5M2210ZF256C4N - MAX V CPLD 1700 LE FBGA-256 | Intel / Altera
MPN: 5M2210ZF256C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.29 | $7.29 |
| 10 | $6.95 | $69.50 |
| 100 | $6.4 | $640.00 |
| 500 | $5.85 | $2,925.00 |
| 1,000 | $5.2 | $5,200.00 |
Drop-in alternatives for 5M2210ZF256C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF256C5N
✅ Drop-In✓ In Stock
$5.49 / Unit
View Datasheet →5M2210ZF256A5N
✅ Drop-In✓ In Stock
$20.9 / Unit
View Datasheet →5M2210ZF256I5N
✅ Drop-In✓ In Stock
$17.5 / Unit
View Datasheet →5M2210ZF256C4
✅ Drop-In📋 Reference alternative (not in catalog)
5M2210ZF256C8N
✅ Drop-In📋 Reference alternative (not in catalog)
5M1270ZF256C4N
✅ Drop-In✓ In Stock
$14.95 / Unit
View Datasheet →5M2210ZF256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (LE) | 1700 |
| Logic Array Blocks (LAB) | 221 |
| User Flash Memory | 8192 bits |
| Internal RAM | 212 Kbits |
| Maximum User I/O Pins | 203 |
| User I/O Banks | 4 |
| Package | 256-ball FBGA (17 mm x 17 mm) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | 4 |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Bank Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 |
| Internal Oscillator | Yes |
| RoHS Status | Compliant (Pb-free ball finish) |
5M2210ZF256C4N Pin Configuration
| Pin A1 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin A2 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin A3 | VCCIO1 — Bank 1 I/O supply voltage |
| Pin A4 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin B1 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin B2 | GND — Ground |
| Pin B3 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin B4 | IO — User I/O pin (bank 1, VCCIO1) |
| Pin C1 | IO — User I/O pin (bank 2, VCCIO2) |
| Pin C2 | VCCIO2 — Bank 2 I/O supply voltage |
| Pin C3 | GND — Ground |
| Pin C4 | IO — User I/O pin (bank 2, VCCIO2) |
| Pin D1 | GND — Ground |
| Pin D2 | IO — User I/O pin (bank 2, VCCIO2) |
| Pin D3 | IO — User I/O pin (bank 2, VCCIO2) |
| Pin D4 | VCCINT — 1.8 V core supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF256C4N is suitable for 6 applications: Bus Interface Bridging (PCI / Local Bus), I/O Expansion for Microcontrollers and ASICs, Power-Supply Sequencing in Multi-Rail Systems, FPGA Configuration and Control Companion, Industrial Control and Factory Automation Logic, Consumer Set-Top Box and Display Glue Logic.
Bus Interface Bridging (PCI / Local Bus)
The 5M2210ZF256C4N is well suited as a PCI-to-local-bus bridge or as glue logic between microprocessors, ASICs, and memory subsystems. Its 1700 logic elements and 160 user I/Os in the FBGA-256 package provide sufficient capacity to implement full 32-bit/33 MHz PCI target or initiator state machines, address decoding, wait-state generation, and interrupt steering. The MAX V instant-on flash configuration boots in under 1 ms, eliminating external boot PROM complexity. The 4 VCCIO banks support mixed-voltage buses (3.3 V PCI plus 1.8 V or 2.5 V processor interface) on the same die, removing external level shifters. Engineers typically use JTAG (IEEE 1149.1) for in-system updates after PCB assembly.
Recommended
I/O Expansion for Microcontrollers and ASICs
Designers commonly use the 5M2210ZF256C4N as an I/O expander when a microcontroller or ASIC lacks sufficient GPIO or peripheral pins. With 160 user I/Os in the FBGA-256 package and four independently-powered VCCIO banks, the part can interface simultaneously to 1.8 V sensor arrays, 2.5 V memory buses, and 3.3 V host processors. The non-volatile flash configuration means the expansion personality persists across power cycles without firmware intervention. Typical implementations include keypad scanning, LED matrix driving, and parallel sensor aggregation, with 212 Kbits of internal RAM available for data buffering before interrupts wake the host CPU. The device is in-system programmable via JTAG for field upgrades.
Recommended
Power-Supply Sequencing in Multi-Rail Systems
The 5M2210ZF256C4N is widely deployed as a power-sequencing controller in multi-rail systems with FPGA, ASIC, or processor subsystems that require specific rail order. Its 4 VCCIO banks and up to 160 GPIOs can monitor PG (power-good) signals from multiple DC-DC converters and assert enable lines in a deterministic sequence with configurable delays. The internal oscillator and flash-based state retention allow reliable startup sequencing within 1 ms of input voltage qualification. Compared to dedicated sequencer ICs, the MAX V offers user-defined logic for fault handling, retry behavior, and EEPROM logging through its 8192-bit user flash. Designers often pair it with TI TPS7A4701 LDOs and PWM controllers for complete power-tree control.
Recommended
FPGA Configuration and Control Companion
The 5M2210ZF256C4N serves as a configuration and control companion to higher-density FPGAs such as Cyclone V or Stratix 10 devices. It can hold fallback bitstreams in its 8192-bit user flash, drive the FPGAs INITn and CONFIGn pins, monitor DONE status, and trigger multi-boot or fallback reconfiguration if the primary bitstream fails CRC check. The 4 VCCIO banks allow direct connection to 1.8 V, 2.5 V, and 3.3 V FPGA banks without level shifters. Because the MAX V boots instantly, it can begin supervising the FPGA from the moment system power stabilizes. JTAG chain management through the 5M2210ZF256C4N also lets engineers update FPGA bitstreams without a dedicated download cable.
Recommended
Industrial Control and Factory Automation Logic
Although rated 0C to 85C commercial, the 5M2210ZF256C4N is widely used in industrial control boards where the local ambient is controlled inside an enclosure. The 1700 logic elements are sufficient to implement multiple industrial protocols (Modbus RTU, parallel fieldbus, encoder quadrature decoding) in a single chip, while 160 user I/Os accommodate many 24 V-tolerant digital inputs through external resistor dividers. The MAX Vs flash-based non-volatile configuration survives brown-outs and unintended power cycles, eliminating field service calls to re-program devices. Engineers often pair the CPLD with isolated digital input modules and solid-state relay drivers. For harsher industrial sites, choose the 5M2210ZF256I7N industrial temperature variant instead.
Recommended
Consumer Set-Top Box and Display Glue Logic
In consumer set-top boxes, HDMI splitters, and digital signage controllers, the 5M2210ZF256C4N consolidates disparate interface bridges, level shifters, and discrete glue logic into one BGA. Common applications include I2S-to-I2C bridge logic, HDMI CEC message handling, LED status indicators, and front-panel button scan matrices. The 256-ball FBGA footprint suits the dense PCBs typical of these products, while the flash-based instant-on boot meets consumer product power-on latency requirements. Engineers use Quartus Prime to maintain firmware across SKUs by re-programming only the changed logic blocks via JTAG in production, and the part is compatible with lead-free reflow up to 260C peak per JEDEC J-STD-020.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF256C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF256C5N | 5M2210ZF256A5N | 5M2210ZF256I5N | 5M2210ZF256C8N | 5M1270ZF256C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-ball FBGA (17x17 mm) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Family | MAX V | MAX V - same | MAX V - same | MAX V - same | MAX V - same | MAX V - same |
| Logic Elements | 1700 | 1700 | 1700 | 1700 | 1700 | 1270 (-25%) |
| Speed Grade | 4 (slower) | 5 (faster) | 5 (faster) | 5 (faster) | 8 (slowest) | 4 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash | 8192 bits | 8192 bits | 8192 bits | 8192 bits | 8192 bits | 8192 bits |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 | JTAG - same | JTAG - same | JTAG - same | JTAG - same | JTAG - same |
Key Differentiators
- 1700 logic elements vs 1270 in 5M1270ZF256C4N at same FBGA-256 footprint (vs 5M1270ZF256C4N)
- Faster speed grade option (C5N) available with identical pinout (vs 5M2210ZF256C5N)
- Industrial temperature variant available in same package (vs 5M2210ZF256I5N)
Design Notes
Connect VCCINT (1.8 V) and all four VCCIO bank supplies even if a bank is unused; leave unused banks at 1.8 V to minimize leakage. Place a 0.1 uF X7R ceramic decoupling capacitor within 50 mil of every VCC pin and at least one 4.7 uF bulk capacitor per VCCIO bank. Power-supply sequencing is not strictly required because MAX V devices are designed to tolerate any-core-before-IO or IO-before-core ramp order, but in multi-rail systems follow the power-up sequence dictated by the FPGA or ASIC companion.
Estimated: the FBGA-256 package has a 1.0 mm ball pitch and 17 mm x 17 mm body. Use a 4-layer PCB minimum with a continuous ground plane on layer 2 directly under the BGA for return-path integrity. Microvia-in-pad or via-in-pad with filled-and-capped plating is recommended for the breakout fan-out, with trace widths of 4 mil to escape the inner rows. For prototype bring-up, allocate 2-3 days for first-article X-ray inspection because BGAs are prone to shorts and cold joints without optical inspection of the balls.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and place a 10 kohm pull-up on TCK and TMS to keep the TAP controller in a known state during power-up. Use series termination resistors (33 ohm) on high-speed clocks driving the MAX V clock inputs. Avoid routing JTAG signals adjacent to switching DC-DC converter traces; cross them at 90 degrees if necessary. The internal oscillator can be used as a clock source for slow control logic but is not suitable for high-speed interfaces; supply an external clock for designs requiring precise timing.
Do not leave unused I/O pins floating; explicitly configure them as outputs driven low, or as inputs with the weak pull-up enabled, in the Quartus Prime pin-planner. Floating I/Os can draw excessive current during power-up and contribute to in-rush that triggers brown-out on the 1.8 V core. Also verify VCCIO bank voltage matches the logic-level swing of connected peripherals; mismatched VCCIO can damage the I/O cell or cause logic errors. Always re-fit the design in Quartus Prime after editing pin assignments because changing a pin's bank may require re-routing of VCCIO power planes.
Compliance Information
RoHS compliant and Pb-free ball finish per the 'N' suffix in 'C4N'. Not AEC-Q100 qualified; the 5M2210ZF256I5N industrial variant is the recommended choice for AEC-Q100 style deployments per Intel CPLD qualification roadmap. Material declaration datasheet available from Intel on request.
