EPM2210F256C5N - 2210 LE, 1700 Macrocells MAX II CPLD | Intel
MPN: EPM2210F256C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.75 | $257.50 |
| 100 | $22.4 | $2,240.00 |
| 500 | $19.3 | $9,650.00 |
| 1,000 | $17.85 | $17,850.00 |
EPM2210F256C5N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that provides instant-on operation, deterministic timing, and high I/O count glue logic for digital systems. CPLDs sit in the programmable logic hierarchy between simple SPLDs and large FPGAs, occupying a role historically filled by discrete 74-series logic gates, address decoders, and bus interface devices. The MAX II family specifically targets low-power, low-cost, high-volume glue-logic replacement with on-chip flash configuration memory.
Key features of the EPM2210F256C5N include 204 user I/Os, MultiVolt core supporting 1.5V/1.8V/2.5V/3.3V I/O standards, four global clocks with eight clock pins, and an on-chip voltage regulator for single-supply operation. The 8Kbits of user flash memory (UFM) provides non-volatile storage for user data, eliminating external EEPROM. The 'C5' speed grade combined with the commercial 0C to 85C operating range makes this part the mainstream cost-optimized variant.
The MAX II architecture uses a 0.18um CMOS process with a unique MultiTrack interconnect scheme, reducing die size while maintaining predictable timing. Unlike SRAM-based FPGAs that require external boot PROMs, the on-chip flash configuration makes MAX II devices instant-on at < 1ms, ideal for systems that cannot tolerate FPGA configuration latency. The 256-FBGA package supports high-density board designs with exposed pads for thermal dissipation.
Typical applications include I/O expansion and bus bridging in industrial controllers, address decoding and timing adjustment in telecom equipment, power-up sequencing logic in networking switches, and glue-logic consolidation in medical and test instruments. The wide I/O voltage range allows direct interfacing to legacy 5V-tolerant busses via resistor networks.
When designing with this part, use Altera (now Intel) Quartus II design software version 13.0 or later for synthesis, fitting, and programming file generation. The JTAG interface supports both IEEE 1149.1 boundary-scan testing and in-system programming via the ByteBlaster or USB-Blaster download cables.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX II family, and practical design notes not aggregated on any single distributor product page.
Drop-in alternatives for EPM2210F256C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM2210F256C5N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Programming Interface, User Flash Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM2210F256C5
✅ Drop-In✓ In Stock
$14.95 / Unit
View Datasheet →EPM2210F256C4N
✅ Drop-In✓ In Stock
$39.85 / Unit
View Datasheet →EPM2210F256C3N
✅ Drop-In✓ In Stock
$47.1 / Unit
View Datasheet →EPM2210F256C4
✅ Drop-In✓ In Stock
$42.8 / Unit
View Datasheet →EPM2210GF256I5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM2210F256A5NGA
✅ Drop-In✓ In Stock
$48.75 / Unit
View Datasheet →EPM2210F256C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 2210 |
| Macrocells | 1700 |
| User I/Os | 204 |
| User Flash Memory (UFM) | 8 Kbits |
| Propagation Delay (tPD) | 7 ns |
| Turn-On Delay (tSU) | 11.2 ns |
| Maximum Internal Frequency | 201.1 MHz |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 um CMOS with on-chip flash |
| Global Clocks | 4 |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EPM2210F256C5N 256-ball fineline bga (17x17mm, 1mm pitch) Pin Configuration Guide
Pin configuration for EPM2210F256C5N (256-ball fineline bga (17x17mm, 1mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F256C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM2210F256C5N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Telecom Backplane Address Decoding, Networking Switch Power-Up Sequencing, Medical Device Glue Logic Consolidation, Automated Test Equipment Timing Adjustment, Display Controller Timing Generation.
Industrial I/O Expansion and Bus Bridging
The EPM2210F256C5N's 2210 logic elements and 204 user I/Os make it ideal for I/O expansion in industrial controllers and bus-bridging between incompatible processor busses. With a 7ns propagation delay and 201.1MHz internal frequency, the CPLD can synchronize signals between a 32-bit MCU bus at 50MHz and a 16-bit FPGA fabric at 100MHz without introducing data corruption. The MultiVolt I/O banks allow direct 3.3V-to-1.8V level translation on the same die, eliminating external level-shifters. The on-chip 8Kbit UFM can store board revision codes or calibration constants, removing the need for external EEPROM. MAX II devices are widely deployed in PLCs, motor drives, and process control equipment where instant-on behavior (<1ms from power-up) is mandatory because FPGAs with SRAM boot PROMs cannot meet cold-start deadlines.
Recommended
Telecom Backplane Address Decoding
In telecom backplanes using ATCA or AdvancedMC architectures, the EPM2210F256C5N serves as the central address decoder and chip-select generator across multiple line cards. The 1700 macrocells provide sufficient capacity to decode 24-bit address ranges with individual chip enables for up to 16 slave devices. With 204 I/Os, the part can simultaneously drive enable lines to FPGAs, ASICs, memory banks, and PHY devices without external bus drivers. The instant-on flash-based configuration eliminates the boot-time complexity of SRAM-based FPGAs in systems that require deterministic startup for hitless firmware upgrades. Operating from a single 3.3V supply simplifies power tree design in space-constrained line cards.
Recommended
Networking Switch Power-Up Sequencing
The EPM2210F256C5N is widely used in managed Ethernet switches to generate precise power-up and power-down sequencing signals for multiple voltage rails. With 204 I/Os and deterministic 7ns timing, the part can drive power-good signals, RESET lines, and ENABLE pins for PHYs, MAC ICs, and switch ASICs in the correct order to prevent latch-up. The MultiVolt I/O capability lets a single CPLD interface to 1.8V PHYs, 2.5V MAC blocks, and 3.3V housekeeping logic without external level translation. The instant-on flash configuration guarantees that the power sequence begins within microseconds of VCC ramp, which is critical for meeting IEEE 802.3 startup timing.
Recommended
Medical Device Glue Logic Consolidation
Medical imaging and patient-monitoring equipment often contains dozens of discrete 74LVC, 74AVC, and 74AHC logic gates scattered across the board. The EPM2210F256C5N can absorb most of this discrete logic into a single programmable device, reducing board area, BOM count, and assembly cost. With 204 user I/Os, the CPLD can replace hundreds of discrete AND/OR/flipflop gates while maintaining the deterministic timing required for safety-critical signal paths. The internal flash UFM stores calibration coefficients for analog front-ends, reducing external EEPROM cost. The Instant-on feature ensures patient-monitor displays reach steady state within milliseconds of clinician power-button press.
Recommended
Automated Test Equipment Timing Adjustment
ATE platforms require programmable delay lines, pulse generators, and pattern sequencers to characterize semiconductors. The EPM2210F256C5N's 7ns propagation delay and 201.1MHz internal frequency support delay-line resolution at the nanosecond scale for sub-100MHz device-under-test clocking. With 1700 macrocells, a single part can implement dozens of independent timing channels for parallel test sites, dramatically reducing per-channel instrument cost. The JTAG programming interface allows in-system reconfiguration to adapt to different DUT families without manual jumper changes. The non-volatile flash configuration preserves test program state across power cycles, supporting unattended ATE burn-in runs.
Recommended
Display Controller Timing Generation
Flat-panel LCD and OLED display controllers require precise HSYNC, VSYNC, DE (data enable), and pixel-clock signals with sub-nanosecond jitter. The EPM2210F256C5N's deterministic 7ns tPD and dedicated global clock networks provide jitter performance far superior to discrete 74-series timing chips. With 204 I/Os, the CPLD can simultaneously drive timing signals to multiple display panels in a multi-monitor KVM switch or digital signage array. The MultiVolt I/O banks interface directly to 1.5V eDP panels, 1.8V MIPI bridge chips, and 3.3V scaler ASICs without external level shifters. Internal UFM stores panel EDID overrides for custom timing modes.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F256C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F256C5 | EPM2210F256C4N | EPM2210F256C3N | EPM2210GF256I5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA (same) | 256-ball FineLine BGA (same) | 256-ball FineLine BGA (same) | 256-ball FineLine BGA (same) |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1700 |
| Speed Grade (tPD) | C5 (7 ns) | C5 (7 ns) | C4 (~9 ns) | C3 (~10 ns) | I5 (~7.5 ns) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) |
| Lead-Free Finish | Yes (N suffix) | No (leaded) | Yes | Yes | Yes |
| Core Voltage Regulator | On-chip (single 3.3V supply) | On-chip | On-chip | On-chip | On-chip, 1.8V core (MAX II G) |
| User I/Os | 204 | 204 | 204 | 204 | 204 |
Key Differentiators
- Instant-on flash configuration vs SRAM-FPGA boot PROMs (vs EPF8820ATC144-3 (legacy SRAM-based FLEX 8000))
- On-chip User Flash Memory (UFM) replaces external EEPROM (vs Discrete 24LC256 I2C EEPROM + standard CPLD)
- MultiVolt I/O banks support mixed-voltage interfaces on one die (vs Discrete 74LVC4245 level shifters)
Design Notes
The 256-ball FineLine BGA uses a 1.0mm ball pitch, which is at the practical limit for standard 4-mil (0.1mm) laser-drilled via-in-pad PCB processes. Use 0.5mm drill vias with 0.2mm solder mask dam, and route all signal escape traces on the top layer beneath the BGA using microvia or via-in-pad technology. Maintain a continuous ground plane on layer 2 and a 3.3V power plane on layer 3 to provide low-impedance return paths for the high-edge-rate I/O signals. Decoupling: place 0.1uF X7R ceramic capacitors within 50 mils of every VCCIO/VCCINT ball pair, plus one 10uF bulk tantalum per quadrant.
MAX II CPLDs require a single 3.3V supply on VCCINT because the on-chip linear regulator generates the internal 1.8V core rail. Estimated: at 100% toggle rate on all 204 I/Os at 100MHz, dynamic current draw is approximately 200-300mA. Add a 4.7uF bulk capacitor near each VCCINT ball pair, and ensure the 3.3V regulator can supply at least 500mA peak. For battery-backed designs, hold VCCINT above 2.0V during power-down to prevent configuration corruption. The UFM block draws negligible standby current (~50uA).
Do not exceed 3.6V on VCCINT or VCCIO; permanent damage occurs above 4.0V. The JTAG TCK pin should be pulled low through 10kohm when not in use to prevent spurious configuration attempts. When programming in-system via JTAG, ensure the nCONFIG pin is held high via a 10kohm pull-up to VCCINT. Do not connect unused I/O pins directly to ground or VCCIO - allow Quartus II to configure them as input tri-stated with weak pull-up to avoid output contention during in-system programming.
The EPM2210F256C5N supports LVTTL, LVCMOS, PCI, and SSTL-2 I/O standards via the VCCIO bank voltages. For 50MHz+ LVCMOS signals, use 22ohm series-termination resistors at the driver output to dampen reflections on long PCB traces (>50mm). The MultiTrack interconnect architecture has predictable pin-to-pin timing; always check the Quartus II timing report for the longest combinatorial path before committing to a C5 vs C4 speed grade. Hold-time violations are rare but can occur when feeding data into a fast clock - add a 2-input LUT delay element if needed.
Compliance Information
RoHS compliance per Altera/Intel datasheet (N suffix indicates lead-free finish). REACH compliance stated by manufacturer. AEC-Q100 not qualified - choose EPM2210A5N variants for automotive. Halogen-free status not stated in available data [DATA_NEEDED].
