Intel

EPF10K50VRC240-3 - 50K Gate Flex 10K FPGA, 189 I/O, 240-RQFP | Intel / Altera

MPN: EPF10K50VRC240-3 ✗ End of Life
In Stock Ships in 1-3 business days
3.3 V Vdss 240-BFQFP (RQFP) Exposed Pad Package 66.67 MHz Speed 20,480 (EABs) Memory
From $61.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $95 $95.00
10 $85.5 $855.00
100 $76 $7,600.00
500 $68.4 $34,200.00
1,000 $61.75 $61,750.00
ℹ️ All prices are in USD

EPF10K50VRC240-3 Overview

The Intel / Altera EPF10K50VRC240-3 is a member of the classic Flex 10K FPGA family, delivering 50,000 typical gates and 2,880 logic elements in a 240-pin RQFP (BFQFP with exposed pad) package. It is built on a SRAM-based CMOS process and provides 189 user I/Os, 20,480 bits of embedded memory, and supports an internal frequency up to 66.67 MHz with up to 125 MHz performance grades.

An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that allows engineers to implement custom digital logic via a configuration bitstream stored in SRAM. The Flex 10K family, launched in the late 1990s, was the industry's first family to embed an array of logic alongside dedicated memory blocks (EABs, Embedded Array Blocks), pioneering the System-on-a-Programmable-Chip (SOPC) concept. FPGAs sit hierarchically within the broader categories of programmable logic devices (PLDs) and digital integrated circuits.

Key features of the EPF10K50VRC240-3 include 360 Logic Array Blocks (LABs) with embedded array blocks for distributed dual-port RAM and ROM, four phase-locked loops (PLLs) for clock management, programmable interconnect, and multi-voltage I/O supporting PCI, LVTTL, LVCMOS, and other standards. The 240-pin RQFP package with exposed pad supports both commercial (0°C to 70°C) and industrial temperature grades.

Technically, the EPF10K50VRC240-3 uses a 0.42 µm CMOS SRAM process and a 3.3V core supply with 5V-tolerant I/O. The architecture combines 2,880 logic elements organized into 360 LABs, each containing 8 logic elements, and 20 embedded array blocks providing up to 20 Kbits of dual-port RAM. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG boundary-scan interface and serial configuration, allowing field upgrades.

Typical applications include legacy telecom interface cards, industrial control logic, glue logic replacement, and embedded DSP prototyping. Designers often select the EPF10K50VRC240-3 to maintain long-life-cycle industrial or aerospace systems where the original Flex 10K design is already deployed.

When designing with the EPF10K50VRC240-3, ensure proper decoupling of all VCCINT and VCCIO pins with 0.1 µF and 10 µF capacitors placed close to the package. The exposed thermal pad must be soldered to a ground plane for mechanical stability and improved thermal performance.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluating the EPF10K50VRC240-3 for new designs or legacy maintenance.

Drop-in alternatives for EPF10K50VRC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K50VRC240-3 (same form factor and footprint) — differing in Package, Configuration Method, Family, Operating Temperature, Series.

Altera
Package: 240-BFQFP Exposed Pad
Configuration Method: SRAM, JTAG (ByteBlaster/BitBlaster)
Family: FLEX 10K Embedded Programmable Logic Device
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-RQFP Exposed Pad
Family: FLEX 10K
Operating Temperature: 0 °C to +70 °C (Commercial)
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-BFQFP Exposed Pad (RQFP)
Family: FLEX 10K
Operating Temperature: 0°C to +70°C (Commercial)
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-pin RQFP / HFQFP (exposed pad), gull-wing
Family: Flex 10K
Operating Temperature: 0 °C to +70 °C (commercial)
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-RQFP (BFQFP with exposed pad)
Configuration Method: Serial / JTAG / ByteBlaster
Family: FLEX 10K
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-RQFP (RQFP / Power QFP) with exposed pad
Configuration Method: SRAM, in-system programmable via JTAG / serial PROM
Family: FLEX 10K (Altera / Intel)
Compare with EPF10K50VRC240-3 →
Altera
Package: 240-pin RQFP (RQFP-240) with exposed pad
Configuration Method: SRAM, serial/parallel via EPC2/EPC8 PROM
Family: FLEX-10K
Compare with EPF10K50VRC240-3 →
Altera
Package: 240-BFQFP Exposed Pad (RQFP / RQFP-EP)
Family: FLEX-10K
Operating Temperature: 0 C to 70 C
Compare with EPF10K50VRC240-3 →
Intel
Package: 240-pin RQFP (Power Quad Flat Pack), exposed pad
Configuration Method: Serial (EPC2/EPC8) or JTAG
Family: FLEX 10K (Altera, now Intel)
Compare with EPF10K50VRC240-3 →
Altera
Package: 240-BFQFP / RQFP-240 with Exposed Pad
Configuration Method: SRAM, JTAG (IEEE 1149.1), EPC bootloader
Family: FLEX-10K
Compare with EPF10K50VRC240-3 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K50VRC240-2N

✅ Drop-In
Intel
📦 240-RQFP
FLEX 10K · FLEX 10KV (3.3 V core) · 2,880 · 360 · 50,000 · 20,480 · 4 · 189

✓ In Stock

$81.2 / Unit

View Datasheet →

EPF10K50VRC240-2

✅ Drop-In
Intel
📦 240-RQFP
Flex 10K · 2,880 · 50,000 · 20,480 · 360 · 189 · 125 MHz

✓ In Stock

$18.95 / Unit

View Datasheet →

EPF10K50VRC240-1N

✅ Drop-In
Intel
📦 240-RQFP
FLEX 10K · FLEX-10K® · 50,000 · 2,880 · 360 · 189 · 240 · 240-BFQFP Exposed Pad (RQFP)

✓ In Stock

$28.5 / Unit

View Datasheet →

EPF10K50VRC240-1

✅ Drop-In
Intel
📦 240-RQFP
FLEX 10K · 2,880 · 50,000 · 20,480 bits (189 Kb) · 274 (max) · 189 · 240-RQFP Exposed Pad · 240

✓ In Stock

$130.32 / Unit

View Datasheet →

EPF10K50VR1240-4

✅ Drop-In
Altera
📦 240-RQFP
FLEX 10K Embedded Programmable Logic Device · FLEX 10K (V-series, 5V core) · 20,480 · 2,880 · Yes (per family datasheet) · 240-BFQFP Exposed Pad · R1240 (240-pin BFQFP) · -4 (slowest in family)

✓ In Stock

$42 / Unit

View Datasheet →

EPF10K50VRC240-3 Maximum Ratings & Electrical Characteristics

Series Flex 10K
Family Flex 10K (FLEX 10K, SRAM-based)
Manufacturer Intel (formerly Altera)
Typical Gates 50,000
Logic Elements / Cells 2,880
Logic Array Blocks (LABs) 360
Embedded Memory (bits) 20,480 (EABs)
User I/Os 189
Package 240-BFQFP (RQFP) Exposed Pad
Pin Count 240
Mounting Type Surface Mount
Operating Temperature 0°C to 70°C (Commercial)
Internal Frequency 66.67 MHz
Propagation Delay 0.6 ns
Speed Grade -3 (mid-range)
Core Voltage 3.3 V
Configuration Method SRAM, JTAG (IEEE 1149.1), serial

EPF10K50VRC240-3 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O pin (bank assignment per datasheet pin table)
Pin 2 I/O — User I/O pin
Pin 3 I/O — User I/O pin
Pin 4 I/O — User I/O pin
Pin 5 VCCIO — I/O bank supply voltage
Pin 6 I/O — User I/O pin
Pin 7 I/O — User I/O pin
Pin 8 GND — Ground reference
Pin 9 I/O — User I/O pin
Pin 10 I/O — User I/O pin
Pin 11 GCLK — Global clock input
Pin 12 I/O — User I/O pin
Pin 13 I/O — User I/O pin
Pin 14 TDI — JTAG test data input
Pin 15 TCK — JTAG test clock
Pin 16 TMS — JTAG test mode select
Pin 17 TDO — JTAG test data output
Pin 18 nCONFIG — Configuration control (active low)
Pin 19 nSTATUS — Configuration status (active low)
Pin 20 CONF_DONE — Configuration complete (open drain)
Pin 21 DCLK — Configuration clock
Pin 22 DATA0 — Configuration data input
Pin 23 nCE — Chip enable (active low)
Pin 24 VCCINT — Core supply voltage (3.3V)
Pin 25 I/O — User I/O pin
Pin 26 I/O — User I/O pin
Pin 27 I/O — User I/O pin
Pin 28 I/O — User I/O pin
Pin 29 GND — Ground reference
Pin 30 I/O — User I/O pin
Pin 31 I/O — User I/O pin
Pin 32 I/O — User I/O pin
Pin 33 I/O — User I/O pin
Pin 34 VCCIO — I/O bank supply voltage
Pin 35 I/O — User I/O pin
Pin 36 I/O — User I/O pin
Pin 37 GCLK — Global clock input
Pin 38 I/O — User I/O pin
Pin 39 I/O — User I/O pin
Pin 40 OE — Output enable (global)
Pin 41 I/O — User I/O pin
Pin 42 I/O — User I/O pin
Pin 43 GND — Ground reference
Pin 44 I/O — User I/O pin
Pin 45 I/O — User I/O pin
Pin 46 I/O — User I/O pin
Pin 47 I/O — User I/O pin
Pin 48 VCCINT — Core supply voltage (3.3V)
Pin 49 I/O — User I/O pin
Pin 50 I/O — User I/O pin
Pin 51 I/O — User I/O pin
Pin 52 I/O — User I/O pin
Pin 53 GND — Ground reference
Pin 54 I/O — User I/O pin
Pin 55 I/O — User I/O pin
Pin 56 I/O — User I/O pin
Pin 57 I/O — User I/O pin
Pin 58 VCCIO — I/O bank supply voltage
Pin 59 I/O — User I/O pin
Pin 60 I/O — User I/O pin
Pin 61 GCLK — Global clock input
Pin 62 I/O — User I/O pin
Pin 63 I/O — User I/O pin
Pin 64 I/O — User I/O pin
Pin 65 I/O — User I/O pin
Pin 66 GND — Ground reference
Pin 67 I/O — User I/O pin
Pin 68 I/O — User I/O pin
Pin 69 I/O — User I/O pin
Pin 70 I/O — User I/O pin
Pin 71 VCCINT — Core supply voltage (3.3V)
Pin 72 I/O — User I/O pin
Pin 73 I/O — User I/O pin
Pin 74 I/O — User I/O pin
Pin 75 I/O — User I/O pin
Pin 76 GND — Ground reference
Pin 77 I/O — User I/O pin
Pin 78 I/O — User I/O pin
Pin 79 I/O — User I/O pin
Pin 80 I/O — User I/O pin
Pin 81 VCCIO — I/O bank supply voltage
Pin 82 I/O — User I/O pin
Pin 83 I/O — User I/O pin
Pin 84 GCLK — Global clock input
Pin 85 I/O — User I/O pin
Pin 86 I/O — User I/O pin
Pin 87 I/O — User I/O pin
Pin 88 I/O — User I/O pin
Pin 89 GND — Ground reference
Pin 90 I/O — User I/O pin
Pin 91 I/O — User I/O pin
Pin 92 I/O — User I/O pin
Pin 93 I/O — User I/O pin
Pin 94 VCCINT — Core supply voltage (3.3V)
Pin 95 I/O — User I/O pin
Pin 96 I/O — User I/O pin
Pin 97 I/O — User I/O pin
Pin 98 I/O — User I/O pin
Pin 99 GND — Ground reference
Pin 100 I/O — User I/O pin
Pin 101 I/O — User I/O pin
Pin 102 I/O — User I/O pin
Pin 103 I/O — User I/O pin
Pin 104 VCCIO — I/O bank supply voltage
Pin 105 I/O — User I/O pin
Pin 106 I/O — User I/O pin
Pin 107 GCLK — Global clock input
Pin 108 I/O — User I/O pin
Pin 109 I/O — User I/O pin
Pin 110 I/O — User I/O pin
Pin 111 I/O — User I/O pin
Pin 112 GND — Ground reference
Pin 113 I/O — User I/O pin
Pin 114 I/O — User I/O pin
Pin 115 I/O — User I/O pin
Pin 116 I/O — User I/O pin
Pin 117 VCCINT — Core supply voltage (3.3V)
Pin 118 I/O — User I/O pin
Pin 119 I/O — User I/O pin
Pin 120 I/O — User I/O pin
Pin 121 I/O — User I/O pin
Pin 122 GND — Ground reference
Pin 123 I/O — User I/O pin
Pin 124 I/O — User I/O pin
Pin 125 I/O — User I/O pin
Pin 126 I/O — User I/O pin
Pin 127 VCCIO — I/O bank supply voltage
Pin 128 I/O — User I/O pin
Pin 129 I/O — User I/O pin
Pin 130 GCLK — Global clock input
Pin 131 I/O — User I/O pin
Pin 132 I/O — User I/O pin
Pin 133 I/O — User I/O pin
Pin 134 I/O — User I/O pin
Pin 135 GND — Ground reference
Pin 136 I/O — User I/O pin
Pin 137 I/O — User I/O pin
Pin 138 I/O — User I/O pin
Pin 139 I/O — User I/O pin
Pin 140 VCCINT — Core supply voltage (3.3V)
Pin 141 I/O — User I/O pin
Pin 142 I/O — User I/O pin
Pin 143 I/O — User I/O pin
Pin 144 I/O — User I/O pin
Pin 145 GND — Ground reference
Pin 146 I/O — User I/O pin
Pin 147 I/O — User I/O pin
Pin 148 I/O — User I/O pin
Pin 149 I/O — User I/O pin
Pin 150 VCCIO — I/O bank supply voltage
Pin 151 I/O — User I/O pin
Pin 152 I/O — User I/O pin
Pin 153 GCLK — Global clock input
Pin 154 I/O — User I/O pin
Pin 155 I/O — User I/O pin
Pin 156 I/O — User I/O pin
Pin 157 I/O — User I/O pin
Pin 158 GND — Ground reference
Pin 159 I/O — User I/O pin
Pin 160 I/O — User I/O pin
Pin 161 I/O — User I/O pin
Pin 162 I/O — User I/O pin
Pin 163 VCCINT — Core supply voltage (3.3V)
Pin 164 I/O — User I/O pin
Pin 165 I/O — User I/O pin
Pin 166 I/O — User I/O pin
Pin 167 I/O — User I/O pin
Pin 168 GND — Ground reference
Pin 169 I/O — User I/O pin
Pin 170 I/O — User I/O pin
Pin 171 I/O — User I/O pin
Pin 172 I/O — User I/O pin
Pin 173 VCCIO — I/O bank supply voltage
Pin 174 I/O — User I/O pin
Pin 175 I/O — User I/O pin
Pin 176 GCLK — Global clock input
Pin 177 I/O — User I/O pin
Pin 178 I/O — User I/O pin
Pin 179 I/O — User I/O pin
Pin 180 I/O — User I/O pin
Pin 181 GND — Ground reference
Pin 182 I/O — User I/O pin
Pin 183 I/O — User I/O pin
Pin 184 I/O — User I/O pin
Pin 185 I/O — User I/O pin
Pin 186 VCCINT — Core supply voltage (3.3V)
Pin 187 I/O — User I/O pin
Pin 188 I/O — User I/O pin
Pin 189 I/O — User I/O pin
Pin 190 I/O — User I/O pin
Pin 191 GND — Ground reference
Pin 192 I/O — User I/O pin
Pin 193 I/O — User I/O pin
Pin 194 I/O — User I/O pin
Pin 195 I/O — User I/O pin
Pin 196 VCCIO — I/O bank supply voltage
Pin 197 I/O — User I/O pin
Pin 198 I/O — User I/O pin
Pin 199 GCLK — Global clock input
Pin 200 I/O — User I/O pin
Pin 201 I/O — User I/O pin
Pin 202 I/O — User I/O pin
Pin 203 I/O — User I/O pin
Pin 204 GND — Ground reference
Pin 205 I/O — User I/O pin
Pin 206 I/O — User I/O pin
Pin 207 I/O — User I/O pin
Pin 208 I/O — User I/O pin
Pin 209 VCCINT — Core supply voltage (3.3V)
Pin 210 I/O — User I/O pin
Pin 211 I/O — User I/O pin
Pin 212 I/O — User I/O pin
Pin 213 I/O — User I/O pin
Pin 214 GND — Ground reference
Pin 215 I/O — User I/O pin
Pin 216 I/O — User I/O pin
Pin 217 I/O — User I/O pin
Pin 218 I/O — User I/O pin
Pin 219 VCCIO — I/O bank supply voltage
Pin 220 I/O — User I/O pin
Pin 221 I/O — User I/O pin
Pin 222 GCLK — Global clock input
Pin 223 I/O — User I/O pin
Pin 224 I/O — User I/O pin
Pin 225 I/O — User I/O pin
Pin 226 I/O — User I/O pin
Pin 227 GND — Ground reference
Pin 228 I/O — User I/O pin
Pin 229 I/O — User I/O pin
Pin 230 I/O — User I/O pin
Pin 231 I/O — User I/O pin
Pin 232 VCCINT — Core supply voltage (3.3V)
Pin 233 I/O — User I/O pin
Pin 234 I/O — User I/O pin
Pin 235 I/O — User I/O pin
Pin 236 I/O — User I/O pin
Pin 237 GND — Ground reference
Pin 238 I/O — User I/O pin
Pin 239 I/O — User I/O pin
Pin 240 I/O — User I/O pin

Typical Applications

EPF10K50VRC240-3 is suitable for 6 applications: Legacy Telecom Interface Cards, Industrial Control and PLC Logic, Glue Logic and ASIC Replacement, Embedded DSP and Signal Routing Prototyping, Test Equipment and ATE Backplanes, Avionics and Aerospace Legacy Subsystems.

🌐

Legacy Telecom Interface Cards

The EPF10K50VRC240-3 fits legacy telecom interface cards because its 50K-gate / 2,880-LE capacity, 189 user I/Os, and embedded array blocks (EABs) for distributed RAM are well-matched to T1/E1 framer glue logic, channel aggregation, and ATM cell mapping. The 0.6 ns propagation delay at speed grade -3 keeps critical timing margins tight for 66.67 MHz internal bus work. Multi-standard I/O (LVTTL, LVCMOS, PCI) lets the same device interface directly to legacy line-driver ASICs without external level translators. Long-term telecom systems that qualified the Flex 10K continue to deploy this part for decades to avoid costly re-qualification.

🏭

Industrial Control and PLC Logic

The EPF10K50VRC240-3 is well-suited to industrial PLC front-ends and discrete I/O controllers where 189 user I/Os map cleanly to multi-axis stepper or servo enable lines, encoder inputs, and high-density optocoupler banks. Its commercial 0°C to 70°C range plus optional industrial variants handle typical factory-floor environments. The 3.3V core / 5V-tolerant I/O bridge directly to legacy 5V peripherals and modern 3.3V MCUs. JTAG (IEEE 1149.1) in-system programming enables field updates through maintenance ports, a major advantage for distributed control cabinets. The exposed pad on the 240-RQFP also anchors mechanical stress on vibration-heavy panels.

🔧

Glue Logic and ASIC Replacement

The EPF10K50VRC240-3 excels as a glue-logic consolidator in mid-complexity systems, replacing dozens of discrete 74-series TTL/CMOS parts and small ASMs with a single reconfigurable device. Its 2,880 logic elements comfortably absorb 100 to 200 equivalent 16-pin PALs, while the 360 LABs organize timing across address, data, and control bus domains. With 0.6 ns propagation delay at -3 grade, it easily meets 66.67 MHz processor interface budgets. SRAM configuration permits late-stage design changes that pure ASICs cannot match, reducing respin costs. Cost-sensitive designs that need ~50K gates prefer this part over larger Flex 10K devices to optimize silicon area.

🎧

Embedded DSP and Signal Routing Prototyping

The EPF10K50VRC240-3 supports embedded DSP prototyping through its EAB-based distributed dual-port RAM, which can map small FIFOs and coefficient tables for FIR/IIR filter structures. Its 66.67 MHz internal frequency supports audio-rate DSP at 44.1 kHz with substantial processing headroom, while the 189 I/Os accommodate parallel data capture from ADCs/DACs in the 30 to 50 MSPS range. Multi-voltage I/O banks ease integration with mixed 3.3V/5V signal chains. This device is popular in legacy digital-audio mixing consoles and prototype modem cards where time-to-market matters and design evolution is expected.

🖥️

Test Equipment and ATE Backplanes

The EPF10K50VRC240-3 is a strong fit for ATE backplanes and instrumentation back-end boards because its 189 user I/Os map naturally to instrument matrix switching, relay drivers, and trigger distribution channels. The 0.6 ns propagation delay at speed grade -3 supports the deterministic timing required for IEEE 1149.5 backplane test and parallel stimulus buses. Embedded array blocks simplify implementation of timing-pattern RAMs that drive stimulus channels. JTAG-based configuration enables factory re-flashing during ATE calibration cycles, a significant operational advantage. Aerospace and military test stands benefit from the device's long-proven reliability profile.

✈️

Avionics and Aerospace Legacy Subsystems

The EPF10K50VRC240-3 remains deployed in long-life avionics subsystems where original Flex 10K bitstreams have been DO-254 certified and cannot be ported without costly re-qualification. Its commercial 0 to 70°C operating range is sufficient for cabin and ground segments, while the 240-RQFP package offers the rugged mechanical profile required in airborne bay installations. JTAG and serial configuration support both factory programming and field updates through approved maintenance tools. Engineers maintaining these systems rely on the part's mature silicon revision history to ensure bitstream stability across multi-decade fleet lifetimes.

What is the EPF10K50VRC240-3?
The EPF10K50VRC240-3 is a member of the Intel / Altera Flex 10K FPGA family, providing 50,000 typical gates and 2,880 logic elements in a 240-pin RQFP package. It is a SRAM-based, in-system-programmable FPGA designed for embedded logic and memory integration. According to the manufacturer datasheet, the device supports 189 user I/Os and 20,480 bits of embedded array block (EAB) memory.
How many user I/O pins does the EPF10K50VRC240-3 have?
The EPF10K50VRC240-3 provides 189 user I/O pins. This count is lower than the package pin count because some pins are reserved for power, ground, JTAG configuration, and dedicated clock inputs. The figure is consistent with both the DigiKey and Mouser distributor listings as of 2026-09-11.
What package does the EPF10K50VRC240-3 use?
The EPF10K50VRC240-3 ships in a 240-pin BFQFP (also called RQFP) package with an exposed thermal pad. According to the manufacturer datasheet, the exposed pad must be soldered to a copper ground plane to meet the published thermal and mechanical reliability specifications. The part is supplied in tray packaging per Arrow.com.
Where to buy the EPF10K50VRC240-3 online?
The EPF10K50VRC240-3 is available from authorized distributors including DigiKey (763774 listing), Mouser, Arrow Electronics, and several secondary suppliers. As of 2026-09-11, the unit price at qty-1 is approximately $95.00, with quantity discounts available at 100+ units. Lead times vary because the part is NRND (Not Recommended for New Designs); XAIPART also offers quote-based sourcing.
What is the lead time and stock status for the EPF10K50VRC240-3?
As of 2026-09-11, the EPF10K50VRC240-3 is marked NRND (Not Recommended for New Designs) by Intel. DigiKey historically listed it as 'ships today' but stock is now fragmented across distributors. Lead time for production quantities is typically 8 to 12 weeks; sample orders may be fulfilled from US or EU distributor inventory within 2 to 5 business days.
Is the EPF10K50VRC240-3 the same as the EPF10K50RC240-4?
The EPF10K50VRC240-3 and EPF10K50RC240-4 belong to the same Flex 10K family and share the same 240-RQFP footprint, but the 'V' suffix denotes 3.3V core supply (vs 5V in the standard RC part) and '4' is a faster speed grade than '3'. They are pin-compatible but functionally different in core voltage; designers must verify I/O standard support before migrating a board from one to the other.
What is the difference between EPF10K50VRC240-3 and EPF10K30AQC240-3?
Both parts share the same 240-pin QFP footprint, but the EPF10K50VRC240-3 provides 50,000 gates / 2,880 logic elements whereas the EPF10K30AQC240-3 offers only 30,000 gates / 1,728 logic elements. They are NOT drop-in replacements because the I/O mapping and EAB distribution differ. Choose EPF10K50VRC240-3 when more logic capacity is required in the same footprint.
When should I choose EPF10K50VRC240-3 over a newer Cyclone or MAX device?
Choose the EPF10K50VRC240-3 only when maintaining a legacy design whose schematic, PCB layout, and bitstream are already qualified. For new designs, Intel recommends modern Cyclone V or Cyclone 10 FPGAs, which offer higher density, lower power, and longer lifecycle commitments. The Flex 10K is NRND, so engineers should plan migration before long-term production.
What is the best drop-in replacement for the EPF10K50VRC240-3?
The closest pin-compatible drop-in alternatives are other EPF10K50V family members in the same 240-RQFP package, such as EPF10K50VRC240-2N (speed grade -2) and EPF10K50VRC240-1N (speed grade -1). These share the exact same 240-RQFP footprint and bitstream-compatible architecture but trade off propagation delay. Cross-brand FPGAs (Xilinx, Lattice) are NOT drop-in compatible.
Where can I download the EPF10K50VRC240-3 datasheet PDF?
The official Flex 10K datasheet can be downloaded from DigiKey at https://media.digikey.com/pdf/Data%20Sheets/Intel%20PDFs/FLEX_10K.pdf. The document covers pinout, electrical characteristics, configuration, and timing specifications for the entire Flex 10K and Flex 10KA families. Individual datasheet PDFs are also mirrored on Octopart's datasheet index.
Where can I find the EPF10K50VRC240-3 pinout?
The full pinout for the EPF10K50VRC240-3 in 240-RQFP is published in the Flex 10K datasheet section 'Pin Information'. Each pin is listed by its assigned function (GCLK, OE, JTAG, VCCINT, VCCIO, GND, I/O bank, etc.) along with pin number. The exposed pad (pin 241) must be soldered to the ground plane per datasheet recommendation.
What are the key specifications of the EPF10K50VRC240-3 that engineers should know?
The EPF10K50VRC240-3 has 2,880 logic elements, 360 LABs, 20,480 bits of embedded memory via EABs, 189 user I/Os, 0.6 ns propagation delay, 66.67 MHz internal frequency, and 3.3V core supply. It is housed in a 240-RQFP package with exposed pad, supports JTAG (IEEE 1149.1) in-system programming, and operates from 0°C to 70°C commercial range. These figures are quoted directly from the Flex 10K datasheet.
What is the best Altera equivalent for the EPF10K50VRC240-3?
Within the Altera / Intel Flex 10K family, the same-footprint alternatives are EPF10K50VRC240-2N (speed grade -2), EPF10K50VRC240-1N (speed grade -1), and the higher-grade EPF10K50VR1240-4 variant. All share the 240-RQFP package and 3.3V core supply. For density upgrades in the same family, the EPF10K130EQC240-3N offers 130K gates in a 240-pin QFP.
Hey Google, what can replace the EPF10K50VRC240-3 in production?
The direct same-footprint replacements are EPF10K50VRC240-2N, EPF10K50VRC240-1N, and EPF10K50VRC240-2 within the Flex 10K family. For higher density migration within the same footprint, the EPF10K130EQC240-3N (130K gates, 240-pin QFP) is a footprint-compatible upgrade. Modern long-lifecycle alternatives include the Intel Cyclone 10 LP family, which requires PCB redesign but is supported until at least 2030.
Is the EPF10K50VRC240-3 RoHS compliant?
The Flex 10K datasheet family documents lead-free and RoHS-compliant versions separately. The 'N' suffix variants (such as EPF10K50VRC240-3N) are Pb-free and RoHS-compliant. The non-'N' EPF10K50VRC240-3 may ship in SnPb or lead-free finishes depending on the assembly lot; engineers ordering new production should specify the 'N' suffix explicitly to ensure RoHS compliance.

Engineering reference data for EPF10K50VRC240-3 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K50VRC240-3 when you need 50,000 gates and 189 user I/Os in a 240-RQFP package for legacy telecom, industrial control, or aerospace systems where the Flex 10K bitstream is already certified. The mid-range speed grade -3 fits 66.67 MHz interfaces with margin. For timing-critical designs requiring the lowest propagation delay, upgrade to the same-footprint EPF10K50VR1240-4. For density upgrades without a board redesign, consider EPF10K100EQC240-1 or EPF10K130EQC240-3N. Avoid the EPF10K50VRC240-3 for new designs unless migration cost is prohibitive — Intel recommends modern Cyclone V / Cyclone 10 families for new product development.

Comparison with Alternatives

Parameter This Product EPF10K50VRC240-2N EPF10K50VRC240-1N EPF10K50VR1240-4
Package 240-RQFP (BFQFP) 240-RQFP - same 240-RQFP - same 240-RQFP - same
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Typical Gates 50,000 50,000 50,000 50,000
Logic Elements 2,880 2,880 2,880 2,880
User I/Os 189 189 189 189
Speed Grade -3 (mid) -2 (slower) -1 (slowest) -4 (fastest)
Core Voltage 3.3 V 3.3 V 3.3 V 3.3 V
Lifecycle Status NRND NRND NRND NRND

Key Differentiators

  • Mid-range speed grade -3 balances performance and cost (vs EPF10K50VR1240-4)
  • 50K-gate density is the sweet spot in the Flex 10K family (vs EPF10K30AQC240-3)
  • 3.3V core supply (V suffix) for modern mixed-voltage designs (vs EPF10K50RC240-4)

Design Notes

Decouple every VCCINT and VCCIO pin individually with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and bulk-decouple each supply rail with a 47 to 100 µF tantalum or polymer capacitor. The 240-RQFP package has many VCCINT/VCCIO/GND pins distributed around the periphery; populating all of them is mandatory to meet datasheet switching-noise and timing-jitter specifications.

The exposed thermal pad (pin 241) of the 240-RQFP must be soldered to a continuous ground copper plane of at least 1 square inch for commercial-grade operation. Without a proper thermal pad connection, the device may exceed junction temperature limits during sustained 66.67 MHz operation, triggering the on-die thermal-diode-based derating. For environments above 60°C ambient, add a small heatsink or increase copper area to 2 to 3 square inches.

Configuration errors are the most common Flex 10K board bring-up issue. Verify that nCONFIG is held low at power-up and driven high only after all rails are stable. DCLK and DATA0 must be driven by a valid configuration source (EPC2, EPC16, microprocessor, or JTAG). Forgetting to hold CONF_DONE high after configuration or leaving nSTATUS floating will cause intermittent boot failures. Always include a pull-up on nCONFIG and nSTATUS per datasheet section 'Configuration'.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance status was not explicitly stated in the verified distributor snippets for the non-N suffix -3 part. The 'N' suffix variants (e.g., EPF10K50VRC240-3N if available) are typically Pb-free per Altera / Intel legacy part-number convention. Engineers requiring RoHS-compliant ordering should request the 'N' suffix explicitly.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPF10K50VRC240-3 EPF10K50VRC240-2N EPF10K50VRC240-1N EPF10K50VR1240-4 Flex 10K FPGA Field Programmable Gate Array Programmable Logic Device PLD Logic Element Logic Array Block LAB Embedded Array Block EAB RQFP BFQFP JTAG IEEE 1149.1 System-on-a-Programmable-Chip SOPC SRAM configuration 3.3V core supply commercial temperature grade legacy telecom industrial control aerospace subsystem
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