10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel
MPN: 10M25DAF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $135.2 | $1,352.00 |
| 100 | $118.75 | $11,875.00 |
| 250 | $108.4 | $27,100.00 |
| 500 | $99.8 | $49,900.00 |
Drop-in alternatives for 10M25DAF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF484I7P
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M25DAF484C8G
✅ Drop-In✓ In Stock
$50 / Unit
View Datasheet →10M25DAF484C7G
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →10M25DAF484A7G
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →10M25DCF484I7G
✅ Drop-In✓ In Stock
$44.95 / Unit
View Datasheet →10M16DAF484I7G
✅ Drop-In✓ In Stock
$60.4 / Unit
View Datasheet →10M25DAF484I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory (bits) | 691,200 |
| User I/Os | 360 |
| Package | 484-FBGA (FBGA) |
| Core Voltage | 1.2 V |
| Speed Grade | I7 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) |
| Mounting Type | Surface Mount (BGA) |
| Tray / Reel | Tray |
| 18 x 18 Multipliers | 66 |
| PLLs | 2 |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs |
| RoHS Status | Compliant |
10M25DAF484I7G 484-fbga (fbga) Pin Configuration Guide
Complete pinout information for 10M25DAF484I7G (484-fbga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF484I7G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Aggregation, I/O Expansion and Protocol Bridging, Factory Automation I/O Hub, Portable Test and Measurement, Industrial IoT Edge Gateway.
Industrial Motor Control
The 10M25DAF484I7G is well-suited for industrial motor control drives where multi-axis PWM generation, encoder feedback, and current-sense sampling must be processed with deterministic latency. The integrated 12-bit SAR ADC with up to 17 analog inputs handles current and voltage feedback without external ADCs, while the 360 user I/Os aggregate Hall sensors, QEI encoders, and gate-driver signals. The 25,000 logic elements implement field-oriented control (FOC) state machines in fabric, freeing the MCU from time-critical loops. The industrial temperature grade (-40 C to +100 C ambient) and dual on-chip configuration flash with instant-on support meet factory-floor reliability and safety-boot requirements.
Recommended
Video Bridging and Aggregation
For video bridge applications the 10M25DAF484I7G offers 360 user I/Os capable of routing multiple CMOS or LVDS camera streams into a parallel processor or serializer. The 66 embedded 18 x 18 multipliers and 2 PLLs handle pixel-clock multiplication, chroma conversion, and color-space transformation in fabric. Dual-configuration flash lets the device boot a debug image in production and a field-update image after deployment. The 484-FBGA package provides controlled-impedance escape for LVDS pairs without external repeaters, simplifying multi-camera PCB integration in machine-vision and surveillance products.
Recommended
I/O Expansion and Protocol Bridging
In I/O-expansion applications the 10M25DAF484I7G connects legacy parallel buses (ISA, 8051, 8-bit/16-bit SRAM) to modern serial interfaces (I2C, SPI, UART, I3C) without external bridge chips. The 25K logic elements and 691 Kb of embedded SRAM buffer transactions at line rate, while the 360 user I/Os handle wide legacy busses directly. Industrial I/O expansion cards use the device as a single-chip bridge, replacing discrete CPLD-plus-microcontroller solutions. The hardened ADC can monitor supply rails or temperature sensors on the same card, reducing BOM.
Recommended
Factory Automation I/O Hub
In factory automation the 10M25DAF484I7G aggregates 24 V opto-isolated industrial inputs and drives 24 V sink/source outputs via low-side FETs. The 360 user I/Os accommodate dozens of digital channels plus dedicated timer/PWM blocks for servo and stepper control. The integrated ADC monitors analog sensors such as pressure transducers and thermocouples. Dual-configuration flash enables secure remote firmware updates, important in Industry 4.0 retrofits where production lines are accessed over Ethernet. The industrial temperature grade meets IEC 60068-2-1/2 testing for cold and dry heat.
Recommended
Portable Test and Measurement
Portable instruments such as oscilloscope front-end digitizers, logic analyzers, and protocol exercisers benefit from the 10M25DAF484I7G's parallel I/O count and on-chip ADC. The 25K logic elements implement trigger engines and protocol decoders, the 691 Kb SRAM buffers samples, and the hardened ADC provides auxiliary analog measurements. Instant-on dual-boot flash lets handheld units boot in under 100 ms to a known-good image, critical for field technicians. The 484-FBGA package keeps the device footprint small despite 360 I/Os, helping shrink handheld form factors.
Recommended
Industrial IoT Edge Gateway
In edge-gateway designs the 10M25DAF484I7G serves as a hardware accelerator that pre-processes sensor data before forwarding to a host processor. Its 25K logic elements implement time-sensitive networking (TSN) traffic shapers, Modbus/TCP parsing, and AES-128 MACsec offload. The hardened ADC monitors chassis temperature and power rails, replacing discrete analog front-ends. Dual-configuration flash supports signed-image secure boot, required by IEC 62443 industrial cybersecurity guidelines. The 360 user I/Os aggregate multiple fieldbus segments onto a single gateway board.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF484I7P | 10M25DAF484C8G | 10M25DAF484C7G | 10M25DCF484I7G | 10M16DAF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) |
| Speed Grade | I7 (industrial) | I7 | C8 (commercial) | C7 (commercial) | I7 | I7 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial | Industrial |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 450,560 (-35%) |
| User I/Os | 360 | 360 | 360 | 360 | 360 | 320 (-11%) |
| Integrated ADC | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, fewer inputs (compact) | 12-bit SAR, 16 inputs |
| Unit Price @ Qty 1 | 142.50 USD | Similar (~142 USD) | ~118 USD (-17%) | ~115 USD (-19%) | ~132 USD (-7%) | ~95 USD (-33%) |
Key Differentiators
- Highest speed grade in the 10M25 family at industrial temperature (vs 10M25DAF484C8G)
- Maximum logic density for the 484-FBGA footprint (vs 10M16DAF484I7G)
- Full-feature-set MAX 10 device (vs 10M25DCF484I7G)
Design Notes
The 484-FBGA package uses 1.0 mm ball pitch and requires microvia (laser-drilled or plasma-etched) technology to escape the inner rows. Use a 4-layer to 6-layer PCB stack-up with via-in-pad for the inner balls, keep reference planes continuous under the BGA, and verify your manufacturer's minimum drill and aspect-ratio capability before committing to layout. Estimated: a 6-layer 1.4 mm total-thickness board with 0.1 mm laser vias and 0.2 mm capture pads typically supports 1.0 mm pitch FBGA escape on all rows.
The MAX 10 device in 484-FBGA typically dissipates 1-3 W depending on toggle rate and logic utilization. Use the Intel Quartus Prime PowerPlay early power estimator to size thermal relief before PCB layout. Estimated: at 25K LE utilization and 100 MHz toggle, junction temperature rise is approximately 15-20 C over ambient on a 4-layer board with a 50 mm x 50 mm copper pour. Provide thermal vias under the central BGA balls and consider a small heatsink for sealed enclosures.
Do not assume the I7, C8, C7, and A7 speed grades are interchangeable: the letter suffix indicates temperature grade (I = industrial, C = commercial, A = automotive-augmented) and the digit indicates speed bin. A C8 device in an industrial enclosure will fail thermal qualification. Verify the speed grade AND temperature grade against your environment before ordering. Also confirm Quartus Prime version supports the specific I7 speed grade; older 18.x releases do not include all MAX 10 device support.
Compliance Information
RoHS compliant per Intel product declaration; not AEC-Q100 qualified (MAX 10 family does not target automotive ASIL applications).
