5M160ZE64C4N - MAX V CPLD 128 Macro 54 IOs EQFP-64 | Intel
MPN: 5M160ZE64C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.8 | $6.80 |
| 10 | $6.12 | $61.20 |
| 100 | $5.42 | $542.00 |
| 500 | $4.85 | $2,425.00 |
| 1,000 | $4.3 | $4,300.00 |
Drop-in alternatives for 5M160ZE64C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M160ZE64C5N
β Drop-Inβ In Stock
$4.95 / Unit
View Datasheet β5M160ZE64A5N
β Drop-Inβ In Stock
$6.2 / Unit
View Datasheet β5M160ZE64I4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
Contact for price
View Datasheet β5M160ZE100C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5M80ZE64C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2.1 / Unit
View Datasheet β5M40ZE64C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1.7 / Unit
View Datasheet β5M160ZE64C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device | 5M160Z |
| Logic Elements / Macrocells | 128 |
| Maximum User I/Os | 54 |
| User Flash Memory | 8 Kbits |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V MultiVolt |
| Speed Grade | C4 (tPD1 ~4.0 ns) |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Package | EQFP-64 (E64), 7x7x1.4 mm, 0.4 mm pitch |
| Configuration | Non-volatile flash, instant-on |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Internal Oscillator | Yes (programmable) |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2/3 |
| RoHS Status | Compliant |
| MSL Level | 3 |
| Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
5M160ZE64C4N Pin Configuration
| Pin 1 | I/O β User I/O pin (bank 1) |
| Pin 2 | I/O β User I/O pin (bank 1) |
| Pin 3 | I/O β User I/O pin (bank 1) |
| Pin 4 | I/O β User I/O pin (bank 1) |
| Pin 5 | I/O β User I/O pin (bank 1) |
| Pin 6 | I/O β User I/O pin (bank 1) |
| Pin 7 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 8 | I/O β User I/O pin (bank 1) |
| Pin 9 | I/O β User I/O pin (bank 1) |
| Pin 10 | I/O β User I/O pin (bank 1) |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β User I/O pin (bank 1) |
| Pin 13 | I/O β User I/O pin (bank 1) |
| Pin 14 | I/O β User I/O pin (bank 1) |
| Pin 15 | I/O β User I/O pin (bank 1) |
| Pin 16 | I/O β User I/O pin (bank 1) |
| Pin 17 | VCCINT β Core supply voltage (1.8 V) |
| Pin 18 | I/O β User I/O pin (bank 2) |
| Pin 19 | I/O β User I/O pin (bank 2) |
| Pin 20 | I/O β User I/O pin (bank 2) |
| Pin 21 | I/O β User I/O pin (bank 2) |
| Pin 22 | GND β Ground |
| Pin 23 | I/O β User I/O pin (bank 2) |
| Pin 24 | I/O β User I/O pin (bank 2) |
| Pin 25 | I/O β User I/O pin (bank 2) |
| Pin 26 | I/O β User I/O pin (bank 2) |
| Pin 27 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 28 | I/O β User I/O pin (bank 2) |
| Pin 29 | I/O β User I/O pin (bank 2) |
| Pin 30 | I/O β User I/O pin (bank 2) |
| Pin 31 | GND β Ground |
| Pin 32 | I/O β User I/O pin (bank 2) |
| Pin 33 | I/O β User I/O pin (bank 2) |
| Pin 34 | TDI β JTAG Test Data In |
| Pin 35 | TMS β JTAG Test Mode Select |
| Pin 36 | TCK β JTAG Test Clock |
| Pin 37 | TDO β JTAG Test Data Out |
| Pin 38 | I/O β User I/O pin (bank 2) |
| Pin 39 | I/O β User I/O pin (bank 2) |
| Pin 40 | I/O β User I/O pin (bank 3) |
| Pin 41 | I/O β User I/O pin (bank 3) |
| Pin 42 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 43 | I/O β User I/O pin (bank 3) |
| Pin 44 | I/O β User I/O pin (bank 3) |
| Pin 45 | GND β Ground |
| Pin 46 | I/O β User I/O pin (bank 3) |
| Pin 47 | I/O β User I/O pin (bank 3) |
| Pin 48 | I/O β User I/O pin (bank 3) |
| Pin 49 | I/O β User I/O pin (bank 3) |
| Pin 50 | I/O β User I/O pin (bank 3) |
| Pin 51 | I/O β User I/O pin (bank 3) |
| Pin 52 | I/O β User I/O pin (bank 3) |
| Pin 53 | GND β Ground |
| Pin 54 | I/O β User I/O pin (bank 3) |
| Pin 55 | I/O β User I/O pin (bank 3) |
| Pin 56 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 57 | I/O β User I/O pin (bank 3) |
| Pin 58 | I/O β User I/O pin (bank 4) |
| Pin 59 | I/O β User I/O pin (bank 4) |
| Pin 60 | I/O β User I/O pin (bank 4) |
| Pin 61 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 62 | I/O β User I/O pin (bank 4) |
| Pin 63 | I/O β User I/O pin (bank 4) |
| Pin 64 | I/O β User I/O pin (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M160ZE64C4N is suitable for 6 applications: Bus Interface Bridging, Industrial I/O Expansion, Power-Up/Down Sequencing, Address Decoding for Memory-Mapped Peripherals, State-Machine Controllers, Display and Touch-Panel Hub.
Bus Interface Bridging
The 5M160ZE64C4N is well suited as a bus bridge between microcontrollers and peripherals operating at different voltages, thanks to its MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V logic on the same die. With 128 macrocells and 4.0 ns tPD1 propagation delay, the device can implement glue logic, address-latch demultiplexing, and protocol conversion (e.g., SPI to parallel GPIO) without external logic. The flash-backed configuration means no boot PROM is required, simplifying BOM and reducing board area compared to FPGA-based bridges.
Recommended
Industrial I/O Expansion
With 54 user I/Os, the 5M160ZE64C4N can expand the limited GPIO count of low-cost microcontrollers in PLCs, motor controllers, and sensor hubs. The C4N speed grade provides 4.0 ns pin-to-pin delay, fast enough for deterministic I/O response in closed-loop control loops. The internal programmable oscillator eliminates the need for an external clock generator for simple timed events, and the 0-85 C operating range covers most factory-floor enclosures.
Recommended
Power-Up/Down Sequencing
The 5M160ZE64C4N is ideal for multi-rail power-sequencing controllers, where multiple DC-DC converters and LDO regulators must be enabled in a specific order to protect downstream processors and FPGAs. Using the internal 128 macrocells, the CPLD can monitor PG (power-good) signals and generate sequenced EN outputs with programmable delays. Its flash-backed configuration eliminates external boot logic, and the 1.8 V core + MultiVolt I/O allow direct interface to most power-supervisor ICs.
Recommended
Address Decoding for Memory-Mapped Peripherals
Engineers commonly use the 5M160ZE64C4N to decode chip-select lines for memory-mapped peripherals (SRAM, NOR flash, ASIC registers) on 8/16/32-bit buses. With 128 macrocells and 4.0 ns tPD, the CPLD delivers sub-bus-cycle decoding latency for 50-100 MHz microcontroller/MPU buses. The device's JTAG interface allows in-field reprogramming of the address map without soldering, and the small EQFP-64 footprint fits easily under BGA fan-out.
Recommended
State-Machine Controllers
The 5M160ZE64C4N's non-volatile flash configuration makes it ideal for deterministic state-machine controllers in appliances, vending machines, and point-of-sale terminals. 128 macrocells provide ample capacity for Mealy/Moore state machines with 16-24 states plus output combinational logic. Instant-on operation from the flash cell guarantees that critical safety states are active within microseconds of VCC ramp, without external configuration boot time.
Recommended
Display and Touch-Panel Hub
In display panels and touch-controller hubs, the 5M160ZE64C4N can perform LVTTL-to-LVDS signal conversion, backlight PWM generation, and I2C/SPI touch-controller bridging. The MultiVolt I/O banks enable direct connection to both 1.8 V display timing controllers and 3.3 V touch sensors. The 4.0 ns pin-to-pin delay supports 50-100 MHz pixel-clock regeneration for small LCDs up to WVGA resolution. Low power consumption and small EQFP-64 footprint suit space-constrained display modules.
Recommended
Recommended Products Summary
Engineering reference data for 5M160ZE64C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M160ZE64C5N | 5M160ZE64A5N | 5M160ZE64I4N | 5M80ZE64C4N | 5M40ZE64C4N |
|---|---|---|---|---|---|---|
| Package | EQFP-64 (E64) | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements / Macrocells | 128 | 128 | 128 | 128 | 64 | 40 |
| Maximum User I/Os | 54 | 54 | 54 | 54 | 30 | 30 |
| Speed Grade (tPD1) | ~4.0 ns (C4) | ~5.0 ns (C5) | ~3.5 ns (A5) | ~4.0 ns (I4) | ~4.0 ns (C4) | ~4.0 ns (C4) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Configuration Method | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Key Differentiators
- Lowest-power 128-macro MAX V in EQFP-64 with 54 I/Os (vs 5M1270ZT144C4N)
- Faster timing at equivalent density than 5M160ZE64C5N (vs 5M160ZE64C5N)
- MultiVolt I/O support across 4 banks for mixed-voltage glue logic (vs 5M160ZE64I4N (industrial variant))
Design Notes
Solder the E64 exposed thermal pad (on the underside of the package) to the PCB ground plane with multiple thermal vias for heat spreading and ground inductance reduction. Per the Intel MAX V datasheet pin-connection guidelines, leaving the ePad floating can cause thermal runaway and erratic I/O behavior. Provide at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the ePad to a continuous ground plane on the opposite PCB layer.
Decouple VCCINT (1.8 V) with one 1 uF X7R ceramic capacitor placed within 5 mm of the pin, plus a 0.1 uF X7R high-frequency bypass capacitor. Each VCCIO bank (1, 2, 3, 4) requires its own 0.1 uF + 1 uF decoupling pair placed close to the package. Bulk 10 uF tantalum or polymer capacitors should be located near the regulator outputs. Estimated: total decoupling budget is approximately 6 capacitors for full 4-bank operation.
Do not leave JTAG pins (TCK/TMS/TDO/TDI) floating - they must be pulled to a defined logic level through 10 kohm resistors to prevent spurious configuration attempts. The TRST/nCONFIG pin should be tied high through 10 kohm for normal operation. When programming in-system via JTAG, ensure that no other devices on the JTAG chain are interfering with the TCK signal by using a JTAG buffer if chain length exceeds 6 inches.
Route all high-speed I/O (faster than 100 MHz) on inner PCB layers with a continuous ground reference plane to control impedance. For LVCMOS 3.3 V outputs driving long traces (greater than 50 mm), use 22-33 ohm series damping resistors near the CPLD pin to suppress ringing. The 5M160ZE64C4N C4N speed grade supports edge rates below 1 ns, so impedance-controlled routing is essential above 50 MHz toggle rates.
Compliance Information
RoHS and REACH compliance per Intel MAX V product family declaration. Not AEC-Q100 qualified (commercial-grade CPLD); choose industrial 5M160ZE64I4N for harsher environments.
