10M40DCF672I7G - MAX 10 FPGA, 40K LEs, 1.29Mb, 672-FBGA | Intel
MPN: 10M40DCF672I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $100.82 | $100.82 |
| 10 | $95.78 | $957.80 |
| 100 | $87.45 | $8,745.00 |
| 500 | $79.2 | $39,600.00 |
| 1,000 | $72.65 | $72,650.00 |
Drop-in alternatives for 10M40DCF672I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M40DCF672C8G
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View Datasheet →10M40DCF672C7G
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View Datasheet →10M40DAF672I7G
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View Datasheet →10M40DAF672C8G
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View Datasheet →10M40DAF672C7G
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View Datasheet →10M40DCF672I7G Maximum Ratings & Electrical Characteristics
| Product Family | MAX 10 |
| Logic Elements (LEs) | 40,000 |
| Embedded Memory (M9K blocks) | 2,500 Kbits |
| Embedded User Flash | 1,290,240 bits |
| User I/O Count (max) | 500 |
| Multipliers (18x18) | 144 |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Process Node | 55 nm |
| Core Supply Voltage | 1.2 V |
| Operating Temperature Range | -40 C to +100 C (industrial) |
| Package | 672-ball FBGA (1.0 mm pitch) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Configuration Memory | On-die flash (non-volatile, dual-image) |
| Hard Memory Controller | DDR3 / LPDDR2 (integrated) |
| On-die ADC | Yes (1 MSPS, 12-bit equivalent) |
10M40DCF672I7G 672-ball fbga (1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10M40DCF672I7G (672-ball fbga (1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M40DCF672I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DCF672I7G is suitable for 6 applications: Industrial Motor Control Co-processor, Machine Vision Camera Bridge, Software-Defined Radio Front-End, Test and Measurement Instrument Front-End, Industrial IoT Edge Node, Display and Video Bridging.
Industrial Motor Control Co-processor
The 10M40DCF672I7G's 40K logic elements, 144 (18x18) multipliers, and 4 PLLs make it a natural fit for FOC (field-oriented control) motor co-processing paired with an MCU. With 500 user I/Os in the FBGA-672 package, the device can drive multiple resolver-to-digital converters, gate-drive PWM channels, and incremental encoder interfaces simultaneously. Designers place the MAX 10 between a host STM32 or similar MCU and the power stage, offloading the deterministic 50 us current-loop math. Industrial -40 C to +100 C operation and on-die flash (no external boot PROM) cut BOM count and enable instant-on safety interlocks after power-up.
Recommended
Machine Vision Camera Bridge
Pairing the 10M40DCF672I7G with image sensors such as the Aptina MT9P031 or Sony IMX264 requires multi-channel LVDS bridging, exposure-timing generation, and pixel-pipeline preprocessing that microcontrollers cannot execute in real time. The MAX 10's integrated LVDS transceivers, 16 global clock networks, and 2,500 Kbits of embedded M9K memory let it buffer one full HD line for edge-detection or histogram preprocessing before forwarding compressed frames over GigE Vision or USB3 Vision. Industrial temperature grade (-40 C to +100 C) tolerates factory-floor thermal stress, and the 672-ball FBGA's 500 I/Os support MIPI CSI-2 and parallel LVCMOS inputs in parallel.
Recommended
Software-Defined Radio Front-End
The 10M40DCF672I7G's 144 (18x18) DSP multipliers and 4 PLLs deliver enough signal-processing bandwidth for narrow-band SDR front-ends up to 50 MHz of instantaneous bandwidth. The device digitizes I/Q data from an external ADC, performs channelization, filtering, and demodulation (FM, AM, GMSK, or simple PSK), and presents decoded audio/data packets to a host CPU via SPI or UART. The 500 I/Os in the FBGA-672 support direct ADC/DAC connections and multiple antenna switches. Compared with a host-MCU DSP approach, the MAX 10 reduces latency from milliseconds to microseconds at the same BOM cost.
Recommended
Test and Measurement Instrument Front-End
For low-cost bench instruments such as protocol analyzers, arbitrary waveform generators, or LCR meters, the 10M40DCF672I7G provides protocol state machines, custom timing generation, and DSP pre-processing that commercial MCUs cannot deliver. The 40K LEs and 1.29 Mbit user flash hold calibration coefficients and personality firmware, while 500 user I/Os enable direct connection to ADC/DAC front-ends, LCD displays, and rotary encoders. Industrial temperature grade and on-die flash (no boot memory) reduce field failures and field-replaceable unit costs.
Recommended
Industrial IoT Edge Node
The 10M40DCF672I7G's instant-on non-volatile boot (under 10 ms from power-valid), on-die ADC, and integrated PLLs make it ideal for industrial IoT edge nodes that wake on alarm, sample sensors, and transmit telemetry. The 40K LEs can host Modbus TCP, EtherCAT slave, or IO-Link master stacks concurrently, while the 500 I/Os of the FBGA-672 interface to multiple sensor buses (RS-485, CAN, I2C, SPI). The 1.29 Mbit user flash holds configuration and node identity securely on-die, reducing attack surface compared with external SPI flash.
Recommended
Display and Video Bridging
Bridging LVDS / RGB / MIPI DSI display panels to a host GPU often requires a flexible timing controller that off-the-shelf scalers cannot deliver. The 10M40DCF672I7G, with its 500 I/Os and integrated LVDS transceivers, can be programmed to accept one display protocol and emit another with custom color-space conversion and gamma correction. The 2,500 Kbits of embedded M9K memory buffer up to one full HD line of pixel data, while the 40K LEs run scaling / deinterlacing algorithms in hardware. Industrial temperature operation and instant-on boot suit automotive and kiosk applications.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DCF672I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DCF672C8G | 10M40DCF672C7G | 10M40DAF672I7G | 10M40DAF672C8G | 10M40DAF672C7G |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| User Flash | 1.29 Mbit (dual-image) | 1.29 Mbit (dual-image) | 1.29 Mbit (dual-image) | Smaller (single-image DA) | Smaller (single-image DA) | Smaller (single-image DA) |
| Temperature Grade | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C |
| Speed Grade | I7 (industrial, fast) | C8 (commercial, standard) | C7 (commercial, fast) | I7 (industrial, fast) | C8 (commercial, standard) | C7 (commercial, fast) |
| User I/O Count | 500 | 500 | 500 | 500 | 500 | 500 |
| Approx. Unit Price (qty 1) | $100.82 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded SRAM (M9K) | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits |
| Multipliers (18x18) | 144 | 144 | 144 | 144 | 144 | 144 |
Key Differentiators
- Highest I/O count available in the MAX 10 family (vs 10M40DCF484I7G)
- Dual-image configuration flash with instant-on (vs 10M40DAF672I7G)
- Industrial temperature grade with full speed margin (vs 10M40DCF672C8G)
Design Notes
Estimated: the FBGA-672 footprint requires a 1.0 mm ball pitch with 0.5 mm pad diameter on the outer layer; place all 0.1 uF / 1 uF / 10 uF decoupling capacitors within 100 mils of each power pin pair. Route the JTAG chain (TCK / TMS / TDI / TDO) as a daisy-chain with 33 ohm series-termination resistors at the driver output, and place the JTAG header within 6 inches of the FPGA to avoid signal-integrity issues. Use Intel's pin connection guidelines for the 672-ball FBGA to avoid unconnected-pad thermal-mechanical failure modes.
The 10M40DCF672I7G requires a 1.2 V core supply (VCC), a 2.5 V / 3.3 V analog supply (VCCA), and a separate 2.5 V / 3.0 V charge-pump supply for flash programming. Use a low-noise LDO such as the LT3042 for the analog rails, and a switching regulator such as the TPS54331 for the 1.2 V core with bulk decoupling. Power sequencing must bring up VCCA before VCC; Intel's datasheet specifies the exact power-rail sequencing order. Estimated: at full utilization the device can draw 1.5-2.0 A from the 1.2 V rail, so the regulator must deliver at least 3 A peak.
LVDS and DDR3 interfaces on the 10M40DCF672I7G require matched-impedance routing (100 ohm differential for LVDS, 50 ohm single-ended / 100 ohm differential for DDR3) and length matching within +/- 25 mils on the byte lanes. Use the IBIS models from the Intel website to validate the routing topology before layout freeze. Address the DDR3 write-leveling and read-capture issues with the External Memory Interface Toolkit during board bring-up. Common pitfall: failing to enable the FPGA's on-die termination (OCT) for DDR3 - this causes signal-integrity failures on the byte lanes.
Estimated: at full utilization (40K LEs at 200 MHz toggle, 144 multipliers active, all I/O toggling at 100 MHz), the 10M40DCF672I7G dissipates approximately 1.5-2.0 W in still air. The FBGA-672 package's theta-JA is approximately 18 C/W with a JEDEC-standard 4-layer PCB; with the device operating at an industrial 100 C ambient, junction temperature can reach 130 C. For full-margin operation above 70 C ambient, increase PCB copper pour under the package or attach a small heatsink to keep Tj below 125 C.
Compliance Information
Lead-free (Pb-free) finish indicated by trailing 'G' in MPN. Not AEC-Q100 qualified - migrate to automotive-grade Cyclone family for AEC-Q100 needs. RoHS and REACH compliance per Intel product page; halogen-free status not explicitly published in the verified data.
