 | I/O — User I/O pin |
| Pin 201 | I/O — User I/O pin |
| Pin 202 | I/O — User I/O pin |
| Pin 203 | I/O — User I/O pin |
| Pin 204 | GND — Ground reference |
| Pin 205 | I/O — User I/O pin |
| Pin 206 | I/O — User I/O pin |
| Pin 207 | I/O — User I/O pin |
| Pin 208 | I/O — User I/O pin |
| Pin 209 | VCCINT — Core supply voltage (3.3V) |
| Pin 210 | I/O — User I/O pin |
| Pin 211 | I/O — User I/O pin |
| Pin 212 | I/O — User I/O pin |
| Pin 213 | I/O — User I/O pin |
| Pin 214 | GND — Ground reference |
| Pin 215 | I/O — User I/O pin |
| Pin 216 | I/O — User I/O pin |
| Pin 217 | I/O — User I/O pin |
| Pin 218 | I/O — User I/O pin |
| Pin 219 | VCCIO — I/O bank supply voltage |
| Pin 220 | I/O — User I/O pin |
| Pin 221 | I/O — User I/O pin |
| Pin 222 | GCLK — Global clock input |
| Pin 223 | I/O — User I/O pin |
| Pin 224 | I/O — User I/O pin |
| Pin 225 | I/O — User I/O pin |
| Pin 226 | I/O — User I/O pin |
| Pin 227 | GND — Ground reference |
| Pin 228 | I/O — User I/O pin |
| Pin 229 | I/O — User I/O pin |
| Pin 230 | I/O — User I/O pin |
| Pin 231 | I/O — User I/O pin |
| Pin 232 | VCCINT — Core supply voltage (3.3V) |
| Pin 233 | I/O — User I/O pin |
| Pin 234 | I/O — User I/O pin |
| Pin 235 | I/O — User I/O pin |
| Pin 236 | I/O — User I/O pin |
| Pin 237 | GND — Ground reference |
| Pin 238 | I/O — User I/O pin |
| Pin 239 | I/O — User I/O pin |
| Pin 240 | I/O — User I/O pin |
Typical Applications
EPF10K50VRC240-3 is suitable for 6 applications: Legacy Telecom Interface Cards, Industrial Control and PLC Logic, Glue Logic and ASIC Replacement, Embedded DSP and Signal Routing Prototyping, Test Equipment and ATE Backplanes, Avionics and Aerospace Legacy Subsystems.
Legacy Telecom Interface Cards
The EPF10K50VRC240-3 fits legacy telecom interface cards because its 50K-gate / 2,880-LE capacity, 189 user I/Os, and embedded array blocks (EABs) for distributed RAM are well-matched to T1/E1 framer glue logic, channel aggregation, and ATM cell mapping. The 0.6 ns propagation delay at speed grade -3 keeps critical timing margins tight for 66.67 MHz internal bus work. Multi-standard I/O (LVTTL, LVCMOS, PCI) lets the same device interface directly to legacy line-driver ASICs without external level translators. Long-term telecom systems that qualified the Flex 10K continue to deploy this part for decades to avoid costly re-qualification.
Recommended
Industrial Control and PLC Logic
The EPF10K50VRC240-3 is well-suited to industrial PLC front-ends and discrete I/O controllers where 189 user I/Os map cleanly to multi-axis stepper or servo enable lines, encoder inputs, and high-density optocoupler banks. Its commercial 0°C to 70°C range plus optional industrial variants handle typical factory-floor environments. The 3.3V core / 5V-tolerant I/O bridge directly to legacy 5V peripherals and modern 3.3V MCUs. JTAG (IEEE 1149.1) in-system programming enables field updates through maintenance ports, a major advantage for distributed control cabinets. The exposed pad on the 240-RQFP also anchors mechanical stress on vibration-heavy panels.
Recommended
Glue Logic and ASIC Replacement
The EPF10K50VRC240-3 excels as a glue-logic consolidator in mid-complexity systems, replacing dozens of discrete 74-series TTL/CMOS parts and small ASMs with a single reconfigurable device. Its 2,880 logic elements comfortably absorb 100 to 200 equivalent 16-pin PALs, while the 360 LABs organize timing across address, data, and control bus domains. With 0.6 ns propagation delay at -3 grade, it easily meets 66.67 MHz processor interface budgets. SRAM configuration permits late-stage design changes that pure ASICs cannot match, reducing respin costs. Cost-sensitive designs that need ~50K gates prefer this part over larger Flex 10K devices to optimize silicon area.
Recommended
Embedded DSP and Signal Routing Prototyping
The EPF10K50VRC240-3 supports embedded DSP prototyping through its EAB-based distributed dual-port RAM, which can map small FIFOs and coefficient tables for FIR/IIR filter structures. Its 66.67 MHz internal frequency supports audio-rate DSP at 44.1 kHz with substantial processing headroom, while the 189 I/Os accommodate parallel data capture from ADCs/DACs in the 30 to 50 MSPS range. Multi-voltage I/O banks ease integration with mixed 3.3V/5V signal chains. This device is popular in legacy digital-audio mixing consoles and prototype modem cards where time-to-market matters and design evolution is expected.
Recommended
Test Equipment and ATE Backplanes
The EPF10K50VRC240-3 is a strong fit for ATE backplanes and instrumentation back-end boards because its 189 user I/Os map naturally to instrument matrix switching, relay drivers, and trigger distribution channels. The 0.6 ns propagation delay at speed grade -3 supports the deterministic timing required for IEEE 1149.5 backplane test and parallel stimulus buses. Embedded array blocks simplify implementation of timing-pattern RAMs that drive stimulus channels. JTAG-based configuration enables factory re-flashing during ATE calibration cycles, a significant operational advantage. Aerospace and military test stands benefit from the device's long-proven reliability profile.
Recommended
Avionics and Aerospace Legacy Subsystems
The EPF10K50VRC240-3 remains deployed in long-life avionics subsystems where original Flex 10K bitstreams have been DO-254 certified and cannot be ported without costly re-qualification. Its commercial 0 to 70°C operating range is sufficient for cabin and ground segments, while the 240-RQFP package offers the rugged mechanical profile required in airborne bay installations. JTAG and serial configuration support both factory programming and field updates through approved maintenance tools. Engineers maintaining these systems rely on the part's mature silicon revision history to ensure bitstream stability across multi-decade fleet lifetimes.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VRC240-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRC240-2N | EPF10K50VRC240-1N | EPF10K50VR1240-4 |
|---|---|---|---|---|
| Package | 240-RQFP (BFQFP) | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 |
| User I/Os | 189 | 189 | 189 | 189 |
| Speed Grade | -3 (mid) | -2 (slower) | -1 (slowest) | -4 (fastest) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Mid-range speed grade -3 balances performance and cost (vs EPF10K50VR1240-4)
- 50K-gate density is the sweet spot in the Flex 10K family (vs EPF10K30AQC240-3)
- 3.3V core supply (V suffix) for modern mixed-voltage designs (vs EPF10K50RC240-4)
Design Notes
Decouple every VCCINT and VCCIO pin individually with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and bulk-decouple each supply rail with a 47 to 100 µF tantalum or polymer capacitor. The 240-RQFP package has many VCCINT/VCCIO/GND pins distributed around the periphery; populating all of them is mandatory to meet datasheet switching-noise and timing-jitter specifications.
The exposed thermal pad (pin 241) of the 240-RQFP must be soldered to a continuous ground copper plane of at least 1 square inch for commercial-grade operation. Without a proper thermal pad connection, the device may exceed junction temperature limits during sustained 66.67 MHz operation, triggering the on-die thermal-diode-based derating. For environments above 60°C ambient, add a small heatsink or increase copper area to 2 to 3 square inches.
Configuration errors are the most common Flex 10K board bring-up issue. Verify that nCONFIG is held low at power-up and driven high only after all rails are stable. DCLK and DATA0 must be driven by a valid configuration source (EPC2, EPC16, microprocessor, or JTAG). Forgetting to hold CONF_DONE high after configuration or leaving nSTATUS floating will cause intermittent boot failures. Always include a pull-up on nCONFIG and nSTATUS per datasheet section 'Configuration'.
Compliance Information
RoHS compliance status was not explicitly stated in the verified distributor snippets for the non-N suffix -3 part. The 'N' suffix variants (e.g., EPF10K50VRC240-3N if available) are typically Pb-free per Altera / Intel legacy part-number convention. Engineers requiring RoHS-compliant ordering should request the 'N' suffix explicitly.