10M50DCF484C7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
MPN: 10M50DCF484C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $62.8 | $6,280.00 |
| 500 | $55.4 | $27,700.00 |
| 1,000 | $48.9 | $48,900.00 |
Drop-in alternatives for 10M50DCF484C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DCF484C8G
✅ Drop-In✓ In Stock
$106.16 / Unit
View Datasheet →10M50DAF484C7G
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →10M50DCF484I7G
✅ Drop-In✓ In Stock
$99.6 / Unit
View Datasheet →10M40DCF484C7G
✅ Drop-In✓ In Stock
$124.2 / Unit
View Datasheet →10M40DCF484C8G
✅ Drop-In✓ In Stock
$53.9 / Unit
View Datasheet →10M40DAF484C7G
✅ Drop-In✓ In Stock
$92.4 / Unit
View Datasheet →10M50DCF484C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| User I/O Pins | 360 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Speed Grade | 7 |
| Operating Temperature Range | 0 C to 85 C (Commercial) |
| Package | 484-ball FBGA (F484) |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Configuration Memory | Internal flash (non-volatile) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
10M50DCF484C7G 23 x 23 mm Pin Configuration Guide
Complete pinout information for 10M50DCF484C7G (23 x 23 mm package) with 360 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF484C7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 360 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF484C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Low-Cost PCIe Endpoint Cards, Portable Test and Measurement Equipment, IoT Edge Gateways and Sensor Aggregation.
Industrial Motor Control
The 10M50DCF484C7G is well suited for industrial motor control because its 50,000 logic elements and embedded DSP blocks can implement field-oriented control (FOC) algorithms with PWM generation, encoder feedback, and current-sensing loops in a single device. With 360 user I/Os available on the F484 package, designers can connect multiple encoder channels, gate-driver control signals, and serial peripheral interfaces (SPI/I2C/UART) to host MCUs. The integrated configuration flash enables instant-on (<10 ms) operation, critical for safety-critical motor restart sequences. Engineers should note that for deployments outside 0 C to 85 C, the industrial-grade 10M50DCF484I7G should be selected instead.
Recommended
Factory Automation I/O Expansion
In factory-automation PLCs and distributed I/O modules, the 10M50DCF484C7G serves as a flexible I/O expander and protocol bridge. Its 360 user I/Os can be configured as LVCMOS 3.3V, LVDS, or RS-485 differential pairs to interface sensors, actuators, and industrial Ethernet MACs. The 1,677 Kbit embedded SRAM buffers high-speed EtherCAT, PROFINET, or EtherNet/IP frames without external memory. The MAX 10 instant-on flash configuration ensures deterministic boot for time-critical fieldbus nodes. Designers should verify signal-integrity margins on the 1.0 mm-pitch BGA fanout at 50 MHz+ toggle rates.
Recommended
Video Bridging and Display Controllers
The 10M50DCF484C7G can aggregate and convert video streams between LVDS, CMOS camera interfaces, and HDMI/DisplayPort bridges in industrial HMIs and kiosks. Its 50K LE capacity implements color-space conversion, frame-rate adaptation, and on-screen display (OSD) blending logic in a single chip. The 360 I/Os provide enough LVDS pairs for parallel camera input up to 1080p60. The non-volatile configuration flash enables instant-on video output without external boot delays. Designers targeting higher bandwidth should consider the 10M50DAF484C7G variant with hard DDR3 for line buffers.
Recommended
Low-Cost PCIe Endpoint Cards
For low-cost PCIe Gen2 x1 endpoint cards such as data-acquisition modules or industrial interface cards, the 10M50DCF484C7G provides a hard PCIe Gen2 IP block plus 50K LE for application logic. The 1.2 V core and integrated PLLs simplify PCIe clocking and spread-spectrum generation. With 360 user I/Os available, the F484 package supports multiple high-speed serial lanes plus parallel GPIO expansion. Designers should note that PCIe reference-clock input requires a 100 MHz HCSL source and proper AC-coupling capacitors on the TX/RX pairs.
Recommended
Portable Test and Measurement Equipment
Portable test instruments benefit from the 10M50DCF484C7G's instant-on capability, low power at 1.2 V core, and integration of ADC blocks for direct sensor interfacing. The 50K LE can implement DSP filtering, FFT processing, and display-driving logic in a single chip, reducing BOM cost and board area versus a discrete MCU-plus-FPGA design. The commercial 0 C to 85 C temperature range covers most indoor and outdoor-portable test scenarios. For battery-powered designs, designers should verify quiescent power budget with the Quartus Prime PowerPlay analyzer.
Recommended
IoT Edge Gateways and Sensor Aggregation
As an IoT edge gateway, the 10M50DCF484C7G aggregates multiple sensor interfaces (SPI, I2C, UART, LVDS) and pre-processes data with custom hardware accelerators running in DSP blocks. The 1,677 Kbit embedded SRAM buffers burst-mode sensor data before forwarding to a host processor over PCIe or Ethernet. The integrated configuration flash supports secure boot with AES-256 bitstream encryption, critical for tamper-resistant IoT deployments. Designers can pair this part with a Wi-Fi or cellular module for wireless IoT endpoints, using MAX 10's flexible GPIO for module control and status signaling.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF484C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF484C8G | 10M50DAF484C7G | 10M50DCF484I7G | 10M40DCF484C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 50,000 LE | 50,000 LE (same) | 50,000 LE (same) | 50,000 LE (same) | 40,000 LE (-20%) |
| Embedded Memory | 1,677,312 bits | 1,677,312 bits (same) | 1,677,312 bits (same) | 1,677,312 bits (same) | [DATA_NEEDED] |
| Speed Grade | 7 | 8 (faster) | 7 (same) | 7 (same) | 7 (same) |
| Temperature Range | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) |
| Hard DDR3 Controller | No | No | Yes | No | No |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash (same) | Internal Flash (same) | Internal Flash (same) | Internal Flash (same) |
| Approx. Unit Price (qty 1) | $78.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile instant-on configuration (vs 10M50DAF484C7G)
- Commercial temperature for cost-sensitive deployments (vs 10M50DCF484I7G)
- Maximum logic density in MAX 10 F484 commercial grade (vs 10M40DCF484C7G)
Design Notes
The F484 BGA has a 1.0 mm ball pitch on a 23 x 23 mm substrate. Use a 6 or 8-layer PCB stack-up with 50 ohm controlled-impedance traces for high-speed LVDS pairs. Each BGA ball requires a 0.5 mm via-in-pad with filled-and-capped plating to minimize inductance. Route all VCCINT and VCCA power balls through a dedicated inner-layer plane stitched with 0.1 uF and 10 uF decoupling capacitors placed as close to the package as routing permits.
MAX 10 FPGAs require a 1.2 V core rail (VCCINT), a 2.5 V or 3.3 V analog supply (VCCA), and a 1.2 V to 3.3 V I/O supply per bank. Estimated: at typical industrial utilization (60% LE, 50% RAM, 25 C ambient), core current is approximately 0.5 A to 1.0 A. Use a sequencer IC such as the LTC2923 or a discrete MOSFET-based circuit to enforce 2.5 V VCCA before 1.2 V VCCINT to prevent latch-up at power-up.
Do not confuse speed grade 7 (C7G) with industrial temperature (I7G). The 'C' indicates commercial temperature and the '7' is the speed grade; 'I' indicates industrial temperature. MAX 10 bitstreams are NOT pin-compatible across speed grades - always recompile in Quartus Prime with the correct device selected. Also, the D-suffix (DAF) variants include a hard DDR3 controller that requires dedicated bank assignment and pin planning for DDR3 differential clocks.
Compliance Information
RoHS compliant per FindIC and Altera product page specifications. Not AEC-Q100 qualified (FPGA, not automotive-grade). For halogen-free status, consult Intel directly - not stated in verified data.
