10M25DCF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel
MPN: 10M25DCF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58.4 | $58.40 |
| 10 | $54.1 | $541.00 |
| 100 | $49.25 | $4,925.00 |
| 250 | $45.8 | $11,450.00 |
| 500 | $42.1 | $21,050.00 |
Drop-in alternatives for 10M25DCF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DCF484A7G
✅ Drop-In✓ In Stock
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View Datasheet →10M25DCF484C7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF484C8G
✅ Drop-In✓ In Stock
$50 / Unit
View Datasheet →10M25DAF484C7G
✅ Drop-In✓ In Stock
$38.5 / Unit
View Datasheet →10M25DAF484A7G
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →10M25DAF484I7G
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View Datasheet →10M25DCF484C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 25,000 |
| Embedded Memory (Bits) | 691,200 |
| Number of I/O | 360 |
| Package | 484-BGA (FBGA) |
| Speed Grade | -8 |
| Temperature Grade | Commercial (0C to 85C) |
| Configuration Memory | Internal flash (non-volatile) |
| On-chip ADC | Yes (MAX 10 family feature) |
| Operating Temperature | 0C to 85C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10M25DCF484C8G 484-bga (fbga) Pin Configuration Guide
Complete pinout information for 10M25DCF484C8G (484-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DCF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DCF484C8G is suitable for 7 applications: Industrial Machine Vision, Motor Control and Drive, Factory Automation Backplane Bridges, Low-Cost Video Processing and Bridging, Sensor Fusion Hubs for IoT Edge Gateways, Portable Test and Measurement Instrumentation, ASIC Prototyping and Design Validation.
Industrial Machine Vision
The 10M25DCF484C8G's 25,000 logic elements and 360 user I/Os in a 484-BGA package make it well-suited to industrial machine vision pipelines. Designers can implement CoaXPress, GigE Vision, or Camera Link aggregation directly in the fabric, with the abundant M9K block RAM (691 Kbits total) absorbing line buffers and frame headers before forwarding data via LVDS or external DDR memory. The -8 speed grade supports the high fMAX needed for pixel-clock domain crossing at 200-300 MHz, while the on-chip flash configuration enables instant-on for line-scan cameras that must be ready before the conveyor starts moving.
Recommended
Motor Control and Drive
Field-oriented control (FOC) loops for three-phase motors demand deterministic, sub-microsecond computation - exactly what the 10M25DCF484C8G delivers via parallel fabric execution. Its 18x18 hardware multipliers (DSP blocks) handle Park/Clarke transforms and PID loops in parallel, while 360 I/Os support encoder, Hall-sensor, and PWM-channel fan-out for multi-axis drives. The instant-on behavior from on-chip flash removes boot latency that SRAM FPGAs incur, critical for safety-rated drive startups. The 484-BGA package also routes cleanly to gate-driver PCBs with controlled impedance.
Recommended
Factory Automation Backplane Bridges
Protocol-bridging nodes between Profinet, EtherCAT, Modbus TCP, and legacy fieldbus segments fit naturally on the 10M25DCF484C8G. With 25K logic elements the device can host several soft-IP stacks concurrently, and the 484-BGA provides the pin budget needed for parallel multi-port bridging (RJ45, fiber, RS-485) without external muxing. The non-volatile flash eliminates the boot PROM and lets the bridge come online within milliseconds - important for deterministic industrial restart behavior. The -8 speed grade sustains 100 Mbps Ethernet MAC timing closure comfortably.
Recommended
Low-Cost Video Processing and Bridging
The 10M25DCF484C8G can act as a video format converter, color-space transformer, or light scaler between HDMI, MIPI CSI-2, RGB parallel, and LVDS inputs. The 360 I/Os accommodate wide video buses plus sideband control, and the 691 Kbits of embedded SRAM buffers scan-line data without external DDR. The -C8 commercial speed grade supports pixel-clock domain conversions up to 148.5 MHz (720p/1080i timing). Designers building KVM extenders, video walls, or medical imaging front-ends frequently adopt this density point.
Recommended
Sensor Fusion Hubs for IoT Edge Gateways
Edge gateways aggregating SPI, I2C, UART, and CAN sensor streams benefit from the 10M25DCF484C8G's abundant I/O and DSP blocks. The fabric can run lightweight FFT and thresholding on vibration, acoustic, or temperature data before forwarding only events upstream. The on-chip flash reduces BOM for fan-less industrial gateways, and the commercial temperature grade fits indoor enclosure deployments. Quartus Prime and Platform Designer accelerate IP reuse across gateway SKUs.
Recommended
Portable Test and Measurement Instrumentation
Bench-top oscilloscopes, protocol analyzers, and JTAG debuggers use the 10M25DCF484C8G as a flexible capture-and-display engine. With 360 I/Os the device can sample 16+ digital channels at 500 MSPS alongside analog front-end conditioning, while the 18x18 multipliers perform on-the-fly FIR filtering. The non-volatile configuration means the instrument is ready immediately at power-on, with no boot delay visible to the user. USB and Ethernet interfaces are easily implemented in soft IP.
Recommended
ASIC Prototyping and Design Validation
For pre-silicon ASIC validation, the 10M25DCF484C8G offers 25K LEs of capacity - enough to prototype medium-complexity SoC peripherals, custom buses, and glue logic at near-real speed. The Quartus Prime design flow supports rapid RTL iteration, and the 484-BGA package's high I/O count enables ASIC-pin-count emulation including wide memory busses. When the target ASIC exceeds this density, designers move up to the 10M50 tier in the same package family, preserving PCB layout and IP investments.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DCF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DCF484A7G | 10M25DCF484C7G | 10M25DAF484C8G | 10M25DAF484C7G | 10M25DAF484A7G | 10M25DAF484I7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F484) | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Speed Grade | -8 | -7 | -7 | -8 | -7 | -7 | -7 |
| Temperature Grade | Commercial (0C to 85C) | Automotive-grade qualified (A7G) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Automotive-grade qualified (A7G) | Industrial (-40C to 100C) |
| On-chip ADC | No (standard DCF) | No | No | Yes (Analog-on-Demand enabled) | Yes | Yes | Yes |
| User I/O Count | 360 | 360 | 360 | 360 | 360 | 360 | 360 |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 |
| Config Memory | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
Key Differentiators
- Highest commercial speed grade in the 25K-LE F484 family (vs 10M25DCF484C7G)
- Standard fabric - lower cost than ADC-enabled variant (vs 10M25DAF484C8G)
- Single supply, instant-on configuration (vs Cyclone IV EP4CE25F484 (SRAM FPGA))
Design Notes
The 484-BGA package uses 1.0 mm ball pitch. Designers should adopt a 4-layer or 6-layer PCB stack-up with a dedicated ground plane directly under the device, and use via-in-pad with filled/capped vias for the inner-row BGA balls. Power decoupling requires 100 nF X7R capacitors within 1 mm of every VCCIO/VCCINT ball group, plus bulk 10 uF tantalum or ceramic at each voltage rail. Failure to provide proper decoupling risks power-supply noise coupling into the PLL and SERDES blocks.
Estimated: At -8 speed grade with all 25K LEs running at 200 MHz toggle rate and typical 30% switching activity, internal dissipation reaches approximately 1.5-2.0 W. The 484-BGA package's theta_JA (approximately 12-15 C/W with appropriate thermal vias and copper pour) yields a junction temperature rise of 25-30 C above ambient. Industrial designs should populate the full thermal-via array under the BGA exposed pad region to maintain a low junction-to-ambient thermal resistance.
Do not confuse the 'C8G' suffix ordering code with the -6 or -7 speed grades - the trailing '8' refers to the speed bin, not the temperature grade. Always verify the full OPN against the Intel MAX 10 ordering code reference. Mixing up speed grades can break timing closure on critical paths such as DDR3 interfaces. Also confirm Quartus Prime version supports the specific device-package-pin combination before PCB commitment.
Compliance Information
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - select 10M25DAF484A7G or other A7G OPN for AEC-Q100 automotive-grade applications. MSL level and exact VCCINT are not stated in the verified web data and are marked [DATA_NEEDED] in the specs array.
