10M16DCF484A7G - MAX 10 FPGA, 16K LE, 484-FBGA | Altera
MPN: 10M16DCF484A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65.5 | $6,550.00 |
| 250 | $60 | $15,000.00 |
| 500 | $55.25 | $27,625.00 |
| 1,000 | $51 | $51,000.00 |
Drop-in alternatives for 10M16DCF484A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DAF484A7G
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →10M16DAF484I7G
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View Datasheet →10M16DAF484I7P
✅ Drop-In✓ In Stock
$53.05 / Unit
View Datasheet →10M16DAF484C7G
✅ Drop-In✓ In Stock
$55.5 / Unit
View Datasheet →10M08DCF484I7G
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View Datasheet →10M16DCF484A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Embedded Memory | 549 Kbits |
| Maximum User I/Os | 320 |
| Package | 484-ball FBGA (F484) |
| Mounting Type | Surface Mount (SMD/SMT) |
| Operating Temperature | -40 C to +125 C (Automotive) |
| Core Supply Voltage | 1.2 V |
| Process Technology | TSMC 55 nm embedded flash + SRAM |
| Configuration | Non-volatile, on-chip flash, instant-on |
| Temperature Grade | Automotive (A7G) |
| Terminal Form | Ball |
| Terminal Count | 484 |
| Package Code | BGA (FineLine BGA) |
| RoHS Status | Compliant |
10M16DCF484A7G bga (fineline bga) Pin Configuration Guide
Complete pinout information for 10M16DCF484A7G (bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCF484A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCF484A7G is suitable for 6 applications: Industrial Motor Control, Automotive Driver Assistance, IoT Edge Gateways, Video Bridging and Format Conversion, Factory Automation Controllers, Medical Patient Monitoring.
Industrial Motor Control
The 10M16DCF484A7G fits industrial motor control designs because it integrates 16K logic elements plus 549 Kbits block RAM, enough to implement field-oriented control (FOC), PWM generation, and encoder feedback processing in a single chip. Its automotive -40 C to +125 C temperature grade handles harsh factory environments with high ambient temperatures near motor housings. The 320 user I/Os accommodate multiple encoder inputs, Hall sensor channels, and gate driver interfaces without external logic. The on-chip 12-bit ADC simplifies current-sensing feedback, eliminating an external ADC and reducing BOM cost. Designers can use the embedded DSP blocks for fast math operations in the current loop, achieving sub-microsecond loop times.
Recommended
Automotive Driver Assistance
The 10M16DCF484A7G is suitable for ADAS subsystems such as rear-view camera bridges, sensor fusion pre-processors, and LED headlight controllers, where its automotive temperature grade (-40 C to +125 C) and instant-on flash configuration are critical. Its non-volatile boot in under 10 ms enables fast safety response times required for ISO 26262 functional safety systems. The 484-ball FBGA package provides 320 user I/Os to connect multiple CSI-2 camera interfaces, CAN-FD transceivers, and automotive Ethernet PHYs. The on-chip ADC monitors battery voltage and temperature for safety diagnostics. Designers can leverage the embedded DSP blocks for lane-detection preprocessing.
Recommended
IoT Edge Gateways
The 10M16DCF484A7G suits IoT edge gateways because its non-volatile instant-on configuration boots in milliseconds, ideal for event-driven wake-up from sleep states. Its 16K logic elements support multi-protocol bridging (Modbus, MQTT, BLE, LoRa) and local decision-making without round-trip to the cloud, reducing latency and cellular data cost. The 549 Kbits of block RAM buffer sensor data during intermittent connectivity, and the on-chip ADC monitors battery voltage in solar-powered deployments. With 320 I/Os, the device interfaces to multiple sensors, displays, and wireless modules in a single chip, replacing a microcontroller plus CPLD combination.
Recommended
Video Bridging and Format Conversion
The 10M16DCF484A7G handles video bridging tasks such as MIPI CSI-2 to parallel RGB conversion or HDMI retiming because its 16K logic elements plus embedded memory can buffer video frames at low resolutions. The 320 user I/Os in the F484 package accommodate the wide parallel buses required by video interfaces (up to 24-bit RGB plus control signals). The LVDS I/O support enables direct connection to LVDS displays without external transceivers, saving board space. The automotive temperature grade supports infotainment and instrument cluster designs operating continuously at high ambient temperatures inside dashboards.
Recommended
Factory Automation Controllers
The 10M16DCF484A7G fits factory automation PLCs and distributed I/O controllers because its 320 user I/Os can interface to many field sensors and actuators simultaneously, replacing multiple smaller FPGAs or a microcontroller plus CPLD combination. The instant-on non-volatile boot ensures deterministic startup, critical for safety shutdown sequencing on the factory floor. Its automotive-grade temperature range handles cabinet ambient temperatures that may exceed 85 C in enclosed control boxes. The on-chip ADC reads analog process variables (temperature, pressure, flow) directly, simplifying front-end analog design.
Recommended
Medical Patient Monitoring
The 10M16DCF484A7G can serve as the central logic in patient monitoring equipment (multi-parameter monitors, infusion pumps) where its automotive-grade temperature reliability and instant-on non-volatile configuration provide safety benefits. The 16K logic elements implement real-time DSP filtering for ECG/EEG signal processing, while the 549 Kbits of block RAM buffer waveform data for display. The on-chip ADC reduces analog front-end complexity for low-frequency vital sign measurements. Designers should still perform IEC 60601-1 compliance testing and consider IEC 62304 software lifecycle requirements when using this FPGA in medical devices.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCF484A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAF484A7G | 10M16DAF484I7G | 10M16DAF484I7P | 10M16DAF484C7G | 10M08DCF484I7G |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 |
| Embedded Memory (Kbits) | 549 | 549 | 549 | 549 | 549 | 378 |
| Max User I/Os | 320 | 320 | 320 | 320 | 320 | 250 |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | -7 (A7G) | -7 | -7 | -7 | -7 | -7 |
| On-chip ADC | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) |
| Non-volatile Configuration | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) | Yes (on-chip flash) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest-density same-package drop-in option with automotive temp grade (vs 10M08DCF484I7G)
- Same die in automotive temp grade, true drop-in replacement (vs 10M16DAF484A7G)
- Non-volatile flash boot eliminates external boot PROM (vs Cyclone IV EP4CE16F484 (SRAM-based FPGA))
Design Notes
The 484-ball FBGA package has a 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stack-up with micro-via escape patterns. Per Intel's MAX 10 Hardware Design Guidelines, use 0.8 mm laser-drilled micro-vias on the top layer to fan out from each BGA ball, with through-vias on inner layers. Route all power and ground planes on inner layers to provide low-impedance return paths for high-speed LVDS pairs. Decoupling: place 0.1 uF X7R 0402 capacitors within 2 mm of every VCCINT and VCCIO ball, with bulk 10 uF tantalum or ceramic capacitors near each power rail.
The MAX 10 10M16 device requires multiple power rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O banks), VCCA (2.5 V analog supply for ADC), and VCCD_PLL (1.2 V PLL supply). Per the MAX 10 datasheet, the recommended power-on sequence is VCCINT first, then VCCIO, then VCCA, with monotonic ramp times between 0.2 ms and 100 ms. Designers should use a power sequencer or simple RC delay network to enforce this order and prevent I/O latch-up during power-up. Estimated power consumption for a typical 16K LE design at 100 MHz logic toggle rate is approximately 0.5 W to 1.0 W; full utilisation can reach 1.5 W requiring thermal relief on the PCB.
Do not leave the MSEL[2:0] configuration mode pins floating - tie them to VCCIO or GND through 10 kohm resistors to select the correct configuration mode (AS, JTAG, or passive serial). Per Intel's MAX 10 configuration guide, MSEL settings for the 10M16DCF484A7G in standard F484 are typically MSEL=010 for active serial mode. Always connect the JTAG TCK, TMS, TDI, TDO pins through a 10-pin or 20-pin header for programming and boundary-scan debug. Designers frequently forget to connect the nCONFIG, nSTATUS, and CONF_DONE pins to test points, which prevents failure analysis later.
Estimated: at maximum junction temperature of 125 C (automotive grade) and maximum power dissipation of 1.5 W, the required thermal resistance is theta_JA = (125 - 70) / 1.5 = 36.7 C/W for a 70 C ambient. The 484-ball FBGA package typically has theta_JA of 18-25 C/W with sufficient PCB copper area, but airflow may be needed if power dissipation exceeds 1.0 W. Place thermal vias in a grid under the BGA thermal pad area to conduct heat to internal ground planes. Always verify with the manufacturer's thermal model for the specific PCB stack-up.
Compliance Information
RoHS compliance and lead-free terminal finish confirmed by the G suffix in the OPN per Altera product page. AEC-Q100 qualification status not formally stated in the data provided; the 'A' suffix indicates automotive temperature grade but not full AEC-Q100 certification. REACH and halogen-free status unknown from verified data - request manufacturer documentation for full compliance verification.
