10M50DAF672C7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel/Altera
MPN: 10M50DAF672C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $71.77 | $71.77 |
| 10 | $64.59 | $645.90 |
| 100 | $57.42 | $5,742.00 |
| 250 | $52.83 | $13,207.50 |
| 500 | $48.25 | $24,125.00 |
Drop-in alternatives for 10M50DAF672C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DAF672C8G
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View Datasheet →10M50DAF672I7G
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View Datasheet →10M40DAF672C7G
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View Datasheet →10M40DAF672C8G
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$86.1 / Unit
View Datasheet →10M40DAF672I7G
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View Datasheet →10M50DAF672C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Logic Array Blocks (LAB) | 500 |
| Total Memory Bits | 1,677,312 |
| Embedded Memory | 1,638 Kbit |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Package | 672-FBGA (F672) |
| Package Code | BGA, Square, Ball |
| Number of Terminals | 672 |
| Configuration Memory | Dual-boot on-chip flash |
| Speed Grade | C7 |
| Temperature Grade | Commercial (other) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Integrated ADC | Yes (12-bit, on-chip) |
| DSP Blocks | Yes |
10M50DAF672C7G bga, square, ball Pin Configuration Guide
Complete pinout information for 10M50DAF672C7G (bga, square, ball package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF672C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DAF672C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Portable Medical Instrumentation, Low-Cost Video Bridging, Embedded Vision Pre-Processing, IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF672C7G's 50,000 logic elements and integrated 12-bit ADC blocks make it ideal for industrial motor-control designs. The 672-FBGA provides sufficient I/O for parallel encoder, resolver, and PWM interfaces, while the on-chip ADC samples current and voltage feedback without external converters. The MAX 10's dual-boot flash supports field firmware updates critical for installed-base motor drives. Compared with a discrete MCU-plus-FPGA partition, the integrated ADC cuts BOM cost and PCB area, while the non-volatile instant-on enables safe torque-disable within milliseconds of power-up.
Recommended
Factory Automation I/O Expansion
The 10M50DAF672C7G's high I/O count in the 672-FBGA package suits factory automation I/O expansion modules. With 50K LE the device can implement dozens of industrial protocols (Modbus, EtherCAT slaves, Profibus) in soft logic while the on-chip flash stores configuration and field-calibration data. The commercial C7 speed grade meets timing closure for sub-microsecond deterministic I/O response required by PLC backplanes. Engineers typically pair this FPGA with external PHY transceivers for galvanic isolation, leveraging the MAX 10's flexible I/O voltage standards.
Recommended
Portable Medical Instrumentation
The 10M50DAF672C7G's low-power non-volatile architecture and integrated ADC blocks suit battery-powered medical instrumentation such as patient monitors and portable ultrasound front-ends. The on-chip flash enables instant-on boot for clinician-activated devices, while the 1.2 V core minimizes quiescent power. The 12-bit ADC captures analog sensor channels (ECG, SpO2, temperature) directly, eliminating separate ADC ICs. Designers should verify IEC 60601 compliance for patient-contact circuits; the FPGA itself does not provide isolation, so external barrier components are still required.
Recommended
Low-Cost Video Bridging
The 10M50DAF672C7G's 50K LE supports video bridge designs converting between MIPI CSI-2, LVDS, CMOS parallel, and HDMI streams. The 672-FBGA's high I/O count accommodates wide parallel video buses plus LVDS serializer channels. Embedded DSP blocks accelerate scaling and color-space conversion, while the integrated ADC is unused in pure-digital video paths. The non-volatile flash allows rapid boot for camera modules and display controllers, and the commercial C7 grade meets timing for 1080p60 pixel-clock domains at moderate logic utilization.
Recommended
Embedded Vision Pre-Processing
The 10M50DAF672C7G delivers enough logic (50K LE) and DSP blocks to perform front-end image pre-processing (filtering, thresholding, Bayer conversion) before passing data to a host processor. The 672-FBGA's I/O count enables direct connection to parallel image sensors, while the integrated ADC monitors illumination and supply rails. Dual-boot flash supports A/B firmware schemes for safe field upgrades in vision-equipped IoT nodes. Compared with running pre-processing on the host CPU, the FPGA offloads deterministic per-pixel work, lowering system latency and power.
Recommended
IoT Edge Gateways
The 10M50DAF672C7G's combination of non-volatile boot, integrated ADC, and 50K LE makes it a fit for IoT edge gateways aggregating sensor data before forwarding to the cloud. The 672-FBGA package provides GPIO for RS-485, CAN, and I2C sensor networks, while the MAX 10's low standby power suits solar or battery-powered installations. The dual-boot flash enables OTA firmware rollback, and the commercial temperature grade covers most outdoor enclosures without requiring industrial-temp parts.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF672C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF672C8G | 10M50DAF672I7G | 10M40DAF672C7G | 10M40DAF672C8G | 10M40DAF672I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Logic Elements | 50,000 LE | 50,000 LE | 50,000 LE | 40,000 LE (-20%) | 40,000 LE (-20%) | 40,000 LE (-20%) |
| Speed Grade | C7 | C8 (slower) | I7 (industrial) | C7 | C8 (slower) | I7 (industrial) |
| Temperature Grade | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Industrial (-40C to +100C) |
| Embedded Memory | 1,638 Kbit | 1,638 Kbit | 1,638 Kbit | 1,260 Kbit (-23%) | 1,260 Kbit (-23%) | 1,260 Kbit (-23%) |
| Integrated ADC | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
| Non-Volatile Configuration | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) |
Key Differentiators
- Highest logic density in the 672-FBGA MAX 10 family (vs 10M40DAF672C7G)
- Faster speed grade than C8 equivalent (vs 10M50DAF672C8G)
- Commercial temperature grade offers lower cost versus industrial grade (vs 10M50DAF672I7G)
Design Notes
The 672-FBGA package requires a 1.0 mm pitch BGA fanout with microvia or via-in-pad technology for escape routing. Recommended stackup is a 6- or 8-layer PCB with continuous ground planes beneath the device to control return paths for high-speed LVDS and DDR interfaces. Decoupling capacitors (100 nF plus 10 uF bulk) must be placed within 5 mm of each power pin pair; Intel's MAX 10 hardware reference design provides a validated decoupling network.
The 1.2 V core supply must ramp monotonically within 0.2 ms to 100 ms; out-of-spec ramp rates can trigger configuration failures or partial flash writes. Use a sequenced power-supply IC (such as Intel's MAX 10 power-tree reference) with explicit Power-On-Reset (POR) monitoring. The I/O voltage rails (1.8 V, 2.5 V, 3.3 V) can be independent of core voltage but must settle before the configuration phase ends.
Do not confuse MAX 10 speed grades with one another: C7 is faster than C8 by one speed step, and selecting C8 may fail timing closure at the target Fmax. Also, the commercial temperature grade (this part) limits operation to 0 C to +85 C; for industrial environments, select the I7 suffix variant (e.g. 10M50DAF672I7G) without changing the PCB footprint.
Compliance Information
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified). Industrial temperature grade available as 10M50DAF672I7G variant.
