MPC5741PK1AMLQ8R - Dual-Core 180MHz 1MB MCU | NXP
MPN: MPC5741PK1AMLQ8R β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for MPC5741PK1AMLQ8R β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
SPC5741PK1AMLQ8R
β Drop-Inπ Reference alternative (not in catalog)
SPC5741PK1AKLQ8R
β Drop-Inπ Reference alternative (not in catalog)
SPC5741PK1AMLQ8
β Drop-Inπ Reference alternative (not in catalog)
MPC5741PK1AMLQ8R Maximum Ratings & Electrical Characteristics
| Core Processor | e200z4 (Power Architecture) |
| Number of Cores | 2 (Dual-Core) |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 180 MHz |
| Program Memory Size | 1MB (1M x 8) FLASH |
| RAM Size | 128KB (128K x 8) |
| NVM | 1MB |
| Supply Voltage | 3.3 V |
| ADC Modules | 4 x ADC |
| PWM Modules | 2 x PWM |
| SENT Interfaces | 2 x SENT |
| Connectivity | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART |
| Operating Temperature | -40C to +125C |
| Package | 144-LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Safety Standard Suitability | ISO 26262 ASIL-D chassis and safety applications |
MPC5741PK1AMLQ8R 144-lqfp (20x20 mm) Pin Configuration Guide
Complete pinout information for MPC5741PK1AMLQ8R (144-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC5741PK1AMLQ8R.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MPC5741PK1AMLQ8R is suitable for 6 applications: Automotive Engine Control Units (ECU), Chassis and ASIL-D Safety Systems, Transmission Control, ADAS Domain and Sensor Fusion Control, Industrial Automation and Motor Control, Gateways and Networked Control Nodes.
Automotive Engine Control Units (ECU)
The MPC5741PK1AMLQ8R fits engine control because its dual e200z4 cores at 180 MHz deliver the deterministic real-time throughput needed for crank-angle-synchronized injection and ignition control, while 4x ADC modules sample wideband oxygen, knock, and pressure sensors with low latency. The 2x SENT interfaces connect modern automotive sensors directly, and the 2x PWM modules drive injectors or throttle actuators. In the ECU powertrain topology, the MCU sits between the sensor front end and gate/pre-driver stages, with CANbus and FlexRay linking it to the vehicle network; the 1MB flash holds calibration-rich control code without external memory.
Recommended
Chassis and ASIL-D Safety Systems
NXP documentation designates the MPC5741P family as suitable for ISO 26262 ASIL-D chassis and safety applications. The dual e200z4 architecture enables one core to execute control software while the second performs safety monitoring, a fundamental ASIL-D partitioning scheme. The 180 MHz core speed closes high-rate control loops for braking, steering, and stability systems, while the -40C to +125C operating range covers underhood and chassis mounting points. Communication via CANbus and FlexRay provides redundant message channels typical of safety architectures, and the 1MB flash supports code with diagnostics and end-to-end protection layers included.
Recommended
Transmission Control
Automatic and dual-clutch transmissions demand simultaneous solenoid current control, speed/position decoding, and network communication, all served by the MPC5741PK1AMLQ8R peripheral set: 2x PWM modules drive solenoid drivers, 4x ADC channels measure currents and pressures, and CAN interfaces exchange torque requests with the engine ECU. The 128KB SRAM accommodates adaptive shift-schedule data structures, while the 180 MHz dual cores separate clutch control from diagnostics tasks deterministically. Operating from a 3.3V supply with -40C to +125C ratings suits the harsh transmission-mounted electronic environment.
Recommended
ADAS Domain and Sensor Fusion Control
In ADAS domain controllers, the MPC5741PK1AMLQ8R acts as the real-time safety companion to high-throughput vision or radar processors. Its dual e200z4 cores at 180 MHz execute sensor-fusion state machines and safety monitoring, while Ethernet and CAN connectivity bridge high-bandwidth and legacy in-vehicle networks. The 2x SENT interfaces accept raw automotive sensor data, and the -40C to +125C range plus ASIL-D suitability meet the deployment constraints of front-camera and radar modules. The 1MB flash retains fail-operational code paths critical for ADAS availability requirements.
Recommended
Industrial Automation and Motor Control
Industrial drives and factory automation benefit from the MPC5741PK1AMLQ8R's deterministic Power Architecture cores and rich peripheral mix. The 2x PWM modules generate inverter switching patterns for motor control, 4x ADCs sample phase currents and bus voltage, and the 180 MHz dual cores run field-oriented control in one core while a second handles fieldbus protocol stacks. Ethernet, CAN, and UART/USART interfaces integrate the node into industrial networks, and the 144-LQFP footprint enables compact drive boards. The -40C to +125C range supports cabinet and outdoor environments alike.
Recommended
Gateways and Networked Control Nodes
The MPC5741PK1AMLQ8R serves as a gateway MCU where CANbus, FlexRay, LINbus, and Ethernet must be bridged: its communication subsystem handles multiple protocol stacks concurrently on the dual 180 MHz e200z4 cores, one core per network domain for isolation. The 1MB flash stores protocol firmware and diagnostic data, and the 128KB SRAM buffers message queues. Typical implementations place the MCU between transceiver stages for each bus, with the -40C to +125C rating supporting underhood or exterior mounted modules. The 3.3V supply simplifies integration with standard automotive power trees.
Recommended
Recommended Products Summary
Engineering reference data for MPC5741PK1AMLQ8R β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5741PK1AMLQ8R | SPC5741PK1AKLQ8R | SPC5741PK1AMLQ8 |
|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz | 2 x e200z4, 180 MHz |
| Flash Memory | 1MB (1M x 8) | 1MB (1M x 8) | 1MB (1M x 8) | 1MB (1M x 8) |
| SRAM | 128KB | 128KB | 128KB | 128KB |
| Peripherals | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT | 4x ADC, 2x PWM, 2x SENT |
| Device Grade | M grade (per MPN suffix) | M grade, reel packaging | K grade (different temp/speed bin) | M grade, tray packaging |
| Lifecycle Status | Active | Active (DigiKey stock) | Active (DigiKey stock) | Active (Mouser stock) |
Key Differentiators
- Dual-core e200z4 architecture for ASIL-D safety partitioning (vs SPC5741PK1AKLQ8R)
- Broadest in-class connectivity set (CAN, Ethernet, FlexRay, LIN, SPI, UART) (vs SPC5741PK1AMLQ8)
- Honest cross-brand limitation: no pin-compatible competitor exists (vs Infineon SAK-TC297TP (AURIX))
Design Notes
The MPC5741PK1AMLQ8R operates from a 3.3V supply, but MPC57xx-class devices typically also require additional core and IO rails per the reference manual power tree. Use a dedicated automotive safety PMIC or sequenced LDO/buck chain and follow NXP's recommended power sequencing to avoid latch-up during startup. Place 100nF ceramic decoupling capacitors at each supply pin pair plus bulk capacitance near the package; verify rail ripple against the datasheet VDD limits at 180 MHz operation where dynamic current peaks occur.
At 180 MHz dual-core operation, the 144-LQFP (20x20 mm) package dissipates heat primarily through its leads. The operating range is -40C to +125C junction, so compute worst-case junction temperature from your application current draw and ambient using the package theta-JA from the MPC5741P datasheet. For underhood ECUs near the +125C ambient limit, minimize concurrent peripheral activity or reduce core clock in thermal folds; provide thermal vias and 2oz copper pours on the PCB to spread heat.
The MPC5741PK1AMLQ8R and SPC5741PK1AMLQ8R are the same silicon under different naming; always confirm which designation your supplier ships. The K-grade SPC5741PK1AKLQ8R is footprint-identical but has a different device grade - do not substitute grades in safety applications without re-qualification. For ISO 26262 ASIL-D designs, follow the MPC5741P safety manual lockstep/partitioning guidelines and enable both e200z4 cores' safety mechanisms; a single-core configuration invalidates the assumed safety concept.
Compliance Information
The SPC-prefix designation (SPC5741PK1AMLQ8R) indicates NXP automotive-qualified product; specific RoHS/REACH declarations should be pulled from the NXP product page ecodata. Per Alldatasheet listing, the family is suitable for ISO 26262 ASIL-D chassis and safety applications.
