M29W160EB80ZA3SE - 16Mb NOR Flash 80ns TFBGA-48 | Micron
MPN: M29W160EB80ZA3SE β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.59 | $1.59 |
| 10 | $1.49 | $14.90 |
| 100 | $1.42 | $142.00 |
| 500 | $1.38 | $690.00 |
| 1,000 | $1.35 | $1,350.00 |
Drop-in alternatives for M29W160EB80ZA3SE β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
M29W160EB70ZA3SE
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
M29W160ET70ZA6E
β Drop-Inπ Reference alternative (not in catalog)
M29W800FT70ZA3SE
β Drop-Inβ In Stock
$1.38 / Unit
View Datasheet βM29W160FB70N3E
β Drop-Inβ In Stock
$3.58 / Unit
View Datasheet βM29W160EB80ZA6E
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
M29W160EB80ZA3SE Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash (Parallel) |
| Memory Size | 16 Mbit (2M x8 / 1M x16) |
| Access Time | 80 ns |
| Interface | Parallel (Byte-wide / Word-wide) |
| Supply Voltage | 2.7 V to 3.6 V |
| Organization | 16 Mbit Boot Block, x8/x16 selectable |
| Operating Temperature | -40C to +125C |
| Package | 48-TFBGA (6x8 mm, 0.8 mm ball pitch) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tape & Reel (TR) |
| Qualification | AEC-Q100 (automotive grade per datasheets.com listing) |
| Programming Supply | Single 3V supply for program, erase and read |
| Technology Family | M29W160EB (3rd generation M29W series) |
| Erase Block Architecture | Boot block (parameter and main blocks) |
| RoHS Status | Pb-free (SE suffix) |
M29W160EB80ZA3SE 48-tfbga (6x8 mm, 0.8 mm ball pitch) Pin Configuration Guide
Complete pinout information for M29W160EB80ZA3SE (48-tfbga (6x8 mm, 0.8 mm ball pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29W160EB80ZA3SE.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29W160EB80ZA3SE is suitable for 6 applications: Automotive ECU Boot Code Storage, Industrial PLC and Control Firmware, Networking and Telecom Equipment, Consumer Set-Top Box and TV Firmware, Medical Device Code Storage, Embedded MCU Bootloader with FPGA Configuration.
Automotive ECU Boot Code Storage
The M29W160EB80ZA3SE stores boot code and calibration data in automotive electronic control units. Its AEC-Q100 qualification and -40C to +125C operating range make it suitable for under-hood and powertrain environments where consumer-grade Flash would fail. The boot-block architecture protects the resident bootloader from accidental corruption during field firmware updates, while the 80 ns access time allows many MCUs to fetch code in place with minimal wait states. Designers typically connect it to a 16-bit bus with the BYTE# pin tied appropriately; the single 2.7V-3.6V supply simplifies the power tree in 3.3V automotive rails. Verify the speed grade at maximum temperature, since access time degrades toward the corner.
Recommended
Industrial PLC and Control Firmware
Programmable logic controllers and industrial drives need nonvolatile code storage that survives power interruptions and factory-floor temperature swings. The 16 Mbit density of the M29W160EB80ZA3SE holds firmware, FPGA configuration images, and parameter blocks, and parallel NOR allows the CPU to execute initialization code directly from Flash at power-up. The suspend/resume capability lets the controller service real-time interrupts during lengthy block erases, preserving deterministic behavior. Block protection prevents field personnel from accidentally erasing the bootloader during maintenance updates. Combined with a 3.3V industrial rail, the device integrates without additional programming supplies, reducing BOM cost and board complexity.
Recommended
Networking and Telecom Equipment
Routers, switches, and line cards use the M29W160EB80ZA3SE to store BIOS, boot ROM, and configuration images. Parallel NOR offers faster random access than serial alternatives, shortening boot time in equipment where availability SLAs matter. The x8/x16 selectable organization lets hardware teams choose a 16-bit bus for speed or 8-bit for pin-constrained ASICs. The 80 ns access time supports zero-wait-state execution at moderate bus clocks, and the single 3V supply matches common telecom logic rails. Its AEC-Q100 lineage also provides the reliability margin telecom carriers expect for unattended outdoor cabinets operating across wide temperature ranges.
Recommended
Consumer Set-Top Box and TV Firmware
Set-top boxes, digital TVs, and home appliances store boot ROM and firmware in parallel NOR Flash such as the M29W160EB80ZA3SE. The 16 Mbit capacity accommodates compressed bootloader plus application images, while in-place execution shortens cold-start time perceived by users. The TFBGA-48 package fits thin mainboards, and Tape & Reel packaging supports high-volume SMT assembly. Cost per bit at approximately $1.35 (as of 2026-09-04) makes it competitive for cost-sensitive consumer BOMs. Designers should reserve parameter blocks for user settings and use the block-protect feature to secure the boot region against malicious or accidental overwrites during OTA update failures.
Recommended
Medical Device Code Storage
Diagnostic instruments, patient monitors, and portable medical devices require firmware storage with high reliability and long-term availability. The M29W160EB80ZA3SE provides 16 Mbit of code space with in-place execution for fast instrument startup, and its automotive-derived process discipline translates into robust retention and endurance behavior valued in regulated designs. Block protection supports secure-boot schemes required by medical safety standards, and the TFBGA-48 footprint suits compact handheld enclosures. Since requalification of medical firmware is costly, selecting an active, well-documented family with multiple speed and density variants - as the M29W160EB offers - protects against mid-lifecycle supply disruptions.
Recommended
Embedded MCU Bootloader with FPGA Configuration
Systems combining a microcontroller and an FPGA use parallel NOR Flash to hold both the MCU bootloader and the FPGA bitstream. The 16 Mbit M29W160EB80ZA3SE stores a multi-megabyte FPGA image plus MCU code, and the parallel bus lets the MCU or a CPLD stream configuration data to the FPGA at power-up faster than serial Flash alternatives. The 80 ns access time supports streaming at tens of megabytes per second when page-mode reads are used, cutting configuration latency. Designers should map the bitstream and bootloader into separate protected blocks and implement CRC checks on read-back to detect corruption before configuration.
Recommended
Recommended Products Summary
Engineering reference data for M29W160EB80ZA3SE β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29W160EB70ZA3SE | M29W160ET70ZA6E | M29W800FT70ZA3SE | M29W160FB70N3E |
|---|---|---|---|---|---|
| Package | 48-TFBGA (ZA, 6x8) | 48-TFBGA (ZA, 6x8) - same | 48-TFBGA (ZA, 6x8) - same | 48-TFBGA (ZA, 6x8) - same | M29W160FB family package - verify ball map |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 16 Mbit | 16 Mbit | 16 Mbit | 8 Mbit | 16 Mbit |
| Access Time | 80 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| Boot Block Position | Bottom boot (EB) | Bottom boot | Top boot (ET) | Top boot (FT) | Bottom boot (FB) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Automotive AEC-Q100 | Yes (per datasheets.com record) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Approx. Unit Price | $1.3460 (LCSC, as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest random access in the 80 ns grade (vs M29W160ET70ZA6E)
- Double the density of the 8 Mbit variant (vs M29W800FT70ZA3SE)
- Bottom boot block protects low-address boot code (vs M29W160ET70ZA6E)
- Automotive AEC-Q100 qualification (vs M29W160FB70N3E)
Design Notes
The 0.8 mm-pitch TFBGA-48 (6x8) requires careful escape routing: use 4-mil traces with via-in-pad or dogbone escapes, and keep the parallel address bus length-matched within 50 mm to minimize skew against the 80 ns access budget. Series-terminate address and data lines (22-33 ohm) to control ringing on 3.3V CMOS levels, and route CE#, OE#, and WE# away from clock lines to prevent glitch-triggered spurious writes.
Never assert WE# or CE# while VCC is below the minimum 2.7V specification - use a supervisor or the RESET# pin, driven low until the rail is valid, to lock out writes during power-up and brown-out. Omitting the RESET# pull-up is the most common field-failure cause in M29W designs, resulting in corrupted boot blocks after marginal power sequencing. Also confirm boot-block orientation (EB bottom vs ET top) against your CPU memory map before layout.
Decouple VCC with at least 0.1 uF ceramic per supply ball plus one 4.7-10 uF bulk capacitor per device; program and erase currents are pulsed and can collapse a weak 3.3V rail, causing write aborts. Estimated: with 10 mA average program current and 0.5 ohm rail impedance, a 100 ns pulse can dip the rail ~5 mV - usually benign, but long PCB traces with no bulk cap can push it into spec violations.
Parallel NOR Flash at 3.3V dissipates very little heat (tens of milliwatts during active read, estimated from family-typical ICC), so no heatsink or thermal via field is required. The primary thermal design concern is solder-joint reliability across -40C to +125C excursions: follow the datasheet reflow profile for the TFBGA and use standard PCB-to-ball CTE-matched laminate for automotive deployments.
Compliance Information
SE order-code suffix denotes Pb-free (lead-free) packaging. Datasheets.com record lists automotive AEC-Q100 qualification. REACH, halogen-free, and conflict-minerals statuses were not stated in the provided web data.
