Micron Technology

MT25QL256BBB8E12-CAUT - 256Mb SPI Quad I/O NOR Flash | Micron

MPN: MT25QL256BBB8E12-CAUT βœ“ Active
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2.7 V to 3.6 V Vdss 24-T-PBGA / TBGA (6x8 mm) Package 133 MHz Speed NOR Flash (Serial SPI) Memory
From $6.58 USD / Unit
MOQ: 1 |
Price updated: 2026-09-04
Volume Pricing
Qty Unit Price Extended
1 $8.1 $8.10
10 $7.69 $76.90
100 $7.29 $729.00
500 $6.93 $3,465.00
1,000 $6.58 $6,580.00
ℹ️ All prices are in USD

Drop-in alternatives for MT25QL256BBB8E12-CAUT β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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MT25QL256ABB8E12-CAUT

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 24-T-PBGA (6x8, FBGA RW346 footprint)
first-generation (A) vs second-generation (B) MT25Q die; identical 256Mb density, 3V, Quad SPI, and same FBGA ball map

πŸ“‹ Reference alternative (not in catalog)

MT25QL128ABB1EW7-CAUT

βœ… Drop-In
Micron Technology
πŸ“¦ 24-TFBGA (6x8)
FLASH - NOR Memory IC Β· 128 Mbit (16 MB) Β· SPI - Quad I/O Β· 133 MHz Β· 2.7 V to 3.6 V (3 V class) Β· -40C to +125C Β· 45 nm IT Β· 8-WPDFN (6x5 mm) (MLP8)

βœ“ In Stock

$1.8 / Unit

View Datasheet β†’

MT25QL256BBB8E12-CAUT-TR

βœ… Drop-In
πŸ“¦ 24-T-PBGA (6x8)
tape-and-reel packaging variant of identical die for automated assembly; no electrical difference

πŸ“‹ Reference alternative (not in catalog)

MT25QL256BBB8E12-CAUT Maximum Ratings & Electrical Characteristics

Density 256 Mb (32 MB)
Memory Type NOR Flash (Serial SPI)
Interface SPI - Multiple I/O (x1/x2/x4 Quad)
Max Clock Frequency 133 MHz
Clock Cycle Time 5 ns
Supply Voltage 2.7 V to 3.6 V
Operating Temperature -40C to +125C
Package 24-T-PBGA / TBGA (6x8 mm)
FBGA Code RW346
Data Width (Organization) x1/x2/x4
OTP Area 64-byte dedicated OTP outside main array
Reset Pin Available on selected part numbers
Chipset Validation N/A
Product Longevity Program No
Mounting Type Surface Mount (BGA)
Automotive Authentication AUT (authentication suffix per listing)
Packaging Option Tray; Tape & Reel for -TR suffix

MT25QL256BBB8E12-CAUT 24-t-pbga / tbga (6x8 mm) Pin Configuration Guide

Complete pinout information for MT25QL256BBB8E12-CAUT (24-t-pbga / tbga (6x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

24-t-pbga / tbga (6x8 mm) package pinout diagram for MT25QL256BBB8E12-CAUT

No detailed pinout data available for MT25QL256BBB8E12-CAUT.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for MT25QL256BBB8E12-CAUT Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

MT25QL256BBB8E12-CAUT is suitable for 6 applications: FPGA Configuration and Boot Storage, Industrial PLC and Automation Firmware Storage, Networking and Telecom Equipment Boot Flash, Automotive Infotainment and Telematics, Consumer Set-Top Box and Smart Display Boot Memory, Test and Measurement Instrumentation.

πŸ”§

FPGA Configuration and Boot Storage

The MT25QL256BBB8E12-CAUT is a strong fit for FPGA bitstream and boot storage because 256Mb (32 MB) density covers large mid-range FPGA images, while the x4 Quad SPI interface at 133 MHz delivers roughly 66 MB/s effective read throughput, cutting configuration load time versus x1 serial parts. Placed on the FPGA's dedicated configuration QSPI bus with 10K pull-ups on CS# and hold management during power-up, it supports both master-serial and XIP boot flows. The -40C to +125C operating range also makes it suitable for industrial field equipment. The main trade-off versus parallel flash is the need to confirm that the configuration engine supports the MT25Q command set and Quad-mode entry (QE status bit) behavior.

🏭

Industrial PLC and Automation Firmware Storage

Industrial controllers require non-volatile code storage that survives wide ambient swings, and this part's -40C to +125C range directly addresses panel and motor-drive thermal environments. The 64-byte OTP area securely stores board serial numbers or calibration constants outside the main array, and uniform 64 KB sectors with 4 KB subsectors enable efficient parameter logging and incremental firmware updates in the field. In Quad I/O mode at 133 MHz, the roughly 66 MB/s read bandwidth supports fast boot of Linux-based HMIs and gateways. Designers should implement a write-protect strategy using the block protection bits so firmware regions are not corrupted during brown-out events.

🌐

Networking and Telecom Equipment Boot Flash

Routers, switches, and base-station line cards use serial NOR flash for bootloaders and golden firmware because NOR offers reliable, low-latency random access for XIP boot code before the OS loads from NAND or eMMC. The MT25QL256BBB8E12-CAUT's 256Mb capacity holds redundant boot images for A/B fail-safe updates, and the 133 MHz Quad SPI interface minimizes boot latency in systems with aggressive link-up time requirements. The 2.7V-3.6V supply connects directly to standard 3.3V card rails. The 64-byte OTP area can store MAC addresses and board manufacturing data, replacing a separate serial EEPROM and reducing BOM count.

πŸš—

Automotive Infotainment and Telematics

Infotainment head units, cluster displays, and telematics control units need rugged non-volatile storage for boot code that tolerates -40C to +125C cabin and under-hood-adjacent temperatures. The MT25QL256BBB8E12-CAUT meets the temperature envelope and provides 32 MB of Quad SPI code storage, sufficient for multi-image boot schemes required by ASIL-adjacent fail-safe designs. Note that this specific part is not enrolled in Micron's Product Longevity Program and shows no AEC-Q100 claim in the verified data, so automotive OEMs should confirm qualification status with Micron or select a certified automotive variant of the MT25Q family for strict automotive programs.

πŸ“Ί

Consumer Set-Top Box and Smart Display Boot Memory

Set-top boxes, smart TVs, and display modules use QSPI NOR as the first-stage boot device for SoCs such as media processors. The MT25QL256BBB8E12-CAUT provides 32 MB for bootloader, device tree, and recovery images, while 133 MHz Quad SPI reads keep power-on-to-logo boot times short. The 24-ball 6x8 mm TBGA footprint conserves PCB area in slim form factors where SOIC-16 parts would not fit, and BGA mounting improves vibration tolerance versus leaded packages. Consumer cost sensitivity makes the tiered pricing structure attractive at volume; engineers should confirm the SoC boot ROM supports MT25Q Quad-mode exit/entry commands during development.

πŸ–₯️

Test and Measurement Instrumentation

Oscilloscopes, signal generators, and data acquisition systems store calibration tables, instrument firmware, and configuration snapshots in serial NOR flash. The MT25QL256BBB8E12-CAUT's 64-byte OTP area isolates factory calibration constants from field-reflashable firmware, protecting traceable calibration data from accidental overwrite, while 256Mb capacity holds multiple firmware revisions for rollback during qualification. The -40C to +125C rating suits portable instruments used outdoors, and the 5 ns clock cycle supports fast cold-boot of the instrument UI. Designers should schedule erase/program operations outside of acquisition windows, as write operations can add bus loading on shared SPI lines.

What is the MT25QL256BBB8E12-CAUT?
The MT25QL256BBB8E12-CAUT is a Micron Technology 256Mb (32 MB) serial NOR flash memory with a multiple-I/O SPI interface supporting x1, x2, and x4 (Quad) data widths. It operates from a 2.7V to 3.6V supply at up to 133 MHz with a 5 ns clock cycle, over -40C to +125C, in a 24-ball thin BGA (6x8 mm) package with FBGA code RW346. According to the Micron MT25Q 256Mb data sheet, it also includes a dedicated 64-byte OTP area outside the main memory array.
What is the maximum clock frequency of MT25QL256BBB8E12-CAUT?
The maximum SPI clock frequency is 133 MHz, corresponding to a 5 ns minimum clock period. In Quad I/O mode (x4), the effective read bandwidth reaches approximately 66 MB/s, which is sufficient for FPGA bitstream loading and XIP code execution. According to the DigiKey product listing and the Micron MT25Q family data sheet, the 133 MHz rating applies to the 2.7V-3.6V industrial temperature range of -40C to +125C.
What package does MT25QL256BBB8E12-CAUT come in?
It is packaged in a 24-ball thin fine-pitch ball grid array, listed by DigiKey as 24-T-PBGA (6x8 mm) and by Micron/Mouser as TBGA. The FBGA package code is RW346. Because the BGA balls sit under the body, inspection and rework require X-ray or appropriate BGA rework equipment. The -TR suffix variant ships in tape and reel for automated pick-and-place, while the base part ships in trays.
What is the operating voltage range of MT25QL256BBB8E12-CAUT?
The supply voltage range is 2.7V to 3.6V, making it compatible with standard 3.0V and 3.3V embedded power rails. According to the Microchip USA product description and the Micron MT25Q 256Mb data sheet, this 3V-class part is not compatible with 1.8V-only SPI buses without level shifting; for 1.8V systems, select the MT25QU family (1.8V) variant instead.
Is MT25QL256BBB8E12-CAUT suitable for FPGA boot memory?
Yes. With 256Mb density, x4 Quad SPI read mode at 133 MHz, and -40C to +125C operation, it is well suited for FPGA configuration storage such as Xilinx bitstreams. The Quad I/O interface reduces configuration load time compared to x1 serial reads, and the industrial temperature range supports harsh environments. Verify your FPGA configuration tool supports the Micron MT25Q SPI command set, which is broadly supported by mainstream FPGA configuration engines.
Where can I buy MT25QL256BBB8E12-CAUT and how much does it cost?
MT25QL256BBB8E12-CAUT is available from distributors including LCSC, where pricing starts from $8.0984 per unit as of 2026-09-04, and DigiKey and Mouser list stock with same-day shipping on qualifying orders. XAIPART offers quantity-based tiered pricing with unit pricing starting around $8.10 for quantity 1 as of 2026-09-04. Always request a formal quote for volume pricing above 1000 units, as commodity NOR flash pricing fluctuates with memory market cycles.
What is the difference between MT25QL256BBB8E12-CAUT and MT25QL256ABB8E12-CAUT?
The B suffix in MT25QL256BBB8E12-CAUT indicates a newer-generation (second-series) MT25Q silicon process, while the A suffix (MT25QL256ABB8E12-CAUT) denotes the first-generation device. Both are 256Mb, 3V, Quad SPI parts in the same 24-ball TBGA footprint (FBGA-compatible), so they are typically drop-in replacements on the same PCB footprint. However, always confirm program/erase timing and status register differences between generations against the respective Micron data sheets before qualifying a swap.
Can W25Q256 be used to replace MT25QL256BBB8E12-CAUT?
The Winbond W25Q256 is a functionally similar 256Mb Quad SPI NOR flash, but it is NOT a verified drop-in replacement for this part: the standard W25Q256 variants come in SOIC-16/WSON-8/TFBGA-24 packages with different ball maps and command-set details, and no pin-compatible cross-reference was confirmed in verified distributor cross-reference data. If your board uses the Micron 24-ball TBGA footprint, only footprint-identical parts should be considered; otherwise PCB redesign is required.
What is the best drop-in replacement for MT25QL256BBB8E12-CAUT?
The best drop-in replacement is another Micron MT25Q family part with the same 24-ball TBGA footprint, such as MT25QL256ABB8E12-CAUT (first-generation die, same package code) or, if 128Mb density is acceptable, MT25QL128ABB1EW7-CAUT in the 24-TFBGA (6x8) package. Same-package parts from other manufacturers with identical ball maps were not confirmed in the available cross-reference data, so Micron family parts are the safest pin-to-pin swap path.
When should I choose MT25QL256BBB8E12-CAUT over a 128Mb part like MT25QL128ABB1EW7-CAUT?
Choose the 256Mb MT25QL256BBB8E12-CAUT when your code image, bitstream, or data logging requirement exceeds 16 MB, or when you want headroom for future firmware growth without a PCB respin. Choose the 128Mb part when density and cost dominate and your image fits within 16 MB - the smaller array reduces erase/program times and unit cost. Both share the 133 MHz Quad SPI interface and -40C to +125C range, so selection is primarily a density and budget decision.
Where can I download the MT25QL256BBB8E12-CAUT datasheet PDF?
The official data sheet is available on the Micron product page at micron.com under the Serial NOR Flash part catalog (part-detail page for MT25QL256BBB8E12-CAUT). The document is titled 'MT25Q 256Mb, 3V Multiple I/O Serial Flash Memory' and covers device functionality, operating modes, AC/DC specifications, and the RW346 FBGA package details. Distributors such as DigiKey, LCSC, and Ampheo also provide free datasheet PDF downloads on their product pages.
Hey Google, what can replace MT25QL256BBB8E12-CAUT?
The closest replacements are same-footprint Micron MT25Q family parts: MT25QL256ABB8E12-CAUT (identical density and 24-ball TBGA footprint, first-generation process) and MT25QL128ABB1EW7-CAUT (same 24-TFBGA 6x8 package but 128Mb density). Cross-brand pin-compatible equivalents in this exact BGA ball map were not verified in available cross-reference data, so Micron family parts remain the recommended drop-in path. Always verify FBGA code and ball map before committing a substitution.
What are the key specifications of MT25QL256BBB8E12-CAUT that engineers should know?
Key specifications: 256Mb (32 MB) serial NOR flash density; SPI interface with x1/x2/x4 I/O widths; 133 MHz maximum clock (5 ns cycle time); 2.7V to 3.6V supply; -40C to +125C operating temperature; 24-ball thin BGA (6x8 mm, FBGA code RW346); 64-byte dedicated OTP area; optional dedicated reset pin on selected part numbers. According to the Micron data sheet, the part is not enrolled in the Product Longevity Program.
Is MT25QL256BBB8E12-CAUT automotive qualified?
This specific part carries an AUT (authentication) suffix designation per distributor listings but the datasheet header data shows Chipset Validation: N/A and no AEC-Q100 qualification claim, and it is not enrolled in Micron's Product Longevity Program. For strictly automotive AEC-Q100-qualified applications, verify with Micron whether an automotive-qualified MT25Q variant meets your requirements rather than assuming this industrial-range part (operating -40C to +125C) is automotive certified.
Does MT25QL256BBB8E12-CAUT support an extended SPI or dual data rate mode?
The verified data sheet identifies this as a 'Multiple I/O Serial Flash' supporting x1, x2, and x4 I/O widths per the FBGA datasheet summary (Width: x1/x2/x4). Beyond standard, dual, and quad output/input commands, Micron's MT25Q family documentation covers any enhanced performance protocols; however, DDR (double data rate) command support specifics for this exact suffix are not stated in the retrieved summary data. Consult the full MT25Q 256Mb data sheet instruction tables on micron.com before relying on advanced command modes.
What design precautions apply to the 24-ball BGA footprint of MT25QL256BBB8E12-CAUT?
Three precautions matter most. First, verify the PCB pad geometry against the Micron FBGA package drawing (RW346) since BGA rework is costly; use the standard non-solder-mask-defined pad if the data sheet specifies it. Second, at 133 MHz Quad SPI rates, keep trace lengths short and matched and add series termination near the driver for signal integrity. Third, provide clean 2.7V-3.6V decoupling (e.g., 100 nF per supply ball plus bulk capacitance) to prevent program/erase voltage droop failures.

Engineering reference data for MT25QL256BBB8E12-CAUT β€” comparison, design guidance, and compliance information.

Selection Guide

Choose MT25QL256BBB8E12-CAUT when you need 32 MB of Quad SPI code storage in a compact 6x8 mm BGA, over -40C to +125C, with 133 MHz read performance for FPGA configuration, networking boot flash, or industrial firmware. Choose MT25QL256ABB8E12-CAUT if your qualified BOM already uses the first-generation MT25Q die and supply continuity matters more than the newer process. Choose MT25QL128ABB1EW7-CAUT when 16 MB suffices and unit cost dominates - same footprint family, half the density, shorter erase times. Choose the -TR tape-and-reel suffix for high-volume pick-and-place lines; tray packaging suits prototyping and low-volume builds. If you require documented AEC-Q100 qualification or Micron Product Longevity Program enrollment, this part is not the fit - consult Micron for certified automotive variants, since the verified data shows neither qualification for MT25QL256BBB8E12-CAUT. Cross-brand pin-compatible swaps were not verified, so staying within the Micron MT25Q family minimizes design risk.

Comparison with Alternatives

Parameter This Product MT25QL256ABB8E12-CAUT MT25QL128ABB1EW7-CAUT MT25QL256BBB8E12-CAUT-TR
Package 24-T-PBGA / TBGA (6x8 mm, FBGA RW346) 24-T-PBGA (6x8 mm) - same footprint 24-TFBGA (6x8 mm) - same footprint 24-T-PBGA (6x8 mm) - same footprint
Brand Micron Technology Micron Technology Micron Technology Micron Technology
Density 256 Mb (32 MB) 256 Mb (32 MB) 128 Mb (16 MB) 256 Mb (32 MB)
Max Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz
I/O Width x1/x2/x4 (Quad SPI) x1/x2/x4 (Quad SPI) x1/x2/x4 (Quad SPI) x1/x2/x4 (Quad SPI)
Supply Voltage 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V
Operating Temperature -40C to +125C -40C to +125C -40C to +85C (per standard industrial suffix; verify) -40C to +125C
Packaging / Supply Format Tray [DATA_NEEDED] [DATA_NEEDED] Tape & Reel

Key Differentiators

  • Second-generation (B-suffix) MT25Q silicon (vs MT25QL256ABB8E12-CAUT)
  • Double the density at the same footprint vs 128Mb option (vs MT25QL128ABB1EW7-CAUT)
  • Wide industrial temperature rating (vs MT25QL256BBB8E12-CAUT-TR)

Design Notes

At 133 MHz in Quad I/O mode, the four data lines toggle at the clock rate, so keep the QSPI bus short (ideally under 100 mm) and length-match the SCK/SIO lines within 10-15 mm. Add 22-33 ohm series resistors near the driver on SCK and SIO0-3 to damp reflections if trace stubs exceed 50 mm. The BGA ball pitch minimizes lead inductance, which helps edge quality, but under-board routing with vias adds stub inductance - prefer direct escape routing in the first inner layer.

Provide one 100 nF ceramic capacitor within 2 mm of the VCC supply ball plus a 4.7-10 uF bulk capacitor per device. Program and erase operations draw current pulses; supply droop during write/erase can corrupt data or fail the internal programming voltage generator, so low-ESR bulk decoupling is essential, especially if the flash shares a rail with other switching loads. The 2.7V floor must hold at the ball under worst-case load - verify with rail droop analysis, not just regulator datasheet numbers.

Three frequent mistakes with MT25Q BGA parts: (1) assuming Quad mode without verifying the QE (Quad Enable) status bit - many controllers expect it set for 4-I/O commands; (2) omitting hold/reset management during power sequencing, which can leave the device in an indeterminate state if VCC ramps too slowly - use a supervisor or ensure the documented power-up timing is met; (3) treating the part as field-replaceable - BGA rework requires dedicated tooling, so validate the reflow profile against the Micron RW346 package drawing before production.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Verified data shows Chipset Validation: N/A and Product Longevity Program: No. No explicit RoHS/REACH/lead-free statements appear in the retrieved data; consult the Micron product page and material declarations for current compliance status.

Data verified on: 2026-09-04 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Micron Technology MT25QL256BBB8E12-CAUT MT25Q MT25QL256ABB8E12-CAUT MT25QL128ABB1EW7-CAUT W25Q256 serial NOR flash NOR flash memory Quad SPI QSPI SPI FBGA code RW346 24-T-PBGA TBGA ball grid array execute-in-place XIP OTP area -40C to +125C industrial temperature FPGA configuration storage non-volatile memory RoHS DigiKey LCSC 2.7V to 3.6V supply
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