10M50DAF672I7G - MAX 10 FPGA 50K LE, 672-FBGA | Intel / Altera
MPN: 10M50DAF672I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185.72 | $185.72 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162.3 | $16,230.00 |
| 250 | $152.8 | $38,200.00 |
| 500 | $144.2 | $72,100.00 |
Drop-in alternatives for 10M50DAF672I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10M50DAF672I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (Bits) | 1,677,312 |
| Maximum User I/O | 500 |
| Number of Pins | 672 |
| Package | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Configuration Memory | Internal Flash (dual-configuration) |
| Multipliers (18×18) | 144 |
| PLLs | 4 |
| Hard Memory Controllers | 2 |
| Integrated ADC | Yes (12-bit SAR) |
| Operating Temperature | -40 °C to +100 °C (Industrial, I7G) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M50DAF672I7G 672-fbga (fineline bga, 27 mm × 27 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10M50DAF672I7G (672-fbga (fineline bga, 27 mm × 27 mm, 1.0 mm pitch) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF672I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DAF672I7G is suitable for 6 applications: Industrial Multi-Axis Motor Control, Industrial IoT Gateway and Protocol Bridging, Video Bridging and Display Controller, Portable Test and Measurement Instrumentation, Low-Cost ASIC Prototyping Platform, Embedded Vision Edge Processing.
Industrial Multi-Axis Motor Control
The 10M50DAF672I7G is an ideal fit for industrial multi-axis motor-control designs. Its 144 (18×18) DSP blocks handle field-oriented-control (FOC) math for three-axis servo drives simultaneously, while 4 PLLs generate synchronized PWM carrier waveforms at up to 400 kHz. The integrated 12-bit SAR ADC samples phase currents at 1 MSPS with deterministic latency, and 500 user I/O connect to encoders (EnDat, BiSS, SSI), Hall sensors, and gate drivers. According to Altera's industrial reference designs, a single MAX 10 device replaces a discrete MCU plus external ADC plus CPLD, reducing BOM cost by 30–40% and improving loop-bandwidth determinism for high-dynamic servo applications.
Recommended
Industrial IoT Gateway and Protocol Bridging
For industrial IoT gateways bridging Modbus, EtherCAT, PROFINET, and OPC-UA, the 10M50DAF672I7G provides deterministic hardware-level protocol conversion. Its 50K logic elements and 1.677 Mbit embedded memory fit multiple soft-IP protocol stacks concurrently without external SRAM, while dual-configuration Flash enables secure field firmware updates with rollback. The 672-FBGA package's 500 I/O accommodate multi-port Ethernet PHYs, RS-485 transceivers, and digital-isolation barriers. According to Altera application notes, the MAX 10's on-die Flash eliminates boot-time variability typical of external-PROM FPGAs, achieving <100 ms power-on-to-IO-ready for time-sensitive networks.
Recommended
Video Bridging and Display Controller
The 10M50DAF672I7G serves as a low-cost video bridge between MIPI CSI-2, LVDS, HDMI, and RGB parallel interfaces in industrial panels and HMI displays. Its 50K logic elements implement color-space conversion, de-interlacing, and on-screen display (OSD) blending, while the integrated DDR3 memory controller buffers video frames at up to 1.6 Gbps. The 672-FBGA 500 I/O handle 24-bit parallel RGB plus sideband control and touch-panel I2C. According to the Altera Video and Image Processing reference design, the MAX 10 fabric performs 1080p60 pixel processing at <5% logic utilization, leaving headroom for HMI logic on the same chip.
Recommended
Portable Test and Measurement Instrumentation
For portable test and measurement equipment—handheld oscilloscopes, logic analyzers, and field-installable data loggers—the 10M50DAF672I7G offers an ideal balance of integration and low power. Its 12-bit SAR ADC at 1 MSPS handles general-purpose analog front-end acquisition, while 50K logic elements implement trigger logic, decoders (I2C/SPI/UART/CAN), and DSP for FFT and statistical analysis. The internal Flash eliminates external boot PROM, shrinking PCB area by 50%. According to the MAX 10 datasheet, the 1.2 V core plus on-die regulators yields typical static current below 100 mA, extending battery runtime in field-portable instruments.
Recommended
Low-Cost ASIC Prototyping Platform
The 10M50DAF672I7G functions as a low-cost ASIC prototyping vehicle for pre-silicon validation. Its 50K logic elements map directly from synthesized Verilog or VHDL, while 144 DSP multipliers validate arithmetic-heavy designs (filters, FFTs, codecs) before tape-out. The 672-FBGA package exposes 500 I/O that mirror typical ASIC pad-ring counts, enabling realistic IO-timing and signal-integrity validation. According to Altera's ASIC prototyping documentation, MAX 10 devices integrate hardened PCIe, DDR, and ADC IP, eliminating soft-IP synthesis time and accelerating prototype bring-up by 2–3× versus pure FPGA flows.
Recommended
Embedded Vision Edge Processing
The 10M50DAF672I7G enables low-cost embedded-vision processing at the network edge, where power and BOM cost matter most. Its 144 DSP multipliers execute convolutional neural network (CNN) inference for simple object-detection tasks at 10–30 fps, while the integrated DDR3 controller handles frame buffers from external image sensors. The 12-bit ADC and 500 I/O connect directly to MIPI or parallel CMOS sensors without an external bridge chip. According to Altera's MAX 10 vision reference design, the device runs a quantized MobileNet variant at 15 fps while drawing less than 1.5 W total power, suiting battery-powered smart-camera and IoT-vision deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF672I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF672C8G | 10M50DAF672C7G | 10M40DAF672I7G | 10M40DAF672C8G | 10M40DCF672I7G |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (F672, 27x27 mm, 1.0 mm pitch) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 LE | 50,000 LE (same die) | 50,000 LE (same die) | 40,000 LE (-20%) | 40,000 LE (-20%) | 40,000 LE dual-core (-20%) |
| Embedded Memory (Bits) | 1,677,312 | 1,677,312 (same die) | 1,677,312 (same die) | 1,235,200 (-26%) | 1,235,200 (-26%) | 1,235,200 (-26%) |
| Maximum User I/O | 500 | 500 (same) | 500 (same) | 500 (same) | 500 (same) | 500 (same) |
| Temperature Grade | Industrial -40C to +100C (I7G) | Commercial 0-85C | Commercial 0-85C | Industrial -40C to +100C | Commercial 0-85C | Industrial -40C to +100C |
| Speed Grade | 7 (I7G) | 8 | 7 | 7 | 8 | 7 |
| Integrated ADC | 12-bit SAR | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) |
Key Differentiators
- On-die Flash configuration memory eliminates external boot PROM (vs 10M40DAF672I7G (same MAX 10 family, also has Flash; advantage vs Cyclone V FPGAs))
- Highest logic density in MAX 10 family at this package (vs 10M40DAF672I7G)
- Industrial temperature grade with speed grade 7 (vs 10M50DAF672C8G)
- Integrated 12-bit SAR ADC (vs Lattice ECP5 LFE5UM-85F672 (cross-brand))
- Hard DDR3 memory controllers reduce soft-IP overhead (vs Lattice ECP5 / Xilinx Spartan-7)
Design Notes
The 10M50DAF672I7G's 672-FBGA at 1.0 mm ball pitch requires a microvia HDI PCB stack-up with at least 1-2-1 or 2-2-2 laser-drilled vias. Use 4+ routing layers plus dedicated VCCINT (1.2 V) and GND planes. Via-in-pad with filled-and-capped microvias is recommended for the inner-row BGA balls to escape within the 1.0 mm pitch. According to the MAX 10 hardware-design guide, maintain a continuous reference plane beneath the device to control impedance for high-speed DDR3 interfaces (target 50 ohm single-ended, 100 ohm differential).
Decouple the 10M50DAF672I7G with a tiered capacitor network: one 0402 0.1 uF X7R per VCCINT/VCCA ball, plus 10 uF and 100 uF bulk capacitors near the device. Place small-value capacitors (0.1 uF, 1 nF) within 100 mils (2.5 mm) of each supply pin. According to Altera's power-distribution network guide, the 1.2 V core rail must hold within +/-30 mV under transient load for jitter-free PLL operation. Use at least 4 power-pins-per-plane strategy to minimize IR drop.
The 10M50DAF672I7G is specified for –40C to +100C junction temperature (I7G industrial grade). At typical utilization (50% LE, 70% toggle, 85C ambient), the 672-FBGA with theta_JA approximately 12 C/W requires no external heatsink. However, at full 50K-LE utilization in an enclosed industrial chassis, designers should validate with the Quartus Prime PowerPlay thermal model and provide at least 2 oz copper on inner planes for heat-spreading. A small 10x10 mm thermal pad on the BGA bottom side improves dissipation if board space allows.
For DDR3 interfaces on the 10M50DAF672I7G, use matched-length traces (within +/-25 mil for DQ/DQS byte groups) and 100-ohm differential impedance for clocks. The MAX 10's hard memory controller supports DDR3 up to 1.6 Gbps per pin. According to Altera's external memory interface handbook, simulate SI with IBIS-AMI models before PCB fabrication, and place VTT termination resistors within 200 mils of the FPGA receive pins. SSTL-135 signaling requires 1.35 V VDDQ plus VREF tracking the VDDQ/2 rail.
Common pitfalls when designing with the 10M50DAF672I7G include: (1) forgetting that dual-configuration Flash uses two pages, requiring pin configuration (CONFIG_SEL) to be pulled correctly at boot; (2) ignoring the JTAGEN pin—leave it high or pulled high via 10 kohm to enable in-system programming; (3) using unsupported I/O standards on configuration pins (all configuration I/O must be LVCMOS 3.3 V or 2.5 V); (4) skipping the CRC check on user-mode Flash images, which can lead to silent bit-rot in long-life industrial deployments.
Compliance Information
RoHS compliant per Altera product page and Heisener listing. AEC-Q100 not applicable—this is an industrial-grade (I7G) FPGA, not an automotive-qualified part. For automotive designs, refer to Altera's automotive-grade MAX 10 variants. Lead-free (Pb-free) reflow-compatible. Halogen-free status not explicitly stated in verified web data.
