10M08DCF484I7G - MAX 10 FPGA, 8K LE, 250 I/O, 484-FBGA | Intel
MPN: 10M08DCF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.25 | $42.25 |
| 10 | $38.95 | $389.50 |
| 100 | $35.4 | $3,540.00 |
| 500 | $31.85 | $15,925.00 |
| 1,000 | $28.2 | $28,200.00 |
Drop-in alternatives for 10M08DCF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DCF484C8G
✅ Drop-In✓ In Stock
$19.8 / Unit
View Datasheet →10M08DAF484I7G
✅ Drop-In✓ In Stock
$25.8 / Unit
View Datasheet →10M08DAF484I7P
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →10M08DAF484C8G
✅ Drop-In✓ In Stock
$27.65 / Unit
View Datasheet →10M04DAF484I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DCF484I7G Maximum Ratings & Electrical Characteristics
| Device Family | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory (Bits) | 387,072 |
| User Flash (Bits) | 378,880 |
| Maximum User I/O | 250 |
| Package | 484-FBGA |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| On-chip ADC | 12-bit, 1 MSPS |
| Configuration Method | On-die flash (instant-on) |
| PLLs | 4 |
| 18x18 Multipliers | 24 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V (LVCMOS/LVDS/SSTL) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M08DCF484I7G 484-fbga Pin Configuration Guide
Complete pinout information for 10M08DCF484I7G (484-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCF484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DCF484I7G is suitable for 6 applications: Industrial Machine Vision and Imaging, Factory Automation and Motor Control I/O Expansion, Display Bridging and Video Format Conversion, Test and Measurement Instrumentation, Low-Cost Software-Defined Radio Front End, Legacy Glue Logic and Bridge Replacement.
Industrial Machine Vision and Imaging
The 10M08DCF484I7G is well suited to industrial machine vision pipelines because its 250 user I/Os can simultaneously capture a parallel RGB camera interface, drive an LVDS display, and aggregate sensor buses (I2C, SPI, GPIO), while the 8,000 logic elements implement Bayer demosaicing, gamma correction, and region-of-interest extraction. The integrated 12-bit ADC at 1 MSPS allows direct monitoring of illumination LEDs and supply rails without an external ADC IC. Compared with a discrete MCU-plus-CPLD-plus-ADC implementation, the MAX 10 consolidates three chips into one, reducing BOM cost by roughly 30 percent and freeing board area for a smaller 484-FBGA footprint. Quartus Prime IP libraries provide ready-made Image Processing and Video Sync Generator blocks that shorten development cycles for typical camera-link replacement designs.
Recommended
Factory Automation and Motor Control I/O Expansion
The 10M08DCF484I7G excels as an I/O aggregator for factory-automation backplanes because the 250 LVCMOS/LVDS-capable pins can sink hundreds of optocoupler-isolated 24V digital inputs while the on-die 12-bit ADC samples analog current and voltage feedback for multi-axis motor control. Hard IP including 4 PLLs and 24 18x18 multipliers supports encoder decoding, PWM generation, and field-oriented-control math without soft logic penalties. Instant-on flash configuration is critical in safety-related machinery where the FPGA must be ready before the MCU queries it. Industrial-grade -40C to +100C operation and the 484-FBGA package with high I/O density make the 10M08 a common choice for multi-axis stepper and BLDC controller boards.
Recommended
Display Bridging and Video Format Conversion
In display-bridging applications the 10M08DCF484I7G converts between parallel RGB, LVDS, and MIPI-style video interfaces using its abundant 250 I/Os and dedicated LVDS serializer/deserializer hardware. The 387 Kbit of M9K embedded memory supports line-buffer and frame-rate-conversion FIFOs, while the dual-configuration flash allows secure boot plus golden-image recovery, important for field-upgradable signage. The integrated ADC and temperature sensor enable on-screen diagnostics for industrial HMI panels. Designers can leverage Altera/Intel Video IP cores in Quartus Prime to implement color-space conversion (RGB to YCbCr, etc.) with deterministic latency. The industrial temperature grade supports outdoor kiosk deployments without additional thermal hardening.
Recommended
Test and Measurement Instrumentation
The 10M08DCF484I7G is a frequent choice for test-and-measurement front ends because the integrated 12-bit ADC at 1 MSPS digitizes multi-channel analog sensor inputs (temperature, pressure, current) directly, while the 250 user I/Os drive relays, multiplexers, and front-panel keypads. The on-chip 378 Kbit user flash stores calibration coefficients and instrument firmware, eliminating an EEPROM from the BOM. Hardware multipliers accelerate DSP blocks such as FIR filtering and FFT computation common in stimulus-response measurement equipment. Instant-on configuration also shortens instrument boot time, improving production-line throughput. Industrial-grade operation supports laboratory and factory-floor deployment in a single SKU.
Recommended
Low-Cost Software-Defined Radio Front End
For entry-level SDR designs, the 10M08DCF484I7G implements digital down-conversion, channel filtering, and I/Q buffering using its 24 hardware 18x18 multipliers and 4 PLLs while the 250 I/Os interface directly to ADC/DAC LVDS data buses. The instant-on flash boot allows fast band-switching without external PROMs. Industrial-grade parts are valuable for portable SDR gear exposed to outdoor temperature swings. The 484-FBGA package's I/O density is sufficient for 14-bit dual-channel ADC interfaces plus auxiliary control signals. Hobby and commercial SDR products based on MAX 10 leverage its deterministic low-latency fabric for protocol decoding.
Recommended
Legacy Glue Logic and Bridge Replacement
The 10M08DCF484I7G is widely used to replace obsolete discrete logic, PAL/GAL devices, and legacy CPLDs in long-life industrial products because the on-die flash configuration eliminates an external boot PROM and the 8,000 LEs comfortably absorb large state machines plus bus-arbitration glue. Dual-configuration flash enables fail-safe firmware updates in the field, critical for installed equipment that cannot easily be returned for service. Industrial temperature grade and the 23x23 mm 484-FBGA footprint make it a drop-in modernization path for legacy boards originally designed around 5V CPLDs. Quartus Prime legacy pin-assignment import eases migration from older MAX devices.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DCF484C8G | 10M08DAF484I7G | 10M08DAF484I7P | 10M08DAF484C8G | 10M04DAF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| Embedded Memory (Bits) | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 | 189,696 (-50%) |
| Maximum User I/O | 250 | 250 | 250 | 250 | 250 | 178 (-29%) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Flash | Dual-configuration | Dual-configuration | Analog content | Analog content | Analog content | Analog content |
| Approx. Unit Price (USD, qty 100) | 35.40 | 29.50 (-17%) | 36.10 (+2%) | 36.10 (+2%) | 30.20 (-15%) | 30.80 (-13%) |
Key Differentiators
- Integrated 12-bit ADC eliminates external ADC IC (vs 10CL080YF484I7G (Cyclone 10 LP))
- On-die flash configuration enables instant-on (<10 ms boot) (vs 10CL080YF484I7G (Cyclone 10 LP))
- Dual-configuration flash allows field firmware updates with rollback (vs 10M08DAF484I7G (analog variant))
- Industrial temperature grade supports -40C to +100C (vs 10M08DCF484C8G (commercial variant))
Design Notes
The 484-FBGA package uses a 1.0 mm ball pitch and a 23x23 mm body, which requires at least a 4-layer PCB with laser-drilled microvias for fan-out routing. According to the Intel MAX 10 Pin Connection Guidelines, signals routed on the top layer must reach the perimeter through via-in-pad or dog-bone fan-out; route high-speed LVDS pairs with matched length within 50 mil tolerance. Decoupling: place 0.1 uF X7R ceramics on every VCC pin within 200 mil and add four 10 uF bulk capacitors around the package perimeter.
The 10M08DCF484I7G requires a 1.2V core rail plus a 2.5V or 3.3V analog/auxiliary rail, both of which must come up monotonically within the Intel power-sequencing specification (VCCAINT before VCCIO). Estimated: at 100 percent toggle on 250 LVCMOS outputs at 100 MHz, the device draws up to approximately 350 mA from the 1.2V core, so the regulator must supply at least 500 mA with 20 percent margin. Use a 3.3V LDO such as a TI TPS7A4531 or equivalent for low-noise analog rail support of the integrated ADC.
Route the LVDS pairs on an inner stripline layer adjacent to a continuous ground plane to control impedance (100 ohm differential). The 484-FBGA escape pattern must reserve microvia antipads under BGA balls; do not run signals through the keep-out zone, as this degrades solder-joint reliability. Keep analog ADC traces (ANAIN pins) short and guarded with ground pours to minimize digital coupling noise into the 12-bit ADC.
Do not assume the 10M08DCF484I7G is pin-compatible with non-MAX 10 FPGAs in similar 484-BGA packages - pin 1 orientation, ball matrix, and function are specific to MAX 10. Also, the 'I7' temperature grade only guarantees -40C to +100C junction; the junction-to-ambient thermal resistance of the 484-FBGA is approximately 20 C/W without airflow, meaning a 2 W internal dissipation will raise Tj by 40C above ambient, requiring airflow or thermal vias for high-utilization designs.
Compliance Information
RoHS compliant per Intel MAX 10 product page. Industrial temperature grade (I7) is not AEC-Q100 qualified; the device is targeted at industrial automation, not automotive.
