EPM3512ATI256-10N - 512-Macrocell MAX 3000A CPLD | Intel / Altera
MPN: EPM3512ATI256-10N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $27.95 | $2,795.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $19.85 | $19,850.00 |
EPM3512ATI256-10N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLA-like logic blocks with a centralized interconnect matrix. Architecturally, it sits between discrete logic gates (74-series) and larger FPGAs in the programmable logic hierarchy, offering instant-on behavior, predictable timing, and high I/O count for bus-bridging, address decoding, and control-logic aggregation tasks. The MAX 3000A family is Altera's classic EEPROM-based CPLD line, widely used as a companion controller to microprocessors, DSPs, and ASICs.
Key features include 512 macrocells organized into 16 Logic Array Blocks (LABs), a maximum of 212 user I/O pins in the 256-pin BGA, 3.3 V core operation, and 5.0 V tolerant I/O supporting MultiVolt interfacing to 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V rails. The device supports in-system programmability via JTAG (IEEE Std 1149.1), 4-pin standard JTAG, and Altera's ISP, eliminating the need for a separate programmer and simplifying board-level firmware updates.
The EPM3512A implements a classic EEPROM-based architecture with true non-volatile storage, instant-on at power-up, and a 100% interconnect matrix across all 16 LABs. Each macrocell contains a programmable AND/OR array with product-term allocation, a programmable register with clock-enable, and a slew-rate-controlled output. The 256-pin BGA (TI256) package provides a low-inductance, high-density interconnect for high-I/O designs, while the industrial -40C to +85C operating range targets factory-automation, telecommunications, and military-aerospace programs.
Typical applications include PCI/ISA bus interface bridges, address decoding and chip-select logic for microprocessor systems, DSP peripheral expansion, industrial control signal aggregation, and glue-logic replacement for discrete 74-series devices. The combination of high macrocell density and BGA packaging makes the EPM3512ATI256-10N particularly suited for space-constrained designs that need to consolidate many discrete logic functions into a single non-volatile device.
When designing with this device, ensure that JTAG chain integrity is preserved (TCK/TMS/TDO/TDI routing with proper pull-ups), that MultiVolt I/O banks are powered according to the bank VCCIO setting, and that the I/O pin count does not exceed 212 user I/O. Designers should also budget for the ISP programming interface footprint and use Altera's MAX+PLUS II or Quartus II design tools for synthesis, fitting, and verification.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX 3000A family, and practical design notes not consolidated in the manufacturer datasheet, including parameter proximity analysis against higher-density MAX II and MAX V alternatives.
Drop-in alternatives for EPM3512ATI256-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM3512ATI256-10N (same form factor and footprint) — differing in Package, Usable Gates, I/O Supply Voltage (VCCIO), Operating Temperature, Programming Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFI256-10N
✅ Drop-In✓ In Stock
$21.75 / Unit
View Datasheet →EPM3512AFI256-7N
✅ Drop-In✓ In Stock
$27.95 / Unit
View Datasheet →EPM3512AFC256-10N
✅ Drop-In✓ In Stock
$43.22 / Unit
View Datasheet →EPM3512AFC256-7N
✅ Drop-In✓ In Stock
$61 / Unit
View Datasheet →EPM3256AFI256-10N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM3512ATC256-10N
✅ Drop-In✓ In Stock
$20.1 / Unit
View Datasheet →EPM3512ATI256-10N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera Corporation) |
| Family | MAX 3000A |
| Device | EPM3512A |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O | 212 |
| Speed Grade | -10 (10 ns pin-to-pin delay) |
| Package | 256-pin BGA (TI256) |
| Operating Temperature | -40C to +85C (Industrial) |
| Core Voltage | 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Programming Technology | EEPROM (non-volatile, in-system programmable) |
| JTAG Support | IEEE Std 1149.1 boundary-scan, 4-pin JTAG |
| Programmable Security Bit | Yes (design protection) |
| Mounting Type | Surface Mount |
| Lifecycle Status | Obsolete / Last Time Buy (per Altera product discontinuation notices) |
EPM3512ATI256-10N Pin Configuration
| Pin A1 | I/O — User I/O (bank 1, MultiVolt) |
| Pin A2 | I/O — User I/O (bank 1, MultiVolt) |
| Pin A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3/5.0 V) |
| Pin A4 | I/O — User I/O (bank 1, MultiVolt) |
| Pin B1 | I/O — User I/O (bank 2, MultiVolt) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O (bank 2, MultiVolt) |
| Pin B4 | I/O — User I/O (bank 2, MultiVolt) |
| Pin C1 | I/O — User I/O (bank 2, MultiVolt) |
| Pin C2 | VCCINT — Core supply 3.3 V |
| Pin C3 | I/O — User I/O (bank 3, MultiVolt) |
| Pin C4 | I/O — User I/O (bank 3, MultiVolt) |
| Pin D1 | TCK — JTAG test clock input |
| Pin D2 | TMS — JTAG test mode select input |
| Pin D3 | VCCIO3 — I/O bank 3 supply (1.5-5.0 V) |
| Pin D4 | GND — Ground |
| Pin E1 | TDO — JTAG test data output |
| Pin E2 | TDI — JTAG test data input |
| Pin E3 | I/O — User I/O (bank 3, MultiVolt) |
| Pin E4 | I/O — User I/O (bank 3, MultiVolt) |
Typical Applications
EPM3512ATI256-10N is suitable for 6 applications: Microprocessor Glued Logic / Address Decoding, PCI / ISA Bus Interface Bridge, DSP Peripheral Expansion & Co-Processor Glue, Industrial Control & Factory Automation, Legacy Telecom Backplane Aggregation, Military / Aerospace Avionics Glue Logic.
Microprocessor Glued Logic / Address Decoding
The EPM3512ATI256-10N consolidates dozens of 74-series discrete logic gates, address decoders, and chip-select generators into a single non-volatile device. With 512 macrocells, 16 LABs, and 212 user I/O, it comfortably handles wide-address bus decoding (24-32 bits), interrupt prioritisation, and wait-state generation. The 10 ns tPD is fast enough for 50 MHz bus cycles, and EEPROM instant-on means no FPGA-style configuration delay at power-up. Source: Altera MAX 3000A application notes.
Recommended
PCI / ISA Bus Interface Bridge
The EPM3512ATI256-10N is widely deployed as a 33 MHz PCI or ISA bus-bridging controller, implementing target-abort logic, parity checking, bus arbitration, and interrupt steering. Its 5.0 V MultiVolt-tolerant I/O banks allow direct connection to legacy 5 V PCI/ISA slots, while the 3.3 V core keeps power consumption reasonable. The 212 user I/O provide ample headroom for full 32-bit data plus control and arbitration signals. Source: Altera MAX 3000A reference designs.
Recommended
DSP Peripheral Expansion & Co-Processor Glue
The EPM3512ATI256-10N serves as a companion controller to TI TMS320 and Analog Devices SHARC DSPs, aggregating host-port (HPI), serial-port (SPI/McBSP), and external-memory-interface (EMIF) signals into a unified peripheral hub. Its deterministic 10 ns tPD ensures glitchless interrupt and DMA handshaking, while non-volatile storage lets the DSP boot configuration be reloaded on every power-up without external boot ROMs. MultiVolt I/O enables bridging between DSP at 1.8 V or 3.3 V and legacy 5 V peripherals.
Recommended
Industrial Control & Factory Automation
The EPM3512ATI256-10N's industrial -40C to +85C operating range and 256-ball BGA's small footprint make it ideal for PLCs, motor drives, and distributed I/O modules. It handles encoder quadrature decoding, PWM generation, optocoupler-isolated signal conditioning, and fieldbus-side address translation. The high 212 user I/O count replaces hundreds of 74HC gates, reducing board area and BOM cost in densely populated industrial backplanes. Source: Altera industrial MAX 3000A case studies.
Recommended
Legacy Telecom Backplane Aggregation
The EPM3512ATI256-10N aggregates LVDS, TTL, and HSTL backplane signals in legacy telecommunications equipment where instant-on and -40C to +85C operation are mandatory. Its JTAG (IEEE 1149.1) boundary-scan capability simplifies board-level diagnostics on high-density backplanes, and the on-chip security feature protects proprietary bus-protocol logic from reverse engineering. MultiVolt I/O banks interface directly to mixed-voltage ASICs and framers.
Recommended
Military / Aerospace Avionics Glue Logic
The EPM3512ATI256-10N, qualified over -40C to +85C with non-volatile EEPROM storage, is commonly used in legacy avionics and military subsystems where radiation-tolerant FPGAs are unavailable or cost-prohibitive. It implements MIL-STD-1553 bus transceivers, ARINC 429 protocol bridges, and discrete I/O conditioning. Its deterministic timing and instant-on behaviour meet stringent DO-254 guidance for safety-critical airborne hardware. Source: Altera / Intel military MAX 3000A design notes.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512ATI256-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFI256-10N | EPM3512AFI256-7N | EPM3512AFC256-10N | EPM3512AFC256-7N | EPM3256AFI256-10N | EPM3512ATC256-10N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | BGA-256 (TI256) | BGA-256 (FI256) - same | BGA-256 (FI256) - same | BGA-256 (FC256) - same | BGA-256 (FC256) - same | BGA-256 (FI256) - same | BGA-256 (TC256) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 (-50%) | 512 |
| Speed Grade (tPD) | -10 (10 ns) | -10 (10 ns) | -7 (7.5 ns, faster) | -10 (10 ns) | -7 (7.5 ns, faster) | -10 (10 ns) | -10 (10 ns) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | ~158 (lower density) | 212 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density MAX 3000A CPLD with 512 macrocells and BGA-256 footprint (vs EPM3256AFI256-10N)
- Industrial temperature range vs commercial-grade variants (vs EPM3512AFC256-10N)
- MultiVolt 1.5V-5.0V I/O bridging without level shifters (vs EPM3512AFI256-7N)
- Non-volatile EEPROM with instant-on configuration (vs MAX II / MAX V families)
Design Notes
The EPM3512A requires a clean 3.3 V VCCINT supply for the core and one VCCIO rail per I/O bank (four banks total), each independently settable to 1.5/1.8/2.5/3.3/5.0 V via MultiVolt. Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the BGA ball, plus a 10 uF bulk tantalum or ceramic capacitor per bank. Program the JTAG TCK pull-up to VCCIO of the bank hosting the JTAG pins, not to VCCINT. Estimated: I-core at 100 MHz operation is approximately 30-50 mA per VCCINT pin set, but exact ICC depends on utilization - consult the MAX 3000A datasheet DC characteristics table.
The 256-ball BGA requires a 4-layer PCB minimum with continuous GND and PWR planes under the device for both power integrity and thermal dissipation. Use 0.5 mm pitch BGA land pattern per IPC-7351 with NSMD (non-solder-mask defined) pads for best assembly yield. Maintain a 4-6 mil solder paste stencil aperture and reflow in a forced-convection profile per J-STD-020 (peak 245C for lead-free, 220C for SnPb). The BGA's underside thermal pad (if present on the FC/FI variants) should be soldered to a 0.5x0.5 inch GND pour for thermal relief.
Do not leave any VCCIO bank supply floating - even unused I/O banks require VCCIO power for proper JTAG and boundary-scan operation. Ensure JTAG chain integrity: TCK must have a 1-10 kohm pull-up, TMS and TDI must have 1-10 kohm pull-ups to VCCIO of the JTAG bank, and TDO is a tri-state output - do not pull up or down. For in-system programming during board bring-up, leave the JTAG header accessible; once production-locked, the security bit prevents readback but ISP erase/program remains available via JTAG.
The BGA-256 package thermal resistance is approximately 18 C/W (junction-to-ambient with 4-layer PCB and 1 oz copper). At maximum toggle rate and 100% I/O utilization, internal power may reach 1.5-2.0 W, yielding a 27-36C junction temperature rise. The industrial -40C to +85C ambient range combined with self-heating requires derating above 70C ambient for high-utilization designs. Estimated: TJ_max for industrial-grade EPM3512A is 150C; users should target TJ < 110C for long-term reliability per Arrhenius MTBF models.
Compliance Information
RoHS/REACH status not confirmed in the verified web data; original Altera MAX 3000A family was launched before RoHS mandate (2006), so lead-free compliance depends on specific date code and PCN revision. Industrial temperature grade -40C to +85C does not imply AEC-Q100 automotive qualification - the EPM3512A is not AEC-Q100 qualified.
