PIC16F15356T-I/ML - 8-bit XLP MCU, 28KB Flash, 28-QFN | Microchip
MPN: PIC16F15356T-I/ML β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.05 | $2.05 |
| 10 | $1.83 | $18.30 |
| 100 | $1.62 | $162.00 |
| 500 | $1.44 | $720.00 |
| 1,000 | $1.28 | $1,280.00 |
| 3,300 | $1.15 | $3,795.00 |
PIC16F15356T-I/ML Overview
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, peripherals and I/O on a single die. The PIC16F15356 belongs to the 8-bit microcontrollers segment of the broader microcontroller hierarchy (8-bit -> 16-bit -> 32-bit MCUs -> microprocessors) and specifically to the PIC16 family, which uses a Harvard architecture with separate program and data buses and a RISC instruction set optimized for deterministic, low-power embedded control.
Key differentiating features include 28KB of self-programmable Flash supporting live updates, the ADCC with averaging and oversampling that offloads signal conditioning from the core, and the four CLC blocks that allow hardware-level logic customization for mixed-signal front-ends. The XLP technology combines multiple low-power modes (Doze, Idle, Sleep with retention) with peripheral module disable to reach deep-sleep currents under 100 nA typical. The 28-QFN package is only 6x6 mm with an exposed thermal pad that lowers junction-to-ambient thermal resistance for higher clock operation.
Typical applications include consumer appliances, IoT sensor nodes, low-power wireless platforms, LED lighting controllers, small motor and fan controls, and human-machine interface panels. The combination of CWG and PWMs directly drives half-bridges for BLDC or fan control; the ADCC plus CLC allows stand-alone sensor signal chains; the dual EUSART supports RS-485 or LIN node connectivity.
When designing with this part, place a 100 nF decoupling capacitor on VDD within 2 mm of the pin and tie the exposed pad to a contiguous ground copper pour for thermal relief. Configure unused I/O as outputs low and enable the MCLR pin's internal weak pull-up only when needed to minimize sleep current.
This page consolidates distributor pricing, drop-in 28-QFN alternatives within the PIC16F153xx family, and practical design notes not found in a single section of the manufacturer datasheet.
Drop-in alternatives for PIC16F15356T-I/ML β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F15356T-I/ML (same form factor and footprint) β differing in ADC, PWM Channels, Package, Comparators, DAC.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
PIC16F15356-I/ML
β Drop-Inβ In Stock
$1.18 / Unit
View Datasheet βPIC16F15355-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15354-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15345-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15344-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15356T-I/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC16F153xx (XLP 16F) |
| Core | PIC 8-bit enhanced mid-range |
| Program Memory | 28 KB Flash (16K x 14 words) |
| SRAM | 2 KB |
| EEPROM | 256 B |
| Max CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| I/O Pins | 25 |
| ADC | 10-bit ADCC |
| DAC | 5-bit / 8-bit |
| PWM Channels | 4 (16-bit) |
| Comparators | 2 |
| CLC | 4 Configurable Logic Cells |
| CWG | Complementary Waveform Generator |
| EUSART | 2 |
| SPI / I2C | 2 (MSSP-type) |
| Package | 28-QFN (6x6 mm) with EP |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS | Compliant |
PIC16F15356T-I/ML Pin Configuration
| Pin 1 | VDD β Positive supply voltage |
| Pin 2 | RA0 β Port A bit 0 / IOC / ADC |
| Pin 3 | RA1 β Port A bit 1 / IOC / ADC |
| Pin 4 | RA2 β Port A bit 2 / IOC / ADC / DAC |
| Pin 5 | RA3 β Port A bit 3 / IOC / ADC |
| Pin 6 | RA4 β Port A bit 4 / IOC / ADC |
| Pin 7 | RA5 β Port A bit 5 / IOC / ADC |
| Pin 8 | RB4 β Port B bit 4 / IOC / PWM |
| Pin 9 | RB5 β Port B bit 5 / IOC / PWM |
| Pin 10 | RB6 β Port B bit 6 / IOC / I2C-SCL / PGC |
| Pin 11 | RB7 β Port B bit 7 / IOC / I2C-SDA / PGD |
| Pin 12 | RA6 β Port A bit 6 / IOC / OSC2 |
| Pin 13 | RA7 β Port A bit 7 / IOC / OSC1 |
| Pin 14 | RC0 β Port C bit 0 / IOC / PWM |
| Pin 15 | RC1 β Port C bit 1 / IOC / PWM |
| Pin 16 | RC2 β Port C bit 2 / IOC / PWM |
| Pin 17 | RC3 β Port C bit 3 / IOC / PWM / SCL |
| Pin 18 | RC4 β Port C bit 4 / IOC / SDA |
| Pin 19 | RC5 β Port C bit 5 / IOC |
| Pin 20 | VDD β Positive supply voltage (second) |
| Pin 21 | RC6 β Port C bit 6 / IOC / TX |
| Pin 22 | RC7 β Port C bit 7 / IOC / RX |
| Pin 23 | RB0 β Port B bit 0 / IOC / INT |
| Pin 24 | RB1 β Port B bit 1 / IOC / INT |
| Pin 25 | RB2 β Port B bit 2 / IOC |
| Pin 26 | RB3 β Port B bit 3 / IOC |
| Pin 27 | RA3/MCLR β Port A bit 3 / Master Clear Reset (active low) |
| Pin 28 | VSS β Ground reference |
Typical Applications
PIC16F15356T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Consumer Appliance Control, LED Lighting Controllers, Small Motor and Fan Control (BLDC / PWM), Human-Machine Interface (HMI) Panels, Industrial Sensor Conditioning and Edge Processing.
Battery-Powered IoT Sensor Nodes
The PIC16F15356T-I/ML is a strong fit for battery-powered IoT sensor endpoints because its XLP Sleep current is below 100 nA typical with RTCC running, and the Core Independent Peripherals (ADCC + CLC + EUSART) operate without CPU wake-up. With 28 KB Flash and 2 KB SRAM it accommodates typical LoRaWAN / Sigfox / Zigbee class-A stacks or Bluetooth Low Energy beacon firmware. The 10-bit ADCC with hardware averaging and oversampling reduces MCU wake time by 60-80% versus polled ADC reads, extending CR2032 coin-cell life from months to years. Operating from 2.3 V to 5.5 V means a single 3.3 V LDO can power the MCU directly from two AA cells or a lithium coin cell.
Recommended
Consumer Appliance Control
In consumer appliances such as coffee machines, blenders and air purifiers, the PIC16F15356T-I/ML drives multiple load types: brushed DC motors via the Complementary Waveform Generator (CWG) for synchronous half-bridge control, LED indicators through the four 16-bit PWM channels for dimming, and user interfaces via capacitive touch driven by the ADCC and CLC blocks. The 32 MHz CPU at 5 V handles user-interface event loops, sensor fusion and BLE control-plane comms through the two EUSART peripherals. Industrial -40 C to +85 C rating meets household appliance thermal environments, and the 28-QFN (6x6 mm) footprint fits compact control boards.
Recommended
LED Lighting Controllers
The PIC16F15356T-I/ML's four 16-bit PWM channels support high-resolution color-mixing for RGBW LED fixtures with 65536 levels per channel. The CWG and CLC blocks generate precise timing-critical blanking, dead-time insertion and current-sensing triggers for constant-current LED drivers without CPU intervention, reducing BOM cost by eliminating analog PWM controller ICs. Operating from 2.3 V to 5.5 V allows direct connection to 5 V mains-derived DC rails or 3.3 V battery systems. The 28-QFN EP package provides thermal headroom for applications where the MCU and LED driver share a single ground plane.
Recommended
Small Motor and Fan Control (BLDC / PWM)
The Complementary Waveform Generator (CWG) on the PIC16F15356T-I/ML provides hardware-generated complementary PWM outputs with programmable dead-time insertion, directly driving N-channel MOSFET half-bridges for 12 V or 24 V brushless DC fan and pump motors. The four 16-bit PWM channels combined with the CLC blocks can implement sensorless BEMF zero-crossing detection and PI speed control loops entirely in hardware, offloading the 32 MHz CPU to manage RS-485 or LIN network tasks. Industrial temperature range and 28-QFN package are well-suited to motor control PCBAs behind an IP54-rated enclosure.
Recommended
Human-Machine Interface (HMI) Panels
The PIC16F15356T-I/ML drives capacitive touch sliders and buttons using the ADCC and CTMU peripherals combined with CLC-based hardware timing, eliminating the need for a dedicated touch controller IC. With 28 KB Flash the device supports USB HID or CDC class stacks for direct panel-to-PC communication, and two EUSART ports enable RS-485 Modbus RTU to a host controller. The 32 MHz core runs GUI update loops at sub-millisecond latency while the two comparators provide safety-critical over-current monitoring. The 28-QFN EP package keeps the MCU footprint under 36 mm squared, fitting behind compact touch panels.
Recommended
Industrial Sensor Conditioning and Edge Processing
The PIC16F15356T-I/ML executes edge-processing tasks on 4-20 mA industrial sensors, thermistor bridges and strain gauges using its 10-bit ADCC with hardware averaging and the four CLC blocks for digital filtering. With 2 KB SRAM and 28 KB Flash the device runs Modbus RTU slave stacks over RS-485 via the two EUSART peripherals, plus local calibration coefficients stored in 256 B EEPROM. The Core Independent Peripherals (CIP) architecture means sensor acquisition, linearization and alarm thresholding continue even when the CPU sleeps, drawing under 100 nA. Industrial -40 C to +85 C qualification matches IEC 60068-2-1/2 industrial environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F15356T-I/ML β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F15356-I/ML | PIC16F15355-I/ML | PIC16F15354-I/ML | PIC16F15345-I/ML | PIC16F15344-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) EP | 28-QFN (6x6 mm) EP - same | 28-QFN (6x6 mm) EP - same | 28-QFN (6x6 mm) EP - same | 28-QFN (6x6 mm) EP - same | 28-QFN (6x6 mm) EP - same |
| Flash Memory | 28 KB | 28 KB | 14 KB (-50%) | 7 KB (-75%) | 14 KB (-50%) | 7 KB (-75%) |
| SRAM | 2 KB | 2 KB | 1 KB (-50%) | 512 B (-75%) | 1 KB (-50%) | 512 B (-75%) |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| GPIO Pins | 25 | 25 | 25 | 25 | 25 | 25 |
| CLC Blocks | 4 | 4 | 4 | 4 | 3 (-1) | 3 (-1) |
| ADC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC | 10-bit ADCC | 10-bit ADC | 10-bit ADC |
| CWG | Yes | Yes | Yes | Yes | Yes | No |
Key Differentiators
- 28 KB Flash doubles the program memory of the PIC16F15355 sibling (vs PIC16F15355-I/ML)
- Four CLC blocks enable hardware logic customization without CPU (vs PIC16F15344-I/ML)
- Complementary Waveform Generator (CWG) for half-bridge motor drive (vs PIC16F15344-I/ML)
- ADCC with hardware averaging reduces CPU wake time (vs PIC16F15345-I/ML)
Design Notes
Estimated: PIC16F15356T-I/ML active current at 32 MHz and 5 V is approximately 7 mA (per Microchip PIC16F153xx datasheet DC characteristics). Place a 100 nF ceramic decoupling capacitor on each VDD pin (1 and 20) within 2 mm of the package, plus a bulk 1-10 uF on the supply rail. For battery-powered designs, leverage Sleep mode (<100 nA with RTCC running) by configuring the ADCC and CLC blocks to wake the CPU only on threshold-crossing events, reducing average current by 10-100x.
The 28-QFN (6x6 mm) package has a thermal resistance (theta-JA) of approximately 45-55 C/W on a 2-layer FR4 board with standard copper. At 7 mA active and 5 V, worst-case power dissipation is about 35 mW, so thermal rise is well under 2 C in typical applications. However, when integrating power-hungry peripherals (CWG driving external MOSFETs at 250 kHz), ensure the exposed pad (pin 29, the thermal pad) is soldered to a contiguous ground copper pour of at least 50 mm squared to maintain junction temperature margin to the 85 C industrial limit.
Route the MCLR pin (pin 27) with a 10 kohm pull-up to VDD and a 100 nF cap to ground for in-circuit serial programming (ICSP). If the MCLR function is not needed, configure it as a digital input only with internal weak pull-up to reduce sleep current. Place the 32.768 kHz low-frequency crystal (SOSC) traces within 5 mm of the SOSCO/SOSCI pins (RC0/RC1) with a ground guard ring to minimize noise coupling into the RTCC timebase. For the 28-QFN EP package, use 0.25 mm via-array stitching under the exposed pad for thermal and electrical ground integrity.
Do not exceed the absolute maximum VDD of 6.5 V. Ensure unused GPIO are configured as outputs low (not inputs floating) to avoid parasitic current draw in the range of 1-5 uA per pin. When migrating code from PIC16F1939 or PIC16F188xx, verify that PPS (Peripheral Pin Select) mappings are explicitly re-assigned because the PIC16F15356 PPS register addresses differ from earlier families. Finally, enable the Fail-Safe Clock Monitor (FSCM) bit in CONFIG1 to automatically switch to the internal HFINTOSC if the external crystal fails, preventing system lockup.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C). AEC-Q100 not qualified in standard 'I' grade; AEC-Q100 qualified variants are 'VAO' suffix. Lead-free and halogen-free per Microchip material declarations.
