10AX115N3F40I2LG - Arria 10 GX FPGA 1150K LE | Intel F40 BGA
MPN: 10AX115N3F40I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9563.17 | $9,563.17 |
| 10 | $9200 | $92,000.00 |
| 50 | $8800 | $440,000.00 |
| 100 | $8450 | $845,000.00 |
| 250 | $8100 | $2,025,000.00 |
Drop-in alternatives for 10AX115N3F40I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F40I2LG
✅ Drop-In✓ In Stock
$7965.99 / Unit
View Datasheet →10AX115N3F40I2SG
✅ Drop-In✓ In Stock
$7100 / Unit
View Datasheet →10AX115N3F40E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2125 / Unit
View Datasheet →10AX115R3F40I2LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115N2F45I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$8750 / Unit
View Datasheet →10AX090N3F40I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9800 / Unit
View Datasheet →10AX115N3F40I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/O Count | 600 |
| Package | 1517-ball FCBGA (F40) |
| Process Technology | 20nm TSMC |
| Operating Temperature | -40C to +100C (industrial) |
| Transceiver Data Rate | Up to 17.4 Gbps |
| On-chip Memory | 28.05 Mbit |
| Hard Memory Controller | Yes (DDR3/DDR4/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 | Yes (x1/x2/x4/x8) |
| Hard Processor System | Optional dual ARM Cortex-A9 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Shipping Media | Tray (LG suffix) |
10AX115N3F40I2LG 1517-ball fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115N3F40I2LG (1517-ball fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N3F40I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N3F40I2LG is suitable for 6 applications: 100G Ethernet Line Card, Software-Defined Radio Baseband, Medical Imaging Accelerator, Broadcast Video Processing, ASIC Prototyping Platform, Industrial Motor Control.
100G Ethernet Line Card
The 10AX115N3F40I2LG is well suited for 100G Ethernet line cards in carrier-grade switches and routers. Its 17.4 Gbps transceiver tiles support CAUI-4 (4x25.78 Gbps) interfaces when paired with a retimer, while soft 100G MAC IP terminates the link layer. The 1,150,000 logic elements accommodate lookup tables, traffic managers, and packet parsing in parallel. With 28.05 Mbit on-chip memory and hard DDR4 controllers, the device handles line-rate table lookups. Compared with discrete PHY plus ASIC designs, a single Arria 10 consolidates PHY, MAC, and packet processing into one programmable device, simplifying BOM and accelerating NPI.
Recommended
Software-Defined Radio Baseband
For LTE and 5G baseband processing, the 10AX115N3F40I2LG combines variable-precision DSP blocks with up to 17.4 Gbps transceivers, enabling CPRI and OBSAI fronthaul aggregation. The 1,150,000 logic elements host channel cards, FFT/iFFT engines, and digital up/down conversion chains. Hardened memory controllers stream ADC samples into external DDR4 buffers while on-chip block RAM holds coefficient tables. Industrial -40C to +100C temperature grade supports outdoor remote-radio-head deployments. The 600 user I/Os handle JESD204B SerDes lanes to RF data converters, replacing multiple FPGAs with a single Arria 10 device.
Recommended
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems benefit from the 10AX115N3F40I2LG's combination of variable-precision DSP blocks and embedded memory bandwidth. The 1.15M logic elements reconstruct image slices in real time, while 28.05 Mbit on-chip memory buffers raw scan lines before back-projection. PCI Express Gen3 hard IP connects directly to the host processor, sustaining ~8 GBps data throughput for 4D imaging streams. The industrial temperature grade ensures reliability in clinical equipment that runs continuously. Compared with GPU-based accelerators, the FPGA delivers deterministic latency critical for synchronized acquisition across multiple transducers.
Recommended
Broadcast Video Processing
The 10AX115N3F40I2LG powers broadcast routers, video walls, and 4K/UHD signal processors by providing parallel pixel-pipeline logic at deterministic rates. Its 600 user I/Os interface to HDMI 2.0, SDI, and DisplayPort 1.2 bridges via external PHYs, while 17.4 Gbps transceivers drive 12G-SDI links for uncompressed 4K transport. The on-chip memory subsystem scales to handle color-space conversion, scaling, and frame-rate conversion without external DDR. According to the Arria 10 datasheet, the integrated hard memory controllers simplify PCB layout compared with multi-FPGA legacy designs.
Recommended
ASIC Prototyping Platform
ASIC design teams use the 10AX115N3F40I2LG as a vehicle to validate RTL before committing to mask sets, taking advantage of 1.15M logic elements, 28.05 Mbit block RAM, and Quartus Prime synthesis parity with downstream tools. Multiple FPGAs can be stitched together via 17.4 Gbps transceivers to prototype ASICs with millions of gates. Hard PCI Express Gen3 IP accelerates system-level bring-up, and the FCBGA-1517 F40 footprint supports standardized ASIC-emulation baseboards. Industrial temperature grade ensures the prototype boards exercise real-world thermal profiles before tape-out.
Recommended
Industrial Motor Control
Multi-axis motor drives use the 10AX115N3F40I2LG to implement field-oriented control loops, encoder feedback, and safety logic in a single device. The 1.15M logic elements run parallel control loops for up to 8 axes, while 17.4 Gbps transceivers connect to remote I/O via EtherCAT or SERCOS III. Industrial -40C to +100C temperature grade supports cabinet-free installation near motors. Hardened memory controllers interface to external DDR for trajectory buffer storage. Compared with MCU plus FPGA solutions, the Arria 10 consolidates control, commutation, and safety SIL-3 logic on one chip.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N3F40I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F40I2LG | 10AX115N3F40I2SG | 10AX115R3F40I2LG | 10AX090N3F40I2LG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | -3 (highest Fmax) | -2 (mid) | -3 (same) | -3 (same) | -3 (same) |
| Transceiver Variant | GX (17.4 Gbps) | GX (17.4 Gbps) | GX (17.4 Gbps) | GT (28.05 Gbps) | GX (17.4 Gbps) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (Mbit) | 28.05 | 28.05 | 28.05 | 28.05 | 22.0 |
| User I/O Count | 600 | 600 | 600 | 600 | 600 |
| Unit Price (qty 1) | ~$9,563 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the Arria 10 family (vs 10AX115N2F40I2LG)
- Industrial temperature range with GX transceivers (vs 10AX115R3F40I2LG)
- Tray packaging format (vs 10AX115N3F40I2SG)
Design Notes
The FCBGA-1517 package dissipates up to 30 W in typical 17.4 Gbps transceiver use. A heatsink with thermal interface material is required for industrial-temperature operation above ambient 60C. The exposed-die package must be reflowed using a profiled profile per JEDEC J-STD-020, and thermal vias under the BGA should be stitched to a copper pour on inner layers. Estimated: with no airflow at 85C ambient, junction temperature can exceed 110C; refer to Arria 10 thermal model for accurate simulation.
FCBGA-1517 requires at least a 12-layer PCB with stacked microvias and 0.4mm pitch escape routing. According to the Arria 10 datasheet, the transceiver reference clock inputs require 50-ohm controlled impedance with via-stub compensation. Power rail decoupling must follow Intel's recommended capacitor placement (1uF + 0.1uF + 10uF per pin group). PCB stack-up should target 50-ohm single-ended and 100-ohm differential impedances per PCIe Gen3 channel requirements.
The 10AX115N3F40I2LG requires five power rails: VCC (core), VCCPT (periphery), VCCR/T (transceiver), VCCH_GXB (transceiver channel), and VCCIO (I/O banks). According to the Arria 10 datasheet, ramp sequence is critical: VCC must rise before VCCPT, which must rise before VCCR/T. Reverse sequencing can latch the device into an unrecoverable state. Use a multi-rail power manager such as the LM3881 or EM21xx to enforce the sequence.
Avoid tying configuration pins (nCONFIG, MSEL[2:0], nSTATUS) to ground without consulting the configuration user guide; selecting the wrong MSEL mode can prevent JTAG or AS configuration from succeeding. Ensure CFGBVS and CDPE pins match the bank voltage for the chosen configuration scheme (1.8V or 2.5/3.0/3.3V). Use the Altera Pin-Out File Generator for the specific Quartus Prime version to avoid pin map revision mismatches.
Transceiver channel-to-channel skew should not exceed 50 ps for 17.4 Gbps operation; route TX and RX pairs symmetrically with matched via counts. According to the Arria 10 GX transceiver user guide, AC-coupling capacitors (100 nF) must be placed within 100 mils of the transmitter pins. Use IBIS-AMI models in Keysight ADS or Cadence Sigrity for channel compliance simulation before PCB commitment.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page. Halogen-free status not explicitly listed in retrieved data; verify with manufacturer. AEC-Q100 not applicable (FPGA is not automotive-qualified at the silicon level). Industrial -40C to +100C junction temperature is the standard reliability grade.
